Electrochromic device and end product
By designing an insulating groove and a double fixing structure in the electrochromic device, the problem of busbar detachment was solved, improving connection reliability and service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN GUANGYI TECH CO LTD
- Filing Date
- 2025-07-22
- Publication Date
- 2026-07-28
AI Technical Summary
In existing electrochromic devices, the bonding strength between the busbar and the conductive layer gradually decreases under harsh environments such as high-temperature cycling, causing the busbar to detach, resulting in an internal open circuit in the device and affecting its service life and reliability.
An electrochromic device is designed, in which a first groove is set on the edge stack body, so that the bus bar is partially embedded in the groove and insulated from the conductive layer, and the bus bar and the conductive layer are double fixed by the conductive part and the adhesive structure, thereby enhancing the connection reliability.
This improves the connection stability between the busbar and the conductive layer, reduces the risk of the busbar falling off, and extends the service life and reliability of the electrochromic device.
Smart Images
Figure CN224569410U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electrochromic technology, and more particularly to an electrochromic device and its end product. Background Technology
[0002] Electrochromic devices (ECDs) are widely used in various fields such as display, light modulation and energy saving, especially in devices such as smart windows, displays and mirrors.
[0003] In existing technologies, busbars are typically bonded to the surface of a conductive layer using conductive adhesive to achieve electrical connection. However, after prolonged use, especially under harsh environmental conditions such as high-temperature cycling, the adhesive strength between the busbar and the conductive layer gradually decreases, causing the busbar to detach from the conductive layer. This results in an internal open circuit, severely impacting the device's lifespan and reliability. Utility Model Content
[0004] In view of this, this application provides an electrochromic device and a terminal product, which aims to solve one of the technical problems in the prior art.
[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:
[0006] In a first aspect, embodiments of this application provide an electrochromic device, comprising:
[0007] An electrochromic device includes a first base layer, a first conductive layer, an electrochromic layer, a second conductive layer, and a second base layer stacked sequentially. The electrochromic device has a central stack and an edge stack that is electrically connected to the central stack. The edge stack surrounds the central stack and has a first groove that penetrates the first base layer, the first conductive layer, and the electrochromic layer to expose the second conductive layer.
[0008] The first busbar is at least partially disposed within the first groove, and the first busbar is insulated from the wall of the first groove;
[0009] A first conductive portion is disposed in the first groove and connected to the surface of the second conductive layer, and the first busbar is connected to the side of the first conductive portion away from the second conductive layer.
[0010] A first adhesive structure, which is an electrical insulator, is at least partially disposed within the first groove. The first adhesive structure connects the first busbar to at least one of the central stack, the second conductive layer, and the first conductive portion within the first groove.
[0011] In one embodiment of the first aspect, the first adhesive structure includes a first connecting portion disposed within the first groove, the first busbar, the first conductive portion, the second conductive layer and the central stack forming a first gap, and at least a portion of the first connecting portion filling the first gap.
[0012] In one embodiment of the first aspect, the first connecting portion completely fills the first gap.
[0013] In one embodiment of the first aspect, the first connection portion connects the first busbar and the first conductive portion to the side facing the central stack, connects the second conductive layer, and connects the side of the central stack facing the edge stack.
[0014] In one embodiment of the first aspect, the first connection portion connects the first busbar and the first conductive portion to the side facing the central stack, and the first connection portion is spaced apart from the central stack.
[0015] In one embodiment of the first aspect, the side of the first connection portion away from the second conductive layer is flush with the surface of the first busbar.
[0016] In one embodiment of the first aspect, the side of the first connection portion away from the second conductive layer extends beyond the surface of the first busbar.
[0017] In one embodiment of the first aspect, when the side of the first connection portion away from the second conductive layer extends beyond the surface of the first busbar, the first connection portion covers a portion of the surface of the first busbar away from the second conductive layer.
[0018] In one embodiment of the first aspect, the first adhesive structure includes a second connecting portion disposed within the first groove, the second connecting portion being disposed on the side of the first busbar away from the central stack, and the second connecting portion connecting the first busbar, the first conductive portion, and the second conductive layer.
[0019] In one embodiment of the first aspect, the side of the second connection portion away from the second conductive layer is flush with the surface of the first busbar.
[0020] In one embodiment of the first aspect, the side of the second connection portion away from the second conductive layer extends beyond the surface of the first busbar.
[0021] In one embodiment of the first aspect, when the side of the second connection portion away from the second conductive layer extends beyond the surface of the first busbar, the second connection portion covers a portion of the surface of the first busbar away from the second conductive layer.
[0022] In one embodiment of the first aspect, when the first adhesive structure includes the first connecting portion, the first connecting portion and the second connecting portion are spaced apart on the surface of the first busbar away from the second conductive layer, so that at least a portion of the surface of the first busbar is exposed.
[0023] In one embodiment of the first aspect, the distance between the first busbar and the central stack in the direction away from the central stack is L1, satisfying: 1mm≤L1≤2.5mm.
[0024] In one embodiment of the first aspect, the thickness of the second connecting portion is L2, satisfying: 1mm≤L2≤2.5mm.
[0025] In one embodiment of the first aspect, the first adhesive structure further includes a third connecting portion located outside the first groove, the third connecting portion connecting the surface of the first substrate layer facing away from the second substrate layer; wherein:
[0026] The third connecting part connects the side of the first busbar facing the central stack and connects to the first connecting part;
[0027] Alternatively, the third connection portion connects the side of the first busbar away from the central stack and connects the second connection portion.
[0028] In one embodiment of the first aspect, the electrochromic device further includes a first protective structure connected to the surface of the first substrate layer opposite to the second substrate layer, wherein the projection of the first adhesive structure is located within the first protective structure in the direction from the second substrate layer to the first substrate layer.
[0029] In one embodiment of the first aspect, the edge stack further includes a second groove formed in the second base layer, exposing the first conductive layer, the second groove being spaced apart from the first groove; the electrochromic device further includes:
[0030] The second busbar is at least partially disposed within the second groove, and the second busbar is insulated from the wall of the second groove;
[0031] The second conductive part is disposed in the second groove and is connected to the surface of the first conductive layer; the second busbar is connected to the side of the second conductive part away from the first conductive layer.
[0032] The second adhesive structure is at least partially disposed within the second groove, and the second adhesive structure connects the second busbar to at least one of the central stack, the first conductive layer, and the second conductive portion.
[0033] Secondly, embodiments of this application also provide a terminal product, including the electrochromic device in any of the above embodiments, wherein the terminal product includes any one of a rearview mirror, a curtain wall, a car sunroof, a car side window, a car windshield, a housing of an electronic product, glasses, and a display panel of an electronic product.
