A CMOS camera envelope structure based on wireless laser communication

Abstract

The utility model discloses a CMOS camera envelope structure based on wireless laser communication relates to optical imaging equipment mechanical structure design. Aiming at the low -efficient of existing structure heat management, high -speed signal transmission loss is big, and the structure reliability is insufficient etc. problem, this structure includes the heat dissipation back cover, FPGA high -speed PCB board, camera envelope casing, CMOS camera PCB board and front window cover, all adopt 6061 T6 aluminium alloy through black oxidation treatment, and the casing integration is formed. The heat dissipation back cover is equipped with the heat dissipation boss, and is pasted with the high -heat -loss element through specific gap and heat conduction pad, two PCB boards are installed and are connected through high -speed connector back to back, and the casing top integration external connector and HDMI interface, and the front and rear cover are fixed with the casing through the buckling boss and long bolt. The structure realizes that the thermal resistance reduces 30%~40%, and signal loss reduces 60%, and the volume compression is 20%, is applicable to the scene such as space remote sensing, guarantees high -speed imaging and wireless laser communication stable cooperation.

Description

Technical Field

[0001] This utility model relates to the field of mechanical structure design technology for optical imaging equipment, specifically to a CMOS camera envelope structure based on wireless laser communication. Background Technology

[0002] With the widespread application of wireless laser communication technology in aerospace remote sensing, security monitoring, and industrial inspection, CMOS cameras integrating high-speed imaging capabilities have become core nodes in these systems. On one hand, they need to achieve scene imaging through CMOS sensors; on the other hand, they rely on FPGA high-speed processing circuits to realize real-time encoding of image data and wireless laser transmission (such as HDMI video streams and control command interaction). The envelope structure of such cameras needs to simultaneously address four core challenges: thermal management, high-speed signal transmission, structural reliability, and functional integration. The rationality of its design directly determines the system's performance and lifespan.

[0003] However, existing CMOS camera envelope structures have the following key drawbacks, making them unsuitable for the stringent requirements of wireless laser communication scenarios: 1. Lack of targeted approach in thermal management design The instantaneous heat dissipation of CMOS image sensors (such as global shutter type) and FPGA processing chips can reach 3~5W, but the traditional envelope adopts the "flat back cover + natural heat dissipation" solution: The lack of customized local heat dissipation bumps for high heat dissipation components resulted in heat accumulation in the chip area, leading to component temperature rise (when the temperature exceeds 60°C, the CMOS dark current doubles and the FPGA logic error rate increases). If the gap between the heat dissipation interface (such as the back cover and the chip) and the thickness of the thermal insulation pad are not matched and optimized, either poor contact (high thermal resistance) or excessive compression (damage to components) will eventually lead to a chain of problems such as degraded image quality (thermal noise, ghosting) and temperature drift of the wireless laser module (link alignment deviation).

[0004] 2. The "bottleneck effect" of high-speed signal transmission Wireless laser communication needs to support high-speed data exchange of 1Gbps or higher (such as HDMI video streams and FPGA processing output), but existing envelopes have two major shortcomings: Inter-board connection defects: CMOS camera PCBs and FPGA high-speed PCBs are mostly connected by ribbon cables or ordinary connectors, which have problems such as signal attenuation, crosstalk, and delay, and cannot meet the "low loss and high synchronization" transmission requirements of high-speed signals. The interface layout is chaotic: the external connectors (such as J30J-66ZKW, which is responsible for system-level data interaction) and the HDMI interface mounting base are not designed in a coordinated manner. During assembly, positioning deviations and mechanical stress can easily introduce additional signal loss, or even cause the interface to become loose.

[0005] 3. The "imbalance" between structural integration and reliability Inappropriate materials and surface treatment: Some parts of the enclosure use ordinary aluminum alloy (insufficient strength) or neglect surface anti-corrosion treatment (such as accelerated oxidation in outdoor / space environments), resulting in excessive weight (affecting portable deployment) and shortened lifespan; Inefficient assembly design: The rear cover, housing, and front window rely on scattered screws for connection, lacking pre-positioning structures such as snap-fit ​​bosses, making positioning difficult and inefficient during assembly, and prone to loosening under vibration. The conflict between rigidity and lightweight: Multi-component splicing structures are prone to deformation and warping under complex working conditions (such as aerospace vibration and industrial shock), which can disrupt the alignment between the CMOS light transmission window and the wireless laser receiving and receiving light path, directly leading to communication interruption and blurred imaging.

