A high thermal conductivity performance substrate

Abstract

The utility model provides a kind of high heat conduction performance substrate, including upper substrate and lower substrate, the upper substrate adopts ceramic material, the lower substrate adopts metal material, a plurality of stand is provided between the upper substrate and lower substrate.The utility model has the advantages that: the upper substrate adopts ceramic material, with higher thermal conductivity compared with metal material, can quickly conduct heat.And the lower substrate adopts metal material, metal material has higher mechanical strength, can effectively improve the overall strength of substrate.Heat conduction plate, heat conduction column and heat dissipation rod between the upper substrate and lower substrate assist the upper substrate to dissipate heat, and the circuit board has better heat dissipation performance.A protective frame is provided on the outer side of the upper substrate, which provides side protection for the upper substrate, greatly improving its side impact resistance.In the guarantee of the heat dissipation performance of substrate, the mechanical strength of substrate is greatly improved, which is beneficial to the long-term use of substrate.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a substrate with high thermal conductivity. Background Technology

[0002] The circuit board substrate is a composite material consisting of a dielectric layer and a high-purity conductor. It is the basic material for manufacturing printed circuit boards. It is made by impregnating a reinforcing material (such as fiberglass cloth) with resin adhesive, then covering it with copper foil, and finally forming it under high temperature and high pressure.

[0003] In existing technologies, ceramic substrates are a commonly used circuit board substrate, possessing advantages such as high thermal conductivity, highly matched coefficients of thermal expansion, and excellent electrical conductivity. However, ceramic substrates also face some problems, such as poor impact resistance, which can lead to damage during transportation and installation, causing property loss. Therefore, a high thermal conductivity substrate is proposed as an improvement. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this invention is to provide a substrate with high thermal conductivity to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.

[0006] To achieve the above objectives, one embodiment of this utility model provides a high thermal conductivity substrate, comprising an upper substrate and a lower substrate. The upper substrate is made of ceramic, and the lower substrate is made of metal. A plurality of pillars are disposed between the upper substrate and the lower substrate, and a plurality of conductive pillars are disposed between the upper substrate and the lower substrate. A protective frame is disposed on the outer side of the upper substrate. A plurality of heat-conducting plates are fixedly connected to the bottom surface of the upper substrate, and heat-conducting pillars are disposed between the heat-conducting plates and the lower substrate. A plurality of heat dissipation rods are fixedly connected to the sides of the heat-conducting pillars.

[0007] Preferably, in any of the above solutions, a plurality of the columns are evenly arranged at the corners of the lower substrate, and the columns are made of metal.

[0008] The above technical solution employs a ceramic substrate, which has a higher thermal conductivity than metal, enabling rapid heat conduction. The lower substrate is made of metal, which offers greater mechanical strength, effectively improving the overall strength of the substrate. Posts are placed between the upper and lower substrates, connecting them and creating a gap for heat dissipation. These posts, made of metal, possess sufficient strength to ensure support. The even distribution of several posts at the corners contributes to the stability of the connection between the upper and lower substrates.

[0009] Preferably, in any of the above solutions, a plurality of the conductive pillars are evenly arranged between the upper substrate and the lower substrate, and the protective frame is made of metal.

[0010] The above technical solution involves conductive pillars forming a conductive path between the upper and lower substrates. A protective frame is installed on the outside of the upper substrate, providing lateral protection and significantly improving its impact resistance. The protective frame is made of metal, ensuring both protection and heat dissipation, which is beneficial for the circuit board's cooling.

[0011] Preferably, in any of the above schemes, a plurality of the heat-conducting plates are evenly arranged on the bottom surface of the upper substrate, and both the heat-conducting plates and the heat-conducting pillars adopt a cylindrical structure.

[0012] The above technical solution employs a heat-conducting plate to absorb and conduct heat from the upper substrate. Combined with heat-conducting pillars, this allows heat to be transferred between the upper and lower substrates, facilitating heat dissipation. The evenly distributed arrangement of several heat-conducting plates ensures uniform heat dissipation throughout the upper substrate.

[0013] Preferably, in any of the above embodiments, a heat-conducting plate is provided between the lower substrate and the heat-conducting pillar, and a plurality of heat dissipation rods are evenly arranged along the height direction of the heat-conducting pillar.

[0014] The above technical solution involves connecting the heat-conducting pillar to the lower substrate, allowing heat to be transferred from the upper substrate to the lower substrate, thus utilizing the area of ​​the lower substrate for heat dissipation. A heat-conducting plate is placed between the lower substrate and the heat-conducting pillar to facilitate heat transfer from the pillar to the lower substrate. A heat dissipation rod is installed on the heat-conducting pillar to dissipate heat into the air, increasing the heat dissipation area and improving heat dissipation efficiency.

