Wafer alignment device

Abstract

The utility model relates to industrial automation technical field discloses a wafer alignment device to solve the technical problem of insufficient precision when wafer - glass temporary bonding, from bottom to top is sequentially provided with lower platform nut seat, platform bottom plate, affixing platform baseplate and affixing platform, and the peripheral side of affixing platform baseplate is provided with a plurality of fixed assemblies and at least one top notch assembly, the fixed assembly and top notch assembly all include the first mounting plate fixed connection in affixing platform baseplate, and the first mounting plate fixed mounting has the vertical thrust first cylinder, and the floating head of first cylinder installs the second mounting plate, and the second mounting plate is provided with the horizontal thrust second cylinder, the first alignment mounting plate for assisting positioning is set up on the second cylinder of fixed assembly, and the second alignment mounting plate for top wafer notch is set up on the second cylinder of top notch assembly. Through the improvement handover alignment structure, solved the problem of insufficient precision when wafer - glass temporary bonding.

Description

Technical Field

[0001] This utility model relates to the field of industrial automation technology, and in particular to a wafer alignment device. Background Technology

[0002] A notch is a small notch or groove on the edge of a wafer, primarily used to identify the wafer's orientation and positioning. During wafer manufacturing and packaging, it's crucial to ensure consistency across all process directions, and the notch provides a standard reference point, facilitating automated equipment identification of the wafer's orientation.

[0003] In existing temporary wafer bonding processes, edge-following is typically used to identify wafer edges for alignment, and the top PING assembly is relied upon for wafer handling and positioning. However, during the wafer handover process between the top PING assembly and the lower platform, slight misalignments can easily occur, causing alignment errors between the wafer and the glass during temporary bonding. This method is difficult to meet high-precision bonding requirements.

[0004] Therefore, there is an urgent need for a wafer alignment device with a reasonable structure, precise alignment capability, and the ability to compensate for handover errors. Utility Model Content

[0005] The purpose of this invention is to provide a wafer alignment device to solve the technical problem of insufficient precision during temporary wafer-glass bonding.

[0006] To achieve the above objectives, this utility model provides a wafer alignment device, which consists of a lower platform nut seat, a platform base plate, an attachment platform substrate, and an attachment platform arranged sequentially from bottom to top. The top of the attachment platform is provided with multiple adsorption holes for adsorbing wafers. An adsorption cavity is provided inside the platform base plate. The adsorption holes are connected to the adsorption cavity, and the adsorption cavity is connected to an external vacuum system through a vent hole on the attachment platform substrate. Multiple fixing components and at least one top Notch component are arranged on the periphery of the attachment platform substrate.

[0007] Both the fixing assembly and the top notch assembly include a first mounting plate fixedly connected to the attachment platform substrate. The first mounting plate is fixedly mounted with a first cylinder for vertical thrust. A second mounting plate is mounted on the floating head of the first cylinder. The second mounting plate is provided with a second cylinder for horizontal thrust. The second cylinder of the fixing assembly is provided with a first alignment mounting plate for auxiliary positioning. The second cylinder of the top notch assembly is provided with a second alignment mounting plate for top wafer notch.

[0008] By introducing an adsorption mechanism, a fixing component, and a top notch component into the platform structure, high-precision secondary positioning of the wafer after placement is achieved. The adsorption holes and adsorption chambers are connected to form a stable negative pressure, ensuring stable wafer adsorption and preventing slippage. The fixing component provides multi-point auxiliary positioning, improving the radial fixing effect of the wafer's outer ring. The top notch component precisely corrects the wafer's rotation angle by pushing the wafer's notch opening, effectively compensating for the offset error caused by the top pin connection. This achieves high-precision temporary bonding between the wafer and the glass, solving the positioning deviation problem caused by the connection in existing technologies, significantly improving bonding accuracy and reliability, and meeting alignment requirements within ±0.05mm.

[0009] Furthermore, the first alignment mounting plate has an alignment cylinder at one end near the attachment platform, and the second alignment mounting plate has a column with an arc-shaped protrusion at one end near the attachment platform. By setting the alignment cylinder, radial positioning of the wafer edge can be achieved, thereby preventing lateral displacement of the wafer after adsorption; the column with the arc-shaped protrusion can accurately conform to the contour of the wafer notch, accurately correct the wafer rotation angle, and improve the overall alignment accuracy.

[0010] Furthermore, the bottom of the platform base plate has multiple cylindrical protrusions, at least four of which have annular grooves, with the central groove communicating with the adsorption cavity inside the platform substrate. By setting the cylindrical protrusions with annular grooves, the structural support of the platform is enhanced, and the communication between the annular grooves and the adsorption cavity can effectively diffuse the negative pressure range.

