Wafer transfer platform mechanism
By using a wafer transfer platform mechanism and an industrial camera in conjunction with the die bonder, and utilizing a hollow stepper motor and a rotary air connector for wafer position and angle correction, the problem of wafer deviation during the placement process is solved, and the transmission accuracy and packaging quality are improved.
CN224556232UActive Publication Date: 2026-07-24SHENZHEN DACHENG AUTOMATION EQUIP CO LTD
View PDF 1 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN DACHENG AUTOMATION EQUIP CO LTD
- Filing Date
- 2025-07-11
- Publication Date
- 2026-07-24
Smart Images
Figure CN224556232U_ABST
Abstract
The application relates to a wafer transfer platform mechanism used for completing wafer position correction by cooperating with an industrial camera of an external device, which comprises a base, a linear drive assembly, a cleaning assembly and a correction assembly arranged on the base in sequence, and a position adjusting assembly arranged on the linear drive assembly and comprising a hollow stepping motor, wherein a suction nozzle seat is arranged at a first end of the hollow stepping motor, a suction nozzle is arranged on the suction nozzle seat, a rotary air joint is installed on a second end of the hollow stepping motor through a connecting nut, and the suction nozzle is in air path conduction with the rotary air joint through the hollow stepping motor, so that the suction nozzle is driven by the hollow stepping motor to perform angle adjustment, transmission between the motor and the suction nozzle is avoided by using a transmission mechanism, and the angle control precision can be improved.
Need to check novelty before this filing date? Find Prior Art