A lamination collating device and automatic unpacking apparatus
By designing a wafer stacking and sorting device, and utilizing a rotating mechanism, pneumatic vibrator, and ball screw structure, the automated sorting and positioning of silicon wafers has been achieved. This solves the problems of cumbersome operation and high labor costs in existing technologies, and improves the reliability and efficiency of silicon wafer stacking.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING SUNWALKLE TECH CO LTD
- Filing Date
- 2025-08-07
- Publication Date
- 2026-07-24
AI Technical Summary
In existing technologies, the unpacking and stacking of monocrystalline silicon wafers are cumbersome, involve high labor intensity and labor costs, and can easily affect uniformity.
Design a wafer stacking and sorting device that employs a rotary mechanism, a pneumatic vibrator, a ball screw structure, and a servo device. Through mechanical structure and motor torque mode, combined with vibration components and automatic pressure adjustment clamping mode, it realizes the automated sorting and positioning of silicon wafers.
It improves the reliability and efficiency of the silicon wafer stacking process, reduces the difficulty of placing silicon wafers by robotic arms, avoids silicon wafer damage, and ensures a neat and uniform result.
Smart Images
Figure CN224556153U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of single crystal silicon wafer feeding technology. Specifically, it relates to a wafer stacking and sorting device and an automatic unpacking device. More specifically, it designs a wafer stacking and sorting device before silicon wafer feeding. Background Technology
[0002] Currently, the first step in the manufacturing process of solar panels is to pull the silicon ingots into round shapes. The second step is to cut the round ingots into square ones, that is, to cut the monocrystalline silicon ingots into square bars according to the required dimensions. Then, the square bars are sliced, packaged, and transported to a factory with silicon wafer texturing and cleaning equipment. After that, the boxes are unpacked manually, and the wafers are stacked and arranged manually before being placed into the wafer forming machine fixture. The manual unpacking and stacking process is cumbersome, labor-intensive, and has high labor costs, and the uniformity is easily affected. Utility Model Content
[0003] The purpose of this utility model is to provide a wafer stacking and sorting device and an automatic unpacking equipment for stacking silicon wafers into large stacks and arranging them neatly. It aims to solve the technical problems of manual unpacking and stacking of wafers in the prior art, which involve cumbersome operation steps, high labor intensity and high labor costs.
[0004] To achieve the above objectives, the technical solution adopted by this utility model is: to provide a stacking and sorting device, comprising: Base; The rotating mechanism includes a mechanism base disposed on the base and a rotating structure rotatably connected to the mechanism base, wherein the rotating structure is provided with a receiving position for placing a silicon wafer; A second drive motor is connected to the rotating structure, and the second drive motor is used to drive the rotating structure to rotate relative to the base of the mechanism. A pneumatic vibrator is connected to the rotating structure; The second adjustment component includes a third baffle disposed in front of the rotating mechanism and a cylinder disposed on the rotating mechanism for pushing the silicon wafer to move in the front-back direction; The first adjustment component is used to adjust the orientation of the silicon wafer in the left-right direction.
[0005] Preferably, the first adjustment component includes: The first baffle is disposed on either side of the rotating mechanism; A second baffle is disposed on the other side of the rotating mechanism; the second baffle is disposed opposite to the first baffle. The ball screw structure is connected to both the first baffle and the second baffle. A first drive motor is connected to the ball screw structure, and the drive motor adjusts the relative positions of the first baffle and the second baffle through the ball screw structure.
[0006] Preferably, the first adjustment component further includes: A linear slide rail is provided on the upper surface of the base; The slider is provided in at least two sets, with one slider connected to the first baffle and the other slider connected to the second baffle.
[0007] Preferably, the system further includes a buffer structure disposed on the chassis; the buffer structure includes a first buffer member disposed on the rear side of the base of the mechanism; the first buffer member provides a buffering function in the vertical direction.
[0008] Preferably, the buffer structure further includes a second buffer element, which is disposed between the first baffle and the second baffle; the second buffer element provides a buffering function in the lateral direction.
[0009] Preferably, the ball screw structure is a forward and reverse rotating ball screw; one end of the ball screw structure is connected to the first baffle; the other end of the ball screw structure is connected to the second baffle.
[0010] Preferably, the vibrating element is a pneumatic vibrator; the pneumatic vibrator is disposed on the bottom surface of the rotating structure.
[0011] Preferably, the second drive motor drives the rotating structure to rotate via a rotating shaft assembly.
[0012] An automatic box unpacking device includes a stacking and sorting device as described in any of the above claims.
