A compression-resistant surface mount capacitor

Abstract

The utility model discloses a kind of compression-resistant chip capacitors, including package, outer electrode mechanism and compression-resistant mechanism, wherein: outer electrode mechanism and compression-resistant mechanism are all arranged in package interior, the compression-resistant mechanism is arranged in the center of package interior, the outer electrode mechanism is arranged in the left and right sides of compression-resistant mechanism, the compression-resistant mechanism is composed of multiple up-and-down stacked sheet ceramic body combination, multiple the sheet ceramic body interior is all provided with inner electrode, two adjacent the inner electrode left and right staggered arrangement, the sheet ceramic body is in arc structure, the package upper wall is in the same arc structure with sheet ceramic body structure, by separating the traditional integrated ceramic electrolyte into multiple structures same sheet ceramic body, make it have higher compression resistance, simultaneously adopt arc structure, axial component force to pressure, on the basis of original, compression resistance is secondarily enhanced.

Description

Technical Field

[0001] This utility model relates to the field of surface mount capacitor technology, and in particular to a voltage-resistant surface mount capacitor. Background Technology

[0002] In the rapid development of electronic devices, surface mount capacitors, as key basic components, play a decisive role in the stability and reliability of the entire circuit system. With their significant advantages such as small size, ease of automated installation, and excellent high-frequency characteristics, surface mount capacitors are widely used in various electronic products, such as smartphones, tablets, wearable devices, and high-end industrial control equipment.

[0003] However, traditional surface mount capacitors currently have significant shortcomings in terms of voltage resistance, a problem that is becoming increasingly apparent in practical applications. In daily use, electronic devices inevitably suffer from various external forces such as impacts, pressure, and vibrations. When these forces are applied to traditional surface mount capacitors, due to limitations in their structural design and materials, the capacitors are prone to deformation and damage. From a materials perspective, the ceramic dielectric material of surface mount capacitors lacks sufficient toughness to buffer and disperse pressure when faced with large external forces, leading to cracks or even breakage of the dielectric layer. This causes a sharp decline in the capacitor's electrical performance, ultimately resulting in the failure of the entire circuit system.

[0004] Therefore, this application provides a voltage-resistant surface mount capacitor. Utility Model Content

[0005] This invention provides a pressure-resistant surface mount capacitor, which can solve the problem that traditional surface mount capacitors are easily deformed and damaged when subjected to external forces.

[0006] This utility model provides a voltage-resistant surface mount capacitor, comprising:

[0007] A surface mount capacitor includes a package, an external electrode mechanism, and a voltage-resistant mechanism. Both the external electrode mechanism and the voltage-resistant mechanism are located inside the package. The voltage-resistant mechanism is located at the center of the package, and the external electrode mechanism is located on the left and right sides of the voltage-resistant mechanism. The voltage-resistant mechanism is composed of multiple stacked thin ceramic sheets. Each of the thin ceramic sheets has an internal electrode, with two adjacent internal electrodes staggered left and right. The thin ceramic sheets have an arched structure, and the upper wall of the package has the same arched structure as the thin ceramic sheets.

[0008] In a pressure-resistant chip capacitor according to one embodiment of the present invention, the external electrode mechanism includes a nickel layer disposed on the outer wall of a thin ceramic body, an external electrode is fixedly installed inside the nickel layer, and one side of the internal electrode extends out of the interior of the thin ceramic body and is welded to the outer wall of the external electrode.

[0009] In a pressure-resistant chip capacitor according to one embodiment of the present invention, the bottom of the external electrode extends into the nickel layer, and its end is exposed 5mm outside the lower wall of the package.

[0010] In a pressure-resistant surface mount capacitor according to one embodiment of the present invention, a heat dissipation groove is provided on the lower wall of the package.

[0011] In a pressure-resistant chip capacitor according to one embodiment of the present invention, the upper wall of the thin ceramic body is provided with a plurality of symmetrically arranged protrusions, and the bottom of the thin ceramic body is provided with a connecting groove adapted to the protrusions.

