A high-stability dry etching device

Abstract

The utility model discloses a kind of dry etching equipment of high stability, the utility model relates to the field of semiconductor manufacturing and microelectronic processing technology, including dry etching equipment main part and support seat, dry etching equipment main part top flange is connected with gas access passage, gas access passage passes through dry etching equipment main part top and is fixedly installed with gas supply assembly, the utility model is in at the advantage that: by smaller gas injection hole one in gas distribution disc bottom is set, and larger gas injection hole two is set at edge, so that the macropore of edge allows more gas to flow to edge, compensate the problem that edge airflow speed is fast, and residence time is short, to further improve edge etching rate, in addition, gas cell is set in gas injection hole two, in un-inflated state, gas cell distance barrel two one distance, airflow can pass through, when gas is filled in gas cell, the more gas filled in, gas cell expands greater, to be able to adjust the flow area of airflow in turn.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing and microelectronics processing technology, specifically a highly stable dry etching device. Background Technology

[0002] Dry etching machines are analytical instruments that utilize plasma for microfabrication and are widely used in semiconductors, MEMS, optoelectronic devices, and other fields. Their core working principle involves bombarding substrate materials with high-density plasma in a vacuum environment to achieve directional etching. However, existing dry etching equipment suffers from inconsistencies in cavity temperature, leading to inconsistent etching rates and uneven etching depths at different locations on the wafer, thus causing process stability issues.

[0003] The applicant discovered through a search that a Chinese patent discloses "a dry etching device" with publication number "CN219267610U". This patent mainly adjusts the opening area of ​​the outermost spray hole by rotating the drive component and the flow limiting plate. However, the rotatable flow limiting plate has the risk of poor sealing. Therefore, we propose a dry etching device with high stability. Utility Model Content

[0004] The purpose of this invention is to provide a highly stable dry etching device.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a highly stable dry etching apparatus, comprising a dry etching apparatus body and a support base, wherein a gas inlet channel is connected to the top flange of the dry etching apparatus body, and a gas supply component is fixedly installed through the top of the dry etching apparatus body.

[0006] The gas supply assembly includes a gas distribution plate. Two gas nozzles are arranged circumferentially at the bottom edge of the gas distribution plate. A cylinder is fixedly connected to each of the two gas nozzles. A cylinder is fixedly connected to the bottom of each cylinder. A hollow connecting frame is fixedly connected to the inner side of each cylinder. An air bladder is provided at the bottom of the hollow connecting frame. The air bladder is located below the inner side of the cylinder. The gas supply assembly is used to adjust the opening size of the two gas nozzles while gas is introduced.

[0007] As a further embodiment of this utility model: a vacuum pipe is provided at one end of the top side of the dry etching equipment body, and the vacuum pipe is connected to an external vacuum pump.

[0008] As a further embodiment of this utility model: a first gas nozzle is arranged in a circumferential direction on the bottom side of the gas distribution disk, and the diameter of the first gas nozzle is smaller than that of the second gas nozzle.

[0009] As a further embodiment of this utility model: the diameter of the second hole in the cylinder is larger than the diameter of the first hole in the cylinder, and an annular sealing groove is provided on the lower inner wall of the second cylinder, and the airbag is a certain distance away from the annular sealing groove when it is not inflated.

[0010] As a further embodiment of this utility model: an air inlet / outlet channel is provided on one side of the bottom of the airbag, and a gas pipeline is provided at the bottom of the air inlet / outlet channel, and the gas pipeline is connected to an external pressure control unit.

[0011] As a further embodiment of this utility model: arc-shaped sealing elements are provided on both the upper and lower sides of the outer surface of the airbag. When the airbag is inflated, the arc-shaped sealing elements abut against the annular sealing groove and protrude a portion to the bottom of the cylinder.

[0012] As a further embodiment of this utility model: the support base is provided with partition plates arranged in concentric circles on the inner side, the partition plates divide the support base into three areas, each partition plate is provided with a heating element, and each partition plate is embedded with a temperature sensor corresponding to the heating element partition, and the temperature sensor is connected to an external controller.

[0013] Compared with the prior art, the beneficial effects of this utility model by adopting the above technical solution are as follows:

[0014] 1. This utility model provides a smaller gas nozzle at the bottom of the gas distribution plate and a larger gas nozzle at the edge. This allows more gas to flow to the edge, compensating for the problem of high airflow speed and short residence time at the edge, thereby improving the edge etching rate. In addition, an air bladder is provided inside the second gas nozzle. In the uninflated state, the air bladder is a distance away from the second cylinder, allowing airflow to pass through. When the air bladder is filled with gas, the more gas is filled, the larger the air bladder expands, thereby adjusting the airflow area. This is better than the prior art which requires consideration of sealing issues.

