Stacked multi-channel array signal embedded acquisition device

Abstract

The utility model discloses a kind of stacked multi-channel array signal embedded acquisition devices, including cabinet, cover, signal acquisition module, signal backplane, switchboard, power connector, external ethernet connector;Cabinet is assembled by bottom plate and multiple side plates, and side plate includes positioning side plate;Signal backplane is fixed in the inside of positioning side plate;The inside of signal backplane is equipped with internal signal connector, its outside is equipped with external signal connector, and external signal connector extends to cabinet outside by passing through the mounting hole on positioning side plate;Power connector and external ethernet connector extend to cabinet interior by passing through positioning side plate and signal backplane in turn;Switchboard is detachably arranged on bottom plate, and is connected with the inner end of external ethernet connector;Signal acquisition module is detachably mounted on bottom plate;Signal acquisition module is electrically connected with internal signal connector by FPC flexible flat cable, and is electrically connected with switchboard by network cable.The utility model has the advantages of good sealing, compact structure.

Description

Technical Field

[0001] This utility model relates to the field of multi-channel array signal acquisition, specifically a stacked multi-channel array signal embedded acquisition device. Background Technology

[0002] In existing technologies, modular instrument systems (such as NI's PXI system) offer flexible configuration options for data acquisition. These systems typically include a chassis, controller, and functional modules. The chassis usually employs a multi-slot backplane structure, allowing users to insert different numbers of data acquisition modules to build the system as needed.

[0003] However, such open-architecture systems have inherent drawbacks: First, their chassis, designed for heat dissipation and ease of plugging and unplugging, typically have numerous openings, resulting in poor system sealing and insufficient dustproof, moisture-proof, and electromagnetic interference (EMI) immunity capabilities. Second, their horizontal plug-in structure determines that the chassis is bulky, not compact, and occupies a lot of space. These structural characteristics result in a low protection rating (IP rating) for the entire system, limited mechanical strength, and vibration and shock resistance. Therefore, they are mainly limited to use in laboratories or well-equipped control rooms, and are difficult to adapt to the stringent requirements for equipment reliability, durability, and compactness in vehicle-mounted, airborne, field, or harsh industrial environments. Summary of the Invention

[0004] The purpose of this invention is to provide a stacked multi-channel array signal embedded acquisition device with good sealing performance and compact structure, addressing the shortcomings of existing technologies.

[0005] The technical objective of this utility model is achieved through the following technical solution: A stacked multi-channel array signal embedded acquisition device includes a chassis with an open top, a cover plate for closing the chassis opening, a signal acquisition module, a signal backplane, a switch board, a power connector, an external Ethernet connector, and an external signal connector. The chassis is assembled from a base plate and multiple side plates, each side plate including a positioning side plate. The signal backplane is fixed to the inner side of the positioning side plate. An internal signal connector is provided on the inner side of the signal backplane, and an external signal connector is provided on its outer side. The external signal connector extends to the outside of the chassis through mounting holes on the positioning side plate. The signal backplane has a first power mounting hole and a first connector mounting hole. The positioning side plate is provided with a second power mounting hole and a second connector mounting hole; the power connector extends into the chassis through the second power mounting hole and the first power mounting hole in sequence; the external Ethernet connector extends into the chassis through the second connector mounting hole and the first connector mounting hole in sequence; the switch board is detachably mounted on the base plate and connected to the inner end of the external Ethernet connector via a network cable; the signal acquisition module is detachably mounted on the base plate; the signal acquisition module is electrically connected to the internal signal connector on the signal backplane via an FPC flexible flat cable and to the switch board via an Ethernet cable.

[0006] Preferably, the signal acquisition module includes a signal acquisition main control board and at least one signal acquisition board; the signal acquisition board is detachably connected to the signal acquisition main control board via studs, and the signal acquisition board and the signal acquisition main control board are also electrically connected via a board-to-board connector; the signal acquisition main control board is provided with an FPC flexible flat cable interface, and the signal acquisition main control board is connected to the internal signal connector on the signal backplane via an FPC flexible flat cable.

[0007] Preferably, the signal acquisition main control board is provided with multiple mounting positions for mounting the signal acquisition board.

[0008] Preferably, the signal acquisition module consists of multiple modules, and the signal backplane is provided with multiple internal signal connectors corresponding to the number of acquisition modules.

[0009] Preferably, multiple signal acquisition modules are mounted on the base plate by stacking studs.

