Multiband communication and positioning function integrated module

Abstract

The utility model discloses a kind of multi-frequency band communication and positioning function integrated module, comprising: radio frequency chip U1, the first pin of radio frequency chip U1 is electrically connected with the one end of capacitor C5, the one end of capacitor C6, the one end of capacitor C7, the one end of inductor L3, the one end of inductor L4, the one end of resistance R33, the other end of capacitor C5, capacitor C6, capacitor C7 is grounded, the thirty second pin of radio frequency chip U1 is electrically connected with the one end of resistance R101.The utility model relative to traditional LoRa front end module, the present scheme supports multiple ISM frequency band and satellite communication frequency band, meets the frequency band requirement of different regions in the world;LoRa, Wi-Fi, Bluetooth and GNSS etc. Multiple communication functions are realized in the same module, and system design is simplified, and hardware cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of circuit technology, and in particular to a multi-band communication and positioning function integrated module. Background Technology

[0002] Currently, in the field of IoT wireless communication, the mainstream solution is to use a single-function RF chip to achieve communication on a specific frequency band and protocol. Traditional LoRa chips only support a limited number of Sub-GHz bands (such as 433MHz, 868MHz, 915MHz, etc.). Different countries and regions use different ISM bands, resulting in limited global deployment of devices and a lack of support for high-frequency bands such as 2.4GHz, making it impossible to work with mainstream wireless technologies such as Wi-Fi and Bluetooth. Existing wireless communication chips generally lack built-in positioning functions, requiring IoT devices to use external GNSS modules to obtain location information, which increases system cost, complexity, and power consumption. While traditional LoRa chips such as SX1262 and SX1267 perform well in low-power communication, they typically only support a limited frequency range and a single communication protocol. Multi-band chip solutions, on the other hand, require multiple independent chips to work together to achieve different functions. For single-band solutions, the functions are relatively limited and cannot meet the frequency band requirements and diverse protocol needs of different regions around the world. For multi-band solutions, the use of multiple chips results in high system complexity, high power consumption, high cost, and a lack of intelligent environmental perception and adaptive capabilities.

[0003] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content

[0004] The purpose of this invention is to overcome at least some of the shortcomings of the prior art and to provide a multi-band communication and positioning function integrated module.

