Laser head cooling device and laser head

Abstract

The application provides a laser head cooling device and a laser head, and relates to the field of lasers; wherein the laser head cooling device comprises a first seat body and a second seat body; the first seat body is provided with a communication hole and a groove; the communication hole is provided through the first seat body along a laser emission direction; the groove is provided around the first seat body, and the groove is provided in a direction away from the communication hole; the second seat body is provided with a mounting hole and a through hole which are communicated with each other; the mounting hole and the through hole both extend along the laser emission direction; the first seat body is mounted in the mounting hole; the communication hole is communicated with the through hole; and the groove and the hole wall of the mounting hole jointly define a cooling water channel. The laser head cooling device is composed of the first seat body and the second seat body; the laser is emitted from the communication hole and the through hole, and heat is generated; the cooling water channel is used for directly cooling the heat; the heat dissipation requirement of the laser head under high-power operation can be met; and the machining quality and the equipment stability are improved.

Description

Technical Field

[0001] This application relates to the field of lasers, and more specifically, to a laser head cooling device and a laser head. Background Technology

[0002] Laser processing technology plays an increasingly important role in modern manufacturing, especially with the growing demand for high-precision and high-efficiency processing, leading to the widespread application of large-NA diameter lasers. These lasers can generate high-energy-density laser beams, making them suitable for various complex processing tasks such as cutting, welding, and drilling.

[0003] During laser processing, the heat generated by the laser head significantly affects the performance and lifespan of the equipment. Common cooling methods on the market include indirect cooling such as using water-cooled blocks. While these methods can reduce equipment temperature to some extent, they often fail to meet the heat dissipation requirements of large-nanometer diameter lasers operating at high power. Especially during prolonged, high-intensity processing tasks, indirect cooling can lead to overheating, consequently affecting processing quality and equipment stability. Utility Model Content

[0004] The purpose of this application is to provide a laser head cooling device and a laser head that can meet the heat dissipation requirements of the laser head under high power operation, thereby improving processing quality and equipment stability.

[0005] In a first aspect, this utility model provides a laser head cooling device, which includes a first base and a second base. The first base has a connecting hole and a groove. The connecting hole is disposed through the first base along the laser emission direction. The groove is disposed around the first base and is disposed in a direction away from the connecting hole. The second base has a mounting hole and a through hole that are connected to each other. Both the mounting hole and the through hole extend along the laser emission direction. The first base is mounted on the mounting hole. The connecting hole communicates with the through hole. The groove and the hole wall of the mounting hole together define a cooling water path.

[0006] In an optional embodiment, the second body is further provided with a water inlet and a water outlet, the water inlet being located at the water inlet end of the cooling water circuit, and the water outlet being located at the water outlet end of the cooling water circuit.

[0007] In an optional embodiment, the laser head cooling device further includes quick-release connectors, with two quick-release connectors respectively installed at the water inlet and the water outlet.

[0008] In an optional embodiment, the connecting hole is composed of a first connecting hole and a second connecting hole, wherein the second connecting hole is located between the first connecting hole and the through hole.

[0009] In an optional embodiment, both the first connecting hole and the second connecting hole are configured as tapered holes, and along the laser emission direction, the diameter of the first connecting hole gradually decreases and the diameter of the second connecting hole gradually increases.

[0010] In an optional embodiment, the centerline of the first connecting hole and the centerline of the second connecting hole are on the same straight line, and the minimum diameter of the first connecting hole is equal to the minimum diameter of the second connecting hole, and the maximum diameter of the first connecting hole is greater than the maximum diameter of the second connecting hole.

[0011] In an optional embodiment, the walls of the connecting holes are coated with an ultra-black nano-coating.

[0012] In an optional embodiment, the laser head cooling device further includes a first seal and a second seal. The first base is also provided with a first mounting groove and a second mounting groove. Along the laser emission direction, the first mounting groove and the second mounting groove are respectively located on both sides of the groove, and the first mounting groove and the second mounting groove are both arranged facing the second base. The first seal is installed in the first mounting groove, and the second seal is installed in the second mounting groove.

[0013] In an optional embodiment, the through hole is composed of a first through hole and a second through hole, wherein the first through hole is located between the second through hole and the connecting hole.

[0014] Secondly, this utility model provides a laser head, including a water chiller and the laser head cooling device described in the foregoing embodiments, wherein the water chiller is connected to the laser head cooling device.

[0015] Compared to existing technologies, the beneficial effects of this application are:

[0016] This application comprises a laser head cooling device consisting of a first body and a second body. The laser is emitted from the connecting hole and the through hole, generating heat. This application utilizes a cooling water circuit to directly cool the heat, which can meet the heat dissipation requirements of the laser head under high power operation, and improve processing quality and equipment stability. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1The diagram shows the distribution of the laser head cooling device, collimating lens, and laser beam in some embodiments;

[0019] Figure 2 A plan view of the laser head cooling device is shown in some embodiments;

[0020] Figure 3 It shows Figure 2 Schematic diagram of the AA section;

[0021] Figure 4 A perspective view of the first seat body is shown in some embodiments;

[0022] Figure 5 A three-dimensional schematic diagram of the second seat is shown in some embodiments.

