LED lamp panel, module and display screen
By filling the gaps between LED module beads with conductive substrate to form a continuous shielding layer, and combining it with an electromagnetic shielding layer and a shielding shell, the problem of electromagnetic radiation leakage from the gaps between the beads is solved, achieving a highly efficient electromagnetic shielding effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- UNILUMIN GRP
- Filing Date
- 2025-07-16
- Publication Date
- 2026-07-28
AI Technical Summary
The gaps between the LED beads in existing LED modules are not covered by a metal shielding structure, resulting in electromagnetic radiation leakage and poor shielding effect.
A conductive substrate is filled into the gaps between the LED beads to form a continuous conductive shielding layer. An electromagnetic shielding layer is then placed on the surface of the conductive shielding layer. Combined with the shielding shell, electromagnetic radiation is shielded from the surface and the back respectively. The composite metal layer is used to synergistically shield high-frequency and low-frequency radiation.
It effectively blocks the electromagnetic wave leakage path between LED beads, suppresses electromagnetic radiation leakage to the maximum extent, and maintains the light output requirements of the LED module, thereby improving the electromagnetic shielding effect.
Smart Images
Figure CN224569666U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electromagnetic radiation shielding technology, and in particular to an LED light board, module and display screen. Background Technology
[0002] With the development of LED display technology, the application of LED modules is becoming increasingly widespread. LED modules generate electromagnetic radiation during operation, which may interfere with the normal operation of surrounding precision electronic equipment. Therefore, effective electromagnetic shielding of the modules is necessary. Existing electromagnetic shielding mainly achieves this by setting a metal shielding mesh or plating on the surface of the lamp panel. To maintain high light transmittance, the metal shielding mesh has relatively large mesh openings. However, these openings are difficult to precisely match the irregular gaps between LED beads, resulting in gap areas not being covered by the metal shielding structure. Electromagnetic radiation then leaks through these gaps, making the electromagnetic shielding effect of the LED module poor. Utility Model Content
[0003] The main purpose of this invention is to provide an LED light board to solve the problem of poor electromagnetic radiation shielding effect of the gaps between LED beads in existing LED modules.
[0004] To achieve the above objectives, this utility model proposes an LED light board, comprising: a substrate, a shielding shell, and a plurality of LED beads. The substrate has a first mounting surface and a second mounting surface arranged back-to-back. The plurality of LED beads are spaced apart on the first mounting surface, and a conductive substrate is provided in the gap between the plurality of LED beads to form a continuous conductive shielding layer on the first mounting surface. An electromagnetic shielding layer is provided on the surface of the conductive shielding layer. The second mounting surface is used to mount driving devices, and the shielding shell is disposed on the second mounting surface to shield the electromagnetic radiation of the driving devices.
[0005] Optionally, the electromagnetic shielding layer includes a conductive layer and a magnetically conductive layer, wherein the conductive layer and the magnetically conductive layer are stacked on the conductive shielding layer.
[0006] Optionally, the conductive layer covers the conductive shielding layer, and the magnetically conductive layer covers the conductive layer.
[0007] Optionally, the conductive layer is a silver metal layer or a copper metal layer; and / or, the magnetically conductive layer is a nickel metal layer.
[0008] Optionally, the shielding shell includes a base and a mounting frame, the mounting frame protruding from the surface of the base and recessed inward relative to the side of the base to form a mounting cavity for mounting the substrate.
[0009] Optionally, the mounting frame has a conductive pad on its outer side facing away from the mounting cavity.
[0010] Optionally, the surface of the electromagnetic shielding layer is provided with a functional film.
[0011] Optionally, the conductive shielding layer includes an epoxy resin layer and a plurality of micron-sized silver particles dispersed in the epoxy resin layer.
[0012] This utility model also proposes an LED module, including electrical components and the aforementioned LED light board, wherein the electrical components are mounted on the driving surface of the substrate.