[0034] Compared with the prior art, the beneficial effects of this application are as follows: This application proposes an electrochromic device, including an electrochromic element, a first busbar, a first conductive portion, and a first adhesive structure. The electrochromic element includes a first base layer, a first conductive layer, an electrochromic layer, a second conductive layer, and a second base layer stacked sequentially. The electrochromic element has a central stack and an edge stack, with the edge stack surrounding the central stack. The edge stack has a first groove that penetrates the first base layer, the first conductive layer, and the electrochromic layer, exposing the second conductive layer. The first busbar is at least partially disposed within the first groove, and the first busbar is insulated from the wall of the first groove, preventing the first busbar from contacting the first conductive layer or the electrochromic layer and causing a short circuit.
[0035] The first conductive part is disposed in the first groove and is connected to the surface of the second conductive layer. The first busbar is connected to the side of the first conductive part away from the second conductive layer, so that the first busbar and the second conductive layer are electrically connected through the first conductive part. The first busbar is fixed to the second conductive layer through the first conductive part.
[0036] The first adhesive structure is at least partially disposed within the first groove. Within the first groove, the first adhesive structure connects the first busbar to at least one of the connecting central stack, the second conductive layer, and the first conductive portion. The first busbar is fixed to at least one of the central stack, the second conductive layer, and the first conductive portion via the first adhesive structure, which helps improve the connection reliability between the first busbar and the second conductive layer.
[0037] In this way, the first busbar is fixed to the second conductive layer through the first conductive part, and the connection between the first busbar and the second conductive layer is directly or indirectly reinforced by the first adhesive structure, thus achieving a second fixation between the first busbar and the second conductive layer. This double fixation structure reduces the risk of the first busbar falling off the surface of the second conductive layer, reduces the occurrence of circuit breaks, and improves the reliability and service life of the electrochromic device. Attached Figure Description
[0038] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0039] Figure 1 The following are schematic diagrams of the electrochromic devices in some embodiments of this application;
[0040] Figure 2 It shows Figure 1 A schematic diagram of the cross-sectional structure of the electrochromic device after being cut along line AA;
[0041] Figure 3 A schematic diagram of the first busbar and the first adhesive structure extension structure of the multi-electrode electrochromic element is shown.
[0042] Figure 4 It shows Figure 2 One of the enlarged structural diagrams at point I in the middle;
[0043] Figure 5 It shows Figure 2 The second enlarged structural diagram at point I;
[0044] Figure 6 One of the structural schematic diagrams of a single-electrode electrochromic device is shown;
[0045] Figure 7 One of the schematic diagrams of a partial structure of a multi-electrode electrochromic device is shown;
[0046] Figure 8 It shows Figure 2 The third enlarged structural diagram at point I;
[0047] Figure 9 A schematic diagram of the second busbar and the second adhesive structure extension of the multi-electrode electrochromic element is shown.
[0048] Figure 10 It shows Figure 2 One of the enlarged structural schematic diagrams at point II;
[0049] Figure 11 It shows Figure 2 The second enlarged structural diagram at point II;
[0050] Figure 12 The second schematic diagram of the structure of a multi-electrode electrochromic device is shown.
[0051] Figure 13 It shows Figure 1 Schematic diagram of the cross-sectional structure at point BB.
[0052] Explanation of key component symbols: 100 - Electrochromic device; 110 - Electrochromic element; 111 - First substrate layer; 112 - First conductive layer; 113 - Electrochromic layer; 114 - Second conductive layer; 115 - Second substrate layer;
[0053] 1131 - Electrochromic film layer; 1132 - Electrolyte layer; 1133 - Ion storage layer; A1 - Central stack; A2 - Edge stack;
[0054] 1161 - First groove; 1162 - Second groove;
[0055] 120 - First busbar; 130 - First conductive part; 140 - First adhesive structure; 150 - Second busbar; 160 - Second conductive part; 170 - Second adhesive structure; 180 - First protective structure; 190 - Second protective structure; G1 - First gap; G2 - Second gap; 141 - First connecting part; 142 - Second connecting part; 143 - Third connecting part; 171 - Fourth connecting part; 172 - Fifth connecting part; 173 - Sixth connecting part. Detailed Implementation
[0056] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0057] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0058] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0059] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0060] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0061] Electrochromic devices (ECDs) have a wide range of applications in displays, light modulation, energy saving, and other fields, and are particularly suitable for devices such as smart windows, displays, and mirrors. ECDs achieve the adjustment of transmittance or reflectance by driving ion migration with an electric field to change the optical properties of the material.
[0062] like Figure 1 and Figure 2 As shown, an embodiment of this application provides an electrochromic device 100. As... Figure 1 and Figure 2 As shown, the electrochromic device 100 includes an electrochromic element 110. The electrochromic element 110 includes a first substrate layer 111, a first conductive layer 112, an electrochromic layer 113, a second conductive layer 114, and a second substrate layer 115, which are stacked sequentially.
[0063] The electrochromic layer 113 includes an electrochromic film layer 1131, an electrolyte layer 1132, and an ion storage layer 1133, which are stacked sequentially. In other embodiments, the electrochromic layer 113 may also be a liquid crystal.
[0064] The first conductive layer 112 and the second conductive layer 114 can both be made of transparent ITO (Indium Tin Oxide) material, or they can be made of other conductive materials commonly used in the art. The first conductive layer 112 and the second conductive layer 114 are disposed on opposite sides of the electrochromic layer 113 and are respectively connected to the positive and negative terminals of an external power supply.
[0065] After the first conductive layer 112 and the second conductive layer 114 are powered by an external power source, the electrochromic layer 113 is electrically conductive, and the optical properties of the material in the electrochromic layer 113 are changed, thereby realizing the functions of color change, transmittance adjustment, and reflectance adjustment of the electrochromic device 100.
[0066] The first substrate layer 111 and the second substrate layer 115 can be made of transparent PET (Polyethylene terephthalate), PC (Polycarbonate), or glass, so that changes in the optical properties of the material in the electrochromic layer 113 can be visually observed from the outside.
[0067] The electrochromic component 110 has a central stack A1 and an edge stack A2 electrically connected to the central stack A1, with the edge stack A2 surrounding the central stack A1. The electrical connection between the edge stack A2 and the central stack A1 means that the first conductive layer 112 in the edge stack A2 is electrically connected to the first conductive layer 112 in the central stack A1, and the second conductive layer 114 in the edge stack A2 is electrically connected to the second conductive layer 114 in the central stack A1. In electrochromic products such as smart glasses, smart windows, displays, and rearview mirrors, the central stack A1 is the color-changing / visible area of the product, while the edge stack A2 is the encapsulation / non-visible area of the product.
[0068] The stacked structure of the first substrate layer 111, the first conductive layer 112, the electrochromic layer 113, the second conductive layer 114, and the second substrate layer 115 at the central stack A1 remains intact, that is, each layer... Figure 1 The paper surfaces shown are completely overlapped without any gaps. The stacked structure of the first base layer 111, the first conductive layer 112, the electrochromic layer 113, the second conductive layer 114, and the second base layer 115 at the edge stack A2 is processed as needed.