[0010] Preferably, the signal acquisition module includes a first signal acquisition module located at the bottom and a second signal acquisition module located at the top; the first signal acquisition module is connected to the base plate via a first stud; the second signal acquisition module is stacked on the first signal acquisition module via a second stud.

[0011] Preferably, the external signal connector is fixed to the signal backplate by pin soldering, and has a square retaining edge on its outer side.

[0012] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model includes a chassis with an open top, a cover plate for closing the chassis opening, a signal acquisition module, a signal backplane, a switch board, a power connector, an external Ethernet connector, and an external signal connector. The chassis is assembled from a base plate and multiple side plates, including a positioning side plate. The signal backplane is fixed to the inside of the positioning side plate. An internal signal connector is provided on the inside of the signal backplane, and an external signal connector is provided on its outside. The external signal connector extends to the outside of the chassis through a mounting hole on the positioning side plate. The signal backplane has a first power mounting hole and a first connector mounting hole. A second power mounting hole and a second connector mounting hole are correspondingly provided on the positioning side plate. The power connector extends to the inside of the chassis through the second power mounting hole and the first power mounting hole in sequence. The external Ethernet connector extends to the inside of the chassis through the second connector mounting hole and the first connector mounting hole in sequence. The switch board is detachably mounted on the base plate and connected to the inside of the external Ethernet connector via a network cable. The signal acquisition module is detachably mounted on the base plate. The signal acquisition module is electrically connected to the internal signal connector on the signal backplane via an FPC flexible cable and to the switch board via an Ethernet cable. This technology not only enables flexible expansion and configuration of multi-channel signals, but also significantly improves structural compactness and environmental protection capabilities. It has the advantages of good sealing and compact structure, and is especially suitable for harsh industrial and field scenarios.

[0013] 2. This utility model achieves reliable electrical connection and enhances mechanical sealing effect through the combination of pin soldering of the external signal connector and the outer square retaining edge, effectively improving the interface protection level and sealing reliability of the device in harsh environments.

[0014] 3. The power interface of this utility model uses a dual mounting hole positioning and a circular retaining edge design, which simplifies the assembly process while achieving physical reinforcement of the interface and improving the sealing of the chassis.

[0015] 4. The tight fit structure of the external Ethernet connector and the dual mounting holes, along with the retaining edge design of this utility model, significantly improves the protection level and overall sealing performance of the interface while ensuring signal transmission stability.

[0016] 5. This utility model combines modular information acquisition components with FPC flexible cables to achieve flexible configuration of both the main control board and the acquisition board, while also taking into account the space efficiency of stacked installation and the reliability of signal transmission.

[0017] 6. By setting up multiple independent signal acquisition modules and corresponding internal signal connectors, this utility model realizes the linear expansion capability of the system channel scale. The parallel and independent connection of each module not only ensures signal integrity but also greatly improves the system configuration flexibility.

[0018] 7. This utility model perfectly balances high-density integration, flexible configuration, and mechanical reliability in industrial environments. Attached Figure Description