[0013] This utility model also proposes a display screen, including a housing and the aforementioned LED module, wherein the LED module is disposed in the housing.
[0014] In the technical solution of this utility model, the LED light board includes a substrate, a shielding shell, and a plurality of LED beads. The substrate has a first mounting surface and a second mounting surface arranged back to back. The plurality of LED beads are spaced apart on the first mounting surface. By filling the gaps between the LED beads with conductive substrate, a continuous conductive shielding layer is formed on the surface of the light board to reflect and absorb electromagnetic waves, blocking the leakage path of electromagnetic waves between the LED beads. At the same time, in conjunction with the electromagnetic shielding layer disposed on the surface of the conductive shielding layer and the shielding shell disposed on the second mounting surface, electromagnetic radiation on the surface and back are shielded respectively, so as to ensure the light output requirements of the LED module while suppressing electromagnetic radiation leakage to the maximum extent. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the LED light board in one embodiment of the present invention;
[0017] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure of the LED light panel;
[0018] Figure 3 This is a schematic diagram of the structure of the conductive shielding layer after curing in one embodiment of the present invention;
[0019] Figure 4 This is a schematic diagram of the shielding shell in one embodiment of the present invention.
[0020] Explanation of icon numbers:
[0021] name label name label LED light panel 100 Mounting cavity 22a substrate 10 LED beads 30 First mounting surface 10a conductive shielding layer 40 Second mounting surface 10b Electromagnetic shielding layer 50 Shielding shell 20 conductive layer 51 base 21 Magnetic layer 52 Installation box 22 Functional membrane 60
[0022] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0025] See Figures 1 to 4 In one embodiment of this utility model, an LED light board 100 includes a substrate 10, a shielding shell 20, and a plurality of LED beads 30. The substrate 10 has a first mounting surface 10a and a second mounting surface 10b arranged opposite to each other. The plurality of LED beads 30 are spaced apart on the first mounting surface 10a, and a conductive substrate is provided in the gap between the plurality of LED beads 30 to form a continuous conductive shielding layer 40 on the first mounting surface 10a. An electromagnetic shielding layer 50 is provided on the surface of the conductive shielding layer 40. The second mounting surface 10b is used to mount driving devices, and the shielding shell 20 is provided on the second mounting surface 10b to shield the electromagnetic radiation of the driving devices.
[0026] In the technical solution of this utility model, the LED light board 100 includes a substrate 10, a shielding shell 20, and a plurality of LED beads 30. The substrate 10 has a first mounting surface 10a and a second mounting surface 10b arranged back to back. The plurality of LED beads 30 are spaced apart on the first mounting surface 10a. By filling the gaps between the LED beads 30 with conductive substrate, a continuous conductive shielding layer 40 is formed on the surface of the light board to reflect and absorb electromagnetic waves, blocking the leakage path of electromagnetic waves between the LED beads 30. At the same time, in conjunction with the electromagnetic shielding layer 50 disposed on the surface of the conductive shielding layer 40 and the shielding shell 20 disposed on the second mounting surface 10b, electromagnetic radiation on the surface and back are shielded respectively, so as to ensure the light output requirements of the LED module while suppressing electromagnetic radiation leakage to the maximum extent.