[0011] Furthermore, the mounting platform substrate has multiple through holes corresponding to the adsorption chambers, and vent holes communicating with the chambers are provided on the periphery. The through hole design enables effective communication between the adsorption chambers and the adsorption holes of the mounting platform, ensuring that the negative pressure is smoothly conducted to the top surface of the platform; after the vent holes on the periphery are connected to the external vacuum pipeline, a unified vacuuming operation can be achieved, ensuring that the negative pressure in the chamber remains stable and providing a reliable gas source for wafer adsorption.

[0012] Furthermore, the adsorption chamber includes multiple annular grooves and cross grooves. The adsorption chamber adopts a combination structure of annular grooves and cross grooves to enhance the uniformity of negative pressure adsorption.

[0013] The wafer alignment device provided by this utility model has the following advantages:

[0014] By introducing an adsorption mechanism, a fixing component, and a top notch component into the platform structure, high-precision secondary positioning of the wafer after placement is achieved. The adsorption holes and adsorption chambers are connected to form a stable negative pressure, ensuring stable wafer adsorption and preventing slippage. The fixing component provides multi-point auxiliary positioning, improving the radial fixing effect of the wafer's outer ring. The top notch component precisely corrects the wafer's rotation angle by pushing the wafer's notch opening, effectively compensating for the offset error caused by the top pin connection. This achieves high-precision temporary bonding between the wafer and the glass, solving the positioning deviation problem caused by the connection in existing technologies, significantly improving bonding accuracy and reliability, and meeting alignment requirements within ±0.05mm. Attached Figure Description

[0015] Figure 1 A three-dimensional structural diagram of the wafer alignment device provided by this utility model;

[0016] Figure 2 Exploded view of the wafer alignment device provided by this utility model;

[0017] Figure 3 A three-dimensional structural diagram of the fixing component provided by this utility model;

[0018] Figure 4 A three-dimensional structural diagram of the top Notch component provided by this utility model;

[0019] Figure 5 A three-dimensional structural diagram of the mounting platform substrate provided by this utility model.

[0020] In the diagram: 10, wafer; 20, mounting platform; 30, platform base plate; 40, mounting platform substrate; 50, lower platform nut seat; 60, fixing assembly; 70, top notch assembly; 11, suction hole; 12, notch opening; 31, annular groove; 32, cross groove; 41, ring groove; 42, vent hole; 43, through hole; 61, first mounting plate; 62, first cylinder; 63, second mounting plate; 64, first alignment mounting plate; 65, second alignment mounting plate; 66, second cylinder; 67, arc-shaped protrusion. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0022] See Figures 1 to 5This invention provides a wafer alignment device for achieving high-precision alignment between a wafer and a glass substrate in a temporary bonding process. The alignment device includes, from bottom to top, a lower platform nut seat 50, a platform base plate 30, an attachment platform substrate 40, and an attachment platform 20.

[0023] The attachment platform 20 is a circular structure with multiple evenly distributed adsorption holes 11 on its surface for vacuum adsorption and fixation of the wafer. The adsorption holes 11 penetrate the attachment platform 20 and communicate with the adsorption cavity inside the platform base plate 30. This adsorption cavity is composed of multiple interlaced annular grooves 31 and cross grooves 32, ensuring a smooth and uniform adsorption path, and improving adsorption efficiency and stability.

[0024] The bottom of the platform base plate 30 has multiple cylindrical protrusions, some of which have annular grooves 41. The center of the groove extends to the upper adsorption chamber to conduct the suction force. The attachment platform substrate 40 has through holes 43 corresponding to the adsorption structure of the platform base plate 30, and ventilation holes 42 are provided on its periphery. The ventilation holes 42 are connected to an external vacuum system through pipes to control the adsorption and release actions.

[0025] The attachment platform 20 has a Notch port 12 on its edge for marking the wafer positioning direction. This structure works with the top Notch component 70 for precise positioning.

[0026] Several fixing components 60 and a top Notch component 70 are arranged at equal intervals around the periphery of the mounting platform substrate 40, which are used together for positioning and fixing the wafer edge and the Notch port.

[0027] The fixed component 60 and the top Notch component 70 have basically the same structure, specifically including:

[0028] An L-shaped first mounting plate 61 is fixed to the attachment platform substrate 40 via a mounting position;

[0029] The first vertical cylinder 62, which is mounted on the first mounting plate 61, is preferably a slide cylinder, and the front end of the cylinder is connected to the second mounting plate 63.