[0005] The technical solution of this utility model is as follows: This utility model provides a multi-band communication and positioning function integrated module, including: a radio frequency chip U1, the first pin of which is electrically connected to one end of capacitor C5, one end of capacitor C6, one end of capacitor C7, one end of inductor L3, one end of inductor L4, and one end of resistor R33 respectively; the other ends of capacitors C5, C6, and C7 are grounded; the thirty-second pin of the radio frequency chip U1 is electrically connected to one end of resistor R101; the other end of resistor R101 is electrically connected to the other end of resistor R33, the other end of inductor L3, one end of inductor L5, one end of capacitor C8, and one end of resistor R100 respectively; the other end of capacitor C8 is connected to the other end of inductor L5, one end of inductor L6, and capacitor C9 respectively. One end of the inductor L6 is electrically connected, and the other end of the inductor L6 is electrically connected to one end of capacitor C10 and one end of capacitor C11. The other end of capacitor C10 is electrically connected to one end of capacitor C12 and the first pin of chip U2. The other ends of capacitors C9, C11, and C12 are all grounded. The thirty-first pin of the RF chip U1 is electrically connected to the other end of the inductor L4 and the other end of resistor R100. The second pin of the RF chip U1 is electrically connected to one end of capacitor C1 and one end of capacitor C2 (VDD_RADIO terminal). The other ends of capacitors C1 and C2 are grounded. The third and fourth pins of the RF chip U1 are electrically connected to crystal oscillator Q2. The fourth and fifth pins of the RF chip U1 are electrically connected to crystal oscillator Q1. The seventh pin of the RF chip U1 and... Pin 8 is electrically connected to crystal oscillator Q3. Pin 10 of RF chip U1 is electrically connected to one end of resistor R32. Pin 11 of RF chip U1 is electrically connected to one end of resistor R1. The other end of resistor R17 is electrically connected to pin 6 of chip U8, one end of resistor R18, and one end of capacitor C43. The other end of capacitor C43 is grounded. Pin 12 of RF chip U1 is electrically connected to one end of capacitor C3 and the other end of inductor L1. The other end of capacitor C3 and pin 13 of RF chip U1 are both grounded. The other end of inductor L1 is electrically connected to pin 14 of RF chip U1. Pin 15 of RF chip U1 is electrically connected to VDD_RADIO and one end of capacitor C4. The other end of capacitor C4 is grounded. Pin 19 of RF chip U1 is connected to resistor R9. One end of the resistor R9 is electrically connected to the capacitor C46, ​​and the other end of the resistor R8 is electrically connected to one end of the capacitor C46 and the fifth pin of the chip U2. The twentieth pin of the RF chip U1 is electrically connected to one end of the resistor R8, and the other end of the resistor R8 is electrically connected to one end of the capacitor C45 and the fourth pin of the chip U2. The other end of the capacitor C45 is grounded.The 26th pin of the RF chip U1 is electrically connected to one end of capacitor C27 and one end of inductor L15. The other end of inductor L15 is electrically connected to one end of capacitor C28, one end of inductor L20, and one end of inductor C53. The other end of inductor L20 is electrically connected to one end of capacitor C30, one end of capacitor C53, and one end of capacitor C29. The other ends of capacitors C27, C28, and C30 are all grounded. The other end of capacitor C29 is electrically connected to the second antenna and one end of TVS diode D3. The other end of TVS diode D3 is grounded. The 27th pin of the RF chip U1 is connected to one end of capacitor C22 and one end of inductor L12. One end of inductor L11 is electrically connected. The other end of inductor L12 is electrically connected to one end of capacitor C24, one end of capacitor C25, and one end of capacitor C23. The other ends of capacitor C22 and capacitor C24 are both grounded. The 28th pin of RF chip U1 is connected to the other ends of inductor L11 and capacitor C23. The other end of capacitor C25 is electrically connected to one end of inductor L13. The other end of inductor L13 is electrically connected to one end of capacitor C26 and the third pin of chip U8. The first and fourth pins of chip U8 are both grounded. The second pin of chip U8 is electrically connected to the VDD_RF_SW terminal and one end of capacitor C58. The other end of capacitor C58 is grounded. The fifth pin of chip U8 is electrically connected to one end of inductor L14. The other end of inductor L14 is electrically connected to one end of capacitor C54. The other end of capacitor C54 is electrically connected to the third antenna and TVS diode D2. The other end of TVS diode D2 is grounded. The twenty-ninth pin of RF chip U1 is electrically connected to one end of capacitor C18, one end of inductor L10, and one end of inductor L9. The other end of inductor L10 is electrically connected to one end of capacitor C20, one end of capacitor C21, and one end of capacitor C19. The other end of capacitor C19 is electrically connected to the other end of inductor L9 and the thirtieth pin of RF chip U1. The other end of capacitor C18... The other end of capacitor C20 is grounded. The other end of capacitor C21 is electrically connected to the ninth pin of chip U2. The second, seventh, eighth, tenth, twelfth, and thirteenth pins of chip U2 are all grounded. The sixth pin of chip U2 is electrically connected to one end of capacitor C39 and the VDD_RF_SW terminal, respectively. The other end of capacitor C39 is grounded. The eleventh pin of chip U2 is electrically connected to one end of capacitor C31 and one end of inductor L17, respectively. The other end of inductor L17 is electrically connected to one end of capacitor C32, one end of TVS diode D1, and the first antenna, respectively. The other ends of TVS diode D1, capacitor C32, and capacitor C31 are all grounded. The radio frequency chip U1 is model LR1120, the chip U2 is model SKY13588-460LF, the chip U8 is model BGA524N6, the first antenna is a Sub-GHz band antenna, the second antenna is a 1.9GHz and 2.4GHz band antenna, and the third antenna is a GPS band antenna.

[0006] Furthermore, the frequency of the crystal oscillator Q1 is 32MHz, the frequency of the crystal oscillator Q2 is 32MHz, and the frequency of the crystal oscillator Q3 is 32.768kHz.

[0007] The advantages of this utility model by adopting the above solution are as follows: compared with the traditional LoRa front-end module, this solution supports multiple ISM frequency bands and satellite communication frequency bands to meet the frequency band requirements of different regions around the world; it realizes multiple communication functions such as LoRa, Wi-Fi, Bluetooth and GNSS within the same module, and simplifies system design and reduces hardware costs. Attached Figure Description

[0008] Figure 1 This is a circuit diagram of the first part of an embodiment of the present invention.