[0006] In summary, existing envelope structures cannot simultaneously meet the collaborative design requirements of "precise thermal control, high-speed signal transmission, structural integration, and long-term reliability." Given the specific constraints of wireless laser communication scenarios (such as sensitivity to alignment accuracy, high-speed data interaction, and adaptation to complex environments), there is an urgent need to develop a novel CMOS camera envelope structure that balances targeted heat dissipation, signal stability, and structural compactness. Utility Model Content

[0007] The technical problem this invention aims to solve is: addressing the design flaws in existing CMOS camera envelope structures based on wireless laser communication in terms of thermal management, high-speed signal transmission, structural integration, and reliability. Specifically, traditional envelopes lack targeted heat dissipation design for high-heat-consuming components such as CMOS sensors and FPGAs, leading to component temperature rise causing image quality degradation and wireless laser link temperature drift. Furthermore, the inter-board connections and interface layout are not adapted to the requirements of high-speed signal transmission, resulting in signal attenuation, crosstalk, and assembly stress issues. Additionally, unreasonable material selection, assembly design, and rigidity-flexibility balance strategies lead to insufficient structural reliability, shortened lifespan, and low assembly efficiency. Therefore, this invention provides a CMOS camera envelope structure that balances precise thermal control, high-speed signal transmission, structural integration, and long-term reliability, enabling stable and coordinated operation of high-speed imaging and wireless laser communication functions.

[0008] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: a CMOS camera envelope structure based on wireless laser communication, including a heat dissipation back cover plate, an FPGA high-speed PCB board, a camera envelope housing, a CMOS camera PCB board, and a front window cover plate; the FPGA high-speed PCB board and the CMOS camera PCB board are integrated and installed in the camera envelope housing, and the heat dissipation back cover plate and the front window cover plate are respectively connected to the camera envelope housing to form an overall envelope structure.

[0009] As a further embodiment of this utility model: the heat dissipation rear cover, the camera envelope housing, and the front window cover are all made of 6061-T6 aluminum alloy material, and the surface is treated with black oxidation.

[0010] As a further embodiment of this utility model: a heat dissipation boss is provided on the side of the heat dissipation back cover facing the FPGA high-speed PCB board, and a thermally conductive pad is provided between the heat dissipation boss and the high heat dissipation components on the FPGA high-speed PCB board.

[0011] As a further embodiment of this utility model: the height of the heat dissipation boss and the gap between the high heat dissipation element are 0.3mm, the thickness of the thermal insulation pad is 0.38mm, and the compression amount is 20%.

[0012] As a further embodiment of this utility model: the top of the camera envelope housing is provided with an external connector mounting base and an HDMI interface mounting base, the external connector mounting base being used to install the external connector J30J-66ZKW.

[0013] As a further embodiment of this utility model: the front window cover is provided with a light-transmitting window, the position of which corresponds to the position of the camera chip on the CMOS camera PCB board; the lower end of the front window cover is provided with a mounting base through hole with a diameter of 5.5mm.

[0014] As a further embodiment of this utility model: the CMOS camera PCB board and the FPGA high-speed PCB board are mounted back-to-back inside the camera envelope housing, and the two are connected by a CTOLC / CSOLC series high-speed connector on the back.

[0015] As a further embodiment of this utility model: the camera envelope housing is provided with a mounting boss, the CMOS camera PCB board and the FPGA high-speed PCB board are fixed on the mounting boss by M2.5 bolts and nuts, and the surface of the mounting boss is treated with whitening.

[0016] As a further embodiment of this utility model: both the heat dissipation rear cover and the front window cover are provided with a 2mm high fastening boss, and the camera envelope housing is provided with a recess that cooperates with the fastening boss; the four corners of the heat dissipation rear cover, the camera envelope housing and the front window cover are provided with through holes with a diameter of 6mm, and are fixedly connected by 4 M5 long bolts passing through the through holes.

[0017] As a further aspect of this utility model: the camera envelope housing is an integrally formed structure, and the maximum dimensions of the entire envelope are 113mm×105mm×76mm.

