PCB film pasting pretreatment device

Abstract

The utility model discloses a kind of PCB film pasting pretreatment devices, including rack, upper plate assembly, conveying assembly and processing assembly sequentially arranged on the rack, the upper plate assembly includes grabbing mechanism, the conveying assembly includes conveying rail, the grabbing mechanism can grab board piece to the conveying rail, the processing assembly includes closed cavity and be located in the plasma generator in the closed cavity, one end of the conveying rail is inserted into the closed cavity, the plasma generator is located above the conveying rail, the plasma generator can be roughened to the board piece processing. Adopt the utility model, PCB surface can be roughened to improve the adhesion of diaphragm and module surface, reduce product failure rate, improve product quality and production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of LED production technology, and in particular to a PCB film pretreatment device. Background Technology

[0002] In the LED manufacturing industry, reliable adhesion between the LED and PCB film and the module surface is crucial for ensuring product performance and appearance quality. Currently, the industry commonly uses two pretreatment methods: direct surface bonding and manual wiping. However, these traditional methods have significant drawbacks: ① Direct surface bonding lacks effective surface treatment of the module, relying solely on physical adsorption or simple chemical bonding between the film and the substrate, resulting in weak adhesion. During subsequent use, the film is prone to detachment due to temperature changes, mechanical stress, and other factors, severely affecting product stability and lifespan; ② Manual wiping relies on manual operation, which is not only time-consuming and labor-intensive but also difficult to meet the needs of large-scale production. Furthermore, the speed of manual pretreatment is incompatible with automated production lines, becoming a bottleneck restricting production efficiency. These problems easily lead to uneven product surfaces and loose film adhesion, severely damaging customer perception and reducing market competitiveness. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a PCB film pretreatment device that can roughen the PCB surface to improve the adhesion between the film and the module surface, reduce the product defect rate, and improve product quality and production efficiency.

[0004] To solve the above-mentioned technical problems, this utility model provides a PCB film-applying pretreatment device, including a frame, an upper board assembly, a conveying assembly and a processing assembly arranged sequentially on the frame, the upper board assembly including a gripping mechanism, the conveying assembly including a conveying rail, and the gripping mechanism being able to grip the board onto the conveying rail.

[0005] The processing assembly includes a sealed cavity and a plasma generator disposed within the sealed cavity. One end of the conveyor rail extends into the sealed cavity, and the plasma generator is located above the conveyor rail. The plasma generator is capable of roughening the plate.

[0006] As an improvement to the above solution, the sealed cavity is provided with an air inlet and an air outlet on its side. The air inlet is connected to an external gas flow control system, and the air outlet is connected to an exhaust gas treatment system.

[0007] As an improvement to the above solution, the processing component further includes a fixing bracket, the upper part of the plasma generator is fixed on the fixing bracket, and the lower part of the plasma generator is arranged facing downwards.

[0008] As an improvement to the above solution, the gripping mechanism includes a robotic arm, a gripping disc on the robotic arm, and a suction cup on the gripping disc. The bottom of the robotic arm is connected to the frame, the gripping disc is connected to the end of the robotic arm, and the suction cup is arranged on the edge of the gripping disc and connected to an external vacuum pump.

[0009] As an improvement to the above solution, the upper plate assembly further includes a first detection element, which is disposed on the frame and has its detection port facing the plate on the conveyor rail.

[0010] As an improvement to the above solution, the number of conveyor rails is two and they are arranged in parallel. The two sides of the plate can be placed on the two conveyor rails respectively. The outer side of the conveyor rails is provided with guardrails made of transparent material.

[0011] As an improvement to the above solution, a positioning component is provided between the two conveying rails. The number of positioning components is two and they are arranged sequentially along the conveying rails. The positioning component includes a positioning drive and a positioning block. The positioning drive is located below the two conveying rails. The two positioning drives can drive the two positioning blocks to move closer or further away from each other. The positioning blocks can abut against the edge of the plate.

[0012] As an improvement to the above solution, the PCB film-applying pretreatment device further includes a lifting assembly, which includes a lifting drive and a lifting plate. The lower side of the lifting plate is connected to the lifting drive, and the upper side of the lifting plate is fixedly connected to the positioning drive. The lifting drive can drive the positioning drive to move up and down through the lifting plate.

[0013] As an improvement to the above solution, the side of the conveyor rail is provided with a plurality of limiting blocks, the limiting blocks are slidably connected to the frame, and the inner side of the limiting blocks can abut against the edge of the plate.

