A processing device for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes

Abstract

The utility model discloses a kind of processing device for oxygen-free copper pipe inner surface electrolytic polishing and passivation involving copper pipe processing technical field, the lower part of tank body inner cavity is equipped with lower filter plate for filtering impurities in cleaning solution, and avoiding impurities bottoming, several support seats for vertically limiting and supporting copper pipe are uniformly distributed in the upper part of lower filter plate, injection tube, which is respectively penetrated through support seat and lower filter plate, is equipped in each support seat, water pump for conveying cleaning solution into injection tube is equipped in the lower part of lower filter plate, tank body inner cavity upper part is also equipped with upper filter plate, and several ultrasonic transducers, which are one-to-one corresponding with several support seats and probe into copper pipe interior, are equipped in the lower part of upper filter plate;The utility model not only can greatly improve the cleaning efficiency of copper pipe inner surface by using ultrasonic cleaning and flushing cleaning, but also can filter and screen impurity particles in cleaning solution for multiple times in cleaning process, greatly guarantee the cleaning quality of copper pipe inner surface.

Description

Technical Field

[0001] This utility model relates to the field of copper tube processing technology, and in particular to a processing device for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes. Background Technology

[0002] In the electrolytic polishing and passivation process of the inner surface of oxygen-free copper tubes, the cleanliness and smoothness of the inner surface are crucial to the subsequent electrolytic polishing and passivation treatment. Current cleaning methods for the inner surface of copper tubes mainly use immersion ultrasonic cleaning, which can remove some contaminants, but still has the following technical shortcomings:

[0003] 1. Low cleaning efficiency: When immersing and cleaning long copper tubes (especially those with small inner diameter), the ultrasonic energy is significantly attenuated deep inside the tube, resulting in uneven cleaning of the inner wall. The end area is often not thoroughly cleaned. It relies solely on ultrasonic cavitation and lacks dynamic scouring force, making it difficult to remove highly adhesive grease or polishing residue particles.

[0004] 2. Secondary contamination from impurities: Metal fragments, oxides and other impurities that fall off during the cleaning process will settle at the bottom of the tank or re-adhere to the inner wall of the copper pipes. This not only affects the cleaning quality but also causes the cleaning solution to be contaminated quickly, requiring frequent replacement.

[0005] 3. Poor equipment adaptability: Existing equipment mostly uses horizontal placement of copper pipes, which leads to air bubble retention and incomplete drainage, affecting drying and subsequent processes.

[0006] 4. High maintenance costs; impurities accumulate and require manual cleaning of the filter screen or tank, resulting in long downtime and reduced production efficiency.

[0007] To solve the above problems, there is an urgent need for a processing device that can efficiently clean the inner wall of copper tubes, dynamically filter impurities, and is compatible with electrolytic polishing and passivation pretreatment. Utility Model Content

[0008] To overcome the shortcomings of the prior art, this utility model discloses a processing device for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes. This utility model can not only greatly improve the cleaning efficiency of the inner surface of copper tubes by using ultrasonic cleaning and rinsing cleaning, but also filter and screen the impurity particles in the cleaning solution multiple times during the cleaning process, which greatly ensures the cleaning quality of the inner surface of copper tubes.

[0009] To achieve the above objectives, the present invention adopts the following technical solution:

[0010] A processing apparatus for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes includes a tank for ultrasonic cleaning of the copper tubes, and further includes:

[0011] The lower filter plate is located in the lower part of the tank cavity and is used to filter impurities in the cleaning solution and prevent impurities from settling to the bottom.

[0012] Several support bases are evenly distributed on the upper part of the lower filter plate to provide vertical limiting support for the copper tubes;

[0013] Several injection tubes are respectively located in several support bases. The upper and lower ends of the injection tubes pass through the support bases and the lower filter plate, respectively, and are used to inject cleaning fluid into the copper tubes.

[0014] A water pump, located below the lower filter plate, is used to draw the cleaning liquid filtered by the lower filter plate and deliver it into the injection pipe.

[0015] The upper filter plate is detachably installed in the upper part of the tank cavity and is used to press down and limit the vertically placed copper pipe.

[0016] Several ultrasonic transducers, located at the bottom of the upper filter plate and corresponding to several support bases, are inserted into the copper tube to clean the inner wall of the copper tube.

[0017] Furthermore, the support base includes:

[0018] The base, located on the upper part of the lower filter plate, is used to support the lower end of the copper tube;

[0019] The rubber seat, located on the upper part of the base, is conical in shape, inserted into the copper tube, and fits with the inner wall of the copper tube through an interference fit.