[0030] The second cylinder 66 is horizontally mounted on the second mounting plate 63;

[0031] If it is a fixed component 60, the second cylinder 66 pushes the first alignment mounting plate 64, which has an alignment cylindrical body at its front end for clamping and positioning the wafer edge.

[0032] If it is the top Notch assembly 70, the second cylinder 66 pushes the second alignment mounting plate 65, which has a column structure with an arc-shaped protrusion 67 at its front end, used to accurately hold the wafer Notch port 12 to achieve orientation correction.

[0033] See Figure 5 To improve the rigidity of the adsorption structure and the suction sealing effect, several annular grooves 41 are provided at the bottom of the platform base plate 30. The support of the base plate is further enhanced by adding annular wedge ribs to avoid deformation or uneven suction during the adsorption process.

[0034] The lower platform nut seat 50 includes a frustum structure and an integrally formed support base, which is used for overall installation stability and provides a mechanical fixing point for the air supply or extraction passage of the adsorption mechanism.

[0035] In practical applications, when an external vacuum pump is connected to the air inlet and outlet of the mounting platform substrate 40 through a pipeline, a negative pressure adsorption is formed by pumping air to adsorb and fix the wafer 10 placed on the platform. Subsequently, multiple fixing components 60 and the top notch component 70 work together to clamp or correct the wafer position from different directions, effectively eliminating the displacement caused by the top notch component releasing the wafer, achieving high-precision alignment, and meeting the precision requirements of glass-wafer temporary bonding.

[0036] The wafer alignment device provided by this utility model has the following advantages:

[0037] By introducing an adsorption mechanism, a fixing component, and a top notch component into the platform structure, high-precision secondary positioning of the wafer after placement is achieved. Specifically, the adsorption holes and adsorption chambers are connected to form a stable negative pressure, ensuring stable wafer adsorption and preventing slippage. The fixing component provides multi-point auxiliary positioning, improving the radial fixation effect on the outer ring of the wafer. The top notch component precisely corrects the wafer rotation angle by pushing the wafer notch opening, effectively compensating for the offset error caused by the top PING connection. This achieves high-precision temporary bonding between the wafer and glass, significantly improving bonding accuracy and reliability. By improving the alignment structure after connection, the problem of insufficient accuracy during wafer-glass temporary bonding is solved, reducing the post-bonding positional accuracy from ±0.2mm to ±0.05mm.

[0038] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer alignment device, characterized in that, The following components are arranged sequentially from bottom to top: a lower platform nut seat (50), a platform base plate (30), an attachment platform (20) substrate, and an attachment platform (20). The attachment platform (20) has multiple adsorption holes (11) for adsorbing wafers (10) on its top. The platform base plate (30) has an adsorption cavity inside. The adsorption holes (11) are connected to the adsorption cavity. The adsorption cavity is connected to an external vacuum system through a vent hole (42) on the attachment platform (20) substrate. The attachment platform (20) substrate has multiple fixing components (60) and at least one top Notch component (70) on its periphery. Both the fixing assembly (60) and the top notch assembly (70) include a first mounting plate (61) fixedly connected to the substrate of the attachment platform (20). The first mounting plate (61) is fixedly mounted with a first cylinder (62) for vertical thrust. A second mounting plate (63) is mounted on the floating head of the first cylinder (62). A second cylinder (66) for horizontal thrust is provided on the second mounting plate (63). A first alignment mounting plate (64) for auxiliary positioning is provided on the second cylinder (66) of the fixing assembly (60), and a second alignment mounting plate (65) for top wafer notch is provided on the second cylinder (66) of the top notch assembly (70).

2. The wafer alignment device according to claim 1, characterized in that, The first alignment mounting plate (64) has an alignment cylinder at one end near the attachment platform (20), and the second alignment mounting plate has a column with an arc-shaped protrusion (67) at one end near the attachment platform (20).

3. The wafer alignment device according to claim 2, characterized in that, The bottom of the platform base plate (30) is provided with multiple cylindrical protrusions, of which at least four cylindrical protrusions are provided with annular grooves (41), and the central groove hole is connected to the adsorption cavity in the substrate of the attached platform (20).

4. The wafer alignment device according to claim 1, characterized in that, The substrate of the attachment platform (20) is provided with a plurality of through holes (43) corresponding to the adsorption cavity, and the periphery is provided with ventilation holes (42) communicating with the cavity.

5. The wafer alignment apparatus according to claim 1, characterized in that, The adsorption chamber includes multiple annular grooves (31) and cross grooves (32).

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