[0014] As an improvement to the above solution, the sealed cavity is provided with a pressure detection device for detecting the air pressure inside the sealed cavity and a temperature detection device for detecting the temperature inside the sealed cavity.

[0015] Implementing this utility model has the following beneficial effects:

[0016] This utility model relates to a PCB pre-treatment device for film lamination, comprising a loading assembly, a conveying assembly, and a processing assembly. The gripping mechanism of the loading assembly places the PCB board to be processed onto the conveyor rail of the conveying assembly, which then feeds the PCB board into the processing assembly. The processing assembly includes a sealed cavity and a plasma generator disposed within the sealed cavity. After the PCB board enters the sealed cavity, the plasma generator directly acts on the board surface, significantly improving surface roughness and chemical activity through high-energy particle bombardment and chemical activation, thereby enhancing the adhesion of the subsequent film lamination. Therefore, this utility model can roughen the PCB surface to improve the adhesion between the film and the module surface, reduce product defect rate, and improve product quality and production efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the PCB film pretreatment device of this utility model;

[0018] Figure 2 This is a partial structural schematic diagram of the upper plate assembly of this utility model;

[0019] Figure 3 This is a top view of the conveying component and positioning component of this utility model;

[0020] Figure 4 This is a structural schematic diagram of the positioning component and lifting component of this utility model. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the following will describe this utility model in further detail with reference to the accompanying drawings. It is hereby declared that the terms "up," "down," "left," "right," "front," "back," "inner," and "outer," etc., appearing or about to appear in this document, are based solely on the accompanying drawings and are not intended to specifically limit this utility model.

[0022] See Figure 1 This utility model discloses a PCB pre-treatment device, including a frame 1, an upper plate assembly 2, a conveying assembly 3, and a processing assembly 4 sequentially arranged on the frame 1. The upper plate assembly 2 is used to load PCB boards 7, the conveying assembly 3 is used to convey the PCB boards 7, and the processing assembly 4 is capable of performing surface treatment on the PCB boards 7. The upper plate assembly 2 includes a gripping mechanism 21, and the conveying assembly 3 includes a conveying rail 31. The gripping mechanism 21 can grip the boards 7 onto the conveying rail 31. Specifically, the gripping mechanism 21 of the upper plate assembly 2 grips the boards 7 by vacuum adsorption or flexible clamping and transfers them onto the conveying rail 31 of the conveying assembly 3.

[0023] The processing component 4 includes a sealed cavity 41 and a plasma generator 42 disposed within the sealed cavity 41. One end of the conveyor rail 31 extends into the sealed cavity 41, allowing the plate 7 to continuously enter the processing area. The plasma generator 42 is located above the conveyor rail 31 and can roughen the plate 7. The plasma stream generated by the plasma generator acts perpendicularly on the surface of the plate 7. Through the physical bombardment and chemical activation of high-energy particles, a uniform micro-rough structure is formed on the surface of the plate 7, while removing surface contaminants, thereby significantly improving the adhesion strength of subsequent film application.

[0024] The beneficial effects of this utility model embodiment are as follows:

[0025] This utility model's PCB pre-treatment device includes an upper board assembly 2, a conveying assembly 3, and a processing assembly 4. The gripping mechanism 21 of the upper board assembly 2 can place the PCB board 7 to be processed onto the conveying rail 31 of the conveying assembly 3. The conveying rail 31 then feeds the PCB board 7 into the processing assembly 4. The processing assembly 4 includes a sealed cavity 41 and a plasma generator 42 disposed within the sealed cavity 41. After the PCB board 7 enters the sealed cavity 41, the plasma generator 42 can directly act on the surface of the board 7. Through high-energy particle bombardment and chemical activation, the surface roughness and chemical activity are significantly improved, enhancing the adhesion of the subsequent film application. Therefore, this utility model can roughen the PCB surface to improve the adhesion between the film and the module surface, reduce the product defect rate, and improve product quality and production efficiency.

[0026] See Figure 1 The sealed cavity 41 has an air inlet 411 and an air outlet 412 on its side. The air inlet 411 is connected to an external gas flow control system. The gas flow control system precisely adjusts the input ratio and flow rate of process gases (such as argon, oxygen, or mixed gases) to ensure the controllability of the plasma reaction environment and avoid energy waste caused by excessive gas. The air outlet 412 is connected to a waste gas treatment system to centrally purify volatile organic compounds and byproducts generated during the treatment process, preventing the direct emission of harmful gases and environmental pollution. This design overcomes the problems of gas escape and insufficient pollution control in traditional open plasma treatment equipment, achieving clean production.