[0069] The edge stack A2 is provided with a first groove 1161, which is located within the edge stack A2. The first groove 1161 penetrates the first base layer 111, the first conductive layer 112 and the electrochromic layer 113, thereby exposing a second conductive layer 114 that matches the shape and size of the bottom of the first groove 1161.
[0070] It needs to be explained, such as Figure 1 and Figure 3 As shown, the first groove 1161 extends along the contour of the edge stack A2, and the extension length of the first groove 1161 is set as required. For example, a first groove 1161 can be provided on one side of the first base layer 111, and the extension length of the first groove 1161 is the same as the side length of the first base layer 111; for example, multiple first grooves 1161 can also be provided on one side of the first base layer 111 at intervals, and the extension length of each first groove 1161 can be 1 / 10, 1 / 8, 1 / 6 or 1 / 5 of the side length of the first base layer 111.
[0071] like Figures 1 to 3 As shown, the electrochromic device 100 also includes a first busbar 120, a first conductive part 130, and a first adhesive structure 140.
[0072] The first busbar 120 is made of metal such as copper foil and has good electrical conductivity. The first busbar 120 has a flat, strip-like structure and is flexible and easy to bend. The first busbar 120 is mounted on the edge stack A2, and the first busbar 120 outside the first groove 1161 is attached to the surface of the first base layer 111 away from the second base layer 115. The first busbar 120 extends along the contour of the first base layer 111.
[0073] The first busbar 120 is at least partially disposed within the first groove 1161, such that the first busbar 120 is electrically connected to at least one second conductive layer 114 exposed from the first groove 1161, i.e., the first busbar 120 connects to the bottom of the first groove 1161. Exemplarily, one first busbar 120 may connect to the bottom of one or more first grooves 1161. In one embodiment, the electrochromic device 100 includes a plurality of first busbars 120, each first busbar 120 connecting to the bottom of one or more first grooves 1161. The plurality of first busbars 120 may be connected in parallel or in series. The multi-point contact between the first busbar 120 and the second conductive layer 114 further enhances the current carrying capacity between the first busbar 120 and the second conductive layer 114.
[0074] In one embodiment, in the direction away from the central stack A1, the extension width of the first groove 1161 is not greater than the width of the edge stack A2. In this application, the edge of the first groove 1161 on the side near the central stack A1 coincides with the edge of the edge stack A2 on the side near the central stack A1, and the edge of the first groove 1161 on the side away from the central stack A1 coincides with the edge of the edge stack A2 on the side away from the central stack A1.
[0075] Along the direction from the central stack A1 to the edge stack A2, the extension width of the first groove 1161 is slightly greater than the width of the first busbar 120, so that the side of the first busbar 120 near the central stack A1 is separated from the central stack A1, reducing the risk of short circuit caused by the contact between the first busbar 120 and the first conductive layer 112 or the electrochromic layer 113.
[0076] like Figure 2 and Figure 4 As shown, the first busbar 120 in the first groove 1161 is insulated from the wall of the first groove 1161, reducing the risk of short circuit caused by the first busbar 120 coming into contact with the first conductive layer 112 or the electrochromic layer 113.
[0077] The first conductive portion 130 is disposed within the first groove 1161 and is connected to the surface of the second conductive layer 114. The first busbar 120 is connected to the side of the first conductive portion 130 away from the second conductive layer 114. In this embodiment, the first busbar 120 is indirectly connected to the bottom of the first groove 1161 through the first conductive portion 130. The first conductive portion 130 is located between the first busbar 120 and the second conductive layer 114, and the two opposing surfaces of the first conductive portion 130 are respectively used to fix the first busbar 120 and the second conductive layer 114. In this embodiment, the first conductive portion 130 electrically connects the first busbar 120 and the second conductive layer 114, and also forms a structural connection between the first busbar 120 and the second conductive layer 114.
[0078] In one embodiment, the first conductive portion 130 is made of a conductive adhesive. A conductive adhesive is an adhesive with conductive properties, made by adding conductive materials to a resin. Exemplarily, the first conductive portion 130 can be an anisotropic conductive film (ACF adhesive).
[0079] In existing electrochromic devices, the connection stability between the busbar and the conductive layer is low. In particular, after long-term use, the busbar is prone to detach from the surface of the conductive layer, causing an internal open circuit in the electrochromic device, which seriously affects the lifespan and reliability of the electrochromic device.
[0080] In response to the above problems, such as Figure 2 and Figure 3 As shown, the electrochromic device 100 further includes a first adhesive structure 140. The first adhesive structure 140 is insulating and is at least partially disposed within a first groove 1161. Within the first groove 1161, the first adhesive structure 140 connects the first busbar 120 to at least one of the connecting central stack A1, the second conductive layer 114, and the first conductive portion 130. Exemplarily, the first adhesive structure 140 connects the first busbar 120 and the central stack A1, or the first adhesive structure 140 connects the first busbar 120 and the second conductive layer 114, or the first adhesive structure 140 connects the first busbar 120 and the first conductive portion 130.
[0081] In one embodiment, the first adhesive structure 140 is connected to two or three of the first busbar 120, the central stack A1, the second conductive layer 114, and the first conductive portion 130. For example, the first adhesive structure 140 connects the first busbar 120, the first conductive portion 130, the second conductive layer 114, and the central stack A1, or the first adhesive structure 140 connects the first busbar 120, the first conductive portion 130, and the second conductive layer 114.
[0082] In other words, in this application, the first busbar 120 is firstly fixed to the second conductive layer 114 through the first conductive part 130. Furthermore, by providing the first adhesive structure 140, the first busbar 120 is connected to at least one of the central stack A1, the second conductive layer 114, and the first conductive part 130, thereby achieving the effect of stabilizing the first busbar 120 and achieving a second fixation between the first busbar 120 and the second conductive layer 114. This dual fixation structure reduces the risk of the first busbar 120 falling off the surface of the second conductive layer 114, reduces the occurrence of circuit breaks, and improves the reliability and service life of the electrochromic device 100.
[0083] In some embodiments, such as Figure 2 , Figure 4 and Figure 5 As shown, the first adhesive structure 140 includes a first connecting portion 141 disposed within a first groove 1161. A first busbar 120, a first conductive portion 130, a second conductive layer 114, and a central stack A1 enclose and form a first gap G1. At least a portion of the first connecting portion 141 fills the first gap G1. In this embodiment, the first connecting portion 141 not only serves to fix the first busbar 120 but also serves to insulate and isolate the first busbar 120 from the first conductive layer 112 or the electrochromic layer 113.