[0020] Furthermore, the tank is equipped with a liquid delivery pipeline located below the lower filter plate. One end of the liquid delivery pipeline is connected to the outlet of the water pump, and the other end of the liquid delivery pipeline is a sealed structure. Several injection pipes are connected to the liquid delivery pipeline.

[0021] Furthermore, a high-pressure nozzle is provided at the upper end of the injection pipe.

[0022] Furthermore, the upper filter plate has several openings that correspond one-to-one with several support seats. The openings are equipped with radially arranged mounting seats. The lower part of the mounting seats is equipped with a mounting rod that is coaxially arranged with the opening. The ultrasonic transducer is installed at the lower end of the mounting rod.

[0023] Furthermore, the inlet is provided with a rubber tube located at the lower part of the mounting base, which is used to transport the cleaning fluid flowing out of the copper tube to the upper part of the upper filter plate.

[0024] Furthermore, the rubber tube has an inverted conical structure with open ends. The outer edge of the upper end of the rubber tube is sealed to the inner wall of the opening, and the diameter of the lower end of the rubber tube is larger than the diameter of the mounting rod.

[0025] Furthermore, the lower part of the tank cavity is provided with a support ring that runs along its inner wall and is used to limit and support the lower filter plate.

[0026] Furthermore, the inner walls on both sides of the groove opening of the tank are provided with slots that are set along the depth of the groove and have open ends. The upper filter plate is provided with slot connectors on both sides that slide and engage with the slots.

[0027] Furthermore, a drain outlet is provided on one side of the bottom of the tank.

[0028] Compared with the prior art, the beneficial effects of this utility model are: by setting a support base and a liquid injection pipe, cleaning fluid can be injected into the copper tube when cleaning the copper tube, which can not only achieve flushing and cleaning of the inner wall of the copper tube, but also compensate for the attenuation of ultrasonic waves in the copper tube, greatly improving the cleaning effect on the inner wall of the copper tube.

[0029] By setting up a lower filter plate and installing a water pump at the bottom of the lower filter plate, impurity particles in the cleaning solution can be filtered and screened, greatly reducing the impurity content of the cleaning solution injected into the copper tube. This not only avoids electrochemical corrosion and reduced cleaning ability in the cleaning solution, but also effectively prevents impurity particles from scratching and contaminating the inner surface of the copper tube.

[0030] By setting up an ultrasonic transducer, ultrasonic cleaning can be performed inside the copper tube, greatly improving the cleaning efficiency of the inner surface of the copper tube.

[0031] By setting up an upper filter plate, the copper tube can be vertically pressed and limited, thus providing strong support for the subsequent insertion of the ultrasonic transducer and the rinsing and cleaning of the cleaning fluid.

[0032] By setting up inlets and rubber tubes, the cleaning fluid flowing out of the copper tubes can be effectively transported to the upper part of the upper filter plate, thereby filtering the outflowing cleaning fluid through the upper filter plate and effectively reducing the content of impurity particles in the cleaning fluid during the copper tube cleaning process.

[0033] This invention not only greatly improves the cleaning efficiency of the inner surface of copper tubes by using ultrasonic cleaning and rinsing, but also filters and screens the impurity particles in the cleaning solution multiple times during the cleaning process, thus greatly ensuring the cleaning quality of the inner surface of the copper tubes. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of this utility model;

[0035] Figure 2 This is a schematic diagram of the upper filter plate structure of this utility model;

[0036] Figure 3 This is a schematic diagram of the lower filter plate structure of this utility model;

[0037] Figure 4 This is a schematic diagram of the tank structure of this utility model.

[0038] In the diagram: 1. Tank body; 1.1. Drain outlet; 1.2. Support ring; 1.3. Slot; 2. Upper filter plate; 2.1. Through port; 2.1.1. Mounting base; 2.1.2. Rubber hose; 2.1.3. Mounting rod; 2.2. Connector; 3. Ultrasonic transducer; 4. High-pressure nozzle; 5. Support base; 5.1. Rubber seat; 5.2. Base; 6. Lower filter plate; 7. Injection pipe; 8. Water pump; 9. Infusion pipeline. Detailed Implementation

[0039] The technical solution of this utility model will be described below with reference to the accompanying drawings of the embodiments of this utility model. In the description, it should be understood that if there are terms such as "upper", "lower", "front", "rear", "left", "right" indicating the orientation or positional relationship, they are only corresponding to the drawings of this utility model for the convenience of describing this utility model, and do not indicate or imply that the device or element referred to must have a specific orientation.

