Heat sink for a laser and laser

Abstract

The utility model discloses an embodiment of a kind of heat dissipation device and laser for laser, the heat dissipation device includes pumping source pedestal and liquid cooling plate, pumping source pedestal is used to place laser chip, liquid cooling groove is opened in liquid cooling plate, pumping source pedestal includes pedestal body, and the several radiating fins of setting on pedestal body, pumping source pedestal is attached to liquid cooling plate, and make several radiating fins be inserted in liquid cooling groove, pumping source pedestal and the groove wall of liquid cooling groove are enclosed to form liquid cooling passage, cooling liquid is circulated in liquid cooling passage, therefore, the heat generated by laser chip can be promptly transferred to radiating fin, and then again through radiating fin transfer to cooling liquid in liquid cooling passage, so that the heat of radiating fin can be promptly taken away by cooling liquid, cooling mode using liquid cooling, high heat dissipation efficiency, so that heat dissipation device can satisfy higher power laser chip heat dissipation demand.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a heat dissipation device for a laser and a laser. Background Technology

[0002] As market competition intensifies, the laser technology field is experiencing rapid development, with manufacturers focusing on developing high-power lasers to seize market opportunities. Currently, most mainstream laser products on the market adopt a single-chip design, with their output power mainly concentrated between 35W and 45W. As the output power of lasers continues to increase, the heat dissipation capacity of the cooling system will become insufficient, easily leading to overheating and burnout of the laser chip. Utility Model Content

[0003] The purpose of this invention is to propose a heat dissipation device and a laser for lasers, aiming to solve the problem that the heat dissipation capacity of the heat dissipation system in existing high-power lasers is insufficient, which easily leads to the laser chip overheating and burning.

[0004] In a first aspect, this utility model provides a heat dissipation device for a laser, the heat dissipation device including a pump source base and a liquid cooling plate, the pump source base being used to place a laser chip, the liquid cooling plate having a liquid cooling groove, the pump source base including a base body and a plurality of heat sinks disposed on the base body, the pump source base being attached to the liquid cooling plate and the plurality of heat sinks being inserted into the liquid cooling groove, the pump source base and the groove wall of the liquid cooling groove forming a liquid cooling channel, the liquid cooling channel circulating coolant.

[0005] In one embodiment, the plurality of heat sinks include a plurality of heat dissipation modules, each heat dissipation module including at least two heat sinks, and a plurality of liquid cooling tanks are provided, each corresponding to one of the heat dissipation modules.

[0006] In one embodiment, each heat dissipation module includes two heat sinks, each heat sink extends along a first direction, each heat dissipation module is spaced apart along a second direction, each liquid cooling tank extends along the first direction and is spaced apart along the second direction, and the first direction and the second direction are set at an angle.

[0007] In one embodiment, two adjacent heat sinks within each heat dissipation module are arranged in parallel, and the distance between two adjacent heat sinks is greater than 1 mm. The width of the heat sink extending along the second direction is L, where 0.8 mm < L < 2 mm; and / or,

[0008] The height dimension of the heat sink along the third direction is H1. The base body has a base bottom embedded in the liquid cooling plate. The height dimension of the base bottom along the third direction is H2. The height dimension of the liquid cooling channel along the third direction is H3. H1+H2=H3-G, 0.8mm≤G≤1.2mm.

[0009] In one embodiment, the heat dissipation device further includes a sealing structure that elastically abuts between the pump source base and the liquid cooling plate and is used to seal the liquid cooling channel.

[0010] In one embodiment, the liquid cooling plate is further provided with a mounting groove, at least a portion of the base body is accommodated within the mounting groove, each of the liquid cooling grooves is formed on the bottom wall of the mounting groove, the side wall of the mounting groove forms a first stepped structure, the sealing structure is attached to the edge of the base body and forms a second stepped structure adapted to the first stepped structure with the base body, the sealing structure seals between the first stepped structure and the base body; and / or,

[0011] The pump source base also includes heat dissipation protrusions disposed on the base body. There are two heat dissipation protrusions, which are respectively located on both sides of the base body. The heat dissipation device also includes several mounting components, which pass through the heat dissipation protrusions and are detachably connected to the liquid cooling plate to fix the pump source base to the liquid cooling plate.