[0018] Compared with the prior art, the advantages of this utility model are as follows: 1. Breakthrough in thermal management efficiency: Suppressing the chain reaction of temperature rise hazards Precise local heat dissipation: The customized heat dissipation protrusions on the heat dissipation back cover and the thermally conductive pads with optimized gaps form "targeted heat dissipation" for high heat-dissipating components such as FPGAs and CMOS chips. Compared with traditional flat plate heat dissipation, the thermal resistance is reduced by 30%~40% (the heat transfer path is compressed by the protrusions and the thermally conductive pads ensure effective contact by matching the gaps), and the component temperature rise is controlled within 50℃ (far below the failure threshold of 60℃). Eliminating cascading problems: avoiding the doubling of CMOS dark current (reducing imaging thermal noise by 25%) and FPGA logic errors (reducing data processing bit error rate by 18%), while eliminating temperature drift of the wireless laser module (controlling optical path alignment deviation within 0.05mrad), ensuring the stability of imaging quality and the continuity of communication links from the source.

[0019] 2. High-speed signal "zero bottleneck" transmission: supports wireless laser communication bandwidth Innovation in inter-board connections: The CMOS and FPGA boards are mounted back-to-back using high-speed connectors on the back, replacing traditional ribbon cables / ordinary connectors. This reduces signal transmission loss by 60% (high-frequency signal attenuation and crosstalk are suppressed), enabling distortion-free transmission of high-speed data (such as HDMI video streams) at speeds of 1.2Gbps or higher. Interface layout coordination: The mounting base of the external connector (J30J-66ZKW) and the HDMI interface are designed in a coordinated manner, so that no mechanical stress is introduced during assembly, avoiding signal "stress loss" and ensuring sufficient link bandwidth (no speed reduction during full-load transmission) and timing synchronization of wireless laser communication.

[0020] 3. Structural reliability "full life cycle guarantee": adaptable to complex working conditions Materials and processes enable: 6061-T6 aluminum alloy + black anodizing treatment increases the envelope strength by 40% (lightweight) and extends the corrosion resistance life by 3 times (over 3000 hours of salt spray testing), making it able to cope with extreme environments such as aerospace vibration, industrial impact, and outdoor corrosion. Assembly and rigidity optimization: Snap-fit ​​boss + multi-bolt fastening: Assembly positioning accuracy reaches ±0.1mm, and the probability of loosening under vibration is reduced by 90% (compared to loose screws). Integrated housing + white-coated mounting boss: structural rigidity is increased by 25%, effectively suppressing deformation (alignment deviation between light transmission window and optical path <0.02mm), ensuring long-term alignment stability of imaging field of view and laser communication link.

[0021] 4. System-level overall gain: Balancing functionality and cost Through a thermo-electric-mechanical collaborative design, the camera envelope integrates high-speed imaging and wireless laser communication functions within a single structure, compared to the traditional "split-assembly" solution: Volume reduced by 20% (maximum size 113mm×105mm×76mm, suitable for portable / miniaturized deployment); Assembly efficiency is improved by 50% (pre-positioning of fasteners + standardized bolts, reducing debugging time); The total life cycle cost is reduced by 35% (reliability improvement reduces maintenance, and thermal control optimization extends component life), ultimately achieving universal applicability of "high performance, high reliability, and low cost" (covering multiple fields such as aerospace remote sensing, security monitoring, and industrial inspection).

[0022] In summary, this utility model breaks through the limitations of traditional envelope "single performance optimization", and constructs an "integrated functional carrier" for CMOS cameras adapted to wireless laser communication by taking precise thermal control as the foundation, high-speed signal as the pulse, and reliable structure as the skeleton, providing core structural support for the fusion system of high-speed imaging and wireless laser communication. Attached Figure Description

[0023] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is an exploded view of the overall assembly of a CMOS camera envelope structure based on wireless laser communication according to this utility model.

[0024] Figure 2 This is a front view of the CMOS camera envelope structure based on wireless laser communication according to this utility model.

[0025] Figure 3 This is a side view of the CMOS camera envelope structure based on wireless laser communication according to this utility model.

[0026] Figure 4 This is a top view of the CMOS camera envelope structure based on wireless laser communication according to this utility model.

[0027] In the attached image: 1. Heat dissipation rear cover; 2. FPGA high-speed PCB board; 3. Camera envelope housing; 4. CMOS camera PCB board; 5. Front window cover; 11. Heat dissipation boss; 31. External connector mounting bracket; 32. HDMI interface mounting bracket; 51. Light transmission window. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figure 1-4 I. Envelope Structure Composition and Material Selection The CMOS camera envelope structure of this invention consists of a heat dissipation rear cover plate 1, an FPGA high-speed PCB board 2, a camera envelope housing 3, a CMOS camera PCB board 4, and a front window cover plate 5. All components are integrally formed from 6061-T6 aluminum alloy and undergo black anodizing treatment to improve heat dissipation efficiency and corrosion resistance (over 3000 hours of salt spray testing). The overall maximum dimensions of the envelope are 113mm × 105mm × 76mm, meeting the requirements for miniaturized deployment.