[0009] Figure 2 This is a circuit diagram of the second part of an embodiment of the present invention. Detailed Implementation

[0010] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0011] Please refer to the following: Figure 1 and Figure 2In this embodiment, the present invention provides a multi-band communication and positioning function integrated module, including: a radio frequency chip U1, the first pin of which is electrically connected to one end of capacitor C5, one end of capacitor C6, one end of capacitor C7, one end of inductor L3, one end of inductor L4, and one end of resistor R33, respectively; the other ends of capacitors C5, C6, and C7 are grounded; the thirty-second pin of the radio frequency chip U1 is electrically connected to one end of resistor R101, and the other end of resistor R101 is connected to the other end of resistor R33, the other end of inductor L3, one end of inductor L5, and one end of capacitor R33. One end of capacitor C8 and one end of resistor R100 are electrically connected. The other end of capacitor C8 is electrically connected to the other end of inductor L5, one end of inductor L6, and one end of capacitor C9. The other end of inductor L6 is electrically connected to one end of capacitor C10 and one end of capacitor C11. The other end of capacitor C10 is electrically connected to one end of capacitor C12 and the first pin of chip U2. The other ends of capacitors C9, C11, and C12 are all grounded. The thirty-first pin of RF chip U1 is electrically connected to the other end of inductor L4 and the other end of resistor R100. The second pin of RF chip U1 is electrically connected to one end of capacitor C1 and one end of capacitor C2 (VDD_RADIO terminal, power supply terminal), respectively. The other ends of capacitors C1 and C2 are grounded. The third and fourth pins of RF chip U1 are electrically connected to crystal oscillator Q2, the fourth and fifth pins of RF chip U1 are electrically connected to crystal oscillator Q1, the seventh and eighth pins of RF chip U1 are electrically connected to crystal oscillator Q3, the tenth pin of RF chip U1 is electrically connected to one end of resistor R32, and the eleventh pin of RF chip U1 is electrically connected to one end of resistor R1. The other end of resistor R17... The terminals are electrically connected to pin 6 of chip U8, one end of resistor R18, and one end of capacitor C43, respectively. The other end of capacitor C43 is grounded. Pin 12 of RF chip U1 is electrically connected to one end of capacitor C3 and the other end of inductor L1, respectively. The other end of capacitor C3 and pin 13 of RF chip U1 are both grounded. The other end of inductor L1 is electrically connected to pin 14 of RF chip U1. Pin 15 of RF chip U1 is electrically connected to the VDD_RADIO terminal and one end of capacitor C4, respectively. The other end of capacitor C4 is grounded. Pin 19 of RF chip U1 is connected to resistor R9. One end of resistor R9 is electrically connected to capacitor C46 and the fifth pin of chip U2. The twentieth pin of RF chip U1 is electrically connected to one end of resistor R8. The other end of resistor R8 is electrically connected to one end of capacitor C45 and the fourth pin of chip U2. The other end of capacitor C45 is grounded. The twenty-sixth pin of RF chip U1 is electrically connected to one end of capacitor C27 and one end of inductor L15. The other end of inductor L15 is electrically connected to one end of capacitor C28, one end of inductor L20, and one end of inductor C53.The other end of inductor L20 is electrically connected to one end of capacitor C30, the other end of capacitor C53, and one end of capacitor C29. The other ends of capacitors C27, C28, and C30 are all grounded. The other end of capacitor C29 is electrically connected to the second antenna and one end of TVS diode D3. The other end of TVS diode D3 is grounded. Pin 27 of RF chip U1 is electrically connected to one end of capacitor C22, one end of inductor L12, and one end of inductor L11. The other end of inductor L12 is electrically connected to one end of capacitor C24, one end of capacitor C25, and one end of capacitor C23. The other end of the capacitor and the other end of capacitor C24 are both grounded. The 28th pin of RF chip U1 is connected to the other end of inductor L11 and capacitor C23 respectively. The other end of capacitor C25 is electrically connected to one end of inductor L13. The other end of inductor L13 is electrically connected to one end of capacitor C26 and the third pin of chip U8 respectively. The first and fourth pins of chip U8 are both grounded. The second pin of chip U8 is electrically connected to the VDD_RF_SW terminal (power supply terminal) and one end of capacitor C58 respectively. The other end of capacitor C58 is grounded. The fifth pin of chip U8 is electrically connected to one end of inductor L14. The other end is electrically connected to one end of capacitor C54. The other end of capacitor C54 is electrically connected to the third antenna and TVS diode D2. The other end of TVS diode D2 is grounded. The 29th pin of RF chip U1 is electrically connected to one end of capacitor C18, one end of inductor L10, and one end of inductor L9. The other end of inductor L10 is electrically connected to one end of capacitor C20, one end of capacitor C21, and one end of capacitor C19. The other end of capacitor C19 is electrically connected to the other end of inductor L9 and the 30th pin of RF chip U1. The other ends of capacitors C18 and C20 are both grounded. The other end is electrically connected to pin 9 of chip U2. Pins 2, 7, 8, 10, 12, and 13 of chip U2 are all grounded. Pin 6 of chip U2 is electrically connected to one end of capacitor C39 and the VDD_RF_SW terminal, respectively. The other end of capacitor C39 is grounded. Pin 11 of chip U2 is electrically connected to one end of capacitor C31 and one end of inductor L17, respectively. The other end of inductor L17 is electrically connected to one end of capacitor C32, one end of TVS diode D1, and the first antenna, respectively. The other ends of TVS diode D1, capacitor C32, and capacitor C31 are all grounded. The RF chip U1 is model LR1120, chip U2 is an RF switch chip, model SKY13588-460LF, and chip U8 is a low-noise amplifier, model BGA524N6. The first antenna is a Sub-GHz band antenna, operating in the Sub-GHz frequency band (such as 433MHz, 868MHz, 915MHz, etc.), suitable for LoRa communication. The second antenna is a 1.9GHz and 2.4GHz band antenna, suitable for LoRa, Wi-Fi scanning, and Bluetooth communication. The third antenna is a GPS band antenna, operating in the GPS frequency band, used for GNSS positioning.

