Heat dissipation base plate, electronic module, electronic device, and vehicle

Abstract

This application relates to a heat dissipation base plate, an electronic module, an electronic device, and a vehicle. The heat dissipation base plate includes: a plate body; and a plurality of heat dissipation columns connected to the plate body. Each heat dissipation column has a cross-section along its height comprising two oppositely arranged straight edges and two oppositely arranged curved edges. The first ends of the two curved edges are connected to the opposite ends of one of the straight edges, and the second ends of the two curved edges are connected to the opposite ends of the other straight edge. Both curved edges are bent outwards. By setting the cross-section of the heat dissipation column along its height to include two oppositely arranged straight edges and two curved edges connecting the opposite ends of the two straight edges, the heat dissipation column of this application has two straight edges and two outwardly curved edges. Therefore, compared to cylindrical or elliptical heat dissipation columns, the heat dissipation column of this application has a larger outer surface area and a larger heat exchange area, thus improving the heat exchange efficiency of the heat dissipation base plate.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more particularly to a heat dissipation base plate, electronic module, electronic device and vehicle. Background Technology

[0002] Existing electronic modules generate a significant amount of heat during normal operation. To keep the module's operating temperature within a normal range, this heat needs to be dissipated. Most existing electronic modules employ direct water cooling, where the coolant flows through the heat dissipation columns of the heat sink base, carrying away the heat through convection.

[0003] Currently, the heat dissipation columns of the heat dissipation base plate are cylindrical or elliptical column structures, which have a certain improvement in heat dissipation capacity compared to flat plate heat dissipation.

[0004] However, during use, it was found that the convective heat transfer efficiency between the heat sink base plate and the coolant of the heat sink with this structure is not high, thus limiting the processing capacity of the electronic module. Utility Model Content

[0005] This application provides a heat dissipation base plate, an electronic module, an electronic device, and a vehicle, which improves the convective heat transfer efficiency between the heat dissipation base plate and the coolant, thereby at least partially solving the above-mentioned technical problems.

[0006] To achieve the above objectives, according to a first aspect of this application, a heat dissipation base plate is provided, the heat dissipation base plate comprising:

[0007] board body;

[0008] Multiple heat dissipation columns are connected to the plate body, and the cross-section of the heat dissipation column in height includes two straight sides and two curved sides arranged opposite each other;

[0009] The first ends of the two curved edges are connected to the opposite ends of one straight edge, and the second ends of the two curved edges are connected to the opposite ends of another straight edge, and both curved edges are bent outwards.

[0010] Optionally, the curved edge is semi-circular.

[0011] Optionally, the radii of the two curved edges are equal.

[0012] Optionally, the length of the cross-section of the heat dissipation column is equal to the radii of the two curved sides plus the length of the straight side, and the width of the cross-section of the heat dissipation column is equal to the diameter of the curved sides.

[0013] Optionally, the length-to-width ratio of the cross-section of the heat dissipation column ranges from 3:1 to 1.5:1.

[0014] Optionally, the length-to-width ratio of the cross-section of the heat dissipation column is 2:1.

[0015] Optionally, one of the two curved edges, the two straight edges, and the other of the two curved edges are arranged sequentially in the direction of the heat-conducting fluid flow.

[0016] Optionally, the plate body is divided into at least two heat dissipation zones in the direction of heat conduction fluid flow, and the heat dissipation columns are arranged in an array within the heat dissipation zones.

[0017] Optionally, the spacing between the heat dissipation columns on at least two of the heat dissipation zones decreases in the direction of the heat-conducting fluid flow.

[0018] Optionally, the spacing between the heat dissipation columns on each of the heat dissipation zones is the same.

[0019] Optionally, there are three heat dissipation zones, including a first heat dissipation zone, a third heat dissipation zone, and a second heat dissipation zone located between the first heat dissipation zone and the third heat dissipation zone.

[0020] Optionally, the spacing between the heat dissipation pillars on the third heat dissipation area is smaller than the spacing between the heat dissipation pillars on the second heat dissipation area, and the spacing between the heat dissipation pillars on the second heat dissipation area is smaller than the spacing between the heat dissipation pillars on the first heat dissipation area.

[0021] Optionally, the spacing between the heat dissipation columns on each heat dissipation zone in the direction of the flow of the heat-conducting fluid is smaller than the spacing between the heat dissipation columns in the direction perpendicular to the flow of the heat-conducting fluid.