[0027] It should be noted that the substrate 10 in this embodiment is a PCB board, on which a driving circuit, a connection circuit, a solder pad, etc. are provided; the conductive substrate is a conductive adhesive with conductivity and adhesion, preferably a single-component low-temperature curing functional adhesive with a thixotropic index of 4 and an overall viscosity of 8000cp, such as silver-based epoxy resin, copper-based epoxy resin, gold-based epoxy resin, etc. It can also be a composite material adhesive, such as graphene and metal composite epoxy resin, as long as it can achieve the formation of a continuous conductive shielding layer 40 between the LED beads 30. This embodiment is not limited to this, and all of the above are within the protection scope of this utility model. When manufacturing the LED light board 100, the LED beads 30 are first fixed to the first mounting surface 10a of the substrate 10. Then, conductive adhesive is extruded in a linear fashion using a dispensing device, such as a piezoelectric valve, and placed in the gap between the LED beads 30. Preferably, the height of the conductive adhesive is the same as the height of the LED beads 30. As an example, a linear extrusion of 18-20 mg per point is made in the X-axis direction of the light board, and a linear extrusion of 15-18 mg per point is made in the Y-axis direction of the light board. Finally, the light board is baked in an oven at 100°C for 60 minutes to achieve complete curing, forming a continuous conductive shielding layer 40 on the first mounting surface 10a. The resulting structure is as follows. Figure 3 As shown, Figure 3 In the diagram, the shaded area represents the area coated with conductive adhesive. It can be understood that because the conductive adhesive fills the gaps between the LED beads 30, the conductive shielding layer 40 forms a mesh-like structure, absorbing electromagnetic waves from the gaps between the LED beads 30 without affecting their light emission. Furthermore, the LED beads 30 are cured by molding with a two-component transparent epoxy molding compound, undergoing initial curing at 130°C for 5 minutes in an oven, followed by full curing at 130°C for 180 minutes, ultimately forming the encapsulation layer. Figure 2The encapsulation layer and the conductive shielding layer 40 form a whole. The encapsulation layer completely covers the LED bead 30 and the conductive adhesive area, so that the LED bead 30 and the substrate 10 form a whole. Preferably, the height of the encapsulation layer is 50-100 μm higher than the height of the LED bead 30. It should be noted that the height of the conductive adhesive and the height of the encapsulation layer are only preferred in this embodiment. The height of the conductive adhesive can also be lower or higher than the height of the LED bead 30. The height of the encapsulation layer can be adapted to the actual situation, provided that it is higher than the LED bead 30. This embodiment is not limited to this. All of the above are within the protection scope of this utility model. The electromagnetic shielding layer 50 is coated on the surface of the encapsulation layer and the surrounding sides of the substrate 10 to shield the electromagnetic radiation emitted from the front and sides of the LED light panel 100. The electromagnetic shielding layer 50 is a metal material with high conductivity and magnetic permeability. It should be noted that when coating the electromagnetic shielding layer 50, the light-emitting area of the LED bead 30 should be avoided. Alternatively, after coating the entire surface, several mesh holes can be laser-cut into the electromagnetic shielding layer 50 so that the light from the LED bead 30 can pass through the mesh holes, thereby maintaining high light transmittance. At the same time, the electromagnetic shielding layer 50 ensures the shielding effectiveness of the LED light panel 100 by reflecting and / or absorbing the electromagnetic radiation from the surface of the LED bead 30. The shielding shell 20 is disposed on the second mounting surface 10b. Since the driving device (not shown in the figure) mounted on the second mounting surface 10b also emits electromagnetic radiation, the shielding shell 20 and the electromagnetic shielding layer 50 can work together to achieve all-round shielding of the electromagnetic radiation of the LED light board 100. It should be noted that the shielding shell 20 in this embodiment is a metal shell made of highly conductive material, such as copper or aluminum. In this way, the electromagnetic radiation emitted by the driving device will be reflected by the shielding shell 20 to be eliminated. It should be noted that, due to processing errors and other reasons, there may be tiny gaps between the substrate 10 and the shielding shell 20, and electromagnetic radiation may leak from these gaps. Therefore, in order to ensure the electrical continuity and overall shielding performance of the LED light board 100, the substrate 10 and the shielding shell 20 in this embodiment are preferably sealed together. This can be achieved by setting conductive gaskets, metal springs, conductive tape, etc. at the joint between the substrate 10 and the shielding shell 20, or by forming a metal fusion zone at the joint between the substrate 10 and the shielding shell 20 through a welding process. This embodiment is not limited to these methods, and all of the above are within the protection scope of this utility model.
