Solid phase substrate and biochip
CN224548422UActive Publication Date: 2026-07-24SHENZHEN ZHENMAI BIOTECHNOLOGY CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN ZHENMAI BIOTECHNOLOGY CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-07-24
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Figure CN224548422U_ABST
Abstract
The utility model discloses a solid phase substrate and biochip. One surface of solid phase substrate is equipped with multiple interval arrangement marks, and each mark includes the first mark line along the first direction extension, and the second mark line along the second direction extension and the intersection with first mark line, and the end of first mark line and second mark line all are located in the edge of solid phase substrate. The utility model implementation's solid phase substrate, because the end of first mark line and second mark line all are located in the edge of solid phase substrate, multiple marks interval arrangement, compared with the mark line of through solid phase substrate, has reduced the area that mark has occupied on solid phase substrate surface, thereby reduced the flux loss of biochip in gene sequencing.
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