[0022] Optionally, the heat dissipation zone includes a first heat dissipation zone, a second heat dissipation zone, and a third heat dissipation zone arranged along the flow direction of the heat-conducting fluid;

[0023] The spacing between the heat dissipation columns in the first heat dissipation area is 0.8mm-1.2mm in the direction of the heat-conducting fluid and 1.3mm-1.6mm in the direction perpendicular to the flow of the heat-conducting fluid.

[0024] The spacing between the heat dissipation columns in the second heat dissipation area is 0.6mm-0.8mm in the direction of the heat-conducting fluid and 1.1mm-1.3mm in the direction perpendicular to the flow of the heat-conducting fluid.

[0025] The spacing between the heat dissipation columns in the third heat dissipation zone is 0.4mm-0.6mm in the direction of the heat-conducting fluid and 0.8mm-1.3mm in the direction perpendicular to the direction of the heat-conducting fluid.

[0026] Optionally, a gap is provided between two adjacent heat dissipation zones.

[0027] Optionally, the plate body includes a base and a step disposed on the base, and the heat dissipation column is disposed on the step.

[0028] According to a second aspect of this application, an electronic module is provided, including a heating element and a heat dissipation base plate, wherein the heating element is connected to the heat dissipation base plate.

[0029] According to a third aspect of this application, an electronic device is provided, including a heat sink and the electronic module, wherein the heat sink and the heat sink base plate are connected to form a heat dissipation chamber, and the heat dissipation column is located inside the heat dissipation chamber.

[0030] Optionally, the radiator has an inlet and an outlet, the radiator includes a first wall and a second wall disposed opposite to each other, the inlet is located on the first wall, the outlet is located on the second wall, and the heat-conducting fluid flows into the heat dissipation cavity from the inlet and flows out from the outlet.

[0031] According to a fourth aspect of this application, a vehicle is provided, including the aforementioned heat sink, the aforementioned electronic module, or the aforementioned electronic device.

[0032] This application embodiment sets the cross-section of the heat sink column in height to include two oppositely arranged straight sides and two curved sides connecting the two opposite ends of the two straight sides. Since the heat sink column of this application has two straight sides and two outwardly curved sides, its outer surface size is larger than that of a cylindrical or elliptical heat sink column, resulting in a larger heat exchange area and improved heat exchange efficiency of the heat sink base plate. This can support the processing power of the electronic module to a certain extent.

[0033] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0036] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation base plate provided in an exemplary embodiment of this application;

[0037] Figure 2yes Figure 1 A structural schematic diagram of the heat dissipation base plate from another perspective;

[0038] Figure 3 yes Figure 1 A top view of the heat dissipation base plate;

[0039] Figure 4 yes Figure 1 A top view of the heat dissipation columns on the heat dissipation base plate;

[0040] Figure 5 It is a junction temperature simulation of an existing heat dissipation base plate with a uniformly distributed three-segment elliptical heat dissipation column.

[0041] Figure 6 This application is adopted. Figure 4 Junction temperature simulation of a three-section heat dissipation base plate with uniformly distributed heat dissipation columns;

[0042] Figure 7 It is a junction temperature simulation of the heat dissipation base plate of the existing sparse-density distributed three-segment elliptical heat dissipation column;

[0043] Figure 8 This application is adopted. Figure 4 Junction temperature simulation of a three-segment heat dissipation base plate with dense and sparse heat dissipation columns;

[0044] Figure 9 This is a schematic diagram of the overall structure of an electronic module provided in the second exemplary embodiment of this application;

[0045] Figure 10 This is a schematic diagram of the overall structure of an electronic device provided in the third exemplary embodiment of this application.

[0046] Explanation of reference numerals in the attached figures:

[0047] 100. Heat dissipation base plate; 10. Plate body; 11. Matrix; 12. Step; 20. Heat dissipation column; 21. Straight edge; 22. Curved edge; 23. Cross section;

[0048] 30. Heat dissipation area; 31. First heat dissipation area; 32. Second heat dissipation area; 33. Third heat dissipation area; 34. Gap;

[0049] 200. Electronic module; 210. Heating element;

[0050] 300. Electronic equipment; 310. Heat sink; 320. Heat dissipation chamber; 321. First wall; 322. Second wall; 323. Inlet; 324. Outlet. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0052] This application sets the cross-section 23 of the heat dissipation column 20 in terms of height to include two oppositely arranged straight edges 21 and two curved edges 22 respectively connecting the opposite ends of the two straight edges 21. Since the heat dissipation column 20 of this application has straight edges 21 and outwardly curved edges 22, it has a larger heat exchange area than a cylindrical heat dissipation column 20 or an elliptical heat dissipation column 20, thereby improving the heat exchange efficiency of the heat dissipation base plate 100 and thus supporting the processing capacity of the electronic module 200 to a certain extent.