[0019] Figure 1 This is an assembly drawing of this utility model; Figure 2 This is a schematic diagram of the internal structure of the assembled chassis; Figure 3 This is a schematic diagram of the signal backplane structure; Reference numerals: 1—Chassis; 11—Positioning side panel; 111—Mounting hole; 112—Second power supply mounting hole; 113—Second connector mounting hole; 12—Base plate; 13—Left side panel; 14—Right side panel; 15—Rear side panel; 2—Cover plate; 3—Signal backplane; 31—Internal signal connector; 311—First internal signal connector; 312—Second internal signal connector; 32—External signal connector; 321—Square retaining edge; 322—Pin; 33—First power mounting hole; 34—First connector mounting hole; 35—Pin hole; 4—Signal acquisition module; 41—First signal acquisition module; 411—First signal acquisition main control board; 412—First acquisition board; 42—Second signal acquisition module; 421—Second signal acquisition main control board; 422—Second acquisition board; 43—FPC flexible flat cable interface; 44—FPC flexible flat cable; 5—Switch board; 6—Power connector; 7—External Ethernet connector; 401—First stud; 402—Second stud. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0023] like Figure 1 — Figure 3 As shown, a stacked multi-channel array signal embedded acquisition device includes a chassis 1 with an open top, a cover plate 2 for closing the opening of the chassis 1, a signal acquisition module 4, a signal backplane 3, a switch board 5, a power connector 6, an external Ethernet connector 7, and an external signal connector 32. The chassis 1 is assembled from a base plate 12 and multiple side plates, including a positioning side plate 11. The signal backplane 3 is fixed to the inside of the positioning side plate 11. An internal signal connector 31 is provided on the inside of the signal backplane 3, and an external signal connector 32 is provided on its outside. The external signal connector 32 extends to the outside of the chassis 1 through a mounting hole 111 on the positioning side plate 11. The signal backplane 3 is provided with a first power mounting hole 33 and a first connector mounting hole 32. Mounting hole 34; a second power mounting hole 112 and a second connector mounting hole 113 are correspondingly provided on the positioning side plate 11; the power connector 6 extends into the chassis 1 through the second power mounting hole 112 and the first power mounting hole 33 in sequence; the external Ethernet connector 7 extends into the chassis 1 through the second connector mounting hole 113 and the first connector mounting hole 34 in sequence; the switch board 5 is detachably mounted on the base plate 12 and connected to the inner end of the external Ethernet connector 7 via a network cable; the signal acquisition module 4 is detachably mounted on the base plate 12; the signal acquisition module 4 is electrically connected to the internal signal connector 31 on the signal backplane 3 via an FPC flexible flat cable 44, and is electrically connected to the switch board 5 via an Ethernet cable. This technical measure significantly improves structural compactness and environmental protection capabilities while enabling flexible expansion and configuration of multi-channel signals. It has the advantages of good sealing and compact structure, and is especially suitable for harsh industrial and field scenarios.

[0024] In a specific implementation, the chassis 1 is a square structure with an opening at the top, including a square base plate 12 and four side plates disposed on the upper side of the base plate 12. The cover plate 2 used to close the opening of the chassis 1 is also a square structure. The side plates include a left side plate 13, a right side plate 14, a rear side plate 15, and a positioning side plate 11. The signal backplate 3 is disposed inside the chassis. In this embodiment, the signal backplate 3 is fixed to the inner side of the positioning side plate 11. The inner side of the signal backplate 3 is provided with an internal signal connector 31, and the outer side is provided with an external signal connector 32. The external signal connector 32 extends to the outside of the chassis 1 through the mounting hole 111 on the positioning side plate 11.

[0025] like Figure 1 — Figure 3 As shown, the external signal connector 32 is fixed to the signal backplate 3 by soldering pins 322, and has a square retaining edge 321 on its outer side. In specific implementations, there are multiple external signal connectors 32, and in this embodiment, there are two; correspondingly, there are two mounting holes 111 on the positioning side plate 11. The inner end of the external signal connector 32 has multiple pins 322; the signal backplate 3 has pin holes 35 that mate with the pins 322, and the pins 322 are soldered and fixed to the signal backplate 3 after being inserted into the pin holes 35; the external signal connector 32 soldered on the signal backplate 3 is an external multi-core connector used to connect externally transmitted multi-channel signal cables. The outer side of the external signal connector 32 has a square retaining edge 321. The positioning side plate 11 has mounting holes 111 for the outer end of the external signal connector 32 to pass through. When the outer end of the external signal connector 32 passes through, the square retaining edge 321 on the outer side of the external signal connector 32 increases the sealing effect. By soldering the pins 322 of the external signal connector 32 to the outer square flange 321, a reliable electrical connection is achieved while enhancing the mechanical sealing effect, effectively improving the interface protection level and sealing reliability of the device in harsh environments.

[0026] like Figure 1 — Figure 3 As shown, the power connector 6 and the external Ethernet connector 7 extend sequentially through the positioning side plate 11 and the signal back plate 3 into the interior of the chassis 1.

[0027] Specifically, the signal backplane 3 is provided with a first power mounting hole 33 and a first connector mounting hole 34; the positioning side plate 11 is correspondingly provided with a second power mounting hole 112 and a second connector mounting hole 113; the power connector 6 extends into the chassis 1 through the second power mounting hole 112 and the first power mounting hole 33 in sequence; the external Ethernet connector 7 extends into the chassis 1 through the second connector mounting hole 113 and the first connector mounting hole 34 in sequence. In this embodiment, the power connector 6 includes a circular power connector body and a circular retaining edge; the power connector 6 extends into the chassis 1 through the second power mounting hole 112 of the positioning side plate 11 and the first power mounting hole 33 of the signal backplane 3, and is used to supply power to the internal equipment. For example, the outer end of the power connector 6 is connected to an external power source, and the inner end of the power connector 6 is connected to the signal acquisition main control board of the signal acquisition module 4 and the switch board 5 through wires respectively. This power and communication interface adopts an integrated through-board mounting structure. Through the dual mounting hole positioning and circular retaining edge design, the assembly process is simplified while the physical reinforcement of the interface and the sealing performance of the chassis 1 are improved.