[0084] In one embodiment, within the first gap G1, the first connecting portion 141 connects the first busbar 120 and the first conductive portion 130 on the side facing the central stack A1, connects the second conductive layer 114, and connects the central stack A1 on the side facing the edge stack A2. In this case, the first connecting portion 141 may completely fill the first gap G1 or may not completely fill it. In this embodiment, the first busbar 120 is fixedly connected to the central stack A1 and the second conductive layer 114 via the first connecting portion 141. This multi-directional fixation helps to stabilize the first busbar 120. The first busbar 120 is connected to the first conductive portion 130 via the first connecting portion 141, which helps to improve the connection reliability between the first busbar 120 and the first conductive portion 130 and reduces the risk of the first busbar 120 detaching from the surface of the first conductive portion 130.
[0085] In some embodiments, the first connecting portion 141 completely fills the first gap G1.
[0086] like Figure 4 As shown, the first connecting part 141 is used to connect the side of the first busbar 120 near the central stack A1 to the central stack A1, thereby achieving a second fixation between the first busbar 120 and the second conductive layer 114.
[0087] In one embodiment, the first connection portion 141 is made of insulating adhesive.
[0088] In one embodiment, an insulating layer is first formed on the surface of the central stack A1 near the first busbar 120, and then the first busbar 120 is connected to the insulating layer through a first connecting part 141. The first connecting part 141 is made of insulating adhesive or other adhesive materials with low conductivity and better high temperature resistance.
[0089] The first connecting portion 141 completely fills the first gap G1, that is, the first connecting portion 141 at least fills the first gap G1. This can be achieved by the first connecting portion 141 being located only within the first gap G1 (e.g., Figure 4As shown), at this time, the shape of the first connecting part 141 is approximately the same as the shape of the first gap G1. Alternatively, a portion of the first connecting part 141 can fill the first gap G1 while the other portion is located outside the first gap G1 (e.g., Figure 5 (As shown).
[0090] In one embodiment, such as Figure 6 As shown, Figure 6 The electrochromic element 110 is a single-electrode electrochromic element, which includes only a first groove 1161. Figure 6 In the illustrated embodiment, the electrochromic element 110 is square, and the extension length of the first groove 1161 is the same as the length of the side of the electrochromic element 110 (i.e., the side where the first groove 1161 is located). That is, the first groove 1161 penetrates the two opposite front and rear sides of the electrochromic element 110. At this time, the first groove 1161 is composed of a groove wall and a groove bottom. The groove bottom of the first groove 1161 is composed of the exposed second conductive layer 114, and the groove wall of the first groove 1161 is composed of the side of the central stack A1 near the edge stack A2. The first gap G1 is formed by a bottom and two sides. The bottom of the first gap G1 is the groove bottom of the first groove 1161 between the first busbar 120 and the central stack A1. One side of the first gap G1 is the groove wall of the first groove 1161, and the other side of the first gap G1 is the side of the first busbar 120 and the first conductive part 130 near the central stack A1.
[0091] In one embodiment, such as Figure 7 As shown, Figure 7 This is a partial schematic diagram of a multi-electrode electrochromic element 110, in which multiple spaced first grooves 1161 are provided. Some of the first grooves 1161 have two walls, each formed by a central stack A1 and an edge stack A2. Correspondingly, the first gap G1 is formed by three side surfaces and a bottom surface. The three side surfaces are formed by the side of the first busbar 120 and the first conductive portion 130 near the central stack A1, the central stack A1, and the edge stack A2, respectively. See details... Figure 7 The first gap G1 at point P1. Part of the first groove 1161 has three groove walls; correspondingly, the first gap G1 is formed by four sides and a bottom surface, as detailed in the reference. Figure 7 The second groove 1162 at point P2.
[0092] It should be noted that in the actual processing, with Figure 7 For example, refer to Figure 13The first busbar 120 extends to the bottom of the first groove 1161, then bends upward from the groove wall of the first groove 1161 to the upper surface of the first base layer 111, and extends downward along the edge of the upper surface of the first base layer 111 to the opening of another first groove 1161, and continues to extend and bend after reaching the bottom of another first groove 1161. The bending and extension of the first busbar 120 do not directly contact the groove wall of the first groove 1161 to avoid short circuit.
[0093] Within the first groove 1161, the first busbar 120 is spaced apart from both the groove wall and the bottom of the first groove 1161. Specifically, the first busbar 120 is insulated from and spaced apart from the surface of the central stack A1 near the edge stack A2 by a first connecting portion 141 or other insulating layer. Similarly, the first busbar 120 is insulated from and spaced apart from the groove wall of the first groove 1161 it covers by an insulating layer. The first busbar 120 is connected to the bottom of the first groove 1161 by a first conductive portion 130, meaning the first busbar 120 is spaced apart from the bottom of the first groove 1161.
[0094] In this embodiment of the application, in order to increase the stability of the structure, the first connecting part 141 completely fills the first gap G1, so that the first connecting part 141 connects the first busbar 120 and the first conductive part 130 to the side facing the central stack A1, connects the second conductive layer 114, and connects the side facing the edge stack A2 of the central stack A1.
[0095] like Figure 8 As shown, in some embodiments, the first connecting portion 141 connects the first busbar 120 and the first conductive portion 130 on the side facing the central stack A1, and the first connecting portion 141 is spaced apart from the central stack A1. In the embodiments of this application, the connection between the first busbar 120 and the first conductive portion 130, and the connection between the first conductive portion 130 and the first conductive layer 112 can be strengthened, thereby strengthening the connection between the first busbar 120 and the second conductive layer 114.
[0096] At this time, insulating tape, insulating film, etc. can also be provided between the first connecting part 141 and the central stack body A1 to improve the insulation performance between the first busbar 120 and the central stack body A1.
[0097] In some embodiments, such as Figure 4 and Figure 5 As shown, the side of the first connecting portion 141 away from the second conductive layer 114 extends beyond or is flush with the surface of the first busbar 120, thereby increasing the adhesion area of the first connecting portion 141 and the first busbar 120 and enhancing the bonding stability.
[0098] In some embodiments, such as Figure 5As shown, when the side of the first connecting portion 141 away from the second conductive layer 114 extends beyond the surface of the first busbar 120, the first connecting portion 141 covers a portion of the surface of the first busbar 120 away from the second conductive layer 114, increasing the adhesion area between the first connecting portion 141 and the first busbar 120 and enhancing the bonding stability. Simultaneously, as... Figure 5 As shown, a portion of the top surface of the first busbar 120 and the side surface away from the central stack A1 are also exposed. When the surface of the first busbar 120 away from the second conductive layer 114 is also covered with a functional layer such as a protective structure (e.g., the first protective structure 180), it is beneficial to enhance the connection reliability between the functional layer and the first busbar 120 and the electrochromic element 110.
