High-sealing vector type frequency converter

Abstract

The utility model discloses a kind of high sealing vector type frequency converters, including shell, the front of the shell is provided with sealing assembly, the inside of the shell is provided with heat dissipation assembly, the heat dissipation assembly includes two side heat conduction plates and heat conduction fin, the inside side of the side heat conduction plate and heat conduction fin is fixedly installed with back heat conduction plate, left and right two side heat conduction plates are fixedly installed in the left and right inner walls of shell respectively, the back heat conduction plate is located at the back of shell, the sealing assembly includes shell cover, the shell cover is attached to the front of shell, the utility model relates to vector type frequency converter technical field;The high sealing vector type frequency converter, the high sealing vector type frequency converter, by setting sealing assembly, shell cover is fixedly connected with shell by bolt, cooperates sealing gasket to realize the effective sealing of shell front, prevent external dust, moisture etc. Into shell interior, guarantee the high sealing performance of equipment.

Description

Technical Field

[0001] This utility model relates to the field of vector inverter technology, specifically a high-sealing vector inverter. Background Technology

[0002] Vector inverters are widely used power electronic devices that achieve precise speed regulation of motors through vector control technology. In many industrial environments, inverters need to operate in environments with a lot of dust, high humidity, or corrosive gases, which places high demands on the sealing performance of the inverters.

[0003] However, existing vector frequency converters often face a contradiction between sealing performance and heat dissipation: reducing heat dissipation holes to improve sealing performance will lead to heat accumulation inside the equipment, affecting operational stability and service life; while increasing heat dissipation structure may reduce the sealing performance of the equipment, allowing external contaminants to enter the equipment and affecting the normal operation of electrical components.

[0004] Therefore, this utility model provides a high-sealing vector inverter to solve the above problems. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a high-sealing vector inverter, which solves the aforementioned problems.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-sealing vector inverter, comprising a housing, a sealing assembly on the front of the housing, and a heat dissipation assembly inside the housing, the heat dissipation assembly comprising two side heat-conducting plates and heat-conducting fins, the two side heat-conducting plates being fixedly installed on the left and right sides of the front of the heat-conducting fins respectively, a back heat-conducting plate being fixedly installed on the inner side of both the side heat-conducting plates and the heat-conducting fins, the left and right side heat-conducting plates being fixedly installed on the left and right inner walls of the housing respectively, the back heat-conducting plate being located on the back of the housing, and the sealing assembly comprising a cover, the cover being fitted to the front of the housing.

[0007] Preferably, a semiconductor cooling plate is fixedly installed on the back of the back heat-conducting plate, the semiconductor cooling plate and the back heat-conducting plate are in contact with each other, a back shell is fixedly installed on the back of the semiconductor cooling plate, and heat dissipation holes are opened inside the back shell.

[0008] Preferably, a bracket is fixedly installed inside the heat dissipation hole, a heat dissipation motor is fixedly installed on the back of the bracket, and a heat dissipation fan is fixedly installed at the output end of the heat dissipation motor.

[0009] Preferably, the back shell has connecting slots on both the left and right sides, the connecting slots connecting the outside to the inside of the heat dissipation hole, and the connection between the connecting slots and the heat dissipation hole is located between the semiconductor cooling plate and the cooling fan.

[0010] Preferably, multiple fixing plates are fixedly installed on the outer side of the shell cover, and multiple fixing blocks are fixedly installed on the outer side of the front of the shell. The fixing plates are located on the front of the corresponding fixing blocks. Mounting holes are opened inside the fixing plates and fixing blocks. Bolts are fixedly installed inside the corresponding mounting holes at the front and rear. The front and rear fixing plates and fixing blocks are fixedly connected by bolts.

[0011] Preferably, a sealing gasket is fixedly installed on the back of the shell cover, and the back of the sealing gasket is attached to the front of the shell.

[0012] Beneficial effects

[0013] This invention provides a high-sealing vector inverter. Compared with the prior art, it has the following advantages:

[0014] Beneficial effects:

[0015] 1. This high-sealing vector inverter features a sealing assembly. The cover is fixed to the housing with bolts, and together with the sealing gasket, it achieves an effective seal on the front of the housing, preventing external dust, moisture, and other contaminants from entering the housing and ensuring the high sealing performance of the equipment.