[0040] Please refer to the instruction manual appendix. Figure 1-4 This utility model provides a technical solution:

[0041] Example 1: A processing device for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes includes a tank 1 for ultrasonic cleaning of the copper tubes. The lower part of the inner cavity of the tank 1 is provided with a lower filter plate 6 for filtering impurities in the cleaning solution and preventing impurities from settling to the bottom. Several support seats 5 for vertically limiting and supporting the copper tubes are evenly distributed on the upper part of the lower filter plate 6. Specifically, the support seat 5 includes a base 5.2. The upper part of the base 5.2 is provided with a rubber seat 5.1 with a conical structure that is interference-fitted with the inner wall of the copper tube. The rubber seat 5.1 can satisfy the interference fit of the copper tube, thereby keeping the copper tube vertically stable.

[0042] Each support base 5 is equipped with an injection pipe 7. The upper and lower ends of the injection pipe 7 pass through the support base 5 and the lower filter plate 6, respectively. The lower part of the lower filter plate 6 is equipped with a water pump 8 for drawing the cleaning liquid filtered by the lower filter plate 6 and delivering the cleaning liquid into the injection pipe 7. In order to enable the water pump 8 to deliver the cleaning liquid to multiple injection pipes 7, the tank body 1 is equipped with a delivery pipe 9 located at the lower part of the lower filter plate 6. One end of the delivery pipe 9 is connected to the outlet of the water pump 8, and the other end of the delivery pipe 9 is a sealed structure. Several injection pipes 7 are connected to the delivery pipe 9. The water pump 8 can draw the cleaning liquid into the injection pipe 7 and then inject it into the copper pipe through the injection pipe 7, thereby achieving the flushing and cleaning of the inner surface of the copper pipe and greatly improving the cleaning efficiency. In order to ensure sufficient impact force during the flushing and cleaning process, a high-pressure spray 4 is provided at the upper end of the injection pipe 7.

[0043] The upper part of the inner cavity of the tank 1 can also be detachably installed with an upper filter plate 2 for pressing down and limiting the vertically placed copper tube. By pressing down on the copper tube with the upper filter plate 2, the copper tube can always be kept vertical and stable. In order to improve the cleaning efficiency of the inner surface of the copper tube, the lower part of the upper filter plate 2 is provided with several ultrasonic transducers 3 that correspond one-to-one with several support seats 5 and penetrate into the copper tube. The ultrasonic transducers 3 can be used to assist in cleaning the inner surface of the copper tube.

[0044] In Example 2, during the rinsing and cleaning process of the inner surface of the copper tube, the impurity particles washed off will be discharged through the upper end of the copper tube. To prevent the impurity particles from settling into the tank 1 and affecting subsequent cleaning,

[0045] The upper filter plate 2 has several openings 2.1 corresponding to several support seats 5. Each opening 2.1 contains a radially arranged mounting seat 2.1.1, such as a star-shaped or cross-shaped structure. The lower part of the mounting seat 2.1.1 has a mounting rod 2.1.3 coaxially arranged with the opening 2.1. An ultrasonic transducer is mounted on the lower end of the mounting rod 2.1.3. Inside the opening 2.1 is a rubber tube 2.1.2 located below the mounting seat 2.1.1, used to transport the cleaning fluid flowing out of the copper tube to the upper part of the upper filter plate 2. Specifically, the rubber tube 2.1.2 has an inverted conical structure, with both ends open. The outer edge of the upper end of the rubber tube 2.1.2 is sealed to the inner wall of the port 2.1. The diameter of the lower end of the rubber tube 2.1.2 is larger than the diameter of the mounting rod 2.1.3. The lower end of the inverted conical rubber tube 2.1.2 is inserted into the upper end of the copper tube and is press-fitted with the inner wall of the copper tube. The cleaning liquid after rinsing and cleaning is directly transported to the upper part of the upper filter plate 2 through the rubber tube 2.1.2. After being filtered by the upper filter plate 2, it flows back into the tank 1. The impurity particles filtered out cannot settle back into the tank 1 due to the screen of the upper filter plate 2, thereby effectively improving the subsequent cleaning quality.

