A double-sided polishing jig structure for semiconductor silicon products

Abstract

This utility model discloses a fixture structure for double-sided grinding of semiconductor silicon products, including an epoxy resin fixture and a silicone strip. The epoxy resin fixture has a through groove and a beveled slot on its inner side. A connecting crossbar is fixedly connected to the outer side of the silicone strip, and a partition is fixedly connected to the outer side of the connecting crossbar. A sliding rod is slidably connected to the inner side of the partition, and a locking block is fixedly connected to the top of the sliding rod. A telescopic spring connects the locking block and the partition. This fixture structure for double-sided grinding of semiconductor silicon products incorporates a silicone strip with a hardness of approximately Shore A65 embedded inside the grinding fixture. When the product vibrates and impacts the fixture, the silicone's cushioning effect absorbs the impact force, protecting the product's outer diameter. Simultaneously, because silicone has low hardness and is easily deformable, the abrasive particles in the gap between the product and the fixture are embedded into the silicone through compression, preventing relative movement and wear, thus increasing the fixture's service life.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a fixture structure for double-sided grinding of semiconductor silicon products. Background Technology

[0002] Silicon and quartz products are commonly used in the semiconductor industry. To achieve better flatness and parallelism, silicon and quartz products need to be double-sided ground. The double-sided grinding process involves placing a ring-shaped or disc-shaped product on a cast iron flat disc (i.e., a grinding disc) on a grinding machine. A planetary jig is used to fix the product in place. During production, the upper and lower grinding discs clamp the product in the middle and apply a certain pressure. The grinding discs rotate in opposite directions and use abrasive to rub and thin the product surface, ultimately achieving a high level of flatness and parallelism. During grinding production, the product is fixed between the upper and lower discs by the planetary jig, which performs a planetary trajectory motion of rotation and revolution. Currently, most planetary jigs used in the industry are made of epoxy resin. A 0.5mm gap needs to be designed between the jig and the product to ensure that the product can rotate freely within the jig.

[0003] The epoxy resin materials currently used typically have a hardness between Shore D85 and 90. This high hardness provides epoxy resin with excellent wear resistance and impact resistance, but it also brings disadvantages in grinding production. Due to the 0.5mm gap between the product and the fixture, the product will vibrate inside the fixture during the grinding process, causing the outer diameter of the product to continuously impact the fixture. Silica products are brittle materials and are prone to chipping or cracking under external forces. Continuous collision with the high-hardness fixture increases the risk of chipping or cracking of the outer diameter of the product. When the fixture is used continuously, the relative movement between the outer diameter of the product and the fixture caused by the rotation of the product inside the fixture will cause the fixture to wear, resulting in a continuous increase in the initial 0.5mm gap between the product and the fixture, thereby continuously increasing the risk of chipping and cracking of the outer diameter of the product caused by vibration.

[0004] To address the aforementioned issues, we have developed an innovative design based on the existing fixture structure for double-sided grinding of semiconductor silicon products. Utility Model Content

[0005] The purpose of this invention is to provide a jig structure for double-sided grinding of semiconductor silicon products, in order to solve the problem mentioned in the background art that existing silicon quartz products are brittle materials and are prone to chipping or cracking under external force. Continuous collision with a high-hardness jig increases the risk of chipping or cracking of the outer diameter of the product. During continuous use of the jig, the relative movement between the outer diameter of the product and the jig caused by the rotation of the product inside the jig will cause wear of the jig, resulting in a continuous increase in the initial 0.5mm gap between the product and the jig, thereby increasing the risk of chipping and cracking of the outer diameter of the product due to vibration.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a fixture structure for double-sided grinding of semiconductor silicon products, comprising an epoxy resin fixture and a silicone strip; the epoxy resin fixture has a through groove on its inner side and an oblique slot on its inner side; a connecting crossbar is fixedly connected to the outer side of the silicone strip; a partition is fixedly connected to the outer side of the connecting crossbar; a sliding rod is slidably connected to the inner side of the partition; a locking block is fixedly connected to the top of the sliding rod; and a telescopic spring is connected between the locking block and the partition.