[0016] 2. This high-sealing vector inverter, by setting up heat dissipation components, uses side heat-conducting plates, heat-conducting fins and back heat-conducting plates to conduct heat inside the housing to the semiconductor cooling plate. The semiconductor cooling plate transfers the heat to the back housing, and then the heat dissipation motor drives the cooling fan to dissipate the heat to the outside through the connecting slot, thus achieving efficient heat dissipation while ensuring sealing performance. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a perspective view of the external structure of this utility model;

[0019] Figure 2 This is a three-dimensional view of the back structure of this utility model;

[0020] Figure 3 This is a three-dimensional view of the overall disassembled structure of this utility model;

[0021] Figure 4 This is a three-dimensional view of the internal structure of this utility model.

[0022] In the diagram: 1. Housing; 2. Sealing assembly; 21. Housing cover; 22. Fixing plate; 23. Fixing block; 24. Bolt; 25. Sealing gasket; 3. Heat dissipation assembly; 31. Side heat conduction plate; 32. Heat conduction fins; 33. Back heat conduction plate; 34. Semiconductor cooling plate; 35. Back shell; 36. Connecting slot; 37. Heat dissipation hole; 38. Bracket; 39. Heat dissipation motor; 310. Cooling fan. Detailed Implementation

[0023] It should be noted that in the description of the embodiments of this application, the terms "front," "rear," "left," "right," "up," "down," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0024] The present application will be further described in detail below with reference to the accompanying drawings and embodiments.

[0025] Reference Figures 1 to 4 This application provides a high-sealing vector inverter, including a housing 1. The housing 1 is made of aluminum alloy material, which has good structural strength and thermal conductivity. A sealing component 2 is provided on the front of the housing 1 to achieve sealing of the front of the housing 1. A heat dissipation component 3 is provided inside the housing 1 to dissipate the heat inside the housing 1.

[0026] The heat dissipation assembly 3 includes two side heat-conducting plates 31 and heat-conducting fins 32. Both the side heat-conducting plates 31 and the heat-conducting fins 32 are made of copper and have excellent thermal conductivity. The two side heat-conducting plates 31 are respectively fixed to the left and right sides of the front of the heat-conducting fins 32 by bolts. The inner sides of the side heat-conducting plates 31 and the heat-conducting fins 32 are welded and fixed to a back heat-conducting plate 33. The back heat-conducting plate 33 is also made of copper. The left and right side heat-conducting plates 31 are respectively fixed to the left and right inner walls of the housing 1 by bolts. The back heat-conducting plate 33 is located at the back of the housing 1 and can fully absorb the heat inside the housing 1.

[0027] The sealing assembly 2 includes a cover 21, which is made of the same aluminum alloy material as the housing 1. The cover 21 is attached to the front of the housing 1 to close the housing 1.

[0028] A thermoelectric cooling plate 34 is attached to the back of the back heat-conducting plate 33 by thermal grease. The thermoelectric cooling plate 34 and the back heat-conducting plate 33 are tightly attached to each other to improve heat conduction efficiency. A back shell 35 is fixed to the back of the thermoelectric cooling plate 34 by bolts. The back shell 35 is made of aluminum alloy and has heat dissipation holes 37 inside.

[0029] A bracket 38 is welded and fixed inside the heat dissipation hole 37. A cooling motor 39 is fixedly installed on the back of the bracket 38 by bolts. The cooling motor 39 is a DC motor. A cooling fan 310 is fixedly installed at the output end of the cooling motor 39 by a coupling. The cooling fan 310 can accelerate air flow and improve heat dissipation efficiency.

[0030] The back cover 35 has connecting slots 36 on both the left and right sides. The connecting slots 36 connect the outside to the inside of the heat dissipation hole 37. The connection between the connecting slots 36 and the heat dissipation hole 37 is located between the semiconductor cooling plate 34 and the cooling fan 310, so that the cooling fan 310 can dissipate the heat generated by the semiconductor cooling plate 34 through the connecting slots 36.