[0053] This application provides a heat dissipation base plate 100, which can be applied to electronic modules 200 such as power modules, chip modules, and other modules requiring heat dissipation, and can also be used in electronic devices 300, vehicles, and other products requiring heat dissipation. The above are merely illustrative examples of application scenarios and are not limited to those scenarios. Figure 1 As shown, Figure 1 This is a schematic diagram of the overall structure of a heat dissipation base plate 100 provided in an exemplary embodiment of this application. The heat dissipation base plate 100 is a functional structural component used to quickly dissipate the heat generated by electronic devices 300 or mechanical parts to the external environment. Through high thermal conductivity materials (such as copper and aluminum) or composite structures, the heat from heat sources (such as chips and power devices) is quickly conducted to the surface of the base plate to avoid local overheating.

[0054] See also Figure 2 and Figure 3 The heat dissipation base plate 100 includes a plate body 10 and multiple heat dissipation columns 20. The multiple heat dissipation columns 20 are connected to the plate body 10. Under normal circumstances, the heat dissipation columns 20 and the heat source are located on two opposite surfaces of the plate body 10, that is, the heat source is located on the top surface of the plate body 10, and the heat dissipation columns 20 are located on the bottom surface of the plate body 10. The plate body 10 conducts the heat generated by the heat source from the top surface to the bottom surface. Some of the heat is directly exchanged through the bottom surface of the plate body 10, and more of the heat is conducted to the heat dissipation columns 20 for heat exchange.

[0055] Specifically, please refer to Figure 4 The heat dissipation column 20 has a cross section 23 in height, which includes two straight sides 21 and two curved sides 22 arranged opposite to each other. The two curved sides 22 are respectively connected to the opposite ends of the two straight sides 21, and both curved sides 22 are bent outward.

[0056] The height of the heat dissipation column 20 extends from the surface of the board body 10 relative to the board body 10.

[0057] The heat dissipation column 20 has a cross-section 23 along its height, comprising two straight edges 21 and two curved edges 22, that is, four edges. Two of these are straight edges, while the other two are curved edges. Furthermore, the two straight edges 21 are arranged opposite each other, or side-by-side; the two curved edges 22 connect the opposite ends of the two straight edges 21. In other words, the two straight edges 21 are arranged opposite each other, and the two curved edges 22 are also arranged opposite each other. The first ends of the two curved edges 22 connect to the opposite ends of one straight edge 21, and the second ends of the two curved edges 22 connect to the opposite ends of the other straight edge 21.

[0058] For ease of understanding, the two straight edges 21 are called the first straight edge 21 and the second straight edge 21, respectively. The two ends of the first straight edge 21 are called points A and B, and the two ends of the second straight edge 21 are called points C and D. Points A and C are at the same end, while points B and D are at the other end. Correspondingly, the two curved edges 22 are also called the first curved edge 22 and the second curved edge 22.

[0059] Based on the above description, the first curved edge 22 connects points A and C, and the second curved edge 22 connects points B and D. Furthermore, both the first and second curved edges 22 do not curve inwards towards the area enclosed by points A, B, D, and C, but rather curve outwards from the area enclosed by these points.

[0060] This application sets the cross-section 23 of the heat sink 20 in terms of height to include two oppositely arranged straight edges 21 and two curved edges 22 respectively connecting the opposite ends of the two straight edges 21. Since the heat sink 20 of this application has two straight edges 21 and two outwardly curved edges 22, the outer surface size of the heat sink 20 of this application is larger than that of a cylindrical heat sink 20 or an elliptical heat sink 20, and it has a larger heat exchange area, which improves the heat exchange efficiency of the heat sink base plate 100, thereby supporting the processing capacity of the electronic module 200 to a certain extent.

[0061] In some embodiments, the plate body 10 includes a base 11 and a step 12 disposed on the base 11, and a heat dissipation column 20 disposed on the step 12.

[0062] In other words, a step 12 is raised on the bottom surface of the substrate 11, and the heat dissipation column 20 is placed on the step 12. By setting the step 12, during liquid cooling heat exchange, the step 12 can correspond to the high heat flux density region of the microchannel flow channel, thereby enhancing local convective heat transfer.

[0063] The following is a detailed description of the cross section 23 of the heat dissipation column 20.

[0064] In some implementations, the curved edge 22 is set to a semi-circular shape in order to balance the flow guiding effect and the heat exchange area.

[0065] In some implementations, the radii of the two curved edges 22 are equal. That is, the length and shape of the two curved edges 22 are consistent.