[0099] In some embodiments, such as Figure 4 and Figure 5 As shown, the first bonding structure 140 includes a second connecting portion 142 disposed in the first groove 1161. The second connecting portion 142 is disposed on the side of the first busbar 120 away from the central stack body A1. The second connecting portion 142 connects the first busbar 120, the first conductive portion 130 and the second conductive layer 114.
[0100] The first connecting part 141 connects to the side of the first busbar 120 near the central stack A1, and the second connecting part 142 connects to the side of the first busbar 120 away from the central stack A1. Both the first connecting part 141 and the second connecting part 142 serve to fix the first busbar 120 to the second conductive layer 114.
[0101] In one embodiment, the first connecting portion 141 or the second connecting portion 142 is provided separately to achieve a second fixation between the first busbar 120 and the second conductive layer 114.
[0102] In one embodiment, the first connecting portion 141 and the second connecting portion 142 are provided simultaneously to achieve a second fixation between the first busbar 120 and the second conductive layer 114.
[0103] This dual-fixation structure reduces the risk of the first busbar 120 detaching from the surface of the second conductive layer 114, reduces the occurrence of circuit breaks, and improves the reliability and service life of the electrochromic device 100.
[0104] In some embodiments, such as Figure 4 and Figure 5 As shown, the side of the second connection portion 142 away from the second conductive layer 114 extends beyond or is flush with the surface of the first busbar 120, increasing the adhesion area between the second connection portion 142 and the first busbar 120 and enhancing the bonding stability.
[0105] In some embodiments, when the side of the second connection portion 142 away from the second conductive layer 114 extends beyond the surface of the first busbar 120, the second connection portion 142 covers a portion of the surface of the first busbar 120 away from the second conductive layer 114, increasing the adhesion area between the second connection portion 142 and the first busbar 120 and enhancing the bonding stability. Meanwhile, as... Figure 5 As shown, a portion of the top surface of the first busbar 120 and the side surface near the central stack A1 are also exposed. When the surface of the first busbar 120 away from the second conductive layer 114 is also covered with a functional layer such as a protective structure (e.g., the first protective structure 180), it is beneficial to enhance the connection reliability between the functional layer and the first busbar 120 and the electrochromic element 110.
[0106] In some embodiments, when the first adhesive structure 140 includes a first connecting portion 141 and a second connecting portion 142, the first connecting portion 141 and the second connecting portion 142 are spaced apart on the surface of the first busbar 120 away from the second conductive layer 114, so that at least a portion of the surface of the first busbar 120 is exposed, increasing the adhesion area of the first adhesive structure 140 and the first busbar 120 and enhancing the bonding stability. Additionally, as... Figure 5 As shown, the top surface of the first busbar 120 is also exposed. The addition of the first connecting portion 141 and the second connecting portion 142 also reduces moisture ingress at the bonding point between the first busbar 120 and the first conductive portion 130, preventing the first busbar 120 from detaching from the first conductive portion 130.
[0107] In some embodiments, such as Figure 4 As shown, in the direction away from the central stack A1, the distance between the first busbar 120 and the central stack A1 is L1, satisfying: 1mm ≤ L1 ≤ 2.5mm. L1 can be 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2.0mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, or 2.5mm, etc., and is not limited to the example distance. If L1 is less than 1mm, the first busbar 120 is likely to contact the central stack A1; if L1 is greater than 2.5mm, the width of the first groove 1161 is too large, reducing the range of the central stack A1.
[0108] It is understood that when the first connecting portion 141 fills the first gap G1, the thickness of the first connecting portion 141 in the direction away from the central stack body A1 is equal to or less than the size of L1.
[0109] In one embodiment, when the first connecting portion 141 is spaced apart from the central stack body A1, the distance between the first connecting portion 141 and the central stack body A1 in the direction away from the central stack body A1 can be 1 mm.
[0110] In some embodiments, such as Figure 4 As shown, in the direction away from the central stack A1, the thickness of the second connecting portion 142 is L2, satisfying: 1mm ≤ L2 ≤ 2.5mm. L2 can be 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2.0mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, or 2.5mm, etc., and is not limited to the example thickness. If L2 is less than 1mm, the excessively thin second connecting portion 142 reduces the bonding force between the first busbar 120 and the second connecting portion 142; if L2 is greater than 2.5mm, the second connecting portion 142 is prone to extending beyond the outer edge of the edge stack A2, which is detrimental to encapsulation.
[0111] In some embodiments, the first adhesive structure 140 further includes a third connecting portion 143 located outside the first groove 1161, the third connecting portion 143 connecting the surface of the first base layer 111 facing away from the second base layer 115. Figure 1 , Figure 3 and Figure 13 A portion of the first busbar 120 is disposed within the first groove 1161, and the other portion of the first busbar 120 outside the first groove 1161 extends along the contour of the edge stack A2. The third connecting portion 143 is used to connect the portion of the first busbar 120 outside the first groove 1161, increasing the adhesion area between the first adhesive structure 140 and the first busbar 120, and enhancing the bonding force between the first adhesive structure 140 and the first busbar 120.
[0112] In one embodiment, the third connection 143 connects the side of the first busbar 120 facing the central stack A1 and connects the first connection 141.
[0113] In one embodiment, the third connection 143 connects the side of the first busbar 120 away from the central stack A1 and connects the second connection 142.
[0114] In one embodiment, there are two third connection portions 143. One third connection portion 143 connects the side of the first busbar 120 facing the central stack body A1 and connects to the first connection portion 141. The other third connection portion 143 also connects the side of the first busbar 120 away from the central stack body A1 and connects to the second connection portion 142.
[0115] In some embodiments, the first adhesive structure 140 is made of an insulating material, such as epoxy resin insulating adhesive, silicone rubber insulating adhesive, or mica-based insulating material, which not only has good insulation performance but also good heat resistance, making the first adhesive structure 140 and the first busbar 120 more stable, reducing the risk of the first busbar 120 falling off the surface of the second conductive layer 114, reducing the occurrence of circuit breaks, and improving the reliability and service life of the electrochromic device 100.
[0116] In some embodiments, such as Figure 1 and Figure 2 As shown, the edge stack body A2 of this application is further provided with a second groove 1162. The second groove 1162 is located within the edge stack body A2 and is formed in the second base layer 115. The second groove 1162 penetrates the second base layer 115, the second conductive layer 114 and the electrochromic layer 113, so that the first conductive layer 112 is exposed.
[0117] The second groove 1162 is spaced apart from the first groove 1161.
[0118] In one embodiment, such as Figure 6 As shown, the single-electrode electrochromic device 100 includes a second groove 1162 and a first groove 1161. The second groove 1162 and the first groove 1161 are located on opposite sides of the electrochromic element 110 and are spaced apart.
