Three-layer plate type bone conduction MEMS microphone

Abstract

The utility model discloses a three -layer board type bone conduction MEMS microphone relates to bone conduction MEMS microphone technical field, aims at solving the existing bone conduction microphone assembly complex, the structural strength after assembly needs to be improved, the whole assembly efficiency needs to be improved, its technical scheme main points include first PCB board, second PCB board, third PCB board, the second PCB board is located between first PCB board and third PCB board, between first PCB board and second PCB board, between second PCB board and third PCB board passes through the tin cream and connects fixed, the second PCB board is printed with the through circuit, the outer surface of third PCB board is provided with the diaphragm subassembly, the diaphragm subassembly is located the inboard of second PCB board, and the diaphragm subassembly contains the support ring. Reach the effect of the current assembly process can effectively simplify, improve assembly efficiency, improve the structural firmness and stability of after assembly simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of bone conduction MEMS microphone technology, and in particular to a three-layer plate type bone conduction MEMS microphone. Background Technology

[0002] Bone conduction MEMS microphones are innovative audio sensors based on microelectromechanical systems (MEMS) technology. They pick up sound by detecting vibrations in the skull instead of airborne sound waves. Their core principle is to convert sound-induced bone vibrations into electrical signals, completely avoiding environmental noise interference and maintaining high-definition recording even in noisy environments. These microphones are characterized by their small size, low power consumption, and high signal-to-noise ratio, while also supporting waterproof and dustproof designs, making them suitable for extreme environments.

[0003] Existing bone conduction microphones are complex to assemble, and the structural strength and overall assembly efficiency need to be improved. Utility Model Content

[0004] The purpose of this invention is to provide a three-layer plate-type bone conduction MEMS microphone that can effectively simplify the current assembly process, improve assembly efficiency, and enhance the structural robustness and stability after assembly.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A three-layer bone conduction MEMS microphone includes a first PCB board, a second PCB board, and a third PCB board. The second PCB board is located between the first PCB board and the third PCB board. The first PCB board and the second PCB board, as well as the second PCB board and the third PCB board, are connected and fixed by solder paste. Conductive circuits are printed on the second PCB board.

[0007] By adopting the above technical solution, the internal structure can be pre-assembled before final assembly, which can effectively reduce the assembly process and improve assembly efficiency.

[0008] Furthermore, a diaphragm assembly is disposed on the outer surface of the third PCB board, and the diaphragm assembly is located inside the second PCB board.

[0009] By adopting the above technical solution, the stable operation of the diaphragm assembly is ensured.

[0010] Furthermore, the diaphragm assembly includes a support ring, a diaphragm is covered and installed at the port of the support ring, and a mass block is adhered to the middle position of the diaphragm, the mass block being located inside the support ring.

[0011] By adopting the above technical solution, the vibration of the diaphragm can be driven by the vibration of the skeleton, and the stability of the diaphragm vibration can be improved by using a mass block.

[0012] Furthermore, a second vent hole is provided at the middle position of the mass block, and a first vent hole is provided on the outer surface of the first PCB board.

[0013] By adopting the above technical solutions, the stable vibration of the internal structure was ensured.

[0014] Furthermore, a MEMS chip and an ASIC chip are disposed on the outer surface of the first PCB board, the MEMS chip and the ASIC chip are electrically connected by gold wires, and the ASIC chip is electrically connected to the first PCB board by gold wires.

[0015] By adopting the above technical solutions, effective signal reception, conversion, and transmission operations can be performed.

[0016] Furthermore, multiple PAD connection structures are provided on the outer surface of the third PCB board.

[0017] By adopting the above technical solution, the microphone structure can be effectively protected.

[0018] In summary, the beneficial technical effects of this utility model are as follows:

[0019] This invention allows for the pre-assembly of each structure onto its corresponding PCB board during assembly. Then, the first, second, and third PCB boards are stacked sequentially. This multi-layer board stacking process effectively improves the convenience and stability of microphone assembly. At the same time, the resulting structure is simple, robust, and highly practical. This structure effectively simplifies the current assembly process and thus improves assembly efficiency. Attached Figure Description

[0020] Figure 1 This is a diagram of the internal structure of this utility model.

[0021] In the figure: 1. First PCB board; 2. Second PCB board; 3. Third PCB board; 4. MEMS chip; 5. ASIC chip; 6. First vent hole; 7. Diaphragm; 8. Support ring; 9. Mass block; 10. Second vent hole; 11. PAD connection structure; 13. Diaphragm assembly. Detailed Implementation

[0022] The method of this utility model will be further described in detail below with reference to the accompanying drawings.