[0012] In one embodiment of this utility model, the external electrode exposed on the bottom side of the package has an "L"-shaped / "J"-shaped / spherical structure.

[0013] The technical solution provided in this application embodiment can include the following beneficial effects: This application designs a pressure-resistant chip capacitor. By dividing the traditional integral ceramic electrolyte into multiple thin ceramic sheets with the same structure, and using a multi-layer thin ceramic sheet stacking process, when the capacitor is subjected to positive pressure, the pressure is transmitted layer by layer through each thin ceramic sheet, with each thin ceramic sheet only bearing a portion of the total pressure. Compared with the traditional integral ceramic body, the stacking design can significantly reduce the stress intensity of a single ceramic layer and reduce cracks caused by local stress exceeding the material limit. Especially when there is a slight deviation in pressure, each ceramic layer can adjust the direction of force through a small horizontal displacement, avoiding edge stress concentration caused by torque on the overall structure. At the same time, both the thin ceramic sheet and the package adopt an arched structure. When subjected to positive pressure, the arched structure decomposes the vertical pressure borne at the top into axial components along the tangent direction of the arch. These components are transmitted to the two side supports through the arch and are ultimately borne by the foundation. Compared to the characteristic of pressure concentration in the middle of a planar structure, an arch can transform concentrated loads into uniform pressure distributed along the entire arch, avoiding structural damage caused by excessive local stress. Even if the ceramic body breaks under pressure, after stacking and combining, even if a certain ceramic layer fails under pressure due to defects, other defect-free ceramic layers can still maintain structural integrity and avoid overall collapse.

[0014] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a structural schematic diagram of an embodiment of this application;

[0017] Figure 2 This is a half-sectional view of an embodiment of this application;

[0018] Figure 3 This is a schematic diagram of the anti-compression mechanism in the embodiments of this application;

[0019] Figure 4 This is a schematic diagram of the external electrode mechanism in an embodiment of this application. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0021] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0022] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0023] Example

[0024] like Figures 1 to 4 As shown, this application provides a voltage-resistant surface mount capacitor, comprising:

[0025] The surface mount capacitor 100 includes a package 10, an external electrode mechanism 20, and a pressure-resistant mechanism 30. The external electrode mechanism 20 and the pressure-resistant mechanism 30 are both located inside the package 10. The pressure-resistant mechanism 30 is located at the center inside the package 10, and the external electrode mechanism 20 is located on the left and right sides of the pressure-resistant mechanism 30. The pressure-resistant mechanism 30 is composed of multiple stacked thin ceramic bodies 31. Each of the multiple thin ceramic bodies 31 has an internal electrode 32. Two adjacent internal electrodes 32 are staggered. The thin ceramic bodies 31 have an arched structure, and the upper wall of the package 10 has the same arched structure as the thin ceramic bodies 31.

[0026] By adopting the above technical solution, the traditional integrated ceramic electrolyte is divided into multiple thin ceramic sheets 31 with identical structures. A multi-layer stacking process of these thin ceramic sheets 31 is used. When the capacitor is subjected to positive pressure, the pressure is transmitted layer by layer through each thin ceramic sheet 31. Each thin ceramic sheet 31 only bears a portion of the total pressure, which is evenly distributed according to the number of stacked layers. Compared to the traditional integrated ceramic body where pressure is concentrated in a single structure, the stacking design significantly reduces the stress intensity of a single ceramic layer, reducing cracks caused by local stress exceeding material limits. Especially when there is a slight pressure deviation, each ceramic layer can adjust the direction of force through a small horizontal displacement, avoiding edge stress concentration caused by torque on the overall structure. Furthermore, both the thin ceramic sheets 31 and the encapsulation body 10 adopt an arched structure. When subjected to positive pressure, the arched structure decomposes the vertical pressure at the top into axial components along the tangent of the arch. These components are transmitted to the two side supports through the arch and are ultimately borne by the foundation. Compared to planar structures like beams where pressure is concentrated in the middle, arches can transform concentrated loads into uniform pressure distributed along the entire arch, avoiding structural damage caused by excessive local stress. Even if the ceramic body breaks under pressure, after stacking and combining, even if a certain ceramic layer fails under pressure due to defects, other defect-free ceramic layers can still maintain structural integrity and avoid overall collapse.