[0119] In one embodiment, such as Figure 12 As shown, the multi-electrode electrochromic device 100 includes a plurality of second grooves 1162 and a plurality of first grooves 1161, so as to Figure 12 For example, Figure 12 The image shows one side of the electrochromic element 110, on which a first groove and a second groove 1162 are provided. The first groove 1161 and the second groove 1162 are provided alternately and at intervals, and the number of the first groove 1161 and the second groove 1162 is not limited in any way.
[0120] In the circumferential direction of the electrochromic element 110, the second groove 1162 extends along the contour of the edge stack A2, and the extension length of the second groove 1162 is set as required. For example, in the multi-electrode electrochromic device 100, the extension length of the second groove 1162 is 1 / 10, 1 / 8, 1 / 6 or 1 / 5 of the side length of the second base layer 115, etc.
[0121] like Figure 2 and Figure 9 As shown, the electrochromic device 100 also includes a second busbar 150, a second conductive part 160, and a second adhesive structure 170.
[0122] The second busbar 150 is made of metal such as copper foil and has good electrical conductivity. The second busbar 150 has a flat, strip-like structure and is flexible and easy to bend. The second busbar 150 is mounted on the edge stack A2 and attached to the surface of the second substrate 115 away from the first substrate 111. The second busbar 150 extends along the contour of the second substrate 115.
[0123] like Figure 2 As shown, a second busbar 150 is also provided, at least partially disposed within the second groove 1162, so that the second busbar 150 is electrically connected to the first conductive layer 112 exposed at each of the second grooves 1162. The multi-point contact between the second busbar 150 and the first conductive layer 112 further enhances the current carrying capacity between the second busbar 150 and the first conductive layer 112.
[0124] In one embodiment, in the direction away from the central stack A1, the extension width of the second groove 1162 is not greater than the width of the edge stack A2. In this application, the edge of the second groove 1162 on the side near the central stack A1 coincides with the edge of the edge stack A2 on the side near the central stack A1, and the edge of the second groove 1162 on the side away from the central stack A1 coincides with the edge of the edge stack A2 on the side away from the central stack A1.
[0125] Along the direction from the central stack A1 to the edge stack A2, the extension width of the second groove 1162 is slightly greater than the width of the second busbar 150, so that the side of the second busbar 150 near the central stack A1 is separated from the central stack A1, reducing the risk of short circuit caused by the second busbar 150 contacting the second conductive layer 114 or the electrochromic layer 113.
[0126] like Figure 10 and Figure 11 As shown, the second busbar 150 in the second groove 1162 is separated from the wall of the second groove 1162, reducing the risk of short circuit caused by the second busbar 150 coming into contact with the second conductive layer 114 or the electrochromic layer 113.
[0127] The second conductive portion 160 is disposed within the second groove 1162 and is connected to the surface of the first conductive layer 112. The second busbar 150 is connected to the side of the second conductive portion 160 away from the first conductive layer 112. Through the second conductive portion 160, the second busbar 150 and the first conductive layer 112 are electrically connected, and the second busbar 150 and the first conductive layer 112 are also structurally connected.
[0128] In one embodiment, the second conductive portion 160 is made of a conductive adhesive. A conductive adhesive is an adhesive with conductive properties, made by adding conductive materials to a resin. Exemplarily, the second conductive portion 160 can be an anisotropic conductive film (ACF adhesive).
[0129] like Figure 10 and Figure 11 As shown, the second adhesive structure 170 is at least partially disposed within the second groove 1162. The second adhesive structure 170 connects the second busbar 150 to at least one of the central stack A1, the first conductive layer 112, and the second conductive portion 160 within the second groove 1162. In other words, in this application, the second busbar 150 achieves a first layer of fixation to the first conductive layer 112 through the second conductive portion 160. Furthermore, by providing the second adhesive structure 170, the second busbar 150 achieves a stable connection with at least one of the central stack A1, the first conductive layer 112, and the second conductive portion 160, thus achieving a second layer of fixation between the second busbar 150 and the first conductive layer 112. This dual-fixation structure reduces the risk of the second busbar 150 detaching from the surface of the first conductive layer 112, reduces the occurrence of open circuits, and improves the reliability and service life of the electrochromic device 100.
[0130] In some embodiments, the second adhesive structure 170 includes a fourth connecting portion 171 disposed in the second groove 1162, and the second busbar 150, the second conductive portion 160, the first conductive layer 112 and the central stack body A1 surround to form a second gap G2, and at least a portion of the fourth connecting portion 171 fills the second gap G2.
[0131] In one embodiment, the fourth connecting portion 171 completely fills the second gap G2.
[0132] like Figure 10 and Figure 11 As shown, the fourth connection part 171 is used to connect the side of the second busbar 150 near the central stack A1 to the central stack A1, thereby realizing a second connection between the second busbar 150 and the first conductive layer 112.
[0133] In one embodiment, the fourth connection 171 is made of insulating adhesive.
[0134] In one embodiment, an insulating layer is first formed on the surface of the central stack A1 near the second busbar 150, and then the second busbar 150 is connected to the insulating layer via a fourth connection 171. The fourth connection 171 is made of insulating adhesive or other adhesive materials with low conductivity and better high-temperature resistance.
[0135] The fourth connecting part 171 completely fills the second gap G2, that is, the fourth connecting part 171 at least fills the second gap G2. It can be that the fourth connecting part 171 is only located inside the second gap G2, in which case the shape of the fourth connecting part 171 is approximately the same as the shape of the second gap G2. Alternatively, a part of the fourth connecting part 171 can fill the second gap G2 and the other part can be located outside the second gap G2.
[0136] In some embodiments, the fourth connection portion 171 connects the second busbar 150 and the second conductive portion 160 to the side facing the central stack body A1, and the fourth connection portion 171 is spaced apart from the central stack body A1.
[0137] In some embodiments, such as Figure 10 and Figure 11 As shown, the side of the fourth connection portion 171 away from the first conductive layer 112 extends beyond or is flush with the surface of the second busbar 150, thereby increasing the adhesion area of the fourth connection portion 171 and the second busbar 150 and enhancing the bonding stability.
[0138] In some embodiments, when the side of the fourth connection portion 171 away from the first conductive layer 112 extends beyond the surface of the second busbar 150, the fourth connection portion 171 covers a portion of the surface of the second busbar 150 away from the first conductive layer 112, increasing the adhesion area of the fourth connection portion 171 and the second busbar 150 and enhancing the bonding stability. Meanwhile, as... Figure 11 As shown, a portion of the top surface of the second busbar 150 and the side surface away from the central stack A1 are also exposed.
[0139] In some embodiments, the second adhesive structure 170 includes a fifth connecting portion 172 disposed in the second groove 1162. The fifth connecting portion 172 is disposed on the side of the second busbar 150 away from the central stack body A1. The fifth connecting portion 172 connects the second busbar 150, the second conductive portion 160 and the first conductive layer 112.