[0015] 2. This utility model divides the support base into a central area, an edge area, and an outermost area by setting two concentric ring-shaped partitions. The zoned temperature control can compensate for the heat loss at the edge of the cavity, ensuring that the wafer maintains a constant temperature during the etching process and improving the etching uniformity.

[0016] Other advantages, objectives and features of this invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination or study, or may be taught from the practice of this invention. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure in an embodiment of this utility model;

[0018] Figure 2 This is a schematic diagram of the interior of the vacuum cavity in an embodiment of this utility model;

[0019] Figure 3 This is a partial cross-sectional view of the gas supply component in an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of cylinder body one and cylinder body two in an embodiment of this utility model;

[0021] Figure 5 This is a cross-sectional view of the airbag in an embodiment of this utility model.

[0022] In the diagram: 1. Main body of dry etching equipment; 2. Vacuum pipeline; 3. Gas inlet channel; 4. Gas supply assembly; 41. Gas distribution plate; 42. Gas nozzle one; 43. Gas nozzle two; 44. Cylinder one; 45. Cylinder two; 451. Annular sealing groove; 46. Hollowed-out connecting frame; 47. Airbag; 471. Inlet and outlet gas channels; 472. Gas pipeline; 473. Arc-shaped seal; 5. Support base; 51. Partition plate; 52. Heating element. Detailed Implementation

[0023] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be noted that the description of these embodiments is for the purpose of helping to understand this utility model, but does not constitute a limitation on this utility model.

[0024] Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0025] Please see the appendix Figure 1 - Appendix Figure 5 This utility model discloses a high-stability dry etching equipment, including a dry etching equipment body 1 and a support base 5. A vacuum pipe 2 is provided at one end of the top side of the dry etching equipment body 1. The vacuum pipe 2 is connected to an external vacuum pump. A gas inlet channel 3 is connected to the top flange of the dry etching equipment body 1. The gas inlet channel 3 passes through the top of the dry etching equipment body 1 and a gas supply component 4 is fixedly installed thereon.

[0026] In Embodiment 1, the gas supply assembly 4 includes a gas distribution plate 41. Gas nozzles 43 are arranged circumferentially at the bottom edge of the gas distribution plate 41. A cylinder 44 is fixedly connected to each of the gas nozzles 43. A cylinder 45 is fixedly connected to the bottom of each cylinder 44. A hollow connecting frame 46 is fixedly connected to the inner side of each cylinder 44. An air bladder 47 is provided at the bottom of the hollow connecting frame 46. The air bladder 47 is located below the inner side of the cylinder 45. The gas supply assembly 4 is used to adjust the opening size of the gas nozzles 43 while gas is introduced.

[0027] Specifically, gas nozzles 42 are arranged in a circular direction on the bottom middle side of the gas distribution plate 41. The diameter of gas nozzle 42 is smaller than that of gas nozzle 43. The diameter of cylinder 45 is larger than that of cylinder 44. An annular sealing groove 451 is provided on the inner wall below cylinder 45. The airbag 47 is a certain distance away from the annular sealing groove 451 when it is not inflated.

[0028] In this embodiment, when the airbag 47 is not inflated, it is a certain distance away from the cylinder 45, allowing airflow to pass through.

[0029] An air inlet / outlet channel 471 is provided on one side of the bottom of the airbag 47, and a gas pipe 472 is provided at the bottom of the air inlet / outlet channel 471. The gas pipe 472 is connected to an external pressure control unit.

[0030] In this embodiment, during inflation, the pressure control unit injects gas into the airbag 47 through a one-way valve to expand it. When the airbag 47 retracts, the pressure control unit closes the inflation valve and opens the degassing valve to extract the gas from the airbag 47.

[0031] The upper and lower sides of the outer surface of the airbag 47 are provided with arc-shaped sealing elements 473. When the airbag 47 is inflated, the arc-shaped sealing elements 473 abut against the annular sealing groove 451 and protrude a portion to the bottom of the cylinder 45.

[0032] In this embodiment, when the airbag 47 inflates, the arc-shaped seal 473 abuts against the annular sealing groove 451, achieving a sealing closure.