[0012] In one embodiment, the number of heat sinks is greater than or equal to the number of laser chips; and / or,

[0013] The number of heat sinks shall not be less than 24.

[0014] In one embodiment, the pump source base further includes a cover plate, and the base body is provided with a receiving groove for placing a plurality of laser chips, the cover plate covering the opening of the receiving groove; and / or,

[0015] The pump source base is a structural component made of copper or aluminum alloy.

[0016] In one embodiment, the liquid-cooled plate includes a plate body, and an inlet connector and an outlet connector mounted on the plate body. The plate body has a circulation channel communicating with the liquid-cooled tank, and both the inlet connector and the outlet connector are connected to the circulation channel; and / or,

[0017] Multiple pump source bases are provided, and each pump source base is spaced apart along a first direction on the liquid cooling plate.

[0018] Secondly, this utility model also provides a laser, the laser comprising:

[0019] Several laser chips; and

[0020] Heat dissipation device for laser in any of the above embodiments;

[0021] Several of the laser chips are disposed on the pump source base.

[0022] The present invention has the following beneficial effects:

[0023] The present invention relates to a heat dissipation device and a laser for lasers. A pump source base is used to place the laser chip. The pump source base is attached to a liquid cooling plate, and several heat sinks are inserted into the liquid cooling tank. The pump source base and the tank wall of the liquid cooling tank form a liquid cooling channel. Therefore, the heat generated by the laser chip can be transferred to the heat sink in a timely manner, and then transferred to the coolant in the liquid cooling channel through the heat sink. Thus, the heat of the heat sink can be carried away by the coolant in a timely manner. By adopting the liquid cooling method and by setting the heat sink, the heat exchange area can be increased and the heat transfer path can be shortened, thereby improving the heat dissipation efficiency, so that the heat dissipation device can meet the heat dissipation requirements of higher power laser chips.

[0024] Furthermore, since the heat dissipation device adopts the aforementioned liquid cooling method, the heat dissipation efficiency is higher. Therefore, for the same output power, the cost of one pump source can be directly reduced. The copper metal in the heat dissipation device can also be replaced with aluminum alloy to maintain a good heat dissipation and cooling effect, thereby meeting the application of high-power laser chips and greatly saving the cost of heat dissipation devices. At the same time, multiple pump sources can be set according to the power requirements of the laser, providing more design flexibility, improving space utilization efficiency, and facilitating the overall layout of the laser. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] in:

[0027] Figure 1 This is a schematic diagram of a heat dissipation device in one embodiment.

[0028] Figure 2 for Figure 1 Sectional view of AA.

[0029] Figure 3 for Figure 2 Enlarged schematic diagram of section B in the middle.

[0030] Figure 4 for Figure 1 Exploded view of the heat dissipation device shown.

[0031] Figure 5 for Figure 4 Enlarged schematic diagram of section C.

[0032] Figure 6 for Figure 1 A schematic diagram of a pump source base in the heat dissipation device shown.

[0033] Figure 7 for Figure 6 Enlarged schematic diagram of section D in the middle.

[0034] Figure 8 for Figure 1 A schematic diagram of another pump source base in the heat dissipation device shown.

[0035] Figure 9 for Figure 1 A schematic diagram of the liquid cooling plate in the heat dissipation device shown.

[0036] Reference numerals: 10, Laser chip; 100, Pump source base; 110, Base body; 111, Second-stage structure; 112, Receiving groove; 120, Heat dissipation module; 121, Heat sink; 130, Heat dissipation protrusion; 140, Cover plate; 200, Liquid cooling plate; 210, Liquid cooling tank; 220, Mounting groove; 221, First-stage structure; 230, Plate body; 231, Circulation channel; 240, Liquid inlet connector; 250, Liquid outlet connector; 300, Liquid cooling channel; 400, Sealing structure. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0039] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include at least one of the stated features. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0040] Please see Figures 1 to 9 This utility model discloses a laser, which includes a heat dissipation device and a plurality of laser chips 10. The heat dissipation device includes a pump source base 100 and a liquid cooling plate 200. The pump source base 100 is used to place the plurality of laser chips 10. The liquid cooling plate 200 has a liquid cooling groove 210. The pump source base 100 includes a base body 110 and a plurality of heat sinks 121 disposed on the base body 110. The pump source base 100 is attached to the liquid cooling plate 200, and the plurality of heat sinks 121 are inserted into the liquid cooling groove 210. The pump source base 100 and the groove wall of the liquid cooling groove 210 form a liquid cooling channel 300, and coolant circulates in the liquid cooling channel 300. Specifically, the coolant can be water, ethylene glycol-based coolant, etc.