[0027] The processing component 4 also includes a fixing bracket 43, on which the upper part of the plasma generator 42 is fixed, and the lower part of the plasma generator 42 is arranged downwards. The fixing bracket 43 rigidly connects the plasma generator 42 to the top of the sealed cavity 41 to avoid displacement deviation caused by vibration during equipment operation.

[0028] See Figure 2 The gripping mechanism 21 includes a robotic arm 211, a gripping disc 212 mounted on the robotic arm 211, and suction cups 213 mounted on the gripping disc 212. The bottom of the robotic arm 211 is connected to the frame 1. The robotic arm 211 drives the gripping disc 212 through multi-axis motion to achieve precise movement in three-dimensional space. The gripping disc 212 is connected to the end of the robotic arm 211. The suction cups 213 are arranged on the edge of the gripping disc 212 and connected to an external vacuum pump. The suction cups 213 distributed on the edge of the gripping disc 212 generate uniform adsorption force under the action of the vacuum pump, adapting to the gripping needs of boards 7 of different sizes. The layout design of the suction cups 213 avoids the gripping failure caused by the deformation of the board 7 in the traditional center adsorption method, and is especially suitable for thin or flexible PCB boards 7, ensuring that the board 7 does not slip or get damaged during transportation.

[0029] The upper plate assembly 2 also includes a first detection element 22, which is mounted on the frame 1. The detection port of the first detection element 22 faces the plate 7 on the conveyor rail 31. The first detection element 22 monitors the position and attitude of the plate 7 on the conveyor rail 31 in real time using an optical or laser sensor and feeds the data back to the control system. When the plate 7 is detected to be offset or tilted, the system automatically adjusts the gripping path of the robotic arm 211 or triggers a correction mechanism to ensure that the plate 7 is in a preset precise position before entering the sealed cavity 41.

[0030] See Figure 3 The conveyor rails 31 are arranged in parallel, and the two sides of the plate 7 can be placed on the two conveyor rails 31 respectively. Compared with the defect of traditional single-rail transmission which is prone to plate 7 shifting, the double-rail structure allows the two sides of the plate 7 to be stably placed on the two conveyor rails 31 respectively, effectively improving the stability of transportation. The outer side of the conveyor rails 31 is provided with guardrails 32, which are made of transparent material (such as high-strength acrylic), which can not only prevent the plate 7 from slipping, but also realize the visual monitoring of the transportation process, making it easy for operators to detect abnormalities in time.

[0031] See Figure 1 and Figure 4Before surface treatment, the plate 7 needs to be centered and positioned to ensure the accuracy of the surface treatment. To achieve this centering and positioning, a positioning assembly 5 is provided between the two conveyor rails 31. Two positioning assemblies 5 are arranged sequentially along the conveyor rails 31. Each positioning assembly 5 includes a positioning drive 51 and a positioning block 52. The positioning drive 51 is located below the two conveyor rails 31, hidden in the space below, saving installation space and avoiding interference with material transport. The two positioning drive assemblies 51 can drive the two positioning blocks 52 to move closer or further apart, allowing the positioning blocks 52 to abut against the edge of the plate 7. The two positioning drive assemblies 51 can independently control the corresponding positioning blocks 52 to move towards or away from each other, ensuring precise contact between the positioning blocks 52 and the edge of the plate 7. This achieves automatic centering and positioning of plates 7 of different sizes, solving the problems of low efficiency and poor accuracy associated with manual adjustment.

[0032] The PCB film-applying pretreatment device further includes a lifting assembly 6, which includes a lifting drive 61 and a lifting plate 62. The lower side of the lifting plate 62 is connected to the lifting drive 61, and the upper side of the lifting plate 62 is fixedly connected to the positioning drive 51. The lifting drive 61 can drive the positioning drive 51 to move up and down via the lifting plate 62. When centering is required, the lifting drive 61 drives the lifting plate 62 to rise. At this time, the positioning block 52 extends above the conveyor rail 31 and can abut against the edge of the board 7. The positioning drive 51 then drives the corresponding positioning blocks 52 to move closer together, thereby centering the board 7. After centering is completed, the positioning drive 51 drives the corresponding positioning blocks 52 to move away from each other. Then, the lifting drive 61 drives the positioning drive 51 and the positioning blocks 52 to descend, avoiding affecting the subsequent movement of the board 7.