[0015] Preferably, in any of the above solutions, the heat dissipation rod, the heat-conducting column, and the heat-conducting plate are all made of metal.

[0016] The above technical solution employs metal materials for the heat dissipation rod, heat conduction column, and heat conduction plate, ensuring heat dissipation while possessing high strength, effectively improving the mechanical strength of the substrate and enhancing its impact resistance.

[0017] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows: 1. This high thermal conductivity substrate features an upper substrate, lower substrate, pillars, a protective frame, a heat-conducting plate, heat-conducting pillars, and a heat dissipation rod. The upper substrate is made of ceramic, which has a higher thermal conductivity than metal, enabling rapid heat transfer. The lower substrate is made of metal, which has higher mechanical strength, effectively improving the overall strength of the substrate. The heat-conducting plate, heat-conducting pillars, and heat dissipation rod assist the upper substrate in heat dissipation between the upper and lower substrates, resulting in better heat dissipation performance. A protective frame is provided on the outside of the upper substrate, providing side protection and significantly improving its impact resistance. While ensuring excellent heat dissipation performance, this design also greatly enhances the substrate's mechanical strength, contributing to its longevity.

[0018] 2. This high thermal conductivity substrate features a metal protective frame, ensuring both protection and heat dissipation, which is beneficial for circuit board cooling. Heat dissipation rods are installed on the heat-conducting pillars, allowing heat to dissipate into the air, increasing the heat dissipation area and improving efficiency. The heat dissipation rods, heat-conducting pillars, and heat-conducting plates are all made of metal, ensuring both effective heat dissipation and high strength, effectively improving the substrate's mechanical strength and impact resistance.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a first-view structural diagram of the present invention; Figure 2 This is a schematic diagram of the second-view structure of the present invention.

[0021] In the diagram: 1-Upper substrate, 2-Lower substrate, 3-Post, 4-Conductive post, 5-Protective frame, 6-Heat-conducting plate, 7-Heat-conducting post, 8-Heat dissipation rod. Detailed Implementation

[0022] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0023] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0024] like Figures 1-2 As shown, this utility model includes an upper substrate 1 and a lower substrate 2. The upper substrate 1 is made of ceramic material, and the lower substrate 2 is made of metal material. Several pillars 3 are arranged between the upper substrate 1 and the lower substrate 2, and several conductive pillars 4 are arranged between the upper substrate 1 and the lower substrate 2. A protective frame 5 is arranged on the outer side of the upper substrate 1. Several heat-conducting plates 6 are fixedly connected to the bottom surface of the upper substrate 1, and heat-conducting pillars 7 are arranged between the heat-conducting plates 6 and the lower substrate 2. Several heat dissipation rods 8 are fixedly connected to the side of the heat-conducting pillars 7.

[0025] Example 1: Several pillars 3 are evenly arranged at the corners of the lower substrate 2. The pillars 3 are made of metal. The upper substrate 1 is made of ceramic, which has a higher thermal conductivity than metal, enabling rapid heat conduction. The lower substrate 1 is made of metal, which has higher mechanical strength, effectively improving the overall strength of the substrate. The pillars 3 are placed between the upper substrate 1 and the lower substrate 2, connecting them and forming a gap between them to allow heat to dissipate outwards. The pillars 3 are made of metal, which has a certain strength to ensure support strength. The even arrangement of several pillars 3 at the corners is beneficial to the stability of the connection between the upper substrate 1 and the lower substrate 2. Several conductive pillars 4 are evenly arranged between the upper substrate 1 and the lower substrate 2. The protective frame 5 is made of metal. The conductive pillars 4 form a conductive path between the upper substrate 1 and the lower substrate 2. The protective frame 5 is set on the outside of the upper substrate 1, providing side protection for the upper substrate 1 and greatly improving its side impact resistance. The protective frame 5 is made of metal, which ensures protection while also providing some heat dissipation, which is beneficial for the heat dissipation of the circuit board.

[0026] Example 2: Several heat-conducting plates 6 are evenly arranged on the bottom surface of the upper substrate 1. Both the heat-conducting plates 6 and the heat-conducting pillars 7 adopt a cylindrical structure. The heat-conducting plates 6 are used to absorb and conduct heat on the upper substrate 1. Together with the heat-conducting pillars 7, they can conduct heat on the upper substrate 1 to the space between the upper substrate 1 and the lower substrate 2, facilitating heat dissipation. The even arrangement of several heat-conducting plates 6 facilitates the uniform dissipation of heat from all parts of the upper substrate 1.