[0028] See Figures 1 to 4Furthermore, in one embodiment of this utility model, the electromagnetic shielding layer 50 includes a conductive layer 51 and a magnetically conductive layer 52, which are stacked on the conductive shielding layer 40. It should be noted that since the LED light panel 100 typically emits high-frequency and low-frequency radiation interference, this embodiment uses a composite metal layer for shielding. The conductive layer 51 shields high-frequency radiation, and the magnetically conductive layer 52 shields low-frequency radiation. The conductive layer 51 can be composed of highly conductive materials such as silver or copper, and the magnetically conductive layer 52 can be composed of highly permeable materials such as nickel or ferrite. This embodiment is not limited to these methods, and all are within the protection scope of this utility model. By setting the electromagnetic shielding layer 50 composed of a composite metal, the complementary physical characteristics of the two materials are utilized to achieve synergistic and efficient suppression of radiation ranging from low-frequency strong magnetic fields to high-frequency radio frequency radiation, thereby improving the radiation shielding effectiveness of the LED light panel 100.
[0029] See Figures 1 to 4 Furthermore, in one embodiment of this utility model, the conductive layer 51 covers the conductive shielding layer 40, and the magnetic layer 52 covers the conductive layer 51. Specifically, in this embodiment, after the lamp bead 30 is cured, a highly conductive material is sprayed onto the surface of the encapsulation layer and the side of the substrate 10 to form the conductive layer 51. The conductive layer 51 is then baked in an oven at 60°C or 75°C for 30 minutes until it is completely cured. Then, a highly permeable material is sprayed onto the surface and side of the cured conductive layer 51 to form the magnetic layer 52. The magnetic layer 52 is then baked in an oven at 55°C or 60°C for 90 minutes until it is completely cured. Thus, by setting a structure with the conductive layer 51 inside and the magnetic permeable layer 52 outside, the high conductivity material has excellent conductivity and electromagnetic induction characteristics, which can effectively reflect most of the high-frequency electromagnetic interference in the first instance and prevent it from radiating outward. The high magnetic permeability material can change the path of the magnetic field and guide the magnetic field to generate eddy current effect, so that the residual low-frequency strong magnetic field penetrating the conductive layer 51 can be absorbed by the magnetic permeable layer 52, reducing the external magnetic field. Therefore, this embodiment achieves shielding by converting electromagnetic waves into current through a small amount of reflection, and most of the skin effect and eddy current effect.
[0030] See Figures 1 to 4Furthermore, in one embodiment of this utility model, the conductive layer 51 is a silver metal layer or a copper metal layer; and / or, the magnetically conductive layer 52 is a nickel metal layer. It should be noted that the conductive layer 51 in this embodiment is a silver metal layer or a copper metal layer, preferably a silver metal layer. Silver is a highly efficient shielding material with a small skin depth, providing excellent conductive continuity, making it suitable for high-frequency radiation shielding. Moreover, silver is not easily oxidized at room temperature, avoiding long-term use where oxidation leads to a decrease in shielding effectiveness. The magnetically conductive layer 52 is preferably nickel metal. Nickel is a ferromagnetic metal with high permeability and anti-saturation capability, resulting in better performance in low-frequency magnetic field shielding. The conductive layer 51 can also be made of other highly conductive materials, such as aluminum metal, conductive polymers, etc.; the magnetically conductive layer 52 can also be made of iron-nickel alloys, ferrites, and other magnetic materials. This embodiment is not limited to these, and all of the above are within the protection scope of this utility model.