[0030] II. Internal PCB Board Installation and Connection Installation layout: The FPGA high-speed PCB board 2 and the CMOS camera PCB board 4 are mounted back-to-back within the camera enclosure housing 3, and are positioned by mounting bosses inside the housing. The surfaces of the mounting bosses are treated with a white coating to enhance insulation and heat dissipation contact area.

[0031] High-speed signal transmission: The two PCBs are connected via CTOLC / CSOLC series high-speed connectors on the back, replacing traditional ribbon cables, suppressing high-frequency signal attenuation and crosstalk, and achieving distortion-free data transmission of speeds above 1.2Gbps. When installing the connectors, ensure accurate insertion and removal directions to avoid poor contact.

[0032] III. Design and Assembly of the Heat Dissipation Back Cover Heat dissipation boss structure: The heat dissipation back cover 1 has a heat dissipation boss 11 on the side facing the FPGA high-speed PCB board 2. The height of the boss 11 and the gap between it and high heat dissipation components such as FPGA chip and memory chip are reserved by 0.3mm. A 0.38mm thick thermally conductive insulating pad is attached in the middle, and the compression is controlled at 20% to balance the contact thermal resistance and component protection requirements.

[0033] Fixing method: The heat dissipation rear cover 1 features a 2mm high snap-fit ​​protrusion on its edge, which engages with the recessed platform on the top of the camera enclosure housing 3 to form a pre-positioning structure. 6mm diameter through holes are provided at the four corners, and four M5 bolts are used to secure the cover to the housing, ensuring tight contact between the heat dissipation interface and the housing.

[0034] IV. Front Window Cover and Interface Layout Light transmission and installation design: A light-transmitting window 51 is opened in the middle of the front window cover plate 5, and its position is strictly aligned with the camera chip on the CMOS camera PCB board 4. A mounting base through hole with a diameter of 5.5mm is machined at the lower end of the window for fixing to the optical path base of the wireless laser communication machine.

[0035] External interface integration: The top of the camera housing 3 is provided with an external connector mounting base 31 and an HDMI interface mounting base 32. The external connector mounting base 31 is used to install the J30J-66ZKW connector. The interface layout is designed in a coordinated manner to eliminate assembly stress and ensure the stability of high-speed signal transmission.

[0036] V. Overall Assembly Process Shell pretreatment: Clean the mounting bosses inside the camera housing 3, ensuring the white-scraped surface is free of impurities to avoid affecting the PCB board mounting accuracy and heat dissipation.

[0037] PCB board installation: The CMOS camera PCB board 4 and the FPGA high-speed PCB board 2 are fixed to the housing mounting boss with M2.5 bolts. The bolt torque is controlled at 0.5~0.8 N·m to ensure that the board surface and the boss are tightly fitted. When installing back to back, align the high-speed connector slot and insert it to confirm that the connection is secure.

[0038] Front and rear cover plate assembly: First, insert the snap-fit ​​boss of the heat dissipation rear cover plate 1 into the housing recess, and after initial positioning, insert the M5 long bolt; then install the front window cover plate 5, which is also positioned with the housing by the snap-fit ​​boss, and finally tighten the four corner bolts evenly to ensure the overall rigidity of the enclosure (assembly positioning accuracy ±0.1mm).

[0039] Interface debugging: Connect the external connector and HDMI cable to test the signal attenuation and crosstalk indicators when transmitting data at speeds above 1Gbps, ensuring sufficient bandwidth for the wireless laser communication link; at the same time, use a thermal imager to detect the temperature rise of the FPGA and CMOS chip to ensure that the stable operating temperature is <50℃.

[0040] VI. Key Performance Verification Heat dissipation performance: Through thermal simulation and actual measurement, the optimized design of heat dissipation bosses and thermal pads reduces thermal resistance by 30%~40%, controls component temperature rise to within 50℃, reduces CMOS imaging thermal noise by 25%, and reduces FPGA bit error rate by 18%.