[0027] Example 3: A heat-conducting plate 6 is disposed between the lower substrate 2 and the heat-conducting pillar 7, and several heat dissipation rods 8 are evenly arranged along the height direction of the heat-conducting pillar 7. The heat-conducting pillar 7 is connected to the lower substrate 2, which can conduct heat from the upper substrate 1 to the lower substrate 2, utilizing the area of ​​the lower substrate 2 for heat dissipation. A heat-conducting plate 5 is disposed between the lower substrate 2 and the heat-conducting pillar 7 to facilitate the conduction of heat from the heat-conducting pillar 7 to the lower substrate 2. Heat dissipation rods 8 are disposed on the heat-conducting pillar 7, which can dissipate heat from the heat-conducting pillar 7 into the air, increasing the heat dissipation area and improving heat dissipation efficiency. The heat dissipation rods 8, the heat-conducting pillar 7, and the heat-conducting plate 6 are all made of metal. The use of metal materials for the heat dissipation rods 8, the heat-conducting pillar 7, and the heat-conducting plate 6 ensures heat dissipation effect while having high strength, which can effectively improve the mechanical strength of the substrate and make the substrate more impact-resistant.

[0028] The working principle of this utility model is as follows: S1. The upper substrate 1 is made of ceramic material, which has a higher thermal conductivity than metal material, enabling rapid heat conduction. The lower substrate 1 is made of metal material, which has higher mechanical strength and can effectively improve the overall strength of the substrate. S2, heat-conducting plate 6, heat-conducting pillar 7 and heat dissipation rod 8 assist the upper substrate 1 in heat dissipation between the upper substrate 1 and the lower substrate 2, so that the circuit board has better heat dissipation performance. S3. A protective frame 5 is provided on the outside of the upper substrate 1. The protective frame 5 provides side protection for the upper substrate 1, which greatly improves its side impact resistance.

[0029] Compared with the prior art, the present invention has the following advantages: 1. This high thermal conductivity substrate comprises an upper substrate 1, a lower substrate 2, pillars 3, a protective frame 5, a heat-conducting plate 6, heat-conducting pillars 7, and a heat dissipation rod 8. The upper substrate 1 is made of ceramic, which has a higher thermal conductivity than metal, enabling rapid heat conduction. The lower substrate 1 is made of metal, which has higher mechanical strength, effectively improving the overall strength of the substrate. The heat-conducting plate 6, heat-conducting pillars 7, and heat dissipation rod 8 assist the upper substrate 1 in heat dissipation between the upper substrate 1 and the lower substrate 2, resulting in better heat dissipation performance. A protective frame 5 is provided on the outside of the upper substrate 1, providing side protection and significantly improving its impact resistance. While ensuring the substrate's heat dissipation performance, this design also greatly enhances its mechanical strength, contributing to its long-term use.

[0030] 2. This high thermal conductivity substrate features a metal protective frame 5, which ensures protection while also providing some heat dissipation, thus facilitating heat dissipation for the circuit board. Heat dissipation rods 8 are installed on the heat-conducting pillars 7, allowing heat to dissipate from the pillars 7 into the air, increasing the heat dissipation area and improving efficiency. The heat dissipation rods 8, heat-conducting pillars 7, and heat-conducting plate 6 are all made of metal, ensuring effective heat dissipation while maintaining high strength, effectively improving the substrate's mechanical strength and impact resistance.

Claims

1. A high thermal conductivity substrate, comprising an upper substrate (1) and a lower substrate (2); characterized in that, The upper substrate (1) is made of ceramic material, the lower substrate (2) is made of metal material, a number of pillars (3) are provided between the upper substrate (1) and the lower substrate (2), a number of conductive pillars (4) are provided between the upper substrate (1) and the lower substrate (2), and a protective frame (5) is provided on the outside of the upper substrate (1). The bottom surface of the upper substrate (1) is fixedly connected with several heat-conducting plates (6), and a heat-conducting column (7) is provided between the heat-conducting plate (6) and the lower substrate (2). A number of heat dissipation rods (8) are fixedly connected to the side of the heat-conducting column (7).

2. The high thermal conductivity substrate as described in claim 1, characterized in that: Several of the columns (3) are evenly arranged at the corners of the lower substrate (2), and the columns (3) are made of metal.

3. The high thermal conductivity substrate as described in claim 2, characterized in that: Several conductive pillars (4) are evenly arranged between the upper substrate (1) and the lower substrate (2), and the protective frame (5) is made of metal.

4. The high thermal conductivity substrate as described in claim 3, characterized in that: Several heat-conducting plates (6) are evenly arranged on the bottom surface of the upper substrate (1), and both the heat-conducting plates (6) and the heat-conducting pillars (7) adopt a cylindrical structure.

5. A high thermal conductivity substrate as described in claim 4, characterized in that: A heat-conducting plate (6) is provided between the lower substrate (2) and the heat-conducting column (7), and several heat dissipation rods (8) are evenly arranged along the height direction of the heat-conducting column (7).

6. A high thermal conductivity substrate as described in claim 5, characterized in that: The heat dissipation rod (8), heat conduction column (7) and heat conduction plate (6) are all made of metal.

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