[0013] The beneficial effects of the wafer stacking and sorting device and automatic unpacking equipment provided by this utility model are as follows: Compared with the prior art, the wafer stacking and sorting device and automatic unpacking equipment of this utility model solve the technical problems existing in the automatic loading and unloading process of robots through mechanical structure, torque mode of motor structure, vibrating component, and automatic pressure adjustment clamping mode, thereby improving reliability. The wafer stacking and sorting device is tilted at a certain angle, lowered vertically, and then rotated to horizontal, which reduces the difficulty of placing silicon wafers by the robotic arm. The sorting adopts a servo device to drive the forward and reverse rotating lead screw structure, clamping according to the torque mode. Different clamping forces can be used to clamp neatly multiple times to prevent damage to silicon wafers. The rotating structure has a pneumatic vibrator under it, which uses gravity plus vibration to align the wafers, resulting in better alignment without damaging the silicon wafers. The sorting and aligning cylinder adopts an automatic pressure adjustment method, using low pressure for initial positioning and high pressure for final positioning, which will not damage the silicon wafers and effectively ensures the alignment effect. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 This is currently the mainstream silicon wafer transport box; Figure 2 A schematic diagram of the structure of a stacking and sorting device provided in this embodiment of the utility model. Figure 1 ; Figure 3 A schematic diagram of the structure of a stacking and sorting device provided in this embodiment of the utility model. Figure 2 ; Figure 4 A schematic diagram of the structure of a stacking and sorting device provided in this embodiment of the utility model. Figure 3 ; Figure 5 A schematic diagram of the structure of a stacking and sorting device provided in this embodiment of the utility model. Figure 4 ; Figure 6 A schematic diagram of the structure of a stacking and sorting device provided in this embodiment of the utility model. Figure 5 ; Figure 7 A schematic diagram of the structure of a stacking and sorting device provided in this embodiment of the utility model. Figure 6 ; Figure 8 A schematic diagram of the structure of a stacking and sorting device provided in this embodiment of the utility model. Figure 7 .
[0016] In the diagram: 1. Base; 2. Rotating mechanism; 21. Mechanism base; 22. Rotating structure; 23. Rotating shaft assembly; 3. Silicon wafer; 4. Vibrating component; 5. Third baffle; 6. Second drive motor; 7. First drive motor; 8. First baffle; 9. Cylinder; 10. Second baffle; 11. Second buffer component; 12. Ball screw structure; 13. Linear slide rail; 14. Slider; 15. First buffer component. Detailed Implementation
[0017] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0018] Please refer to the following: Figures 2 to 8The present invention provides a wafer stacking and sorting device. The wafer stacking and sorting device includes: a base 1, a rotating mechanism 2, a second drive motor 6, a vibrating element 4, a second adjustment assembly, and a first adjustment assembly. The rotating mechanism 2 includes a mechanism base 21 mounted on the base 1 and a rotating structure 22 rotatably connected to the mechanism base 21. The rotating structure 22 has a receiving position for placing silicon wafers 3. The second drive motor 6 is mounted on the base 1 and connected to the rotating structure 22, and is used to drive the rotating structure 22 to rotate relative to the mechanism base 21. The vibrating element 4 is connected to the rotating structure 22 and is used to drive the rotating structure 22 to vibrate. Specifically, the vibrating element 4 assists the silicon wafers 3 to align within the rotating structure 22 by gravity and vibration. The second adjustment assembly includes a third baffle 5 mounted in front of the rotating mechanism 2 and a cylinder 9 mounted on the rotating mechanism 2 for moving the silicon wafers 3 in the front-back direction. The first adjustment assembly is used to adjust the posture of the silicon wafers 3 in the left-right direction.
[0019] In some feasible embodiments, the mechanism base 21 includes a first base plate disposed on the upper surface of the base 1, and a second base plate disposed on the upper surface of the base 1, the second base plate being spaced horizontally relative to the first base plate. The rotating structure 22 is connected to the second drive motor 6 via a rotating shaft assembly 23. The rotating shaft assembly 23 is horizontally mounted between the first and second base plates, and is rotatably connected to both the first and second base plates. The second drive motor 6 is disposed on one side of the first and / or second base plates. One end of the second drive motor 6 is drively connected to the rotating shaft assembly 23. The second drive motor 6 drives the rotating structure 22 to rotate by rotating the rotating shaft assembly 23 (i.e., the rotating structure 22 rotates about the rotating shaft assembly 23 as an axis). Specifically, the rotating structure includes a rotating base plate connected to the rotating shaft assembly 23, baffles on the left and right sides of the rotating base plate, and a cylinder 9 on the rear side of the rotating base plate. A vibrating element 4 is provided on the bottom surface of the rotating base plate.
[0020] In any feasible embodiment, the second drive motor 6 is disposed on the left side of the first base plate. One end of the second drive motor 6 is connected to the rotating shaft assembly 23 for transmission. The second drive motor 6 drives the rotating shaft assembly 23 to rotate, thereby causing the rotating structure 22 to rotate relative to the upper surface of the base 1.