[0031] See Figures 1 to 4 Furthermore, in one embodiment of this utility model, the shielding shell 20 includes a base 21 and a mounting frame 22. The mounting frame 22 protrudes from the surface of the base 21 and is recessed inward relative to the side of the base 21 to form a mounting cavity 22a for mounting the substrate 10. It should be noted that in this embodiment, both the base 21 and the mounting frame 22 are made of aluminum, and the shielding shell 20 is formed by an integral molding process. Of course, the shielding shell 20 can also be made of highly conductive metals such as copper, or it can be made of a plastic shell with conductive paint sprayed inside or filled with conductive material, as long as it can achieve radiation shielding. This embodiment is not limited to these, and all of the above are within the protection scope of this utility model. As an example, the frame of the mounting frame 22 is recessed inward by 4-6 mm relative to the side of the base 21, and the height of the frame is 20 mm. It should be noted that the size and height of the mounting frame are determined according to the actual situation and are not limited here. In this embodiment, the protruding and recessed mounting frame 22 forms a boss-like structure, allowing the LED light board 100 to be detachably connected by snapping the mounting frame 22 into the external housing. At the same time, the LED light board 100 is placed in the mounting cavity 22a, and the frame of the mounting frame 22 can provide some protection for the edges of the LED light board 100.
[0032] See Figures 1 to 4Furthermore, in one embodiment of this utility model, a conductive pad is provided on the outer side of the mounting frame 22 facing away from the mounting cavity 22a. It should be noted that the conductive pad in this embodiment can be conductive cotton, or a combination of one or more of conductive silicone rubber pads, woven metal mesh pads, and metal-coated rubber pads. This embodiment is not limited to these, and all of the above are within the protection scope of this utility model. By providing a conductive pad, this embodiment ensures that when the shielding shell 20 is assembled with the external enclosure, the conductive pad fills the gap between the two, forming a complete closure between the shielding shell 20 and the enclosure. This prevents electromagnetic radiation from leaking through the gaps and compromising the overall shielding effectiveness. Simultaneously, it also blocks water vapor penetration, meeting the sealing and waterproofing requirements of the LED light board 100.
[0033] See Figures 1 to 4 Furthermore, in one embodiment of this invention, a functional film 60 is provided on the surface of the electromagnetic shielding layer 50. It should be noted that the LED light panel 100 in this embodiment has a black functional film 60 on its surface. The functional film 60 is bonded to the surface of the electromagnetic shielding layer 50 using a rolling device. The functional film 60 is preferably a film material with a thickness of 100 μm and a light transmittance greater than or equal to 60%. The functional film 60 includes a service layer and a protective layer stacked together. The protective layer includes a PET layer, which has high wear resistance. Using it as the outermost layer allows the LED light panel 100 to effectively resist scratches, friction, and impacts, improving the service life of the LED light panel 100. The service layer includes an AG layer, which has anti-glare properties, enabling the LED light panel 100 to eliminate glare and maintain light source clarity in strong light environments. This embodiment protects the LED light panel 100 by providing a black functional film 60, while maintaining a consistent blackness on the surface of the LED light panel 100.
[0034] See Figures 1 to 4 Furthermore, in one embodiment of this utility model, the conductive shielding layer 40 includes an epoxy resin layer and a plurality of micron-sized silver particles dispersed in the epoxy resin layer. It should be noted that the silver content of the conductive shielding layer 40 is preferably 80%. With this configuration, the high conductivity of the silver particles causes the induced current in the conductive shielding layer 40 to generate Joule heat, converting electromagnetic energy into heat energy and dissipating it, thus blocking the leakage path of electromagnetic waves between the LED chips. Simultaneously, the conductive shielding layer 40 is lightweight, has strong process adaptability, is suitable for small gaps between LED chips 30, has good adhesion, requires no additional surface treatment, and effectively reduces production costs.
