A symmetrical bus current-sharing water-cooled power device with multiple igbt modules in parallel

By using a symmetrical busbar flow-equalizing water-cooled power device, the problems of junction temperature difference and current imbalance when multiple IGBT modules are connected in parallel are solved, achieving uniform heat dissipation and current balance of IGBT modules, improving the reliability of the device and simplifying its structure.

CN224556117UActive Publication Date: 2026-07-24CENTEROLE (DALIAN) ELECTRIC TRANSMISSION TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CENTEROLE (DALIAN) ELECTRIC TRANSMISSION TECH CO LTD
Filing Date
2025-09-04
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

When multiple IGBT modules are connected in parallel, traditional heat dissipation structures lead to significant differences in junction temperature and differences in busbar parasitic inductance, causing current imbalance. The device is bulky and complex in structure.

Method used

A symmetrical busbar current-sharing water-cooled power device is adopted, including a water-cooled heat sink, a stacked busbar, and power capacitors, to ensure that the IGBT modules are in uniform contact with the heat dissipation surface, eliminate the difference in parasitic inductance of the busbar, and achieve consistency of the current path.

Benefits of technology

Significantly reduces junction temperature differences in IGBT modules, lowers the risk of device failure, improves operational reliability, simplifies device structure, and reduces maintenance costs.

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Abstract

The utility model relates to the field of power electronics, especially a kind of symmetric busbar current-sharing water-cooled power device of multiple IGBT module parallel connection. Device includes water-cooled radiator, left / right / front laminated busbar, power capacitor and frame. Water-cooled radiator is vertically installed in the front side of frame, and IGBT module is arrayed and adhered along its radiating surface Installation;Left / right laminated busbar is symmetrically installed on both sides of frame, and power capacitor is symmetrically installed on both ends of rear side of frame;Front laminated busbar is vertically arranged on the front of IGBT module, and it is electrically connected with each IGBT module terminal one by one, and the left / right laminated busbar is electrically connected with the corresponding area of front laminated busbar and the same side power capacitor pin one by one respectively. The device can reduce the junction temperature difference of IGBT module, eliminate the parasitic inductance difference of busbar to realize current balance, also can reduce the volume of device, simplify maintenance, improve the reliability and stability of power unit.
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