[0140] The fourth connection 171 connects to the side of the second busbar 150 near the central stack A1, and the fifth connection 172 connects to the side of the second busbar 150 away from the central stack A1. Both the fourth connection 171 and the fifth connection 172 serve to fix the second busbar 150 to the first conductive layer 112.
[0141] In one embodiment, the fourth connecting part 171 or the fifth connecting part 172 is provided separately to achieve a second fixation between the second busbar 150 and the first conductive layer 112.
[0142] In one embodiment, the fourth connecting portion 171 and the fifth connecting portion 172 are provided simultaneously to achieve a second fixation between the second busbar 150 and the first conductive layer 112.
[0143] This dual-fixation structure reduces the risk of the second busbar 150 detaching from the surface of the first conductive layer 112, reduces the occurrence of circuit breaks, and improves the reliability and service life of the electrochromic device 100.
[0144] In some embodiments, the side of the fifth connection portion 172 away from the first conductive layer 112 extends beyond or is flush with the surface of the second busbar 150, thereby increasing the attachment area of the fifth connection portion 172 and the second busbar 150 and enhancing the bonding stability.
[0145] In some embodiments, when the side of the fifth connection portion 172 away from the first conductive layer 112 extends beyond the surface of the second busbar 150, the fifth connection portion 172 covers a portion of the surface of the second busbar 150 away from the first conductive layer 112, increasing the adhesion area of the fifth connection portion 172 and the second busbar 150 and enhancing the bonding stability. Meanwhile, as... Figure 11 As shown, a portion of the top surface of the second busbar 150 and a side surface near the central stack A1 are also exposed.
[0146] In some embodiments, when the second adhesive structure 170 includes a fourth connecting portion 171 and a fifth connecting portion 172, the fourth connecting portion 171 and the fifth connecting portion 172 are spaced apart on the surface of the second busbar 150 away from the first conductive layer 112, so that at least a portion of the surface of the second busbar 150 is exposed, increasing the adhesion area of the second adhesive structure 170 and the second busbar 150, and enhancing the bonding stability. Additionally, as... Figure 11 As shown, the top surface of the second busbar 150 is also exposed. The addition of the fourth connecting portion 171 and the fifth connecting portion 172 further reduces moisture ingress at the bonding point between the second busbar 150 and the second conductive portion 160, preventing the second busbar 150 from detaching from the second conductive portion 160.
[0147] In some embodiments, such as Figure 10 In the direction away from the central stack A1, the distance between the second busbar 150 and the central stack A1 is L3, satisfying: 1mm ≤ L3 ≤ 2.5mm. L3 can be 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2.0mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, or 2.5mm, etc., and is not limited to the example distance. If L3 is less than 1mm, the second busbar 150 is likely to contact the central stack A1; if L3 is greater than 2.5mm, the width of the second groove 1162 is too large, reducing the area of the central stack A1.
[0148] It is understood that when the fourth connecting part 171 fills the second gap G2, the thickness of the fourth connecting part 171 is equal to the size of L3 in the direction away from the central stack body A1.
[0149] In one embodiment, when the fourth connecting portion 171 is spaced apart from the central stack body A1, the distance between the fourth connecting portion 171 and the central stack body A1 in the direction away from the central stack body A1 can be 1 mm.
[0150] In some embodiments, such as Figure 10 As shown, in the direction away from the central stack A1, the thickness of the fifth connection portion 172 is L4, satisfying: 1mm ≤ L4 ≤ 2.5mm. L4 can be 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2.0mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, or 2.5mm, and is not limited to the example thickness. If L4 is less than 1mm, the excessively thin fifth connection portion 172 reduces the bonding force between the second busbar 150 and the fifth connection portion 172; if L4 is greater than 2.5mm, the fifth connection portion 172 is prone to extending beyond the outer edge of the edge stack A2, which is detrimental to encapsulation.
[0151] In some embodiments, the second adhesive structure 170 further includes a sixth connecting portion 173 located outside the second groove 1162, the sixth connecting portion 173 connecting to the surface of the second base layer 115 opposite to the second base layer 115. For example... Figure 11 As shown, a portion of the second busbar 150 is disposed within the second groove 1162, and the portion of the second busbar 150 outside the second groove 1162 extends along the contour of the edge stack A2. The sixth connecting portion 173 is used to connect the portion of the second busbar 150 outside the second groove 1162, increasing the adhesion area between the second adhesive structure 170 and the second busbar 150, and enhancing the bonding force between the second adhesive structure 170 and the second busbar 150.
[0152] In one embodiment, the sixth connection 173 connects the side of the second busbar 150 facing the central stack A1 and connects the fourth connection 171.
[0153] In one embodiment, the sixth connection 173 connects the side of the second busbar 150 away from the central stack A1 and connects the fifth connection 172.
[0154] In one embodiment, there are two sixth connection portions 173. One sixth connection portion 173 connects the side of the second busbar 150 facing the central stack body A1 and connects to the fourth connection portion 171. The other sixth connection portion 173 also connects the side of the second busbar 150 away from the central stack body A1 and connects to the fifth connection portion 172.
[0155] In some embodiments, the second adhesive structure 170 is made of an insulating material. For example, epoxy resin insulating adhesive, silicone rubber insulating adhesive, mica-based insulating material, etc., not only have good insulation performance, but also good heat resistance, making the second adhesive structure 170 and the second busbar 150 more stable, reducing the risk of the second busbar 150 detaching from the surface of the first conductive layer 112, reducing the occurrence of circuit breaks, and improving the reliability and service life of the electrochromic device 100.
[0156] It is worth noting that the positional and structural relationships between the second groove 1162, the second busbar 150, the second conductive portion 160, and the second adhesive structure 170 and the electrochromic element 110 in this application can be referred to the above description of the positional and structural relationships between the first groove 1161, the first busbar 120, the first conductive portion 130, and the first adhesive structure 140 and the electrochromic element 110, and will not be repeated here.
[0157] The electrochromic device 100 of this application is used in electrochromic products such as smart glasses, smart windows, displays, and rearview mirrors, which are exposed to rain. Moisture enters the recessed structures such as the first groove 1161 or the second groove 1162 through gaps in the encapsulation structure, affecting the connection structures in the first groove 1161 and the second groove 1162, and shortening the service life of the electrochromic device 100.
[0158] In response to the above problems, such as Figure 2 and Figure 4 As shown, in some embodiments, the electrochromic device 100 further includes a first protective structure 180 and a second protective structure 190. It is worth noting that in specific products, due to the pressing process, Figure 4 The first protective structure 180 above the first groove 1161 will press downwards onto the upper surface of the first busbar 120, and the second protective structure 190 below the second groove 1162 will press upwards onto the lower surface of the second busbar 150.