[0035] This embodiment provides an LED module, including a driver and the aforementioned LED light board 100. The driver is mounted on the second mounting surface 10b of the LED light board 100. It should be noted that the driver may include a driver chip, resistors, capacitors, diodes, etc., to control the dimming and color-changing functions of the LED beads 30. The LED module may also be equipped with heat sinks, fuses, etc., to achieve heat dissipation and overcurrent protection functions. This embodiment is not limited to these, and all of the above are within the protection scope of this utility model. By filling the gaps between the LED beads 30 with a conductive substrate, electromagnetic radiation at the gaps is shielded. Combined with the electromagnetic shielding layer 50 disposed on the surface of the conductive shielding layer 40 and the shielding shell 20 disposed on the second mounting surface 10b, electromagnetic radiation on the surface and back are shielded respectively, thus ensuring the light output requirements of the LED module while minimizing electromagnetic radiation leakage.
[0036] This embodiment provides a display screen, including a housing and the aforementioned LED module, with the LED module disposed in the housing. The LED module's LED light board 100 includes a substrate 10, a shielding shell 20, and a plurality of LED beads 30. The substrate 10 has a first mounting surface 10a and a second mounting surface 10b arranged opposite each other. The plurality of LED beads 30 are spaced apart on the first mounting surface 10a, and conductive substrates are provided between the LED beads 30 to form a continuous conductive shielding layer 40 on the first mounting surface 10a. An electromagnetic shielding layer 50 is provided on the surface of the conductive shielding layer 40. The second mounting surface 10b is used to mount driving devices, and the shielding shell 20 is disposed on the second mounting surface 10b to shield the electromagnetic radiation from the driving devices. It should be noted that the LED module is assembled by being snapped into the housing by the mounting frame 22 of the shielding shell 20. The LED light board 100 shields the electromagnetic radiation at the gaps between the LED beads 30 by filling the gaps with conductive substrate. Together with the electromagnetic shielding layer 50 on the surface of the conductive shielding layer 40 and the shielding shell 20 on the second mounting surface 10b, the electromagnetic radiation on the surface and back are shielded respectively, so as to ensure the light output requirements of the display screen while suppressing electromagnetic radiation leakage to the greatest extent.
[0037] The above description is only an optional embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. An LED light panel, characterized in that, include: The substrate comprises a substrate, a shielding shell, and a plurality of LED beads. The substrate has a first mounting surface and a second mounting surface arranged opposite to each other. The plurality of LED beads are spaced apart on the first mounting surface, and a conductive substrate is provided in the gap between the plurality of LED beads to form a continuous conductive shielding layer on the first mounting surface. An electromagnetic shielding layer is provided on the surface of the conductive shielding layer. The second mounting surface is used to mount a driving device, and the shielding shell is disposed on the second mounting surface to shield the electromagnetic radiation of the driving device.
2. The LED light panel as described in claim 1, characterized in that, The electromagnetic shielding layer includes a conductive layer and a magnetically conductive layer, which are stacked on the conductive shielding layer.
3. The LED light panel as described in claim 2, characterized in that, The conductive layer covers the conductive shielding layer, and the magnetic layer covers the conductive layer.
4. The LED light panel as described in claim 2, characterized in that, The conductive layer is a silver or copper metal layer; and / or the magnetic layer is a nickel metal layer.
5. The LED light panel as described in claim 1, characterized in that, The shielding shell includes a base and a mounting frame. The mounting frame protrudes from the surface of the base and is recessed inward relative to the side of the base to form a mounting cavity for mounting the substrate.
6. The LED light panel as described in claim 5, characterized in that, The mounting frame has a conductive pad on its outer side away from the mounting cavity.
7. The LED light panel as described in claim 1, characterized in that, The surface of the electromagnetic shielding layer is provided with a functional film.
8. The LED light panel according to any one of claims 1 to 7, characterized in that, The conductive shielding layer includes an epoxy resin layer and a plurality of micron-sized silver particles dispersed in the epoxy resin layer.
9. An LED module, characterized in that, It includes a driving device and an LED light panel as described in any one of claims 1 to 8, wherein the driving device is mounted on the second mounting surface of the LED light panel.
10. A display screen, characterized in that, It includes a housing and the LED module as described in claim 9, wherein the LED module is disposed in the housing.