[0021] In some feasible embodiments, the vibrator 4 is a pneumatic vibrator. The pneumatic vibrator is disposed on the bottom surface of the rotating structure 22. More specifically, the pneumatic vibrator is disposed at the center of the bottom surface of the rotating structure 22. The pneumatic vibrator assists in silicon wafer straightening by using vibration straightening, and is lightweight and reliable.
[0022] As one specific implementation of this utility model, please refer to the following: Figures 2 to 8 The first adjustment assembly includes a first baffle 8, a second baffle 10, a first drive motor 7, and a ball screw structure 12. Specifically, the first adjustment assembly includes a first baffle 8 disposed on the left side of the rotating mechanism 2, a second baffle 10 disposed on the right side of the rotating mechanism 2, and a first drive motor 7 that provides power for the movement of the first baffle 8 and the second baffle 10. The ball screw structure 12 is connected to the first baffle 8, the second baffle 10, and the first drive motor 7. The first baffle 8 and the second baffle 10 are disposed opposite to each other. The first drive motor 7 adjusts the relative positions of the first baffle 8 and the second baffle 10 respectively through the ball screw structure 12.
[0023] In some feasible embodiments, the ball screw structure 12 is a forward and reverse rotating ball screw. One end of the ball screw structure 12 is connected to the first baffle 8. The other end of the ball screw structure 12 is connected to the second baffle 10. The drive motor 7 can drive the first baffle 8 and the second baffle 10 to move in opposite directions through the ball screw structure 12.
[0024] As one specific implementation of this utility model, please refer to the following: Figures 2 to 8 The first adjustment component also includes a linear slide rail 13 disposed on the upper surface of the base 1 and a slider 14 slidably connected to the linear slide rail 13. The movement paths of the first baffle 8 and the second baffle 10 are limited by the cooperation of the linear slide rail 13 and the slider 14. Specifically, the linear slide rail 13 is disposed on the front side of the rotating mechanism 2 in the left-right direction. The linear slide rail 13 is disposed adjacent to the ball screw structure 12. There are two sliders 14. One slider 14 is connected to the first baffle 8. The other slider 14 is connected to the second baffle 10.
[0025] In one specific embodiment of this utility model, the wafer stacking and sorting device further includes a buffer structure disposed on the base 1. The buffer structure provides buffering in the vertical and / or horizontal directions. The buffer structure includes a first buffer 15 and a second buffer 11. The first buffer 15 is disposed on the rear side of the mechanism base 21. It is used to effectively protect the rotating structure 22 and the silicon wafer 3. Specifically, the first buffer 15 is a vertical buffer pad. The vertical buffer pad provides a buffering structure for the rotating structure 22 by generating elastic deformation when in contact with the rotating structure 22. The second buffer 11 is disposed on the front side of the mechanism base 21 and is located between the first baffle 8 and the second baffle 10. The second buffer 11 is used to effectively protect the first baffle 8, the second baffle 10, the rotating structure 22, and the silicon wafer 3 by providing buffering. Specifically, the second buffer 11 is a buffer pad structure. The buffer pad structure achieves a horizontal buffering function by generating elastic deformation when in contact with the first baffle 8 and the second baffle 10 respectively. The buffer pad structure achieves vertical buffering function by generating elastic shape when it comes into contact with the rotating structure 22 and the silicon wafer 3 respectively.
[0026] The operation of the stacking and sorting device is as follows: In practical applications, multi-compartment foam boxes are commonly used for silicon wafer transport packaging (see reference). Figure 1 Multi-compartment foam box (see reference) Figure 1 Each small compartment holds 200 silicon wafers, while one fixture of the wafer forming machine can hold 800 silicon wafers, or 4 small stacks. After the machine automatically unpacks the wafers, the stacks of silicon wafers are not neat on all four sides and cannot be directly placed into the wafer forming machine fixture. Therefore, the wafer stacking and sorting device provided by this invention is used. Specifically, the rotating structure 22 is first adjusted to a preset posture (in this posture, the rotating structure 22 is set at a certain angle relative to the upper surface of the base 1, which facilitates the placement of silicon wafers 3, for example, the second drive motor 6 first drives the rotating structure 22 to rotate 10 degrees from a vertical position to a horizontal position. Then, the robot stacks multiple silicon wafers 3 sequentially on the rotating structure 22).
[0027] Then, multiple stacks of silicon wafers 3 are sequentially stacked on the receiving position of the rotating structure 22. Then, the second drive motor 6 drives the rotating structure 22 to rotate horizontally, and at the same time, the vibrating element 4 is activated to generate vibration. Under the combined action of gravity and vibration, the silicon wafers 3 will align with the bottom of the rotating structure 22.