[0159] The first protective structure 180 is connected to the surface of the first base layer 111 that is away from the second base layer 115, and the second protective structure 190 is connected to the surface of the second base layer 115 that is away from the first base layer 111.
[0160] In the direction from the second base layer 115 to the first base layer 111, the projections of the first busbar 120 and the first adhesive structure 140 are both located within the first protective structure 180 disposed at the opening of the first groove 1161. In the direction from the first base layer 111 to the second base layer 115, the projections of the second busbar 150 and the second adhesive structure 170 are both located within the second protective structure 190 disposed at the opening of the second groove 1162, such that the first protective structure 180 covers the opening of the first groove 1161 and the second protective structure 190 covers the opening of the second groove 1162.
[0161] Meanwhile, the first protective structure 180 and the second protective structure 190 extend along the contour of the electrochromic element 110, sealing the openings of all the first grooves 1161 and the second grooves 1162, and also covering the third connecting portion 143 and the sixth connecting portion 173. This reduces the amount of moisture entering the connection between the third connecting portion 143 and the first busbar 120, reduces the amount of moisture entering the connection between the sixth connecting portion 173 and the second busbar 150, and significantly reduces the possibility of moisture entering the first groove 1161 or the second groove 1162 and damaging the internal connection structure, thereby improving the sealing performance of the electrochromic element 110 and extending the service life of the electrochromic device 100.
[0162] Both the first protective structure 180 and the second protective structure 190 are made of waterproof adhesive, such as polyimide, epoxy resin adhesive, or butyl rubber sealing strips / adhesives.
[0163] In one embodiment, along the direction from the central stack A1 to the edge stack A2, both the first protective structure 180 and the second protective structure 190 extend outward from the edge stack A2, such that the edge of the first protective structure 180 away from the edge stack A2 and the edge of the second protective structure 190 away from the edge stack A2 can be bonded together, further improving the waterproof performance of the electrochromic device 100.
[0164] This application also provides a terminal product, which includes the electrochromic device 100 in any of the above embodiments. Therefore, it has all the beneficial effects of the electrochromic device 100 in any of the above embodiments, and will not be described in detail here.
[0165] The end products include any one of the following: rearview mirrors, curtain walls, car sunroofs, car side windows, car windshields, housings of electronic products, eyeglasses, and display panels of electronic products.
[0166] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0167] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.
Claims
1. An electrochromic device, characterized in that, include: An electrochromic device includes a first base layer, a first conductive layer, an electrochromic layer, a second conductive layer, and a second base layer stacked sequentially. The electrochromic device has a central stack and an edge stack that is electrically connected to the central stack. The edge stack is disposed around the central stack and has a first groove that penetrates the first base layer, the first conductive layer, and the electrochromic layer to expose the second conductive layer. The first busbar is at least partially disposed within the first groove, and the first busbar is insulated from the wall of the first groove; A first conductive portion is disposed in the first groove and connected to the surface of the second conductive layer, and the first busbar is connected to the side of the first conductive portion away from the second conductive layer. A first adhesive structure, which is an electrical insulator, is at least partially disposed within the first groove. The first adhesive structure connects the first busbar to at least one of the central stack, the second conductive layer, and the first conductive portion within the first groove.
2. The electrochromic device according to claim 1, characterized in that, The first adhesive structure includes a first connecting portion disposed within the first groove, the first busbar, the first conductive portion, the second conductive layer, and the central stack body forming a first gap, and at least a portion of the first connecting portion filling the first gap.
3. The electrochromic device according to claim 2, characterized in that, The first connecting portion completely fills the first gap; Alternatively, the first connecting portion connects the first busbar and the first conductive portion to the side of the central stack, connects the second conductive layer, and connects the side of the central stack to the side of the edge stack; Alternatively, the first connecting portion connects the first busbar and the first conductive portion to the side facing the central stack, and the first connecting portion is spaced apart from the central stack.
4. The electrochromic device according to claim 2 or 3, characterized in that, The side of the first connection portion away from the second conductive layer extends beyond or is flush with the surface of the first busbar; When the side of the first connection portion away from the second conductive layer extends beyond the surface of the first busbar, the first connection portion covers a portion of the surface of the first busbar away from the second conductive layer.
5. The electrochromic device according to claim 2 or 3, characterized in that, The first adhesive structure includes a second connecting portion disposed within the first groove. The second connecting portion is disposed on the side of the first busbar away from the central stack. The second connecting portion connects the first busbar, the first conductive portion, and the second conductive layer.
6. The electrochromic device according to claim 5, characterized in that, The side of the second connection portion away from the second conductive layer extends beyond or is flush with the surface of the first busbar; When the side of the second connection portion away from the second conductive layer extends beyond the surface of the first busbar, the second connection portion covers a portion of the surface of the first busbar away from the second conductive layer.
7. The electrochromic device according to claim 6, characterized in that, When the first adhesive structure includes the first connecting portion, the first connecting portion and the second connecting portion are spaced apart on the surface of the first busbar away from the second conductive layer, so that at least a portion of the surface of the first busbar is exposed.
8. The electrochromic device according to claim 5, characterized in that, In the direction away from the central stack, the distance between the first busbar and the central stack is L1, which satisfies: 1mm≤L1≤2.5mm, and the thickness of the second connection is L2, which satisfies: 1mm≤L2≤2.5mm.
9. The electrochromic device according to claim 5, characterized in that, The first adhesive structure further includes a third connecting portion located outside the first groove, the third connecting portion connecting the surface of the first substrate layer facing away from the second substrate layer; wherein: The third connecting part connects the side of the first busbar facing the central stack and connects to the first connecting part; Alternatively, the third connection portion connects the side of the first busbar away from the central stack and connects the second connection portion.
10. The electrochromic device according to claim 5, characterized in that, The electrochromic device further includes a first protective structure, which is connected to the surface of the first substrate layer away from the second substrate layer. In the direction from the second substrate layer to the first substrate layer, the projection of the first adhesive structure is located within the first protective structure.
11. The electrochromic device according to claim 1, characterized in that, The edge stack further includes a second groove, which is formed in the second base layer and exposes the first conductive layer. The second groove is spaced apart from the first groove. The electrochromic device further includes: The second busbar is at least partially disposed within the second groove, and the second busbar is insulated from the wall of the second groove; The second conductive part is disposed in the second groove and is connected to the surface of the first conductive layer; the second busbar is connected to the side of the second conductive part away from the first conductive layer. The second adhesive structure is at least partially disposed within the second groove, and the second adhesive structure connects the second busbar to at least one of the central stack, the first conductive layer, and the second conductive portion.
12. A terminal product, characterized in that, The electrochromic device includes any one of claims 1 to 11, wherein the end product includes any one of a rearview mirror, a curtain wall, a sunroof, a side window, a windshield, a housing of an electronic product, eyeglasses, and a display panel of an electronic product.