[0066] In some embodiments, the length of the cross-section 23 of the heat sink 20 is equal to the radii of the two curved edges 22 plus the length of the straight edge 21, and the width of the cross-section 23 of the heat sink 20 is equal to the diameter of the curved edges 22. That is, the cross-section 23 of the heat sink 20 is composed of a square portion in the middle and semicircles at both ends. Compared with cylindrical or elliptical heat sinks 20, this structure has a larger heat exchange area, thereby making the heat dissipation effect of the heat sink base plate 100 better and the junction temperature of the electronic module 200 lower.

[0067] In some embodiments, to improve heat dissipation, the aspect ratio of the cross-section 23 of the heat dissipation column 20 needs to be appropriately adjusted. The length-to-width ratio of the cross-section 23 of the heat dissipation column 20 ranges from 3:1 to 1.5:1. This means that the cross-section 23 of the heat dissipation column 20 is designed as a streamlined structure, providing a larger heat exchange area compared to the same long and short sides. Furthermore, this streamlined heating structure design closely resembles the flow path of the coolant as it passes through the heat dissipation column 20, enabling more effective utilization of the convective heat transfer area of ​​the heat dissipation zone 30.

[0068] In some embodiments, preferably, the length-to-width ratio of the cross-section 23 of the heat dissipation column 20 is 2:1. When the length-to-width ratio of the cross-section 23 is 2:1, the heat exchange area is maximized, and this structural design is closest to the streamline of the coolant flowing through the heat dissipation column 20, which can more effectively utilize the convective heat transfer area of ​​the heat dissipation zone 30.

[0069] In some embodiments, specifically, when the heat dissipation base plate 100 is disposed in the heat-conducting fluid, one of the two curved edges 22, the two straight edges 21, and the other of the two curved edges 22 are arranged sequentially in the flow direction of the heat-conducting fluid. Through this arrangement, the heat dissipation column 20 can better exchange heat with the heat-conducting flow, thereby improving the heat dissipation effect.

[0070] The following is a detailed description of the arrangement of the heat dissipation pillars 20 on the board body 10.

[0071] First, let's look at the division of heat dissipation zone 30.

[0072] In some embodiments, depending on the arrangement of the devices, the plate body 10 is divided into at least two heat dissipation zones 30 in the direction of heat conduction fluid flow, and the heat dissipation pillars 20 are arranged in an array within the heat dissipation zones 30. Devices with high heat flux density can be located at the front end in the direction of heat conduction fluid flow, while devices with relatively low heat flux density can be located at the front end in the direction of heat conduction fluid flow.

[0073] Specifically, in this embodiment, three heat dissipation zones 30 are provided, including a first heat dissipation zone 31, a second heat dissipation zone 32, and a third heat dissipation zone 33. The first heat dissipation zone 31, the second heat dissipation zone 32, and the third heat dissipation zone 33 are arranged side by side, that is, the second heat dissipation zone 32 is located between the first heat dissipation zone 31 and the third heat dissipation zone 33, and the first heat dissipation zone 31, the second heat dissipation zone 32, and the third heat dissipation zone 33 are arranged along the flow direction of the heat-conducting fluid. Next, the relationship of the spacing of the heat dissipation columns 20 on each heat dissipation zone 30 will be described.

[0074] Furthermore, in the direction of heat transfer fluid flow, the spacing between the heat dissipation columns 20 on at least two heat dissipation zones 30 is reduced. By setting the spacing of the heat dissipation columns 20 on the heat dissipation zone 30 upstream of the heat transfer fluid to be greater than the spacing of the heat dissipation columns 20 on the heat dissipation zone 30 downstream of the heat transfer fluid, the overall flow resistance of the coolant can be further reduced, the flow rate of the coolant can be increased, and the heat exchange between the heat dissipation base plate 100 and the heating element 210 can be accelerated. This can significantly reduce the temperature difference of the heating element 210 corresponding to each heat dissipation zone 30, thereby improving the operating temperature range of the heating element 210.

[0075] Specifically, in this embodiment, the spacing of the heat dissipation columns 20 on the third heat dissipation zone 33 is smaller than the spacing of the heat dissipation columns 20 on the second heat dissipation zone 32, and the spacing of the heat dissipation columns 20 on the second heat dissipation zone 32 is smaller than the spacing of the heat dissipation columns 20 on the first heat dissipation zone 31. By setting the spacing of the heat dissipation columns 20 on the first heat dissipation zone 31 upstream of the heat-conducting fluid to be greater than the spacing of the heat dissipation columns 20 on the second heat dissipation zone 32 midstream of the heat-conducting fluid, and setting the spacing of the heat dissipation columns 20 on the second heat dissipation zone 32 midstream of the heat-conducting fluid to be greater than the spacing of the heat dissipation columns 20 on the third heat dissipation zone 33 downstream of the heat-conducting fluid, the overall flow resistance of the coolant can be further reduced, the flow rate of the coolant can be increased, and the heat exchange between the heat dissipation base plate 100 and the heating element 210 can be accelerated. This can significantly reduce the temperature difference of the heating element 210 corresponding to each heat dissipation zone 30, thereby improving the operating temperature range of the heating element 210.