[0012] Furthermore, crystal oscillator Q1 has a frequency of 32MHz, crystal oscillator Q2 has a frequency of 32MHz, and is a high-precision temperature-compensated crystal oscillator to provide a stable high-frequency clock source for the RF chip. Crystal oscillator Q3 has a frequency of 32.768kHz and is used as a low-frequency crystal oscillator for the real-time clock (RTC) function.

[0013] Please refer to the following: Figure 1 and Figure 2 In this solution, the RF chip U1 is the core of this module, responsible for handling various wireless communication protocols (such as LoRa, FSK, Wi-Fi passive scanning, Bluetooth Low Energy, and GNSS positioning). Pins 21 to 24 of the RF chip U1 are connected to the SPI signal terminal for data communication and configuration with an external microcontroller. Pins 19, 11, 10, and 9 of the RF chip U1 serve as multi-function digital input / output pins for control and status indication. At the RF front end, the TXEN and RXEN signals are output by the RF chip U1 through pins 19 and 20, respectively, controlling the activation of transmit and receive modes. The TX MATCH and RX MATCH implement a matching network to optimize the transmission and reception performance of the RF signal and ensure impedance matching. The LNA-EN signal output from pin 11 of the RF chip U1 enables the low-noise amplifier, amplifying the received weak RF signal in receive mode and improving reception sensitivity. Impedance matching is performed in each RF path in this solution to ensure effective signal transmission.

[0014] In summary, the advantages of this solution are as follows: compared with traditional LoRa front-end modules, this solution supports multiple ISM bands and satellite communication bands, meeting the frequency band requirements of different regions around the world; it realizes multiple communication functions such as LoRa, Wi-Fi, Bluetooth and GNSS within the same module, and simplifies system design and reduces hardware costs.