[0027] In an optional embodiment, the external electrode mechanism 20 includes a nickel layer 21 disposed on the outer wall of the thin ceramic body 31. An external electrode 22 is fixedly installed inside the nickel layer 21. One side of the inner electrode 32 extends out of the interior of the thin ceramic body 31 and is welded to the outer wall of the external electrode 22. The bottom of the external electrode 22 extends out of the interior of the nickel layer 21, and its end is exposed 5mm on the lower wall of the package 10. The bottom exposed design replaces the traditional two-sided exposed structure, fundamentally avoiding the electrode peeling problem caused by lateral external force and ensuring the long-term conductivity reliability of the capacitor.

[0028] In an optional embodiment, the lower wall of the package 10 is provided with a heat dissipation groove 11. By providing the heat dissipation groove 11, there is still a gap between the chip capacitor and the circuit line after installation, and the heat dissipation is accelerated by natural convection, thus solving the heat dissipation bottleneck in high-density packaging scenarios.

[0029] In one optional embodiment, the upper wall of the thin ceramic body 31 is provided with a plurality of symmetrically arranged protrusions 33, and the bottom of the thin ceramic body 31 is provided with a connecting groove 34 that matches the protrusions 33. When multiple layers are stacked, precise positioning is achieved by the engagement of the protrusions 33 and the connecting groove 34, which simplifies the assembly process, ensures the alignment accuracy between layers, and avoids uneven stress distribution caused by misalignment.

[0030] In one alternative implementation, the external electrode 22 exposed on one side of the bottom of the package 10 has an "L"-shaped / "J"-shaped / spherical structure, which improves the mounting compatibility of the boost capacitor and meets the needs of diverse circuit layouts.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0032] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0035] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A voltage-resistant surface mount capacitor, characterized in that, include: A surface mount capacitor includes a package, an external electrode mechanism, and a voltage-resistant mechanism. Both the external electrode mechanism and the voltage-resistant mechanism are located inside the package. The voltage-resistant mechanism is located at the center of the package, and the external electrode mechanism is located on the left and right sides of the voltage-resistant mechanism. The voltage-resistant mechanism is composed of multiple stacked thin ceramic sheets. Each of the thin ceramic sheets has an internal electrode, with two adjacent internal electrodes staggered left and right. The thin ceramic sheets have an arched structure, and the upper wall of the package has the same arched structure as the thin ceramic sheets.

2. The voltage-resistant surface mount capacitor according to claim 1, characterized in that, The external electrode mechanism includes a nickel layer disposed on the outer wall of the thin ceramic sheet, an external electrode being fixedly installed inside the nickel layer, and one side of the internal electrode extending out of the interior of the thin ceramic sheet and welded to the outer wall of the external electrode.

3. A voltage-resistant surface mount capacitor according to claim 2, characterized in that, The bottom of the external electrode extends into the nickel layer, and its end protrudes 5 mm from the lower wall of the package.

4. A voltage-resistant surface mount capacitor according to claim 1, characterized in that, The lower wall of the package is provided with a heat dissipation groove.

5. A voltage-resistant surface mount capacitor according to claim 1, characterized in that, The upper wall of the thin ceramic sheet is provided with a plurality of symmetrically arranged protrusions, and the bottom of the thin ceramic sheet is provided with a connecting groove adapted to the protrusions.

6. A voltage-resistant surface mount capacitor according to claim 2, characterized in that, The external electrode exposed on one side of the bottom of the package has an "L" shape, "J" shape, or spherical structure.

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