[0076] Finally, the relationship and specific range of the spacing of the heat dissipation pillars 20 in two directions on each heat dissipation zone 30 are introduced.

[0077] In some embodiments, the spacing between the heat dissipation pillars 20 on each heat dissipation zone 30 can be the same to reduce the cost of generating and manufacturing the heat dissipation base plate 100. Of course, in other embodiments, the spacing between the heat dissipation pillars 20 on each heat dissipation zone 30 can be set as needed, for example, it can be set to be different.

[0078] In some embodiments, the spacing of the heat dissipation columns 20 on each heat dissipation zone 30 in the direction of heat conduction fluid flow is smaller than the spacing of the heat dissipation columns 20 in the direction perpendicular to the flow direction of heat conduction fluid. That is, the spacing dimensions of the heat dissipation columns 20 in the lateral direction and the longitudinal direction are different. By setting the spacing of the heat dissipation columns 20 on each heat dissipation zone 30 in the direction of heat conduction fluid flow to be smaller than the spacing of the heat dissipation columns 20 in the direction perpendicular to the flow direction of heat conduction fluid, the heat exchange area of ​​the entire heat dissipation base plate 100 can be increased to a greater extent, thereby improving the heat exchange efficiency.

[0079] Specifically, when the heat dissipation zone 30 has the aforementioned three heat dissipation zones 30, the spacing of the heat dissipation columns 20 in the direction of heat conduction fluid flow and the spacing of the heat dissipation columns 20 in the direction perpendicular to the direction of heat conduction fluid flow are specifically set as follows:

[0080] The spacing of the heat dissipation columns 20 on the first heat dissipation zone 31 is 0.8mm-1.2mm in the direction of heat conduction fluid flow and 1.3mm-1.6mm in the direction perpendicular to the direction of heat conduction fluid flow.

[0081] The spacing of the heat dissipation columns 20 on the second heat dissipation zone 32 is 0.6mm-0.8mm in the direction of heat conduction fluid flow and 1.1mm-1.3mm in the direction perpendicular to the direction of heat conduction fluid flow.

[0082] The spacing of the heat dissipation columns 20 on the third heat dissipation zone 33 is 0.4mm-0.6mm in the direction of heat conduction fluid flow and 0.8mm-1.3mm in the direction perpendicular to the direction of heat conduction fluid flow.

[0083] By setting the spacing of the heat dissipation columns 20 on the three heat dissipation zones 30 in the direction of heat conduction fluid flow and in the direction perpendicular to the direction of heat conduction fluid flow, the flow resistance, flow velocity and heat exchange area can be best balanced. Each corresponding zone has a different coolant flow velocity and heat dissipation contact area, thereby ensuring that the heat dissipation efficiency between each phase is similar, balancing the working temperature between each phase of the heat-generating element 210, and achieving high heat dissipation efficiency.

[0084] In some embodiments, a gap 34 can be provided between two adjacent heat dissipation areas 30. By providing a gap 34 between two adjacent heat dissipation areas 30, the flow resistance can be effectively reduced, so that the heat dissipation base plate 100 has a better heat dissipation effect.

[0085] like Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the temperature field distribution and heat dissipation effect of the heat dissipation base plate 100 of the elliptical heat dissipation column 20 in the prior art and the heat dissipation base plate 100 of the heat dissipation column 20 of this application are displayed in the working state.