[0015] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multi-band communication and positioning function integrated module, characterized in that, include: Radio frequency (RF) chip U1 has its first pin electrically connected to one end of capacitor C5, one end of capacitor C6, one end of capacitor C7, one end of inductor L3, one end of inductor L4, and one end of resistor R33. The other ends of capacitors C5, C6, and C7 are grounded. The thirty-second pin of RF chip U1 is electrically connected to one end of resistor R101. The other end of resistor R101 is electrically connected to the other ends of resistor R33, the other end of inductor L3, one end of inductor L5, one end of capacitor C8, and one end of resistor R100. The other end of capacitor C8 is connected to the other ends of inductor L5, one end of inductor L6, and capacitor C9. One end of the inductor L6 is electrically connected, and the other end of the inductor L6 is electrically connected to one end of capacitor C10 and one end of capacitor C11. The other end of capacitor C10 is electrically connected to one end of capacitor C12 and the first pin of chip U2. The other ends of capacitors C9, C11, and C12 are all grounded. The thirty-first pin of the RF chip U1 is electrically connected to the other end of the inductor L4 and the other end of resistor R100. The second pin of the RF chip U1 is electrically connected to one end of capacitor C1 and one end of capacitor C2 (VDD_RADIO terminal). The other ends of capacitors C1 and C2 are grounded. The third and fourth pins of the RF chip U1 are electrically connected to crystal oscillator Q2. The fourth and fifth pins of the RF chip U1 are electrically connected to crystal oscillator Q1. The seventh pin of the RF chip U1 and... Pin 8 is electrically connected to crystal oscillator Q3. Pin 10 of RF chip U1 is electrically connected to one end of resistor R32. Pin 11 of RF chip U1 is electrically connected to one end of resistor R1. The other end of resistor R17 is electrically connected to pin 6 of chip U8, one end of resistor R18, and one end of capacitor C43. The other end of capacitor C43 is grounded. Pin 12 of RF chip U1 is electrically connected to one end of capacitor C3 and the other end of inductor L1. The other end of capacitor C3 and pin 13 of RF chip U1 are both grounded. The other end of inductor L1 is electrically connected to pin 14 of RF chip U1. Pin 15 of RF chip U1 is electrically connected to VDD_RADIO and one end of capacitor C4. The other end of capacitor C4 is grounded. Pin 19 of RF chip U1 is connected to resistor R9. One end of the resistor R9 is electrically connected to the capacitor C46 and the fifth pin of the chip U2. The twentieth pin of the RF chip U1 is electrically connected to one end of the resistor R8. The other end of the resistor R8 is electrically connected to one end of the capacitor C45 and the fourth pin of the chip U2. The other end of the capacitor C45 is grounded. The twenty-sixth pin of the RF chip U1 is electrically connected to one end of the capacitor C27 and one end of the inductor L15.The other end of inductor L15 is electrically connected to one end of capacitor C28, one end of inductor L20, and one end of inductor C53. The other end of inductor L20 is electrically connected to one end of capacitor C30, one end of capacitor C53, and one end of capacitor C29. The other ends of capacitors C27, C28, and C30 are all grounded. The other end of capacitor C29 is electrically connected to the second antenna and one end of TVS diode D3. The other end of TVS diode D3 is grounded. The 27th pin of RF chip U1 is electrically connected to one end of capacitor C22, one end of inductor L12, and one end of inductor L11. The other end of inductor L12 is electrically connected to one end of capacitor C24 and one end of capacitor C25. One end of capacitor C25 is electrically connected to one end of capacitor C26, and the other end of capacitor C24 is grounded. The 28th pin of RF chip U1 is connected to the other ends of inductor L11 and capacitor C23. The other end of capacitor C25 is electrically connected to one end of inductor L13. The other end of inductor L13 is electrically connected to one end of capacitor C26 and the third pin of chip U8. The first and fourth pins of chip U8 are grounded. The second pin of chip U8 is electrically connected to the VDD_RF_SW terminal and one end of capacitor C58. The other end of capacitor C58 is grounded. The fifth pin of chip U8 is electrically connected to one end of inductor L14. The other end is electrically connected to one end of capacitor C54. The other end of capacitor C54 is electrically connected to the third antenna and TVS diode D2. The other end of TVS diode D2 is grounded. The twenty-ninth pin of RF chip U1 is electrically connected to one end of capacitor C18, one end of inductor L10, and one end of inductor L9. The other end of inductor L10 is electrically connected to one end of capacitor C20, one end of capacitor C21, and one end of capacitor C19. The other end of capacitor C19 is electrically connected to the other end of inductor L9 and the thirtieth pin of RF chip U1. The other ends of capacitors C18 and C20 are both grounded. The other end of capacitor C21 is electrically connected to the ninth pin of chip U2. Pins 2, 7, 8, 10, 12, and 13 of chip U2 are all grounded. Pin 6 of chip U2 is electrically connected to one end of capacitor C39 and the VDD_RF_SW terminal, with the other end of capacitor C39 grounded. Pin 11 of chip U2 is electrically connected to one end of capacitor C31 and one end of inductor L17, with the other end of inductor L17 electrically connected to one end of capacitor C32, one end of TVS diode D1, and the first antenna, with the other ends of TVS diode D1, capacitor C32, and capacitor C31 all grounded. The model of RF chip U1 is LR1120, and the model of chip U2 is SKY13588-460LF.The chip U8 is model BGA524N6. The first antenna is a Sub-GHz band antenna, the second antenna is a 1.9GHz and 2.4GHz band antenna, and the third antenna is a GPS band antenna.

2. The multi-band communication and positioning function integrated module according to claim 1, characterized in that, The frequency of crystal oscillator Q1 is 32MHz, the frequency of crystal oscillator Q2 is 32MHz, and the frequency of crystal oscillator Q3 is 32.768kHz.

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