[0046] In Example 3, to facilitate the disassembly and cleaning of the lower filter plate 6 and the upper filter plate 2, a support ring 1.2 is provided at the lower part of the inner cavity of the tank body 1, which is set along its inner wall and is used to limit and support the lower filter plate 6. The inner walls on both sides of the tank opening of the tank body 1 are provided with slots 1.3 that are set along the depth of the tank body 1 and have open ends. The upper filter plate 2 is provided with slot connectors 2.2 on both sides that slide and engage with the slots 1.3. A drain port 1.1 is provided on one side of the bottom of the tank body 1, which can facilitate the subsequent cleaning and maintenance of the tank body.

[0047] The parts of this utility model not described in detail are prior art. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that this utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the above embodiments should be regarded as exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description. Therefore, it is intended to include all changes that fall within the meaning and scope of the equivalents of the claims in this utility model, and no reference numerals in the claims should be regarded as limiting the content of the claims.

Claims

1. A processing apparatus for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes, comprising a tank (1) for ultrasonic cleaning of the copper tubes, characterized in that, Also includes: The lower filter plate (6) is located in the lower part of the inner cavity of the tank (1) and is used to filter impurities in the cleaning liquid and prevent impurities from settling to the bottom. Several support seats (5) are evenly distributed on the upper part of the lower filter plate (6) to provide vertical limiting support for the copper tube; Several injection tubes (7) are respectively located in several support seats (5). The upper and lower ends of the injection tubes (7) pass through the support seats (5) and the lower filter plate (6) respectively, and are used to inject cleaning fluid into the copper tubes. A water pump (8) is located at the bottom of the lower filter plate (6) and is used to draw the cleaning liquid filtered by the lower filter plate (6) and deliver it into the injection pipe (7); The upper filter plate (2) is detachably installed in the upper part of the inner cavity of the tank (1) to press down and limit the vertically placed copper pipe; Several ultrasonic transducers (3) are located at the lower part of the upper filter plate (2) and correspond one-to-one with several support seats (5), which are inserted into the copper tube and clean the inner wall of the copper tube.

2. The processing apparatus for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes according to claim 1, characterized in that: The support base (5) includes: The base (5.2) is located on the upper part of the lower filter plate (6) and is used to support the lower end of the copper tube; A rubber seat (5.1) is located on the upper part of the base (5.2) and has a conical structure. It is inserted into the copper tube and is interference-fitted with the inner wall of the copper tube.

3. The processing apparatus for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes according to claim 1, characterized in that: The tank (1) is equipped with a liquid delivery pipeline (9) located below the lower filter plate (6). One end of the liquid delivery pipeline (9) is connected to the outlet of the water pump (8), and the other end of the liquid delivery pipeline (9) is a sealed structure. Several injection pipes (7) are connected to the liquid delivery pipeline (9).

4. The processing apparatus for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes according to claim 3, characterized in that: The upper end of the injection tube (7) is equipped with a high-pressure nozzle (4).

5. The processing apparatus for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes according to claim 1, characterized in that: The upper filter plate (2) has several openings (2.1) that correspond one-to-one with several support seats (5). The openings (2.1) are equipped with radial mounting seats (2.1.1). The lower part of the mounting seat (2.1.1) is equipped with a mounting rod (2.1.3) that is coaxially arranged with the opening (2.1). The ultrasonic transducer is installed at the lower end of the mounting rod (2.1.3).

6. The processing apparatus for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes according to claim 5, characterized in that: The inlet (2.1) is provided with a rubber tube (2.1.2) located below the mounting base (2.1.1) and used to transport the cleaning fluid flowing out of the copper tube to the upper part of the upper filter plate (2).

7. The processing apparatus for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes according to claim 6, characterized in that: The rubber tube (2.1.2) has an inverted conical structure and both ends are open. The outer edge of the upper end of the rubber tube (2.1.2) is sealed to the inner wall of the port (2.1). The diameter of the lower end of the rubber tube (2.1.2) is larger than the diameter of the mounting rod (2.1.3).

8. The processing apparatus for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes according to claim 1, characterized in that: The lower part of the inner cavity of the tank (1) is provided with a support ring (1.2) that is arranged along its inner wall and is used to limit and support the lower filter plate (6).

9. The processing apparatus for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes according to claim 1, characterized in that: The inner walls on both sides of the groove of the tank (1) are provided with slots (1.3) that are set along the depth of the groove (1) and open at the top. The upper filter plate (2) is provided with slot connectors (2.2) that slide and engage with the slots (1.3) on both sides.

10. The processing apparatus for electrolytic polishing and passivation of the inner surface of oxygen-free copper tubes according to claim 1, characterized in that: The tank (1) has a drain outlet (1.1) on one side of the bottom.

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