[0086] like Figure 5 and Figure 6 As shown, Figure 5 This is a junction temperature simulation of the heat dissipation base plate 100 of the existing uniformly distributed three-segment elliptical heat dissipation column 20. Figure 6 This application is adopted. Figure 4 The junction temperature simulation of the three-section heat dissipation base plate 100 with uniformly distributed heat dissipation columns 20 is performed. Figure 5 and Figure 6 Divided into three heat dissipation zones, 30. Figure 5 The heat dissipation column 20 on the top is an elliptical heat dissipation column 20. Figure 6 The middle part is a heat sink 20. Figure 5 and Figure 6 In the heat dissipation zone 30, the heat dissipation pillars 20 are evenly distributed. Figure 5 and Figure 6 The heat dissipation areas 30, from left to right, are sequentially named the first heat dissipation area 31, the second heat dissipation area 32, and the third heat dissipation area 33. Figure 5 The highest temperature in the first heat dissipation zone 31 is 138.3 degrees Celsius, while Figure 6 The highest temperature of the first heat dissipation zone 31 is 135.92 degrees Celsius; Figure 5 The highest temperature in the second heat dissipation zone 32 was 145.03 degrees Celsius, while Figure 6 The highest temperature in the second heat dissipation zone 32 is 142.49 degrees Celsius; Figure 5 The highest temperature in the third heat dissipation zone 33 was 150.53 degrees Celsius, while Figure 6 The highest temperature of the third heat dissipation zone 33 is 147.89 degrees Celsius. As can be seen from the above temperature data, after adopting the heat dissipation column 20 of this application, the junction temperature of the heat-generating element 210 is further reduced, and the output current of the module is significantly improved.

[0087] like Figure 7 and Figure 8 As shown, Figure 7 It is a junction temperature simulation of the heat dissipation base plate 100 of the existing sparse and densely distributed three-segment elliptical heat dissipation column 20. Figure 8 This application is adopted. Figure 4 Junction temperature simulation of a three-segment heat dissipation base plate 100 with sparse and dense distribution of heat dissipation columns 20; Figure 7 The heat dissipation column 20 on the top is an elliptical heat dissipation column 20. Figure 8 The middle part is a heat sink 20. Figure 7 and Figure 8In the heat dissipation zone 30, the heat dissipation columns 20 are distributed with varying density. Figure 7 and Figure 8 The heat dissipation zones 30 from left to right are called the first heat dissipation zone 31, the second heat dissipation zone 32, and the third heat dissipation zone 33, respectively. The density distribution means that the spacing of the heat dissipation columns 20 in the third heat dissipation zone 33 is smaller than that in the second heat dissipation zone 32, and the spacing of the heat dissipation columns 20 in the second heat dissipation zone 32 is smaller than that in the first heat dissipation zone 31. However, the spacing of the heat dissipation columns 20 is the same in each heat dissipation zone 30.

[0088] in, Figure 7 The highest temperature in the first heat dissipation zone 31 was 142.27 degrees Celsius, while Figure 8 The highest temperature of the first heat dissipation zone 31 is 140 degrees Celsius. Figure 7 The highest temperature in the second heat dissipation zone 32 was 142.76 degrees Celsius, while Figure 8 The highest temperature in the second heat dissipation zone 32 is 141.65 degrees Celsius. Figure 7 The highest temperature in the third heat dissipation zone 33 was 146.49 degrees Celsius, while Figure 8 The highest temperature of the third heat dissipation zone 33 is 144.77 degrees Celsius. The simulation results clearly show that, under the same conditions, compared to the prior art's elliptical heat dissipation column 20, the sparsely arranged segmented heat dissipation columns 20 of this application significantly reduce the temperature difference between phases of the heat dissipation base plate 100 compared to the prior art's elliptical heat dissipation column 20, resulting in a significantly enhanced temperature uniformity effect.

[0089] In other words, the heat dissipation base plate 100 scheme of the heat dissipation pillars 20 in this application includes a scheme with uniformly distributed heat dissipation pillars 20 and a scheme with sparsely distributed heat dissipation pillars 20. The simulation calculation results are compared with those of the existing uniformly distributed three-segment elliptical cylindrical heat dissipation base plate 100 and the three-segment sparsely distributed elliptical cylindrical heat dissipation base plate 100. The results show that the heat dissipation base plate 100 of the heat dissipation pillars 20 in this application has better heat dissipation performance than the existing elliptical cylindrical heat dissipation base plate 100, whether it is uniformly distributed three-segment or three-segment sparsely distributed. Moreover, the heat dissipation base plate 100 with heat dissipation pillars 20 with different density distribution has stronger heat dissipation efficiency, further reducing the chip operating junction temperature. More importantly, the temperature difference between the chip junctions of each phase is significantly reduced compared with the existing heat dissipation base plate 100. This characteristic further verifies that the heat dissipation base plate 100 of the heat dissipation pillars 20 in this application has stronger heat dissipation efficiency and can significantly improve the operating range of the power module.

[0090] This application sets the cross-section 23 of the heat sink 20 in terms of height to include two oppositely arranged straight edges 21 and two curved edges 22 respectively connecting the opposite ends of the two straight edges 21. Since the heat sink 20 of this application has two straight edges 21 and two outwardly curved edges 22, the outer surface size of the heat sink 20 of this application is larger than that of a cylindrical heat sink 20 or an elliptical heat sink 20, and it has a larger heat exchange area, which improves the heat exchange efficiency of the heat sink base plate 100, thereby supporting the processing capacity of the electronic module 200 to a certain extent.

