Mounting and heat dissipation structure of film capacitor for motor controller
By integrally die-casting the thin-film capacitor mounting cavity within the motor controller housing and sharing the heat dissipation channel with the IGBT, the problems of long heat dissipation paths and low channel utilization of thin-film capacitors are solved, achieving efficient heat dissipation and cost reduction.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SICHUAN JIANAN IND
- Filing Date
- 2025-08-15
- Publication Date
- 2026-07-24
AI Technical Summary
Existing thin-film capacitors have long heat dissipation paths, resulting in low heat dissipation efficiency, complex and costly assembly processes, and water-cooling structures that are independent of IGBTs, leading to low water channel utilization.
The device employs a thin-film capacitor mounting cavity integrally die-cast within the motor controller housing, with a potting compound layer covering the capacitor's outer wall. A heat dissipation channel is positioned between the capacitor and the IGBT, sharing a common heat dissipation path, thus eliminating the need for a plastic shell and fixing bolts.
Shorten the heat dissipation path, improve water channel utilization, reduce capacitor temperature, extend life, simplify assembly process, and reduce material and energy costs.
Smart Images
Figure CN224554183U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of new energy vehicle controller technology, specifically to an installation and heat dissipation structure for a thin-film capacitor used in a motor controller. Background Technology
[0002] With the development of electric drive technology for new energy vehicles, motor controllers are evolving towards higher power density, lower cost, and longer lifespan. As a core component of the motor controller, the heat dissipation performance of film capacitors directly affects the controller's reliability.
[0003] Existing technologies have the following shortcomings: Traditional film capacitors mostly use independent plastic shells, fixed to the controller housing with bolts. This requires thermal grease to fill the gaps, and the heat dissipation path is "core → potting compound → plastic shell → thermal grease → housing," resulting in a long and inefficient heat dissipation path. Some film capacitors dissipate heat through a top water-cooling plate or surrounding water-cooling components, but the water-cooling structure is independent of the IGBT, leading to low water channel utilization. The assembly process is complex, requiring separate installation of the capacitor shell, application of thermal grease, and securing bolts, resulting in high material and process costs.
[0004] Therefore, there is an urgent need for a thin-film capacitor design that simplifies the structure, shortens the heat dissipation path, and improves the utilization rate of the water channel. Summary of the Invention
[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a mounting and heat dissipation structure for film capacitors used in motor controllers. This structure can shorten the heat dissipation path of the film capacitor and improve the utilization rate of the water channel.
[0006] The purpose of this utility model is achieved by the following solution: a mounting and heat dissipation structure for a thin-film capacitor for a motor controller, comprising a motor controller housing, a thin-film capacitor assembly, and a potting compound layer. The motor controller housing has an integrally die-cast thin-film capacitor mounting cavity, which opens to the top of the motor controller housing on one side. The thin-film capacitor assembly is disposed within the mounting cavity. The potting compound layer fills the space between the mounting cavity and the assembly, covering the outer wall of the assembly. A heat dissipation channel is provided within the motor controller housing, positioned between the thin-film capacitor assembly and the IGBT assembly. The heat dissipation channel is a hollow pipe, and heat is transferred between the thin-film capacitor assembly and the IGBT assembly through the heat dissipation channel.
[0007] The thin-film capacitor assembly includes a capacitor core and positive and negative input copper busbars and positive and negative output copper busbars connected to the capacitor core.
[0008] The motor controller housing is made of die-cast aluminum.
[0009] The potting compound layer is an epoxy resin potting compound.
[0010] The advantages of this utility model are: 1. Shortened heat dissipation path: The heat dissipation path is "film capacitor core → potting compound → motor controller housing and common heat dissipation channel", which reduces the "plastic shell → silicone grease" step compared with the traditional path, thereby reducing the temperature of the capacitor core and extending its life.
[0011] 2. Improved water channel utilization: IGBTs and film capacitors share the same heat dissipation water channel, saving space, reducing water resistance, eliminating the need for independent water cooling components, simplifying the structure and reducing energy consumption.
[0012] 3. Cost reduction and efficiency improvement: Eliminating the plastic shell, fixing bolts and thermal grease reduces the application of grease and the fastening process, thereby reducing material costs and improving assembly efficiency. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the structure of this utility model;
[0014] Figure 2 This is a schematic diagram of the motor controller housing structure;
[0015] Figure 3 This is a schematic diagram of a capacitor structure. Detailed Implementation
[0016] like Figures 1 to 3 As shown, a mounting and heat dissipation structure for a thin-film capacitor used in a motor controller includes a motor controller housing 1, a thin-film capacitor assembly, and a potting compound layer 5. The motor controller housing 1 is die-cast from aluminum. An integrally die-cast thin-film capacitor mounting cavity 2 is provided inside the motor controller housing 1, with an opening on one side facing upwards. The thin-film capacitor assembly is disposed within the mounting cavity 2. The potting compound layer 5 fills the space between the mounting cavity 2 and the thin-film capacitor assembly, covering the outer wall of the assembly. The potting compound layer 5 is epoxy resin potting compound. The thin-film capacitor assembly includes a capacitor core 6 and positive and negative input copper busbars 8 and positive and negative output copper busbars 7 connected to the capacitor core 6. A heat dissipation channel 3 is provided within the motor controller housing 1, positioned between the thin-film capacitor assembly and the IGBT assembly 4. The heat dissipation channel 3 is a hollow pipe, and heat is transferred between the thin-film capacitor assembly and the IGBT assembly 4 via the heat dissipation channel 3. The thin-film capacitor assembly and the IGBT assembly 4 share a heat dissipation channel, which reduces the heat dissipation path of the capacitor and saves the internal layout space of the motor controller housing 1.
[0017] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications made to the present utility model by those skilled in the art without departing from the spirit of the present utility model shall fall within the protection scope of the present utility model.
Claims
1. A mounting and heat dissipation structure for a thin-film capacitor for a motor controller, comprising a motor controller housing (1), a thin-film capacitor assembly, and a potting compound layer (5), wherein the interior of the motor controller housing (1) is provided with a thin-film capacitor mounting cavity (2) integrally die-cast with the motor controller housing (1), the thin-film capacitor mounting cavity (2) opening to the top of the motor controller housing (1) on one side, the thin-film capacitor assembly being disposed in the thin-film capacitor mounting cavity (2), the potting compound layer (5) filling the space between the thin-film capacitor mounting cavity (2) and the thin-film capacitor assembly, and the potting compound layer (5) covering the outer wall of the thin-film capacitor assembly, characterized in that: The motor controller housing (1) is provided with a heat dissipation channel (3), which is located between the thin film capacitor assembly and the IGBT assembly (4). The heat dissipation channel (3) is a hollow pipe, and the heat of the thin film capacitor assembly and the IGBT assembly (4) is transferred by the heat dissipation channel (3).
2. The mounting and heat dissipation structure for the thin-film capacitor used in the motor controller according to claim 1, characterized in that: The thin-film capacitor assembly includes a capacitor core (6) and positive and negative input copper busbars (8) and positive and negative output copper busbars (7) that are interconnected with the capacitor core (6).
3. The mounting and heat dissipation structure for the thin-film capacitor used in the motor controller according to claim 1, characterized in that: The motor controller housing (1) is formed by die casting of aluminum.
4. The mounting and heat dissipation structure for the thin-film capacitor used in the motor controller according to claim 1, characterized in that: The potting compound layer (5) is an epoxy resin potting compound.