[0033] In the second embodiment, partition plates 51 are arranged in concentric circles on the inner side of the support base 5, dividing the support base 5 into three areas. Each partition plate 51 is equipped with a heating element 52, and a temperature sensor corresponding to the heating element 52 is embedded between the partition plates 51. The temperature sensor is connected to an external controller, which is a PLC controller.

[0034] In this embodiment, two concentric ring-shaped partition plates 51 are provided in the support base 5 to divide it into a central area, an edge area and an outermost area. The partitioned temperature control can compensate for the heat loss at the edge of the cavity, ensure that the wafer maintains a constant temperature during the etching process and improve the etching uniformity.

[0035] Working principle: The sample is placed on the support 5 and the chamber is sealed. Then, the chamber is evacuated through the vacuum pipe 2 and an external vacuum pump. Next, the reactive gas is precisely injected into the chamber through the gas inlet channel 3. When the gas enters the gas distribution disk 41, the gas can enter the chamber through the gas nozzle 1 42 and the gas nozzle 2 43. When more reactive gas needs to be delivered, the gas flow area of ​​the gas nozzle 2 43 can be adjusted to accelerate the edge etching rate and match it with the center. That is, the gas is injected into the gas bag 47 through the pressure control system. By controlling the gas pressure, the distance between the gas bag 47 and the cylinder 2 45 can be adjusted, thereby adjusting the air flow area. The support 5 controls the wafer temperature at the target value by heating. When the process parameters reach the stable preset value, etching can begin.

[0036] The terms "front," "back," "left," "right," "top," and "bottom" all refer to the figures in the accompanying drawings. Figure 1 Based on.

[0037] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this utility model.

[0038] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments.

[0039] For those skilled in the art, various changes, modifications, substitutions, and alterations to these embodiments without departing from the principles and spirit of this utility model will still fall within the protection scope of this utility model.

Claims

1. A highly stable dry etching apparatus, comprising a dry etching apparatus body (1) and a support base (5), characterized in that: The top flange of the dry etching equipment body (1) is connected to a gas inlet channel (3), which passes through the top of the dry etching equipment body (1) and is fixedly installed with a gas supply component (4); The gas supply component (4) includes a gas distribution plate (41). Gas nozzles (43) are arranged in a circular direction at the bottom edge of the gas distribution plate (41). A cylinder (44) is fixedly connected inside each of the gas nozzles (43). A cylinder (45) is fixedly connected to the bottom of each cylinder (44). A hollow connecting frame (46) is fixedly connected to the inner side of each cylinder (44). An air bag (47) is provided at the bottom of the hollow connecting frame (46). The air bag (47) is located below the inner side of the cylinder (45). The gas supply component (4) is used to adjust the opening size of the gas nozzles (43) while gas is introduced.

2. The high-stability dry etching equipment according to claim 1, characterized in that: The dry etching equipment body (1) has a vacuum pipe (2) at one end of its top side, and the vacuum pipe (2) is connected to an external vacuum pump.

3. The high-stability dry etching apparatus according to claim 1, characterized in that: Gas nozzles (42) are arranged in a circumferential direction on the bottom middle side of the gas distribution disk (41), and the diameter of the gas nozzles (42) is smaller than that of the gas nozzles (43).

4. The high-stability dry etching equipment according to claim 1, characterized in that: The diameter of the second cylinder (45) is larger than that of the first cylinder (44). An annular sealing groove (451) is provided on the lower inner wall of the second cylinder (45). The airbag (47) is a certain distance away from the annular sealing groove (451) when it is not inflated.

5. The high-stability dry etching apparatus according to claim 1, characterized in that: The airbag (47) has an air inlet / outlet channel (471) on one side of its bottom, and a gas pipe (472) is provided at the bottom of the air inlet / outlet channel (471). The gas pipe (472) is connected to an external pressure control unit.

6. The high-stability dry etching apparatus according to claim 1, characterized in that: The upper and lower sides of the outer surface of the airbag (47) are provided with arc-shaped sealing elements (473). When the airbag (47) is inflated, the arc-shaped sealing elements (473) abut against the annular sealing groove (451) and protrude a portion to the bottom of the cylinder (45).

7. The high-stability dry etching apparatus according to claim 1, characterized in that: The support base (5) is provided with partition plates (51) arranged in concentric circles on the inner side. The partition plates (51) divide the support base (5) into three areas. Each partition plate (51) is provided with a heating element (52). Each partition plate (51) is embedded with a temperature sensor corresponding to the partition of the heating element (52), and the temperature sensor is connected to an external controller.

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