[0091] This application also provides an electronic module 200, such as Figure 9 As shown, the electronic module 200 includes a heating element 210 and a heat dissipation base plate 100 as described above. The heating element 210 is connected to the heat dissipation base plate 100. The electronic module 200 has all the beneficial effects of the aforementioned drive bridge, which will not be repeated here.

[0092] This application also provides an electronic device 300, such as Figure 10 As shown, the electronic device 300 includes a heat sink 310 and an electronic module 200 as described above. The heat sink 310 and the heat sink base plate 100 are connected to form a heat sink chamber 320. The heat sink column 20 is located inside the heat sink chamber 320. The electronic device 300 has all the beneficial effects of the aforementioned drive bridge, which will not be repeated here.

[0093] In some embodiments, the radiator 310 has an inlet 323 and an outlet 324. The radiator 310 includes a first wall 321 and a second wall 322 disposed opposite to each other. The inlet 323 is located on the first wall 321 and the outlet 324 is located on the second wall 322. The heat-conducting fluid flows into the heat dissipation cavity from the inlet 323 and flows out from the outlet 324.

[0094] For example, the radiator 310 has a groove, and the heat dissipation base plate 100 is connected to the radiator 310 to form a heat dissipation chamber 320. The heat dissipation column 20 is located inside the heat dissipation chamber 320. The radiator 310 has an inlet 323 and an outlet 324 for the heat-conducting fluid. The inlet 323 and the outlet 324 are respectively located on the first wall 321 and the second wall 322 of the radiator 310. The heat-conducting fluid flows into the heat dissipation chamber 320 through the inlet 323 and flows out through the outlet 324. The heating element 210 is connected to the heat dissipation base plate 100, and when the heating element 210 generates heat, it can be directly transferred to the heat dissipation base plate 100. The heat dissipation column 20 on the heat dissipation base plate 100 is located in the heat dissipation cavity 320. During the process of the heat conduction fluid flowing from the inlet 323 to the outlet 324 in the heat dissipation cavity 320, it can absorb the heat emitted by the heating element 210 through the large-area contact with the heat dissipation column 20, thereby reducing the temperature of the heating element 210 and keeping the heating element 210 at a normal and safe operating temperature.

[0095] This application also provides a vehicle that includes the aforementioned heat dissipation base plate 100, the aforementioned electronic module 200, or the aforementioned electronic device 300. This vehicle possesses all the beneficial effects of the aforementioned heat dissipation base plate 100, the aforementioned electronic module 200, or the aforementioned electronic device 300, which will not be elaborated further here.

[0096] The vehicle may be a forklift, a car, a bus, or a gasoline-powered vehicle, a plug-in hybrid electric vehicle, or a new energy vehicle, etc. This disclosure does not make any specific restrictions.

[0097] This application sets the cross-section 23 of the heat sink 20 in terms of height to include two oppositely arranged straight edges 21 and two curved edges 22 respectively connecting the opposite ends of the two straight edges 21. Since the heat sink 20 of this application has two straight edges 21 and two outwardly curved edges 22, the outer surface size of the heat sink 20 of this application is larger than that of a cylindrical heat sink 20 or an elliptical heat sink 20, and it has a larger heat exchange area, which improves the heat exchange efficiency of the heat sink base plate 100, thereby supporting the processing capacity of the electronic module 200 to a certain extent.

[0098] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0099] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0100] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0101] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A heat spreader base plate (100) characterized by, The heat dissipation base plate (100) includes: Board body(10); Multiple heat dissipation columns (20) are connected to the plate body (10). The cross section (23) of the heat dissipation column (20) in height includes two straight sides (21) and two curved sides (22) arranged opposite to each other. The first ends of the two curved edges (22) are connected to the opposite ends of one straight edge (21), and the second ends of the two curved edges (22) are connected to the opposite ends of another straight edge (21), and both curved edges (22) are bent outward.

2. The heat spreader base plate (100) of claim 1, characterized in that The curved edge (22) is semi-circular.

3. The heat dissipation base plate (100) according to claim 2, characterized in that, The radii of the two curved edges (22) are equal.

4. The heat dissipation base plate (100) according to claim 3, characterized in that, The length of the cross section (23) of the heat dissipation column (20) is equal to the radius length of the two curved edges (22) plus the length of the straight edge (21), and the width of the cross section (23) of the heat dissipation column (20) is equal to the diameter of the curved edge (22).