[0023] Reference Figure 1A three-layer bone conduction MEMS microphone includes a first PCB board 1, a second PCB board 2, and a third PCB board 3. The second PCB board 2 is located between the first PCB board 1 and the third PCB board 3. The first PCB board 1 and the second PCB board 2, and the second PCB board 2 and the third PCB board 3 are connected and fixed by solder paste. Conductive circuits are printed on the second PCB board 2. During assembly, each structure can be pre-installed on its corresponding PCB board, and then the first PCB board 1, the second PCB board 2, and the third PCB board 3 can be stacked and assembled in sequence. The multi-layer board stacking process can effectively improve the convenience and stability of microphone assembly. At the same time, the structure is simple and robust, and highly practical. This structure can effectively simplify the current assembly process and thus effectively improve assembly efficiency.

[0024] Reference Figure 1 A diaphragm assembly 13 is provided on the outer surface of the third PCB board 3. The diaphragm assembly 13 is located inside the second PCB board 2. The diaphragm assembly 13 includes a support ring 8. A diaphragm 7 is covered and installed at the port of the support ring 8. A mass block 9 is attached to the middle position of the diaphragm 7. The mass block 9 is located inside the support ring 8. A second vent hole 10 is provided at the middle position of the mass block 9. A first vent hole 6 is provided on the outer surface of the first PCB board 1. During operation, the bone vibration caused by the wearer's voice can be effectively transmitted to the microphone. At this time, with the support of the mass block 9, the diaphragm 7 can vibrate effectively. At this time, the vibration of the diaphragm 7 can drive the gas pressure change in the internal cavity. The change in gas pressure can drive the vibration of the signal conversion unit inside the microphone, which can realize effective sound reception.

[0025] Reference Figure 1 A MEMS chip 4 and an ASIC chip 5 are disposed on the outer surface of the first PCB board 1. The MEMS chip 4 and the ASIC chip 5 are electrically connected by gold wires. The ASIC chip 5 is electrically connected to the first PCB board 1 by gold wires. Multiple PAD connection structures 11 are disposed on the outer surface of the third PCB board 3. When the diaphragm assembly 13 drives the internal cavity air pressure to change, it can effectively drive the diaphragm on the MEMS chip 4 to vibrate, convert the vibration signal into an electrical signal, and output it after ASIC amplification, thus ensuring that the microphone can work stably.

[0026] Working principle: When in use, the microphone components are first assembled. During assembly, each component is first installed on its corresponding PCB board, and then the first PCB board 1, the second PCB board 2, and the third PCB board 3 are stacked and assembled in sequence. Then, they are fixed by solder paste. After assembly, it can be used normally. The bone vibration caused by the wearer's voice can be effectively transmitted to the microphone. At this time, with the support of the mass block 9, the diaphragm 7 can vibrate effectively. The vibration of the diaphragm 7 can drive the gas pressure change in the internal cavity. The change in gas pressure can drive the diaphragm on the MEMS chip 4 to vibrate, converting the vibration signal into an electrical signal, which is then amplified and output by the ASIC.

[0027] The embodiments described herein are preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape, and principle of this utility model should be included within the scope of protection of this utility model.

Claims

1. A three-layer plate-type bone conduction MEMS microphone, comprising a first PCB board (1), a second PCB board (2), and a third PCB board (3), characterized in that: The second PCB board (2) is located between the first PCB board (1) and the third PCB board (3). The first PCB board (1) and the second PCB board (2), and the second PCB board (2) and the third PCB board (3) are connected and fixed by solder paste. The second PCB board (2) has a conductive circuit printed on it.

2. The three-layer plate type bone conduction MEMS microphone according to claim 1, characterized in that: A diaphragm assembly (13) is provided on the outer surface of the third PCB board (3), and the diaphragm assembly (13) is located inside the second PCB board (2).

3. A three-layer plate type bone conduction MEMS microphone according to claim 2, characterized in that: The diaphragm assembly (13) includes a support ring (8), a diaphragm (7) is covered and installed at the port of the support ring (8), and a mass block (9) is attached to the middle position of the diaphragm (7), the mass block (9) being located inside the support ring (8).

4. A three-layer plate type bone conduction MEMS microphone according to claim 3, characterized in that: A second vent hole (10) is provided at the middle position of the mass block (9), and a first vent hole (6) is provided on the outer surface of the first PCB board (1).

5. A three-layer plate type bone conduction MEMS microphone according to claim 1, characterized in that: A MEMS chip (4) and an ASIC chip (5) are disposed on the outer surface of the first PCB board (1). The MEMS chip (4) and the ASIC chip (5) are electrically connected by gold wires, and the ASIC chip (5) is electrically connected to the first PCB board (1) by gold wires.

6. A three-layer plate type bone conduction MEMS microphone according to claim 1, characterized in that: Multiple PAD connection structures (11) are provided on the outer surface of the third PCB board (3).

Images