[0007] Preferably, the through groove and the oblique slot are a through structure, and the oblique slot is arranged in two sets symmetrically about the midpoint of the through groove.

[0008] By adopting the above technical solution, the oblique slot can be set so that the card block can move forward to the maximum stroke and engage with the oblique slot. The engagement of the card block with the oblique slot can fix the silicone strip to the inside of the epoxy resin fixture.

[0009] Preferably, the connecting crossbar, partition and locking block are all made of rubber and have a Shore A hardness of 50-70 degrees.

[0010] By adopting the above technical solution, the excellent plasticity of rubber material allows for easy installation of silicone strips inside epoxy resin fixtures.

[0011] Preferably, the card block is in the shape of an inclined trapezoid, and two sets of card blocks are arranged symmetrically about the midpoint of the partition.

[0012] By adopting the above technical solution, the locking block can fix the silicone strip to the inside of the epoxy resin fixture.

[0013] Preferably, the sliding rod is made of stainless steel and its surface is coated with polytetrafluoroethylene.

[0014] By adopting the above technical solution, and using stainless steel for the sliding rod, corrosion of the sliding rod can be avoided, thereby increasing its service life.

[0015] Preferably, the angle of the beveled slot is consistent with the angle of the beveled surface of the card block.

[0016] By adopting the above technical solution, the silicone strip can be fixed inside the epoxy resin fixture by engaging the oblique slot with the card block.

[0017] Preferably, the compression stroke of the telescopic spring is 5-10mm, and the initial elastic force is 2-5N.

[0018] By adopting the above technical solution, the elastic force of the telescopic spring can cause the locking block to reset itself and lock into the inside of the slanted slot.

[0019] Compared with the prior art, the beneficial effect of this utility model is that the fixture structure for double-sided grinding of semiconductor silicon products is as follows:

[0020] A silicone strip with a hardness of approximately Shore A65 is embedded inside the grinding fixture. When the product vibrates and impacts the fixture, the silicone cushioning can absorb the impact force and protect the outer diameter of the product. At the same time, because silicone has low hardness and is easily deformed, the abrasive in the gap between the product and the fixture will be embedded into the silicone by compression and will not move relative to the silicone, thus preventing wear and tear on the silicone, thereby increasing the service life of the fixture. During the grinding process, the product and the fixture are continuously washed by the grinding fluid. This invention has a groove 2mm wide and 4mm deep in the middle of the fixture. A T-shaped silicone strip composed of a silicone strip and a connecting crossbar is inserted into the groove of the fixture. During the grinding process, the silicone will not fall out of the groove due to the pressure of the product. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the overall side view structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the three-dimensional structure of the through groove of this utility model;

[0024] Figure 4 This is a front view schematic diagram of the through groove structure of this utility model;

[0025] Figure 5 This is a schematic diagram of the three-dimensional structure of the silicone strip of this utility model;

[0026] Figure 6 This utility model Figure 5 Enlarged structural diagram at point A in the middle.

[0027] In the diagram: 1. Epoxy resin fixture; 2. Silicone strip; 3. Through groove; 4. Angled slot; 5. Connecting crossbar; 6. Partition plate; 7. Sliding rod; 8. Locking block; 9. Telescopic spring. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figures 1-6This utility model provides a technical solution: a fixture structure for double-sided grinding of semiconductor silicon products, including: an epoxy resin fixture 1 and a silicone strip 2; the epoxy resin fixture 1 has a through groove 3 on its inner side and an oblique slot 4 on its inner side; a connecting crossbar 5 is fixedly connected to the outer side of the silicone strip 2; a partition 6 is fixedly connected to the outer side of the connecting crossbar 5; a sliding rod 7 is slidably connected to the inner side of the partition 6; a locking block 8 is fixedly connected to the top of the sliding rod 7; and a telescopic spring 9 is connected between the locking block 8 and the partition 6.