[0023] Explanation of key component symbols:

[0024] 10-Laser head cooling device; 100-First base; 110-Connecting hole; 111-First connecting hole; 112-Second connecting hole; 120-Groove; 130-First mounting groove; 140-Second mounting groove; 200-Second base; 210-Mounting hole; 220-Through hole; 221-First through hole; 222-Second through hole; 230-Water inlet; 240-Water outlet; 300-Quick-release connector; 400-First seal; 500-Second seal; 20-Collimating lens; 30-Laser beam. Detailed Implementation

[0025] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0026] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0028] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0029] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0030] Example 1

[0031] Please see Figure 1 This embodiment is applicable to the cooling of the laser head. During the processing, the laser head emits a laser beam 30, which is transmitted through the collimating lens 20. In this embodiment, the transmission path of the laser beam 30 is defined as the laser emission direction.

[0032] Please see Figures 2 to 4 This embodiment provides a laser head cooling device 10, which is installed on the laser head and includes a first base 100 and a second base 200.

[0033] The first base 100 is provided with a connecting hole 110 and a groove 120.

[0034] The connecting hole 110 is disposed through the first base 100 along the laser emission direction. Specifically, the connecting hole 110 is composed of a first connecting hole 111 and a second connecting hole 112.

[0035] Both the first connecting hole 111 and the second connecting hole 112 are configured as tapered holes. Along the laser emission direction, the diameter of the first connecting hole 111 gradually decreases, and the diameter of the second connecting hole 112 gradually increases. The design of the two tapered holes increases the surface area for absorbing stray light and improves the absorption efficiency.

[0036] The walls of the connecting holes 110 are coated with an ultra-black nano-coating, that is, the walls of the first connecting holes 111 and the second connecting holes 112 are coated with an ultra-black nano-coating. The ultra-black nano-coating can absorb more than 99% of ultraviolet light, visible light and infrared light, and increase the absorption of laser stray light.

[0037] Please see Figure 1 and Figure 3 It is understandable that this embodiment reduces stray light by using the design of two conical holes and the process of coating with an ultra-black nano-coating, making the light spot formed by the laser beam 30 more concentrated.

[0038] The centerline of the first connecting hole 111 and the centerline of the second connecting hole 112 are on the same straight line, and the minimum diameter of the first connecting hole 111 is equal to the minimum diameter of the second connecting hole 112, and the maximum diameter of the first connecting hole 111 is greater than the maximum diameter of the second connecting hole 112.

[0039] The groove 120 is disposed around the first base 100, and the groove 120 is disposed in a direction away from the connecting hole 110.

[0040] Please see Figure 2 , Figure 3 and Figure 5 The second base 200 is provided with a mounting hole 210 and a through hole 220 that are connected to each other. Both the mounting hole 210 and the through hole 220 extend along the laser emission direction. The first base 100 is installed in the mounting hole 210. The connecting hole 110 is connected to the through hole 220. The groove 120 and the hole wall of the mounting hole 210 together define the cooling water channel.

[0041] Please see Figure 1 and Figure 3 In this embodiment, the groove 120 can be configured as an annular groove 120, and the cooling water path is an annular cooling water path. The annular cooling water path is arranged around the laser beam 30. On the one hand, the annular cooling water path absorbs the heat generated by the laser beam 30 through direct cooling, reduces the temperature of the laser head, and prevents the laser head from malfunctioning due to overheating. On the other hand, the coolant flow path of the annular cooling water path is relatively long, which can fully exchange heat with the laser head and improve the heat dissipation effect.

[0042] The through hole 220 is composed of a first through hole 221 and a second through hole 222. The first through hole 221 is located between the second through hole 222 and the second connecting hole 112. In this embodiment, the second through hole 222 is located at the bottom of the first through hole 221, and the center line of the second through hole 222 coincides with the center line of the first through hole 221. The diameter of the second through hole 222 is larger than the diameter of the first through hole 221.

[0043] In this embodiment, the laser beam 30 passes through the first connecting hole 111, the second connecting hole 112, the first through hole 221 and the second through hole 222 in sequence, and then emits a light spot of a fixed diameter, thereby achieving stable processing and improving processing accuracy.

[0044] During the processing, the laser is continuously emitted, generating heat. Coolant enters the cooling water circuit from the inlet 230 to absorb the heat. Then, the heated coolant flows out from the outlet 240, carrying away the heat, thereby achieving the purpose of reducing the temperature of the laser head.

[0045] Please see Figure 5 The second body 200 is also provided with an inlet 230 and an outlet 240. The inlet 230 is located at the inlet end of the cooling water circuit, and the outlet 240 is located at the outlet end of the cooling water circuit. The coolant enters the cooling water circuit from the inlet 230 and then flows out from the outlet 240. By adopting an inlet-outlet method, the coolant is circulated, continuously carrying away heat and improving the heat exchange efficiency.

[0046] Please see Figure 2 and Figure 5 According to the aforementioned inlet 230 and outlet 240, the laser head cooling device 10 also includes a quick-release connector 300. The two quick-release connectors 300 are respectively installed at the inlet 230 and outlet 240. The quick-release connectors 300 have the function of quick disassembly, which can reduce the difficulty of installation.