[0041] Understandably, with this configuration, the heat generated by the laser chip 10 can be transferred to the heat sink 121 in a timely manner, and then transferred to the coolant in the liquid cooling channel 300 through the heat sink 121. This allows the heat from the heat sink 121 to be carried away by the coolant in a timely manner. By adopting liquid cooling and by using the heat sink 121, the heat exchange area can be increased and the heat transfer path can be shortened, thereby improving the heat dissipation efficiency and enabling the heat dissipation device to meet the heat dissipation requirements of the higher power laser chip 10.

[0042] Using the laser of this embodiment, provided that the heat dissipation device can meet the heat dissipation requirements of the laser and the laser temperature is controllable during operation, the power of the laser chip 10 can reach 65W or even higher, thereby increasing market competitiveness by using a high-power laser that can operate stably during operation. In other words, using the laser of this invention can meet the requirement of a lower junction temperature, eliminating the need to further reduce the junction temperature standard.

[0043] Specifically, the pump source base 100 is a structural component made of copper or aluminum alloy. When copper is used, its thermal conductivity is better than that of aluminum alloy, resulting in a higher heat dissipation capacity of the heat dissipation device. This allows for the adaptation to higher power laser chips 10, where the laser internal current can be increased to 70A and the power of the laser chip 10 can reach 65W or even higher.

[0044] Furthermore, since the heat dissipation device in this embodiment adopts liquid cooling, the heat dissipation efficiency is higher. Therefore, replacing the copper metal of the heat dissipation device with aluminum alloy can also maintain a good heat dissipation and cooling effect, thereby meeting the application of high-power laser chip 10 and greatly saving the cost of heat dissipation device.

[0045] At this point, although the thermal conductivity of aluminum alloy is somewhat inferior to that of copper alloy, the current inside the laser can be turned up to 57A. However, compared with copper metal, the material cost of a single pump source base 100 can be reduced by 75%. As a result, when the power of the laser chip 10 is 35W and 45W, the cost of the aluminum alloy solution in this embodiment will be much lower than the cost of the copper metal solution in the prior art.

[0046] Specifically, current technology, limited by the heat dissipation system, can only employ a 45W chip pump source configuration. This means using 45W laser chips as the basic light-emitting unit of the pump source, with a single pump source capable of equipping 14 45W chips. The coupling efficiency of this pump source can reach 85%-95%, and the output power of a single pump source can reach approximately 550W. Therefore, to achieve the target output power of 3000W laser, based on calculations of the output power of a single pump source, six pump sources are required. These six pump sources are integrated into the laser in a specific layout, and connected to the corresponding power supply and control system to construct a complete 3000W laser system.

[0047] The heat dissipation system of this embodiment, through the structural arrangement of the pump source base 100 and the liquid cooling plate 200, can improve the heat dissipation capacity of the pump source. This allows for the adoption of a 65W chip pump source configuration, using 65W laser chips as the basic light-emitting unit of the pump source. A single pump source can be configured with 14 65W chips, achieving a coupling efficiency of 85%-95% and an output power of approximately 800W per pump source. Therefore, to achieve the target output power of 3000W laser, based on calculations of the output power of a single pump source and the beam combining efficiency, four pump sources are required. These four pump sources are integrated into the laser in a specific layout, and connected to the corresponding power supply and control system to construct a complete 3000W laser system.

[0048] Therefore, by comparing the two pump source configurations, it can be seen that the scheme using 65W chip pump sources reduces the number of pump sources from 6 to 4 compared to the scheme using 45W chip pump sources. This reduction in the number of pump sources directly leads to lower costs. In terms of raw material procurement, the quantity of materials such as chips, optical components, and circuit boards is reduced accordingly, lowering procurement costs. In the manufacturing process, fewer assembly steps reduce labor costs, and the production cycle may also be shortened. Furthermore, in terms of subsequent maintenance, fewer pump sources mean fewer potential points of failure, reduced maintenance workload, and effectively controlled maintenance costs.