[0031] Multiple fixing plates 22 are integrally formed on the outer side of the cover 21, and multiple fixing blocks 23 are integrally formed on the outer side of the front of the housing 1. The fixing plates 22 are located on the front of the corresponding fixing blocks 23. Mounting holes are provided inside the fixing plates 22 and the fixing blocks 23. Bolts 24 are threadedly connected to the corresponding mounting holes at the front and rear. The front and rear fixing plates 22 and fixing blocks 23 are fixedly connected by bolts 24, ensuring the tightness of the connection between the cover 21 and the housing 1.

[0032] A sealing gasket 25 is attached to the back of the cover 21. The sealing gasket 25 is made of nitrile rubber material, which has good elasticity and sealing performance. The back of the sealing gasket 25 is attached to the front of the cover 1, which further improves the sealing performance of the cover 1.

[0033] Working principle: When this high-sealing vector inverter is working, the heat generated by the electronic components inside the housing 1 is absorbed by the side heat-conducting plate 31, heat-conducting fins 32 and back heat-conducting plate 33. The heat is transferred to the semiconductor cooling plate 34 through the back heat-conducting plate 33. The semiconductor cooling plate 34 transfers the heat to the back shell 35. At the same time, the cooling motor 39 drives the cooling fan 310 to rotate, so that air flows in the heat dissipation holes 37 and the connecting groove 36, dissipating the heat generated by the semiconductor cooling plate 34 to the outside. In terms of sealing, the cover 21 is tightly connected to the housing 1 by bolts 24. The sealing gasket 25 is compressed between the cover 21 and the housing 1 to form an effective sealing structure, preventing external dust, moisture and other substances from entering the interior of the housing 1, thus ensuring the high sealing performance of the equipment.

[0034] Furthermore, all contents not described in detail in this specification are existing technologies known to those skilled in the art, and all electrical components mentioned in this document are powered by external power supply lines.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0036] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-sealing vector inverter, comprising a housing (1), characterized in that: A sealing assembly (2) is provided on the front side of the housing (1), and a heat dissipation assembly (3) is provided inside the housing (1). The heat dissipation assembly (3) includes two side heat conduction plates (31) and heat conduction fins (32). The two side heat conduction plates (31) are respectively fixedly installed on the left and right sides of the front side of the heat conduction fins (32). A back heat conduction plate (33) is fixedly installed on the inner side of both the side heat conduction plates (31) and the heat conduction fins (32). The left and right side heat conduction plates (31) are respectively fixedly installed on the left and right inner walls of the housing (1). The back heat conduction plate (33) is located on the back of the housing (1). The sealing assembly (2) includes a cover (21), which is attached to the front side of the housing (1).

2. The high-sealing vector inverter according to claim 1, characterized in that: A semiconductor cooling plate (34) is fixedly installed on the back of the back heat-conducting plate (33). The semiconductor cooling plate (34) and the back heat-conducting plate (33) are in contact with each other. A back shell (35) is fixedly installed on the back of the semiconductor cooling plate (34). Heat dissipation holes (37) are opened inside the back shell (35).

3. A high-sealing vector inverter according to claim 2, characterized in that: A bracket (38) is fixedly installed inside the heat dissipation hole (37), a heat dissipation motor (39) is fixedly installed on the back of the bracket (38), and a heat dissipation fan (310) is fixedly installed at the output end of the heat dissipation motor (39).

4. A high-sealing vector inverter according to claim 3, characterized in that: The back shell (35) has connecting slots (36) on both the left and right sides. The connecting slots (36) connect the outside to the inside of the heat dissipation hole (37). The connection between the connecting slots (36) and the heat dissipation hole (37) is located between the semiconductor cooling plate (34) and the cooling fan (310).

5. A high-sealing vector inverter according to claim 1, characterized in that: Multiple fixing plates (22) are fixedly installed on the outer side of the shell cover (21), and multiple fixing blocks (23) are fixedly installed on the outer side of the front of the shell (1). The fixing plate (22) is located on the front of the corresponding fixing block (23). The fixing plate (22) and the fixing block (23) are both provided with mounting holes. Bolts (24) are fixedly installed in the front and rear corresponding mounting holes. The front and rear fixing plates (22) and the fixing blocks (23) are fixedly connected by bolts (24).

6. A high-sealing vector inverter according to claim 5, characterized in that: A sealing gasket (25) is fixedly installed on the back of the cover (21), and the back of the sealing gasket (25) is attached to the front of the housing (1).

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