[0047] Please see Figures 2 to 4 The laser head cooling device 10 also includes a first sealing element 400 and a second sealing element 500. The first base 100 is also provided with a first mounting groove 130 and a second mounting groove 140. Along the laser emission direction, the first mounting groove 130 and the second mounting groove 140 are respectively located on both sides of the groove 120, and the first mounting groove 130 and the second mounting groove 140 are both facing the second base 200. The first sealing element 400 is installed in the first mounting groove 130, and the second sealing element 500 is installed in the second mounting groove 140.

[0048] In this embodiment, the first seat 100 and the second seat 200 are sealed together by the first seal 400 and the second seal 500 to prevent coolant leakage and ensure processing safety.

[0049] In actual installation, the first base 100 and the second base 200 can be fixedly connected by snap-fit ​​or screw-fit, and there are no restrictions on this.

[0050] Please see Figures 3 to 5 Based on the above, the installation principle of the laser head cooling device 10 will be further explained in this embodiment as follows:

[0051] S100. Install the first seal 400 in the first mounting groove 130.

[0052] S200. Install the second seal 500 in the second mounting groove 140.

[0053] S300. Insert the first base 100 into the mounting hole 210 and fix the first base 100 and the second base 200 with bolts to define the cooling water path.

[0054] S400. Install a quick-release connector 300 at the inlet 230 and a quick-release connector 300 at the outlet 240.

[0055] In this embodiment, a laser head cooling device 10 is formed by the first base 100 and the second base 200. The laser is emitted from the connecting hole 110 and the through hole 220 and generates heat. This embodiment uses a cooling water circuit to directly cool the heat, which can meet the heat dissipation requirements of the laser under high power operation and improve the processing quality and equipment stability.

[0056] This embodiment is adaptable to different laser heads, enriching the range of laser heads that can be applied to different lasers and expanding the application fields of laser heads.

[0057] Example 2

[0058] Please see Figure 1 , Figure 2 and Figure 5 Based on Embodiment 1, this embodiment provides a laser head, which includes a water chiller and the aforementioned laser head cooling device 10, with the water chiller connected to the laser head cooling device 10.

[0059] Specifically, the water chiller is connected to the inlet 230 and outlet 240 of the laser head cooling device 10 via a quick-release connector 300. After the coolant is output from the water chiller, it enters the cooling water circuit through the inlet 230 and then flows back to the water chiller through the outlet 240, thus achieving the function of circulating cooling.

[0060] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0061] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A laser head cooling device, characterized in that, The device includes a first base and a second base. The first base has a connecting hole and a groove. The connecting hole is disposed through the first base along the laser emission direction. The groove is disposed around the first base and is oriented away from the connecting hole. The second base has a mounting hole and a through hole that are connected to each other. Both the mounting hole and the through hole extend along the laser emission direction. The first base is mounted on the mounting hole. The connecting hole communicates with the through hole. The groove and the wall of the mounting hole together define a cooling water path.

2. The laser head cooling device as described in claim 1, characterized in that, The second body is also provided with a water inlet and a water outlet, the water inlet being located at the water inlet end of the cooling water circuit, and the water outlet being located at the water outlet end of the cooling water circuit.

3. The laser head cooling device as described in claim 2, characterized in that, It also includes quick-release connectors, with two quick-release connectors respectively installed at the inlet and the outlet.

4. The laser head cooling device as described in any one of claims 1 to 3, characterized in that, The connecting hole is composed of a first connecting hole and a second connecting hole, with the second connecting hole located between the first connecting hole and the through hole.

5. The laser head cooling device as described in claim 4, characterized in that, Both the first connecting hole and the second connecting hole are configured as tapered holes, and along the laser emission direction, the diameter of the first connecting hole gradually decreases and the diameter of the second connecting hole gradually increases.

6. The laser head cooling device as described in claim 5, characterized in that, The centerline of the first connecting hole and the centerline of the second connecting hole are on the same straight line, and the minimum diameter of the first connecting hole is equal to the minimum diameter of the second connecting hole, while the maximum diameter of the first connecting hole is greater than the maximum diameter of the second connecting hole.

7. The laser head cooling device according to any one of claims 1 to 3, characterized in that, The walls of the connecting holes are coated with an ultra-black nano-coating.

8. The laser head cooling device according to any one of claims 1 to 3, characterized in that, It also includes a first seal and a second seal. The first seat is further provided with a first mounting groove and a second mounting groove. Along the laser emission direction, the first mounting groove and the second mounting groove are respectively located on both sides of the groove, and the first mounting groove and the second mounting groove are both arranged facing the second seat. The first seal is installed in the first mounting groove, and the second seal is installed in the second mounting groove.

9. The laser head cooling device according to any one of claims 1 to 3, characterized in that, The through hole is composed of a first through hole and a second through hole, with the first through hole located between the second through hole and the connecting hole.

10. A laser head, characterized in that, It includes a water chiller and a laser head cooling device as described in any one of claims 1 to 9, wherein the water chiller is connected to the laser head cooling device.

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