[0030] The through groove 3 and the oblique slot 4 are a through structure, and the oblique slot 4 is arranged in two sets symmetrically about the midpoint of the through groove 3; the connecting crossbar 5, the partition 6, and the locking block 8 are all made of rubber with a Shore A hardness of 50-70 degrees; the locking block 8 is in the shape of an oblique trapezoid, and the locking block 8 is arranged in two sets symmetrically about the midpoint of the partition 6; the sliding rod 7 is made of stainless steel and its surface is coated with polytetrafluoroethylene; the inclination angle of the oblique slot 4 is the same as the inclination angle of the locking block 8; the compression stroke of the telescopic spring 9 is 5-10mm, and the initial elastic force is 2-5N;

[0031] When installing the silicone strip 2, the silicone strip 2 is first placed inside the epoxy resin fixture 1. The silicone strip 2 is then pushed inwards along the inner mounting ring of the epoxy resin fixture 1. The beveled locking blocks 8 on the outer side of the silicone strip 2 slide forward along the inner side of the through groove 3. As the locking blocks 8 slide forward, they are pressed against the inner wall of the through groove 3, causing the locking blocks 8 to compress the telescopic springs 9 and move towards each other. When the locking blocks 8 reach the innermost side of the through groove 3, their sides are flush with the beveled locking slots 4. The locking blocks 8 are then reset by the elastic force of the telescopic springs 9. The locking block 8 moves up and down to engage with the inside of the oblique slot 4. The engagement of the locking block 8 with the oblique slot 4 causes the silicone strip 2 to be distributed in a circular shape inside the epoxy resin fixture 1. When the product vibrates and impacts the epoxy resin fixture 1, the buffer of the silicone strip 2 can absorb the impact force and protect the outer diameter of the product. At the same time, because the silicone strip 2 has low hardness and is easy to deform, the abrasive in the gap between the product and the epoxy resin fixture 1 will be embedded into the silicone strip 2 by compression and will not move relative to the silicone strip 2, causing wear on the silicone strip 2, thereby increasing the service life of the epoxy resin fixture 1.

[0032] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A fixture structure for double-sided grinding of semiconductor silicon products, comprising an epoxy resin fixture (1) and a silicone strip (2); characterized in that, The epoxy resin fixture (1) has a through groove (3) on its inner side and a slanted slot (4) on its inner side. A butt crossbar (5) is fixedly connected to the outer side of the silicone strip (2). A partition (6) is fixedly connected to the outer side of the butt crossbar (5). A sliding rod (7) is slidably connected to the inner side of the partition (6). A locking block (8) is fixedly connected to the top of the sliding rod (7). A telescopic spring (9) is connected between the locking block (8) and the partition (6).

2. The fixture structure for double-sided grinding of semiconductor silicon products according to claim 1, characterized in that: The through groove (3) and the oblique slot (4) are connected, and the oblique slot (4) is arranged in two sets with the top and bottom symmetrical about the midpoint of the through groove (3).

3. The fixture structure for double-sided grinding of semiconductor silicon products according to claim 1, characterized in that: The connecting crossbar (5), partition (6) and locking block (8) are all made of rubber and have a Shore A hardness of 50-70 degrees.

4. The fixture structure for double-sided grinding of semiconductor silicon products according to claim 1, characterized in that: The card block (8) is in the shape of a sloping trapezoid, and two sets of card blocks (8) are arranged symmetrically about the midpoint of the partition (6).

5. The fixture structure for double-sided grinding of semiconductor silicon products according to claim 1, characterized in that: The sliding rod (7) is made of stainless steel and its surface is coated with polytetrafluoroethylene.

6. The fixture structure for double-sided grinding of semiconductor silicon products according to claim 1, characterized in that: The angle of the inclined slot (4) is consistent with the angle of the inclined surface of the card block (8).

7. The fixture structure for double-sided grinding of semiconductor silicon products according to claim 1, characterized in that: The compression stroke of the telescopic spring (9) is 5-10mm, and the initial elastic force is 2-5N.

Images