[0028] like Figure 1 — Figure 2 As shown, the external Ethernet connector 7 extends into the chassis 1 through the second connector mounting hole 113 and the first connector mounting hole 34. In this embodiment, the external Ethernet connector 7 includes a circular external Ethernet connector body and a circular Ethernet connector body retainer. After the external Ethernet connector body is installed in the second connector mounting hole 113 and the first connector mounting hole 34, the inner end of the external Ethernet connector 7 is located inside the chassis 1, and the outer end of the external Ethernet connector 7 is located outside the chassis 1. The outer end of the external Ethernet connector 7 is connected to an external device via a network cable. The switch board 5 is detachably mounted on the base plate 12 and connected to the inner end of the external Ethernet connector 7 via a network cable. Through the tight fit structure of the external Ethernet connector 7 with the dual mounting holes and the retainer design, the protection level and overall sealing performance at the interface are significantly improved while ensuring signal transmission stability.

[0029] like Figure 1 — Figure 2As shown, the signal acquisition module 4 is detachably mounted on the base plate 12. The signal acquisition module 4 is electrically connected to the internal signal connector 31 on the signal backplane 3 via an FPC flexible flat cable 44, and is also electrically connected to the switch board 5 via an Ethernet cable. In specific implementation, the signal acquisition module 4 includes a signal acquisition main control board and at least one signal acquisition board. The signal acquisition board is detachably connected to the signal acquisition main control board via studs, and the signal acquisition boards are also electrically connected to the signal acquisition main control board via board-to-board connectors (not shown in the figure). The signal acquisition main control board is equipped with an FPC flexible flat cable interface 43, and the signal acquisition main control board is connected to the internal signal connector 31 on the signal backplane 3 via an FPC flexible flat cable 44. Through the combination of modular information acquisition components and FPC flexible flat cables 44, flexible configuration of both the main control board and the acquisition board is achieved, while also considering the space efficiency of stacked installation and the reliability of signal transmission.

[0030] like Figure 1 — Figure 2 As shown, the signal acquisition main control board has multiple mounting positions for installing signal acquisition boards. In this embodiment, the second signal acquisition main control board 421 has two mounting positions for installing second signal acquisition boards 422 spaced apart. The mounting positions of the second signal acquisition main control board 421 connect the two second acquisition boards 422 via studs. Corresponding to the second acquisition boards 422, the second signal acquisition main control board 421 has two FPC flexible flat cable interfaces 43 spaced apart. At the same time, the signal backplane 3 has two second internal signal connectors 312 corresponding to the two FPC flexible flat cable interfaces 43. By integrating dual acquisition board mounting positions on a single main control board and using stud connection, the number of channels can be flexibly increased and hardware resources can be managed intensively, significantly improving the signal acquisition density and system configuration flexibility within a unit space.

[0031] like Figure 1 — Figure 2 As shown, there are multiple signal acquisition modules 4, and the signal backplane 3 has multiple internal signal connectors 31 corresponding to the number of acquisition boards. In this embodiment, there are two signal acquisition modules 4, including a first signal acquisition module 41 and a second signal acquisition module 42; the first signal acquisition module 41 includes two first acquisition boards 412; the second signal acquisition module 42 includes two second acquisition boards 422. The signal backplane 3 has two first internal signal connectors 311 corresponding to the first acquisition board 412. The signal backplane 3 has two second internal signal connectors 312 corresponding to the second acquisition board 422. By setting multiple independent signal acquisition modules 4 and corresponding internal signal connectors 31, the linear expansion capability of the system channel scale is realized. The parallel and independent connection of each module ensures signal integrity and greatly improves the system configuration flexibility.

