A galvanometer multi-dimension laser cutting system

Abstract

The utility model discloses a kind of galvanometer multi-dimension laser cutting systems, including machine table and high-pressure filter;The machine table is equipped with waste cavity and processing platform;The waste cavity is located below processing platform;The processing platform includes bottom plate and adsorption plate;The bottom plate covers waste cavity, the surface of bottom plate away from waste cavity is equipped with adsorption cavity and a plurality of first waste hole being penetrated by it;The surface of adsorption plate covering bottom plate is equipped with a plurality of adsorption hole and second waste hole being penetrated by it;A plurality of the adsorption hole are all communicated with adsorption cavity;A plurality of the second waste hole are communicated with waste cavity by a plurality of first waste hole respectively;The suction end of the high-pressure filter is communicated with waste cavity;The suction end of the vacuum equipment is communicated with adsorption cavity;This scheme realizes that PCB can automatically collect and centrally discharge scattered waste material of board edge when being cut into strips, reduces the cleaning work of waste material, improves the requirement of equipment automatic production process, to improve production efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of laser cutting, and in particular to a galvanometer-type multi-dimensional laser cutting system. Background Technology

[0002] When PCB manufacturers cut boards into strips, they generate both overall frame waste and some discrete waste. Currently, the general practice of manufacturers is to remove the cut products one by one, and then remove the overall waste frame. The discrete waste that is cut off can only be cleaned with a brush each time before a new board to be processed can be placed in the board.

[0003] Because the market will need to connect with automated production in the future, and to optimize production processes, reducing cleaning work and waste collection, there is a current need for a processing platform that can automatically collect these discrete wastes and optimize production processes. Utility Model Content

[0004] The purpose of this invention is to provide a galvanometer-type multi-dimensional laser cutting system to solve the problem of difficult cleaning of discrete waste materials in the existing technology.

[0005] To address the aforementioned technical problems, this utility model provides a galvanometer-type multi-dimensional laser cutting system, comprising a machine base, a high-pressure filter, and a vacuum device. The machine base is provided with a waste chamber and a processing platform. The waste chamber is located below the processing platform. The processing platform includes a base plate and an adsorption plate. The base plate covers the waste chamber, and the surface of the base plate facing away from the waste chamber has an adsorption cavity and multiple first waste holes penetrating it. The adsorption plate covers the surface of the base plate where the adsorption cavity is located, and the adsorption plate has multiple adsorption holes and second waste holes penetrating it. All adsorption holes are connected to the adsorption cavity. The multiple second waste holes are respectively connected to the waste chamber through the multiple first waste holes. The suction end of the high-pressure filter is connected to the waste chamber. The suction end of the vacuum device is connected to the adsorption cavity.

[0006] In one embodiment, the waste chamber is provided with a downwardly inclined guide ramp that extends to the bottom of the waste chamber.

[0007] In one embodiment, a waste discharge connector is connected at the bottom of the waste chamber adjacent to the guide ramp, and the waste discharge connector is connected to the suction end of the high-pressure filter.

[0008] In one embodiment, a portion of the second waste holes are distributed around the periphery of the processing platform, and a portion of the second waste holes are arranged in a row in the middle of the processing platform; the positions of the plurality of first waste holes correspond to the positions of the plurality of second waste holes.

[0009] In one embodiment, the second waste hole is an oblong or circular hole, and the interconnected second waste holes have the same shape as the first waste hole.

[0010] The beneficial effects of this utility model are as follows:

[0011] This invention enables the automatic collection and centralized discharge of discrete waste materials from the edges of PCB boards during the board splitting and cutting process, reducing waste cleaning work, improving the requirements of automated production processes, and increasing production efficiency. Furthermore, this invention can be combined with an automated transfer machine, reducing waste discharge issues for automated production, optimizing the processing flow of the entire production line, and reducing the footprint of the machine. Attached Figure Description

[0012] To more clearly illustrate the technical solution of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0013] Figure 1 This is a structural schematic diagram provided by an embodiment of the present utility model;

[0014] Figure 2 yes Figure 1 A top-view structural diagram;

[0015] Figure 3 yes Figure 1 A top-view structural diagram of the processing platform;

[0016] Figure 4 yes Figure 3 A schematic diagram of the AA-direction cross-section structure.

