An LED package device based on embedded electrodes

Abstract

The utility model discloses a kind of LED packaging devices based on embedded electrode, including encapsulation layer, anchoring component, LED chip component, electrode component and insulating bottom layer;Anchoring component and LED chip component are arranged along horizontal direction;Encapsulation layer is cladded in the top surface and side surface of anchoring component and LED chip component;Electrode component is connected with the bottom surface of anchoring component and LED chip component and forms loop;Insulating bottom layer is set in the bottom surface of encapsulation layer, and a plurality of welding holes are set on insulating bottom layer and arranged opposite electrode component;Through above-mentioned structure, LED packaging device has extremely high electrode reliability, avoids failure caused by electrode drop and poor welding, yield is greatly improved, comprehensive cost is reduced, meet use demand.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor micro-display packaging, and in particular to an LED packaging device based on embedded electrodes. Background Technology

[0002] In ultra-small Micro LED MIP packaging, the reliability and size design of external electrodes are the core bottlenecks: 1. Risk of electrode detachment: External electrodes formed by integral metallization processes such as sputtering and electroplating have poor adhesion to the encapsulating colloid (such as epoxy resin and silicone), and are prone to interface failure under thermal stress; 2. Conflict between size and reliability: In order to reduce the package size, the four external electrodes need to be as small as possible and close to the corners. However, the traditional parallel and equidistant arrangement of three chips will limit the space of the circuit leading to a certain electrode, which will force the electrode to be designed to be smaller than the other electrodes, becoming a weak point in soldering reliability. Ultimately, it is necessary to increase the package size to compensate for this. Therefore, there is an urgent need for an LED packaging device based on embedded electrodes to solve the above problems. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an LED packaging device based on embedded electrodes.

[0004] The technical solution adopted by one embodiment of this utility model to solve its technical problem is: an LED packaging device based on embedded electrodes, including a packaging layer, an anchoring component, an LED chip component, an electrode component, and an insulating bottom layer; The anchoring components and LED chip components are arranged horizontally; The encapsulation layer covers the top and sides of the anchoring component and the LED chip component; The electrode assembly is connected to the bottom surface of the anchoring assembly and the LED chip assembly, forming a circuit; An insulating substrate is set on the bottom surface of the encapsulation layer, and several welding holes are provided on the insulating substrate, which are arranged opposite to the electrode assembly.

[0005] As one of the preferred embodiments of this utility model, the anchoring assembly includes a first anchoring plate, a second anchoring plate, a third anchoring plate and a fourth anchoring plate, the LED chip assembly includes a red LED chip, a green LED chip and a blue LED chip, the electrode assembly includes a first positive electrode plate, a second positive electrode plate, a third positive electrode plate and a negative electrode plate, and the welding holes are set to 4. The first positive electrode is connected to the positive electrode of the red LED chip and the first anchoring plate; The second positive electrode is connected to the positive electrode of the green LED chip and the third anchoring plate; The third positive electrode is connected to the positive electrode of the blue LED chip and the fourth anchoring plate; The negative electrode is connected to the negative electrode of the red LED chip, the negative electrode of the green LED chip, the negative electrode of the blue LED chip, and the second anchoring plate. The welding holes correspond one-to-one with the first positive electrode, the second positive electrode, the third positive electrode, and the negative electrode.

[0006] In one of the preferred embodiments of this utility model, the red LED chip, the green LED chip, and the blue LED chip are arranged in a straight line. The first anchoring piece and the second anchoring piece are located on one side of the red LED chip, the green LED chip, and the blue LED chip, and the third anchoring piece and the fourth anchoring piece are located on the other side of the red LED chip, the green LED chip, and the blue LED chip.

[0007] As one of the preferred embodiments of this utility model, the position of at least one of the red LED chip, green LED chip and blue LED chip is offset relative to the reference line formed by the other two, and the offset direction is to make room for the line leading to the first positive electrode, second positive electrode, third positive electrode or negative electrode with the most limited space.

[0008] In one of the preferred embodiments of this utility model, the anchoring component is configured as a copper foil sheet.