[0033] The side of the conveyor rail 31 is provided with multiple limiting blocks 33, which are slidably connected to the frame 1. The inner side of the limiting block 33 can abut against the edge of the plate 7. The limiting blocks 33 ensure that the plate 7 always moves centered along the preset path during transportation, solving the problem of material deviation or jamming caused by traditional fixed limiting. The limiting blocks 33 are slidably connected to the frame 1 through slide grooves or guide rails, and the operator can freely adjust the spacing of the limiting blocks 33 along the conveying direction according to the size of the plate 7. The inner side of the limiting block 33 abuts against the edge of the plate 7, and the elastic buffer layer (such as rubber or silicone) avoids rigid contact damage to the surface of the plate 7.

[0034] The sealed cavity 41 is equipped with a pressure sensor 413 for detecting the air pressure inside the sealed cavity 41 and a temperature sensor 414 for detecting the temperature inside the sealed cavity 41. The pressure sensor 413 is installed at the top of the cavity, and the temperature sensors 414 are distributed on the side walls of the cavity and near the processing area, achieving data redundancy verification through multi-point monitoring. The detection signals are transmitted to the control system in real time. When the air pressure or temperature deviates from the set threshold, the system automatically adjusts the air intake flow rate, exhaust rate, or the power of the plasma generator 42 to ensure that the roughening process is always in the optimal process state.

[0035] The above are preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.

Claims

1. A PCB pretreatment device for laminating film, characterized in that, The device includes a frame, an upper plate assembly, a conveying assembly, and a processing assembly sequentially arranged on the frame. The upper plate assembly includes a gripping mechanism, and the conveying assembly includes a conveying rail. The gripping mechanism is capable of gripping the plate onto the conveying rail. The processing assembly includes a sealed cavity and a plasma generator disposed within the sealed cavity. One end of the conveyor rail extends into the sealed cavity, and the plasma generator is located above the conveyor rail. The plasma generator is capable of roughening the plate.

2. The PCB film-applying pretreatment device according to claim 1, characterized in that, The sealed cavity is provided with an air inlet and an air outlet on its side. The air inlet is connected to an external gas flow control system, and the air outlet is connected to an exhaust gas treatment system.

3. The PCB film-applying pretreatment apparatus according to claim 1, characterized in that, The processing assembly also includes a fixed bracket, the upper part of the plasma generator is fixed on the fixed bracket, and the lower part of the plasma generator is arranged facing downwards.

4. The PCB film-applying pretreatment apparatus according to claim 1, characterized in that, The gripping mechanism includes a robotic arm, a gripping disc mounted on the robotic arm, and a suction cup mounted on the gripping disc. The bottom of the robotic arm is connected to the frame, the gripping disc is connected to the end of the robotic arm, and the suction cup is arranged on the edge of the gripping disc and connected to an external vacuum pump.

5. The PCB film-applying pretreatment apparatus according to claim 4, characterized in that, The upper plate assembly also includes a first detection element, which is disposed on the frame and has its detection port facing the plate on the conveyor rail.

6. The PCB film pretreatment apparatus according to claim 1, characterized in that, The number of conveyor rails is two and they are arranged in parallel. The two sides of the plate can be placed on the two conveyor rails respectively. The outer side of the conveyor rails is provided with guardrails made of transparent material.

7. The PCB film-applying pretreatment apparatus according to claim 6, characterized in that, A positioning component is provided between the two conveying rails. There are two positioning components arranged sequentially along the conveying rails. The positioning component includes a positioning drive and a positioning block. The positioning drive is located below the two conveying rails. The two positioning drives can drive the two positioning blocks to move closer or further away from each other. The positioning blocks can abut against the edge of the plate.

8. The PCB film-applying pretreatment apparatus according to claim 7, characterized in that, The PCB film application pretreatment device further includes a lifting assembly, which includes a lifting drive and a lifting plate. The lower side of the lifting plate is connected to the lifting drive, and the upper side of the lifting plate is fixedly connected to the positioning drive. The lifting drive can drive the positioning drive to move up and down through the lifting plate.

9. The PCB film-applying pretreatment apparatus according to claim 1, characterized in that, The side of the conveyor rail is provided with multiple limiting blocks, which are slidably connected to the frame, and the inner side of the limiting block can abut against the edge of the plate.

10. The PCB film-applying pretreatment apparatus according to claim 1, characterized in that, The sealed cavity is equipped with a pressure sensor for detecting the air pressure inside the sealed cavity and a temperature sensor for detecting the temperature inside the sealed cavity.

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