[0028] After the rotating structure 22 reaches a horizontal position, the vibrating component 4 stops working. Then, the first drive motor 7, through the ball screw structure 12, drives the first baffle 8 and the second baffle 10 to move towards the center. The first drive motor 7 controls the first baffle 8 and the second baffle 10 to clamp the silicon wafer 3. Specifically, a pre-clamping is performed first, then loosened by 2 mm. Then, in a low-pressure state, the cylinder 9 pushes the silicon wafer 3 towards the baffle 5 in the forward-backward direction. The first drive motor 7, through the ball screw structure 12, drives the first baffle 8 and the second baffle 10 towards the center. The clamping force of the baffle on the silicon wafer is controlled by the torque mode of the first drive motor 7. A 30% force is used for pre-clamping, then 2 mm is loosened. Then, the torque of the drive servo motor is adjusted to 100% clamping, and the clamping is loosened to 10%. Finally, the cylinder 9 switches to a high-pressure state to align the silicon wafer 3, preparing it for the next step of robot unloading.
[0029] The present invention also provides an automatic box unpacking device, including the stacking and sorting device as described in any of the above claims.
[0030] This utility model provides a wafer stacking and sorting device, which, compared with the prior art, solves the technical problems existing in the automatic loading and unloading process of robots and improves reliability through mechanical structure, torque mode of motor structure, vibrating element 4, and automatic pressure adjustment clamping mode. The wafer stacking and sorting device is tilted at a certain angle, lowered vertically, and then rotated to horizontal, which reduces the difficulty of the robot arm placing silicon wafers. The sorting adopts a servo device to drive the forward and reverse rotating screw structure, clamping according to the torque mode. Different clamping forces can be used to clamp and straighten the wafers multiple times to prevent damage to the silicon wafers. The rotating structure 22 has a pneumatic vibrator under it, which uses gravity and vibration to align the wafers, resulting in better alignment without damaging the silicon wafers. The sorting and alignment cylinder adopts an automatic pressure adjustment method, using low pressure for initial positioning and high pressure for final positioning, which will not damage the silicon wafers and effectively ensures the alignment effect.
[0031] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A stacking and sorting device, characterized in that, include: Base (1); The rotating mechanism (2) includes a mechanism base (21) disposed on the base (1) and a rotating structure (22) rotatably connected to the mechanism base (21). The rotating structure (22) is provided with a receiving position for placing a silicon wafer (3). The second drive motor (6) is connected to the rotating structure (22), and the second drive motor (6) is used to drive the rotating structure (22) to rotate relative to the mechanism base (21); The vibrating element (4) is connected to the rotating structure (22); The second adjustment component includes a third baffle (5) disposed in front of the rotating mechanism (2) and a cylinder (9) disposed on the rotating mechanism (2) for pushing the silicon wafer (3) to move in the front-back direction. The first adjustment component is used to adjust the orientation of the silicon wafer (3) in the left-right direction.
2. The stacking and sorting device as described in claim 1, characterized in that, The first adjustment component includes: The first baffle (8) is disposed on either side of the rotating mechanism (2); The second baffle (10) is disposed on the other side of the rotating mechanism (2); the second baffle (10) is disposed opposite to the first baffle (8); The ball screw structure (12) is connected to both the first baffle (8) and the second baffle (10). The first drive motor (7) is connected to the ball screw structure (12), and the drive motor (7) adjusts the relative positions of the first baffle (8) and the second baffle (10) through the ball screw structure (12).
3. The stacking and sorting device as described in claim 2, characterized in that, The first adjustment component also includes: A linear slide rail (13) is disposed on the upper end face of the base (1); At least two sets of sliders (14) are provided, with one slider (14) connected to the first baffle (8) and the other slider (14) connected to the second baffle (10).
4. The stacking and sorting device as described in claim 3, characterized in that, The system also includes a buffer structure disposed on the base (1); the buffer structure includes a first buffer member (15), which is disposed on the rear side of the mechanism base (21); the first buffer member (15) provides a buffer function in the vertical direction.
5. The stacking and sorting device as described in claim 4, characterized in that, The buffer structure further includes a second buffer (11), which is disposed between the first baffle (8) and the second baffle (10); the second buffer (11) provides a buffering function in the lateral direction.
6. The stacking and sorting device as described in claim 5, characterized in that, The ball screw structure (12) is a forward and reverse rotating ball screw; one end of the ball screw structure (12) is connected to the first baffle (8); the other end of the ball screw structure (12) is connected to the second baffle (10).
7. The stacking and sorting device as described in claim 1, characterized in that, The vibrating element (4) is a pneumatic vibrator; the pneumatic vibrator is disposed on the bottom surface of the rotating structure (22).
8. The stacking and sorting device as described in claim 1, characterized in that, The second drive motor (6) drives the rotating structure (22) to rotate via the rotating shaft assembly (23).
9. An automatic box-opening device, characterized in that, Includes the stacking and sorting apparatus according to any one of claims 1-8.