[0049] In one embodiment, please refer to Figures 1 to 9 The system includes multiple heat sinks 121 comprising multiple heat dissipation modules 120, each heat dissipation module 120 including at least two heat sinks 121. Multiple liquid cooling tanks 210 are provided, each corresponding to one heat dissipation module 120. This arrangement allows each heat dissipation module 120 to correspond to two laser chips 10, meeting the heat dissipation requirements of the laser chips 10. Alternatively, each heat dissipation module 120 can correspond to one heat dissipation chip, further improving the heat dissipation effect on the laser chips 10.

[0050] Furthermore, in this embodiment, each heat dissipation module 120 includes two heat sinks 121, and each heat sink 121 extends along a first direction. The heat dissipation modules 120 are spaced apart along a second direction. Each liquid cooling tank 210 extends along the first direction and is spaced apart along the second direction, with the first and second directions forming an angle. This arrangement ensures that each heat sink 121 corresponds to one laser chip 10, thereby guaranteeing that the heat dissipation device meets the heat dissipation requirements of the laser. Of course, each heat dissipation module 120 may also include three, four, or more heat sinks 121, and the specific number of heat sinks 121 in each heat dissipation module 120 can be adjusted according to the heat dissipation requirements of the laser.

[0051] Figures 1 to 4 In the diagram, arrow X points to the second direction, arrow Y points to the first direction, and arrow Z points to the third direction.

[0052] Specifically, two adjacent heat sinks 121 are arranged in parallel within each heat dissipation module 120, and the distance between two adjacent heat sinks 121 is greater than 1mm, thereby ensuring the heat dissipation effect of the coolant flow on the heat sinks 121.

[0053] Furthermore, the width of the heat sink 121 extending along the second direction is L, where 0.8mm < L < 2mm. More specifically, L can be selected as 0.9mm, 1.1mm, 1.3mm, 1.5mm, 1.7mm, or 1.9mm. This ensures that the heat sink 121 can promptly transfer the heat generated by the laser chip 10. The extension length of the heat sink 121 along the first direction can be the same as that of the base body 110.

[0054] Furthermore, the height dimension of the heat sink 121 along the third direction is H1, and a base bottom embedded in the liquid cooling plate 200 is formed on the base body 110. The height dimension of the base bottom along the third direction is H2, and the height dimension of the liquid cooling channel 300 along the third direction is H3. H1 + H2 = H3 - G, 0.8mm ≤ G ≤ 1.2mm. With this arrangement, the gap between the heat sink 121 and the bottom wall of the liquid cooling tank 210 can be set to compensate for process errors and to allow for the circulation of coolant, thereby increasing the heat dissipation and cooling effect of the coolant on the heat sink 121.

[0055] Of course, in other embodiments, a plurality of heat sinks 121 may extend along the first direction and be evenly distributed along the second direction, thereby improving the heat dissipation effect on the laser chip 10.

[0056] In one embodiment, please refer to Figure 3 The number of heat sinks 121 is greater than or equal to the number of laser chips 10, thereby ensuring the heat dissipation effect of laser chips 10. Specifically, the number of heat sinks 121 is not less than 24.

[0057] It is understandable that the position of the heat sink 121 needs to correspond to the position of the laser chip 10, so as to accelerate the heat dissipation effect of the laser chip 10. Of course, as the number of heat sinks 121 increases, the heat dissipation effect of the heat dissipation device on several laser chips 10 also increases, so that the laser can meet the heat dissipation requirements of the laser chip 10 at a power of 65W, and the laser temperature can operate stably within a controllable range.

[0058] In one embodiment, please refer to Figure 4 The heat dissipation device also includes a sealing structure 400, which is elastically abutted between the pump source base 100 and the liquid cooling plate 200 and is used to seal the liquid cooling channel 300, thereby preventing coolant leakage and preventing electrochemical corrosion.