[0017] The attached figures are labeled as follows:

[0018] 10. Machine tools;

[0019] 20. Waste chamber; 21. Guide ramp; 22. Waste discharge joint;

[0020] 30. Processing platform; 31. Base plate; 32. Adsorption plate; 33. Adsorption chamber; 341. First waste hole; 342. Second waste hole; 35. Adsorption hole; 36. Vacuum connector;

[0021] 40. High-pressure filter. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0023] This utility model provides a galvanometer-based multi-dimensional laser cutting system, the implementation of which is as follows: Figure 1 and Figure 2 As shown, it includes a machine base 10, a high-pressure filter 40, and a vacuum device.

[0024] The machine tool 10 is mainly used for processing sheet metal and installing various major structural components, specifically as follows: Figure 1 , Figure 2 and Figure 4 As shown, this embodiment has a waste chamber 20 and a processing platform 30 on the machine tool 10.

[0025] The waste chamber 20 is mainly used for waste collection. Therefore, to facilitate the centralized collection of waste, such as... Figure 3 and Figure 4 As shown, in this embodiment, the waste chamber 20 is located below the processing platform 30 so that the waste generated after the board is processed on the processing platform 30 can fall into the waste chamber 20.

[0026] The processing platform 30 is mainly used for processing sheet metal and for collecting waste materials generated after processing, which then fall into the waste material chamber 20. Figure 3 and Figure 4 As shown, in this embodiment, the processing platform 30 includes a base plate 31 and an adsorption plate 32, so that the two work together to achieve the aforementioned purpose.

[0027] Specifically, at this time, the bottom plate 31 covers the waste chamber 20 to enclose the waste chamber 20 into a relatively closed space, and the surface of the bottom plate 31 opposite to the waste chamber 20 is provided with an adsorption chamber 33 and a plurality of first waste holes 341 passing through it; after adopting this arrangement, the adsorption chamber 33 and the waste chamber 20 will be in a non-conductive state, while the plurality of first waste holes 341 will be in a mutually conductive state with the waste chamber 20.

[0028] At this time, the adsorption plate 32 covers the surface of the bottom plate 31 where the adsorption cavity 33 is located. The adsorption plate 32 is provided with multiple adsorption holes 35 and second waste holes 342 that pass through it. The multiple adsorption holes 35 are all connected to the adsorption cavity 33. The multiple second waste holes 342 are respectively connected to the waste cavity 20 through multiple first waste holes 341.

[0029] With this setup, the upper surface of the adsorption plate 32 can be used to place the plate for processing. The waste generated during the plate processing can fall through multiple second waste holes 342 to multiple first waste holes 341, and then fall through multiple first waste holes 341 into the waste chamber 20, so that the waste is eventually collected in the waste chamber 20.

[0030] Regarding the high-pressure filter 40, its main function is to perform suction operation on the waste chamber 20. Therefore, in this embodiment, the suction end of the high-pressure filter 40 is connected to the waste chamber 20. At this time, if the plate is placed on the processing platform 30, the waste chamber 20 will form a negative pressure and suck up the waste on the surface of the processing platform 30 through the first waste hole 341 and the second waste hole 342, so that the waste is sucked into the waste chamber 20 for centralized collection.

[0031] Regarding the aforementioned vacuum equipment, its main function is to perform suction operations on the adsorption chamber 33. Therefore, in this embodiment, the suction end of the vacuum equipment is connected to the adsorption chamber 33, for example, from... Figure 4 It is known that the vacuum equipment can be connected to the vacuum connector 36, and the vacuum connector 36 is connected to the adsorption chamber 33. Therefore, if the board is placed on the processing platform 30, the vacuum equipment will form a negative pressure on the adsorption chamber 33 to adsorb the board through multiple adsorption holes 35, thereby fixing the current placement state of the board.