5. The heat dissipation base plate (100) according to claim 4, characterized in that, The length-to-width ratio of the cross section (23) of the heat dissipation column (20) ranges from 3:1 to 1.5:

1.

6. The heat dissipation base plate (100) according to claim 5, characterized in that, The length to width ratio of the cross section (23) of the heat dissipation column (20) is 2:

1.

7. The heat dissipation base plate (100) according to any one of claims 1-6, characterized in that, One of the two curved edges (22), the two straight edges (21), and the other of the two curved edges (22) are arranged sequentially in the direction of the flow of the heat-conducting fluid.

8. The heat dissipation base plate (100) according to any one of claims 1-6, characterized in that, The plate body (10) is divided into at least two heat dissipation zones (30) in the direction of heat conduction fluid flow, and the heat dissipation columns (20) are arranged in an array within the heat dissipation zones (30).

9. The heat dissipation base plate (100) according to claim 8, characterized in that, In the direction of the flow of the heat-conducting fluid, the spacing between the heat dissipation columns (20) on at least two of the heat dissipation zones (30) becomes smaller.

10. The heat dissipation base plate (100) according to claim 9, characterized in that, The spacing of the heat dissipation columns (20) on each of the heat dissipation zones (30) is the same.

11. The heat dissipation base plate (100) according to claim 8, characterized in that, There are three heat dissipation zones (30), including a first heat dissipation zone (31), a third heat dissipation zone (33), and a second heat dissipation zone (32) located between the first heat dissipation zone (31) and the third heat dissipation zone (33).

12. The heat dissipation base plate (100) according to claim 11, characterized in that, The spacing of the heat dissipation columns (20) on the third heat dissipation area (33) is smaller than the spacing of the heat dissipation columns (20) on the second heat dissipation area (32), and the spacing of the heat dissipation columns (20) on the second heat dissipation area (32) is smaller than the spacing of the heat dissipation columns (20) on the first heat dissipation area (31).

13. The heat dissipation base plate (100) according to claim 8, characterized in that, The spacing of the heat dissipation columns (20) on each heat dissipation zone (30) in the direction of the flow of the heat-conducting fluid is smaller than the spacing of the heat dissipation columns (20) in the direction perpendicular to the flow of the heat-conducting fluid.

14. The heat dissipation base plate (100) according to claim 13, characterized in that, The heat dissipation zone (30) includes a first heat dissipation zone (31), a second heat dissipation zone (32) and a third heat dissipation zone (33) arranged along the flow direction of the heat-conducting fluid; The spacing of the heat dissipation columns (20) on the first heat dissipation area (31) is 0.8mm-1.2mm in the direction of the heat-conducting fluid and 1.3mm-1.6mm in the direction perpendicular to the direction of the heat-conducting fluid. The spacing of the heat dissipation columns (20) on the second heat dissipation area (32) is 0.6mm-0.8mm in the direction of the heat-conducting fluid and 1.1mm-1.3mm in the direction perpendicular to the direction of the heat-conducting fluid. The spacing of the heat dissipation columns (20) on the third heat dissipation zone (33) is 0.4mm-0.6mm in the direction of the heat-conducting fluid and 0.8mm-1.3mm in the direction perpendicular to the direction of the heat-conducting fluid.

15. The heat dissipation base plate (100) according to claim 8, characterized in that, A gap (34) is provided between two adjacent heat dissipation zones (30).

16. The heat dissipation base plate (100) according to any one of claims 1-6, characterized in that, The plate body (10) includes a base (11) and a step (12) disposed on the base (11), and the heat dissipation column (20) is disposed on the step (12).

17. An electronic module (200), characterized in that, It includes a heating element (210) and a heat dissipation base plate (100) as described in any one of claims 1-16, wherein the heating element (210) is connected to the heat dissipation base plate (100).

18. An electronic device (300), characterized in that, Includes a heat sink (310) and an electronic module (200) as described in claim 17, wherein the heat sink (310) and the heat sink base plate (100) are connected to form a heat sink chamber (320), and the heat sink column (20) is located inside the heat sink chamber (320).

19. The electronic device (300) according to claim 18, characterized in that, The radiator (310) has an inlet (323) and an outlet (324). The radiator (310) includes a first wall (321) and a second wall (322) disposed opposite to each other. The inlet (323) is located on the first wall (321), and the outlet (324) is located on the second wall (322). The heat-conducting fluid flows into the heat dissipation cavity from the inlet (323) and flows out from the outlet (324).

20. A vehicle, characterized in that, It includes a heat dissipation base plate (100) as described in any one of claims 1-16, or an electronic module (200) as described in claim 17, or an electronic device (300) as described in any one of claims 18-19.

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