[0059] In one embodiment, please refer to Figure 4The sealing structure 400 is arranged around the pump source base 100 and elastically abuts against the pump source base 100 and the liquid cooling plate 200 to seal the gap between the liquid cooling tank 210 and the pump source base 100, thereby preventing coolant leakage and preventing electrochemical corrosion. The sealing structure 400 can be any one or more of a stepped structure, a circular structure, or a square structure.

[0060] Specifically, four sealing structures 400 are provided, which surround the four sides of the pump source base 100 and elastically abut against the pump source base 100 and the liquid cooling plate 200 to seal all gaps between the liquid cooling tank 210 and the pump source base 100, thereby preventing coolant leakage and preventing electrochemical corrosion.

[0061] In one embodiment, please refer to Figures 4 to 9 The liquid cooling plate 200 is also provided with an installation groove 220, at least part of the base body 110 is housed in the installation groove 220, each liquid cooling groove 210 is opened on the bottom wall of the installation groove 220, the side wall of the installation groove 220 forms a first stepped structure 221, the sealing structure 400 is attached to the edge of the base body 110, and forms a second stepped structure 111 with the base body 110 that is compatible with the first stepped structure 221. The sealing structure 400 seals between the first stepped structure 221 and the base body 110. With this arrangement, the second stepped structure 111 of the sealing structure 400 forms multiple sealing barriers through multiple contact surfaces, effectively preventing media penetration and achieving a more reliable sealing effect, thereby improving the sealing effect of the liquid cooling channel 300.

[0062] In this embodiment, a portion of the base body 110 housed within the mounting groove 220 forms the base bottom, and the second stepped structure 111 is attached to the base bottom.

[0063] In one embodiment, please refer to Figures 4 to 8 The pump source base 100 also includes heat dissipation protrusions 130 disposed on the base body 110. Two heat dissipation protrusions 130 are provided, located on opposite sides of the base body 110. The heat dissipation device also includes several mounting components that penetrate the heat dissipation protrusions 130 and are detachably connected to the liquid cooling plate 200 to fix the pump source base 100 to the liquid cooling plate 200. Specifically, the mounting components can be screws. Both the heat dissipation protrusions 130 and the liquid cooling plate 200 have smooth through holes or screw holes adapted to the screws. Further, the mounting components can be M2.5 screws. The extension length of the heat dissipation protrusions 130 along the second direction can be the same as that of the base body 110, and the heat dissipation protrusions 130 and the base body 110 are integrally formed.

[0064] With this configuration, not only can the pump source base 100 be fixed on the liquid cooling plate 200 by means of the heat dissipation protrusion 130, but the heat dissipation effect of the pump source base 100 can also be further improved by means of the heat dissipation protrusion 130.

[0065] Specifically, there are two sealing structures 400, which correspond one-to-one with each heat dissipation protrusion 130. The sealing structure 400 seals between the pump source base 100 and the liquid cooling plate 200. The installation stability of the sealing structure 400 is increased by tightening the heat dissipation protrusion 130, and the pump source base 100 is pressed tightly onto the liquid cooling plate 200 without leaving any gaps, so as to achieve a seal and prevent the coolant in the liquid cooling channel 300 from flowing out.

[0066] Of course, in other embodiments, the sealing structure 400 may also be a sealing ring.

[0067] In one embodiment, please refer to Figures 1 to 3 The pump source base 100 also includes a cover plate 140. The base body 110 is provided with a receiving groove 112 for placing a plurality of laser chips 10. The cover plate 140 covers the opening of the receiving groove 112. The plurality of laser chips 10 are placed in the receiving groove 112. This arrangement facilitates the fixed installation of the laser chips 10.

[0068] In one embodiment, please refer to Figures 1 to 3 The liquid cooling plate 200 includes a plate body 230, and an inlet connector 240 and an outlet connector 250 installed on the plate body 230. The plate body 230 has a circulation channel 231 that communicates with the liquid cooling tank 210. The inlet connector 240 and the outlet connector 250 are both connected to the circulation channel 231. With this arrangement, coolant can circulate in the liquid cooling tank 210, thereby cooling the heat sink 121 by means of coolant.