[0009] As one of the preferred embodiments of this utility model, a metal layer is provided between the insulating bottom layer and the encapsulation layer, and the electrode assembly is etched and formed by the metal layer.

[0010] In one of the preferred embodiments of this utility model, the insulating underlayer is made of insulating varnish.

[0011] In one of the preferred embodiments of this utility model, the bottom surface of the anchoring component, the bottom surface of the LED chip component, and the bottom surface of the encapsulation layer are coplanar.

[0012] The beneficial effects of this utility model are as follows: An LED packaging device based on embedded electrodes includes a packaging layer, an anchoring component, an LED chip component, an electrode component, and an insulating bottom layer; the anchoring component and the LED chip component are arranged in a horizontal direction; the packaging layer covers the top and side surfaces of the anchoring component and the LED chip component; the electrode component is connected to the bottom surface of the anchoring component and the LED chip component and forms a circuit; the insulating bottom layer is disposed on the bottom surface of the packaging layer, and a plurality of welding holes are provided on the insulating bottom layer opposite to the electrode component; the above structure enables the LED packaging device to have extremely high electrode reliability, avoids failures caused by electrode detachment and poor welding, significantly improves yield, reduces overall cost, and meets usage requirements. Attached Figure Description

[0013] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 A schematic diagram of pre-positioning anchoring components at predetermined locations on a substrate; Figure 2 This is a schematic diagram showing the arrangement of LED chip components on a substrate; Figure 3 This is a schematic diagram illustrating the application of encapsulating film for covering. Figure 4 This is a schematic diagram after curing; Figure 5 This is a schematic diagram of planarization treatment performed on the cured structure. Figure 6 A schematic diagram showing the formation of a metal layer on the bottom surface of the encapsulation layer; Figure 7 This is a schematic diagram illustrating the metal layer. Figure 8 A schematic diagram showing the formation of an insulating underlayer on the bottom surface of an electrode assembly; Figure 9 A schematic diagram illustrating the process of creating solder holes and dividing the insulating substrate to obtain an LED package device; Figure 10 This is a schematic diagram of the negative electrode. Detailed Implementation

[0014] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0015] In the description of this utility model, "multiple" means two or more; "greater than," "less than," and "exceeding" are understood to exclude the stated number; "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly specifying the number of indicated technical features or their sequential relationship.

[0016] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0017] In this utility model, unless otherwise explicitly defined, the terms "setting," "installing," and "connecting" should be interpreted broadly. For example, they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0018] Reference Figures 1-10 This utility model provides an LED packaging device based on embedded electrodes, including a packaging layer 10, an anchoring component 20, an LED chip component 30, an electrode component 40, and an insulating bottom layer 50. The anchoring assembly 20 and the LED chip assembly 30 are arranged horizontally; The encapsulation layer 10 covers the top and sides of the anchoring component 20 and the LED chip component 30; The electrode assembly 40 is connected to the bottom surface of the anchoring assembly 20 and the LED chip assembly 30 and forms a circuit; An insulating base layer 50 is disposed on the bottom surface of the encapsulation layer 10, and a plurality of welding holes 51 are provided on the insulating base layer 50, which are arranged opposite to the electrode assembly 40.

[0019] In this utility model, the fabrication of a 0.26mm × 0.26mm MIP LED package device is used as an example for illustration. The anchoring assembly 20 includes a first anchoring piece 21, a second anchoring piece 22, a third anchoring piece 23, and a fourth anchoring piece 24. The LED chip assembly 30 includes a red LED chip 31, a green LED chip 32, and a blue LED chip 33. The electrode assembly 40 includes a first positive electrode 41, a second positive electrode 42, a third positive electrode 43, and a negative electrode 44. Four welding holes 51 are provided. Specifically: ①Reference Figure 1 Four etched copper foil anchor plates, namely the first anchor plate 21, the second anchor plate 22, the third anchor plate 23 and the fourth anchor plate 24, are pasted on the substrate 70 (blue film fixture). The thickness of the anchor plates is preferably set to 15μm.