[0032] In order to facilitate the collection and gathering of waste in the waste chamber 20, such as Figure 4 As shown, in this embodiment, a guide ramp 21 is provided in the waste chamber 20, which is arranged downwardly and extends to the bottom of the waste chamber 20.

[0033] Therefore, after adopting this setting, the waste that falls into the waste chamber 20 will first fall onto the guide ramp 21, and then slide down to the bottom of the waste chamber 20 through the guide ramp 21, thereby realizing the collection of waste.

[0034] Moreover, as Figure 1 and Figure 4 As shown, this embodiment also has a waste discharge connector 22 connected to the bottom of the waste chamber 20 adjacent to the guide ramp 21, and the waste discharge connector 22 is connected to the suction end of the high pressure filter 40.

[0035] Therefore, with this setup, the waste discharge connector 22 will be arranged adjacent to the collected waste, which will facilitate the high-pressure filter 40 to better absorb and collect the waste.

[0036] In addition, to ensure the comprehensiveness of waste collection, such as Figure 3 and Figure 4As shown, in this embodiment, a portion of the second waste holes 342 are distributed around the periphery of the processing platform 30, and a portion of the second waste holes 342 are arranged in a row in the middle of the processing platform 30. Multiple first waste holes 341 are provided, each corresponding to one of the multiple second waste holes 342, thereby ensuring a wider and more comprehensive range of waste collection.

[0037] Furthermore, to ensure that waste material can be better delivered to the waste material chamber 20, the diameters of the second waste material hole 342 and the first waste material hole 341 should generally be appropriately enlarged. However, since the second waste material hole 342 and the first waste material hole 341 are widely distributed, some locations are not suitable for enlarging their diameters. Therefore, if... Figure 3 and Figure 4 As shown, the second waste hole 342 is an oblong or circular hole, and the second waste hole 342, which is interconnected with the first waste hole 341, has the same shape.

[0038] Therefore, by adopting this configuration, some of the second waste holes 342 and the first waste holes 341 can be set as waist-shaped holes to be distributed in locations with ample space, and some of the second waste holes 342 and the first waste holes 341 can be set as circular holes to be distributed in locations with limited available space, so as to better meet application requirements.

[0039] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.

Claims

1. A galvanometer-based multi-dimensional laser cutting system, characterized in that, This includes machine tools, high-pressure filters, and vacuum equipment; The machine tool is equipped with a waste chamber and a processing platform; The waste chamber is located below the processing platform; The processing platform includes a base plate and an adsorption plate; The bottom plate covers the waste chamber, and the surface of the bottom plate opposite to the waste chamber is provided with an adsorption chamber and a plurality of first waste holes that pass through it; The adsorption plate covers the surface of the base plate where the adsorption cavity is located. The adsorption plate has a plurality of adsorption holes and second waste holes that penetrate it. The plurality of adsorption holes are all connected to the adsorption cavity. The plurality of second waste holes are respectively connected to the waste cavity through the plurality of first waste holes. The suction end of the high-pressure filter is connected to the waste chamber; The suction end of the vacuum device is connected to the adsorption chamber.

2. The galvanometer-type multi-dimensional laser cutting system according to claim 1, characterized in that, The waste chamber is provided with a downwardly inclined guide ramp that extends to the bottom of the waste chamber.

3. The galvanometer-type multi-dimensional laser cutting system according to claim 2, characterized in that, A waste discharge connector is connected at the bottom of the waste chamber adjacent to the guide slope, and the waste discharge connector is connected to the suction end of the high-pressure filter.

4. The galvanometer-type multi-dimensional laser cutting system according to claim 1, characterized in that, A portion of the second waste holes are distributed around the periphery of the processing platform, and a portion of the second waste holes are arranged in a row in the middle of the processing platform; The positions of the plurality of first waste holes correspond to the positions of the plurality of second waste holes.

5. The galvanometer-type multi-dimensional laser cutting system according to claim 1, characterized in that, The second waste hole is an oblong or circular hole, and the second waste hole, which is interconnected with the first waste hole, has the same shape.

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