[0069] Specifically, multiple pump source bases 100 are provided, each spaced apart along the first direction on the liquid cooling plate 200. The number and position of the pump source bases 100 can be adjusted according to the design requirements of the laser. Furthermore, two pump source bases 100 can be provided, and the structures of the two pump source bases 100 can be the same or different. By setting them in this way, the number of pump source bases 100 can be set according to the power requirements of the laser, providing more flexibility in the design of the liquid cooling plate 200, while improving space utilization efficiency, saving installation space, and facilitating the overall layout of the laser.

[0070] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A heat dissipation device for a laser, characterized in that, The heat dissipation device includes a pump source base and a liquid cooling plate. The pump source base is used to place the laser chip. The liquid cooling plate has a liquid cooling groove. The pump source base includes a base body and a plurality of heat sinks disposed on the base body. The pump source base is attached to the liquid cooling plate, and the plurality of heat sinks are inserted into the liquid cooling groove. The pump source base and the groove wall of the liquid cooling groove form a liquid cooling channel, and coolant circulates in the liquid cooling channel.

2. The heat dissipation device for a laser according to claim 1, characterized in that, The heat sinks include multiple heat dissipation modules, each heat dissipation module includes at least two heat sinks, and multiple liquid cooling tanks are provided, each corresponding to one of the heat dissipation modules.

3. The heat dissipation device for a laser according to claim 2, characterized in that, Each heat dissipation module includes two heat sinks, and each heat sink extends along a first direction. Each heat dissipation module is spaced apart along a second direction. Each liquid cooling tank extends along the first direction and is spaced apart along the second direction. The first direction and the second direction are set at an angle.

4. The heat dissipation device for a laser according to claim 3, characterized in that, In each heat dissipation module, two adjacent heat sinks are arranged in parallel, and the distance between two adjacent heat sinks is greater than 1mm. The width of the heat sink extending along the second direction is L, where 0.8mm < L < 2mm. And / or, The height dimension of the heat sink along the third direction is H1. The base body has a base bottom embedded in the liquid cooling plate. The height dimension of the base bottom along the third direction is H2. The height dimension of the liquid cooling channel along the third direction is H3. H1+H2=H3-G, 0.8mm≤G≤1.2mm.

5. The heat dissipation device for a laser according to claim 1, characterized in that, The heat dissipation device also includes a sealing structure, which is elastically abutted between the pump source base and the liquid cooling plate and is used to seal the liquid cooling channel.

6. The heat dissipation device for a laser according to claim 5, characterized in that, The liquid cooling plate is further provided with mounting grooves, and at least a portion of the base body is accommodated within the mounting grooves. Each of the liquid cooling grooves is formed on the bottom wall of the mounting groove, and the side wall of the mounting groove forms a first stepped structure. The sealing structure is attached to the edge of the base body and forms a second stepped structure with the base body that is adapted to the first stepped structure. The sealing structure seals between the first stepped structure and the base body; and / or, The pump source base also includes heat dissipation protrusions disposed on the base body. There are two heat dissipation protrusions, which are respectively located on both sides of the base body. The heat dissipation device also includes several mounting components, which pass through the heat dissipation protrusions and are detachably connected to the liquid cooling plate to fix the pump source base to the liquid cooling plate.

7. The heat dissipation device for a laser according to claim 1, characterized in that, The number of heat sinks is greater than or equal to the number of laser chips; and / or, The number of heat sinks shall not be less than 24.

8. The heat dissipation device for a laser according to claim 1, characterized in that, The pump source base further includes a cover plate, and the base body is provided with a receiving groove for placing a plurality of the laser chips, the cover plate covering the opening of the receiving groove; and / or, The pump source base is a structural component made of copper or aluminum alloy.

9. The heat dissipation device for a laser according to claim 1, characterized in that, The liquid-cooled plate includes a plate body, and an inlet connector and an outlet connector mounted on the plate body. The plate body has a circulation channel communicating with the liquid-cooled tank. Both the inlet connector and the outlet connector are connected to the circulation channel; and / or, Multiple pump source bases are provided, and each pump source base is spaced apart along a first direction on the liquid cooling plate.

10. A laser, characterized in that, The laser includes: Several laser chips; and The heat dissipation device for a laser according to any one of claims 1 to 9; Several of the laser chips are disposed on the pump source base.

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