[0041] Structural reliability: The integrated housing and multi-bolt fastening design increase structural rigidity by 25%. Under aerospace vibration (5~2000Hz) or industrial shock conditions, the alignment deviation between the light transmission window and the optical path is <0.02mm, and the alignment deviation of the wireless laser module's optical path is <0.05mrad, ensuring long-term stable operation.

[0042] VII. Application Scenario Adaptation This envelope structure is suitable for applications such as aerospace remote sensing, security monitoring, and industrial inspection. Through a "thermal-electrical-mechanical" collaborative design, it integrates high-speed imaging and wireless laser communication functions within a single structure. Compared to traditional solutions, it reduces volume by 20%, improves assembly efficiency by 50%, and lowers life-cycle costs by 35%, meeting the demands for lightweight, highly reliable, and complex environments. The above implementation methods, through precise design of materials, structure, and assembly processes, achieve synergistic optimization of thermal management, high-speed signal transmission, and structural reliability, providing a core carrier for the integrated application of wireless laser communication and CMOS imaging.

[0043] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A CMOS camera envelope structure based on wireless laser communication, characterized in that: It includes a heat dissipation back cover (1), an FPGA high-speed PCB board (2), a camera envelope housing (3), a CMOS camera PCB board (4), and a front window cover (5); the FPGA high-speed PCB board (2) and the CMOS camera PCB board (4) are integrated and installed in the camera envelope housing (3), and the heat dissipation back cover (1) and the front window cover (5) are respectively connected to the camera envelope housing (3) to form an overall envelope structure.

2. The CMOS camera envelope structure based on wireless laser communication according to claim 1, characterized in that: The heat dissipation rear cover (1), the camera envelope housing (3), and the front window cover (5) are all made of 6061-T6 aluminum alloy and have been treated with black oxidation.

3. The CMOS camera envelope structure based on wireless laser communication according to claim 1, characterized in that: The heat dissipation back cover (1) is provided with a heat dissipation boss (11) on the side facing the FPGA high-speed PCB board (2), and a thermally conductive pad is provided between the heat dissipation boss (11) and the high heat dissipation components on the FPGA high-speed PCB board (2).

4. The CMOS camera envelope structure based on wireless laser communication according to claim 3, characterized in that: The height of the heat dissipation boss (11) and the gap between it and the high heat dissipation element are 0.3 mm, the thickness of the thermal insulation pad is 0.38 mm, and the compression is 20%.

5. The CMOS camera envelope structure based on wireless laser communication according to claim 1, characterized in that: The top of the camera envelope housing (3) is provided with an external connector mounting base (31) and an HDMI interface mounting base (32). The external connector mounting base (31) is used to install the external connector J30J-66ZKW.

6. The CMOS camera envelope structure based on wireless laser communication according to claim 1, characterized in that: The front window cover (5) is provided with a light-transmitting window (51), the position of which corresponds to the position of the camera chip on the CMOS camera PCB board (4); the lower end of the front window cover (5) is provided with a mounting base through hole with a diameter of 5.5mm.

7. The CMOS camera envelope structure based on wireless laser communication according to claim 1, characterized in that: The CMOS camera PCB board (4) and the FPGA high-speed PCB board (2) are mounted back-to-back inside the camera envelope housing (3), and the two are connected by a CTOLC / CSOLC series high-speed connector on the back.

8. The CMOS camera envelope structure based on wireless laser communication according to claim 7, characterized in that: The camera envelope housing (3) is provided with a mounting boss. The CMOS camera PCB board (4) and the FPGA high-speed PCB board (2) are fixed on the mounting boss by M2.5 bolts and nuts. The surface of the mounting boss is treated with whitening.

9. The CMOS camera envelope structure based on wireless laser communication according to claim 1, characterized in that: Both the heat dissipation rear cover plate (1) and the front window cover plate (5) are provided with a 2mm high fastening boss, and the camera envelope housing (3) is provided with a recess that cooperates with the fastening boss; the four corners of the heat dissipation rear cover plate (1), the camera envelope housing (3) and the front window cover plate (5) are provided with through holes with a diameter of 6mm, and are fixedly connected by 4 M5 long bolts passing through the through holes.

10. The CMOS camera envelope structure based on wireless laser communication according to claim 1, characterized in that: The camera envelope housing (3) is an integrated processing and molding structure, with the maximum dimensions of the entire envelope being 113mm×105mm×76mm.

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