[0020] ②Reference Figure 2Red LED chip 31, green LED chip 32 and blue LED chip 33 with a size of 55μm x 25μm are arranged on substrate 70. Preferably, the red LED chip 31, green LED chip 32 and blue LED chip 33 are arranged in a straight line. The first anchoring piece 21 and the second anchoring piece 22 are located on one side of the red LED chip 31, green LED chip 32 and blue LED chip 33, and the third anchoring piece 23 and the fourth anchoring piece 24 are located on the other side of the red LED chip 31, green LED chip 32 and blue LED chip 33.

[0021] Reference Figure 2 Further preferably, the position of at least one of the red LED chip 31, green LED chip 32, and blue LED chip 33 is offset relative to the reference lines formed by the other two. This offset direction makes room for the lines leading to the most spatially constrained first positive electrode 41, second positive electrode 42, third positive electrode 43, or negative electrode 44. For example, referring to… Figure 2 The green LED chip 32 and the blue LED chip 33 are located on the same baseline, and the baseline of the red LED chip 31 is offset by 20μm towards the first anchor plate 21 to optimize the wiring space leading to the lower right corner electrode, thereby making room for the wiring of the negative electrode plate 44; the spatial arrangement of multiple LED chips is an asymmetrical layout, which can provide a balanced wiring space for multiple external electrodes.

[0022] ③Reference Figures 3-5 Vacuum pressing and filling are performed using encapsulating film. After curing at 150°C, the entire structure is flipped so that the bottom surfaces of the anchoring component 20, the LED chip component 30, and the encapsulation layer 10 are facing upwards. The cured structure is then planarized to expose the electrodes of the LED chip component 30 and the anchoring component 20.

[0023] ④Reference Figure 6 , Figure 7 and Figure 10The metal layer 60 is fabricated using magnetron sputtering, vapor deposition, or atomic layer deposition processes. In this embodiment, magnetron sputtering is preferably used, specifically by magnetron sputtering a Ti / Cu seed layer followed by electroplating a Cu layer to a thickness of 4 μm to form the metal layer 60. Circuit patterns are then etched using photolithography to construct the first positive electrode 41, the second positive electrode 42, the third positive electrode 43, and the negative electrode 44, making the anchoring assembly 20 and the electrode assembly 40 integrally formed. The first positive electrode 41 is connected to the positive electrode of the red LED chip 31 and the first anchoring assembly. The first positive electrode 42 is connected to the positive electrode of the green LED chip 32 and the third anchoring plate 23. The second positive electrode 43 is connected to the positive electrode of the blue LED chip 33 and the fourth anchoring plate 24. The third positive electrode 44 is connected to the negative electrode of the red LED chip 31, the negative electrode of the green LED chip 32, the negative electrode of the blue LED chip 33, and the second anchoring plate 22. In this method, the electrodes of the three LED chips are interconnected in a common cathode manner. Of course, the electrodes of the three LED chips can also be interconnected in a common anode manner.

[0024] ⑤Reference Figures 8-10 An insulating base layer 50 is formed by screen printing insulating varnish on the bottom surface of the encapsulation layer 10. A laser device is used to open the insulating base layer 50 to create four welding holes 51 that correspond one-to-one with the first positive electrode 41, the second positive electrode 42, the third positive electrode 43, and the negative electrode 44. The entire structure is then cut to obtain multiple LED encapsulation devices. It should be noted that the encapsulation device may contain a set of red LED chips 31, green LED chips 32, and blue LED chips 33, or it may contain a multi-in-one device composed of multiple sets of red LED chips 31, green LED chips 32, and blue LED chips 33.

[0025] This utility model also provides a method for preparing the aforementioned LED packaged device, comprising: Step 1: Pre-position the anchoring component 20 at a predetermined position on the substrate 70; Step 2: Arrange the LED chip assembly 30 on the substrate 70; Step 3: Cover and cure with encapsulating film to form encapsulation layer 10; Step 4: Planarize the cured structure to expose the electrodes of the LED chip assembly 30 and the anchoring assembly 20; Step 5: Form and pattern a metal layer on the bottom surface of the encapsulation layer 10 to form an electrode assembly 40 that is connected to the electrodes and anchoring assembly 20 of the LED chip assembly 30. Step 6: Form an insulating substrate 50 with welding holes 51 on the bottom surface of the electrode assembly 40 and cut it to obtain an LED package device.

