Semiconductive electric field equalizing tape

CN224548324UActive Publication Date: 2026-07-24ZHEJIANG MAXWEL INSULATION TECH CO LTD

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Patent Information

Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner: ZHEJIANG MAXWEL INSULATION TECH CO LTD
Filing Date: 2025-07-09
Publication Date: 2026-07-24

AI Technical Summary

Technical Problem

Traditional semiconductive tapes, because the pressure-sensitive adhesive layer is covered with release paper, cannot be rolled up layer by layer on the mandrel like ordinary transparent tapes, resulting in inconvenience in use.

Method used

A semi-conductive electric field equalization tape is designed, which is divided into two parts by setting a fracture line on the substrate layer. The first part is used to cover the electrical device, and the second part is used to be adhered and wound onto the mandrel layer by layer. The first part is wound up by using the adhesive layer of the second part. A conductive film and a voltage-sensitive adhesive layer are set on the outside of the substrate layer to form a stable electric field shield.

Benefits of technology

It achieves layer-by-layer winding of the tape and electric field shielding, while protecting the pressure-sensitive adhesive layer from damage. The second part can also be used as double-sided adhesive, reducing the volume of the tape roll structure.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the field of electric adhesive tapes, in particular to a semiconductive electric field balancing adhesive tape, which comprises an adhesive tape body, the adhesive tape body comprises an insulating base material layer, the base material layer is provided with a fracture line extending along the length direction of the base material layer, and the base material layer is divided into a first base material layer and a second base material layer through the fracture line in the width direction of the base material layer; a conductive pressure-sensitive adhesive layer and a first release paper are sequentially arranged on the inner side of the first base material layer in the thickness direction of the first base material layer; and a first adhesive layer is arranged on the inner side of the second base material layer. According to the scheme, the winding of the first layer part is realized through the layer-by-layer adhesion winding of the second layer part by virtue of the adhesion of the second layer part; thus, the pressure-sensitive adhesive layer of the adhesive tape body can be protected by the release paper (namely the first release paper), and the layer-by-layer adhesion winding of the adhesive tape body can be realized.

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