[0032] like Figure 1 — Figure 2 As shown, multiple signal acquisition modules 4 are mounted on the base plate 12 by stacking studs. In this embodiment, the signal acquisition module 4 includes a first signal acquisition module 41 located at the bottom and a second signal acquisition module 42 located at the top; the first signal acquisition module 41 is connected to the base plate 12 by a first stud 401; the second signal acquisition module 42 is stacked on the first signal acquisition module 41 by a second stud 402. In a specific implementation, the first signal acquisition main control board 411 of the first signal acquisition module 41 is connected to the base plate 12 by a first stud 401 located on its lower side; the first studs 401 are correspondingly located at the four corners of the first signal acquisition main control board 411. The second signal acquisition main control board 421 of the second signal acquisition module 42 has a second stud 402 on its lower side corresponding to the first stud 401, and the second signal acquisition main control board 421 is stacked on the first signal acquisition main control board 411 by the second studs 402. The first signal acquisition main control board 411 is connected to the first internal signal connector 311 via an FPC flexible flat cable 44; the second signal acquisition main control board 421 is connected to the second internal signal connector 312 via an FPC flexible flat cable 44. The first and second signal acquisition main control boards 411 and 421 are electrically connected to the switch board 5 via Ethernet cables. Each signal acquisition main control board is connected to the switch board 5 via an Ethernet interface and to an external Ethernet connector 7 via the external Ethernet interface of the switch board 5, enabling external data communication. This stacked modular structure, through rigid stud connections and independent FPC / Ethernet cabling design, achieves linear expansion of the number of channels while ensuring the independence and stability of signal transmission for each module, perfectly balancing high-density integration, flexible configuration, and mechanical reliability in industrial environments.

[0033] The technical solutions provided by the embodiments of this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the embodiments of this utility model. The description of the above embodiments is only for helping to understand the principles of the embodiments of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the embodiments of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A stacked multi-channel array signal embedded acquisition device, characterized in that, Includes a chassis with an opening at the top, a cover plate for closing the chassis opening, a signal acquisition module, a signal backplane, a switch board, a power connector, an external Ethernet connector, and an external signal connector; The chassis is assembled from a base plate and multiple side plates, the side plates including positioning side plates; The signal backplate is fixed to the inner side of the positioning side plate; the inner side of the signal backplate is provided with an internal signal connector, and the outer side is provided with an external signal connector. The external signal connector extends to the outside of the chassis through the mounting hole on the positioning side plate; the signal backplate is provided with a first power mounting hole and a first connector mounting hole; the positioning side plate is correspondingly provided with a second power mounting hole and a second connector mounting hole. The power connector extends into the chassis through the second power mounting hole and the first power mounting hole in sequence; the external Ethernet connector extends into the chassis through the second connector mounting hole and the first connector mounting hole in sequence. The switch board is detachably mounted on the base plate and connected to the inner end of the external Ethernet connector via a network cable; The signal acquisition module is detachably mounted on the base plate; the signal acquisition module is electrically connected to the internal signal connector on the signal backplane via an FPC flexible flat cable, and is electrically connected to the switch board via an Ethernet cable.

2. The stacked multi-channel array signal embedded acquisition device according to claim 1, characterized in that, The signal acquisition module includes a signal acquisition main control board and at least one signal acquisition board; The signal acquisition board is detachably connected to the signal acquisition main control board via studs, and the signal acquisition board and the signal acquisition main control board are also electrically connected via a board-to-board connector. The signal acquisition main control board is equipped with an FPC flexible flat cable interface, and the signal acquisition main control board is connected to the internal signal connector on the signal backplane via an FPC flexible flat cable.

3. The stacked multi-channel array signal embedded acquisition device according to claim 2, characterized in that, The signal acquisition main control board is provided with multiple mounting positions for installing the signal acquisition board.

4. The stacked multi-channel array signal embedded acquisition device according to claim 2, characterized in that, The signal acquisition module consists of multiple modules, and the signal backplane is provided with multiple internal signal connectors corresponding to the number of acquisition modules.

5. The stacked multi-channel array signal embedded acquisition device according to claim 4, characterized in that, Multiple signal acquisition modules are mounted on the base plate by stacking studs.

6. The stacked multi-channel array signal embedded acquisition device according to claim 5, characterized in that, The signal acquisition module includes a first signal acquisition module located at the bottom and a second signal acquisition module located at the top; The first signal acquisition module is connected to the base plate via a first stud; The second signal acquisition module is mounted on the first signal acquisition module via a stack of second studs.

7. The stacked multi-channel array signal embedded acquisition device according to claim 1, characterized in that, The external signal connector is fixed to the signal backplate by pin soldering, and a square retaining edge is provided on its outer side.

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