[0026] The advantages of this invention are: the structure described above enables the LED packaging device to have extremely high electrode reliability, avoids failures caused by electrode detachment and poor soldering, significantly improves yield, reduces overall cost, and meets usage requirements.

[0027] Of course, this utility model is not limited to the above-described embodiments. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of this utility model. All such equivalent modifications and substitutions are included within the scope defined by the claims of this application.

Claims

1. An LED packaging device based on embedded electrodes, characterized in that: It includes an encapsulation layer (10), an anchoring assembly (20), an LED chip assembly (30), an electrode assembly (40), and an insulating underlayer (50); The anchoring assembly (20) and the LED chip assembly (30) are arranged in a horizontal direction; The encapsulation layer (10) covers the top and side surfaces of the anchoring component (20) and the LED chip component (30); The electrode assembly (40) is connected to the bottom surface of the anchoring assembly (20) and the LED chip assembly (30) and forms a circuit; The insulating substrate (50) is disposed on the bottom surface of the encapsulation layer (10), and the insulating substrate (50) is provided with a plurality of welding holes (51) arranged opposite to the electrode assembly (40).

2. The LED packaging device based on embedded electrodes according to claim 1, characterized in that: The anchoring assembly (20) includes a first anchoring plate (21), a second anchoring plate (22), a third anchoring plate (23), and a fourth anchoring plate (24). The LED chip assembly (30) includes a red LED chip (31), a green LED chip (32), and a blue LED chip (33). The electrode assembly (40) includes a first positive electrode (41), a second positive electrode (42), a third positive electrode (43), and a negative electrode (44). The welding holes (51) are set to 4. The first positive electrode (41) is connected to the positive electrode of the red LED chip (31) and the first anchoring plate (21); The second positive electrode (42) is connected to the positive electrode of the green LED chip (32) and the third anchoring plate (23); The third positive electrode (43) is connected to the positive electrode of the blue LED chip (33) and the fourth anchoring plate (24); The negative electrode (44) is connected to the negative electrode of the red LED chip (31), the negative electrode of the green LED chip (32), the negative electrode of the blue LED chip (33), and the second anchoring plate (22); The welding hole (51) corresponds one-to-one with the first positive electrode (41), the second positive electrode (42), the third positive electrode (43), and the negative electrode (44).

3. The LED packaging device based on embedded electrodes according to claim 2, characterized in that: The red LED chip (31), green LED chip (32) and blue LED chip (33) are arranged in a straight line. The first anchoring piece (21) and the second anchoring piece (22) are located on one side of the red LED chip (31), green LED chip (32) and blue LED chip (33), and the third anchoring piece (23) and the fourth anchoring piece (24) are located on the other side of the red LED chip (31), green LED chip (32) and blue LED chip (33).

4. The LED packaging device based on embedded electrodes according to claim 3, characterized in that: The position of at least one of the red LED chip (31), green LED chip (32) and blue LED chip (33) is offset relative to the other two reference lines formed by the offset direction to make room for the lines leading to the first positive electrode (41), the second positive electrode (42), the third positive electrode (43) or the negative electrode (44) which have the most limited space.

5. An LED packaging device based on embedded electrodes according to claim 1, characterized in that: The anchoring component (20) is a copper foil sheet.

6. The LED packaging device based on embedded electrodes according to claim 1, characterized in that: A metal layer (60) is disposed between the insulating substrate (50) and the encapsulation layer (10), and the electrode assembly (40) is etched from the metal layer (60).

7. The LED packaging device based on embedded electrodes according to claim 1, characterized in that: The insulating underlayer (50) is made of insulating varnish.

8. An LED packaging device based on embedded electrodes according to claim 1, characterized in that: The bottom surface of the anchoring component (20), the bottom surface of the LED chip component (30), and the bottom surface of the encapsulation layer (10) are coplanar.

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