power supply
By installing functional components in the power module and using a blower to form a heat dissipation path, the heat dissipation problem of the power module during high power consumption operation is solved, achieving rapid and uniform heat distribution and efficient heat dissipation, ensuring stable operation of the power supply.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU XWC ELECTRONIC TECH CO LTD
- Filing Date
- 2025-08-11
- Publication Date
- 2026-08-04
AI Technical Summary
Existing power modules have low heat dissipation efficiency when operating at high power consumption, which leads to overheating and frequency reduction of the device, affecting reliability and lifespan.
Design a power supply that improves heat dissipation efficiency by installing functional components on both sides of the heat sink and using a blower to blow hot air to the ventilation components, forming a complete heat dissipation path.
It achieves rapid and uniform heat distribution and dissipation, ensuring that the power supply maintains a suitable temperature under high load, guaranteeing stable operation and normal component function.
Smart Images

Figure CN224596820U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power supply product technology, and in particular to a power supply. Background Technology
[0002] As the performance of electronic devices continues to improve, the power consumption of electronic power modules (EPMs) is also constantly increasing. In these high-performance EPMs, heat dissipation becomes particularly critical. If the power supply has limited heat dissipation efficiency when operating at high power consumption, it can easily lead to overheating and frequency throttling, affecting the reliability and lifespan of the device.
[0003] In existing EPM power supplies, the heatsink typically has an intake fan positioned on the side closest to the ventilation components. This intake fan draws hot air from the heatsink, which then flows to the vents. However, this design has several drawbacks: firstly, the hot air flows slowly between the intake fan and the vents, affecting heat dissipation; secondly, the hot air drawn in by the intake fan may flow to other locations instead of being directly exhausted through the vents.
[0004] In view of this, it is indeed necessary to provide a new power source to solve the above problems. Utility Model Content
[0005] To achieve the above objectives, this utility model provides a power supply capable of rapid heat dissipation.
[0006] Therefore, the present invention provides a power supply, comprising: The casing has ventilation components on its outer side wall; The blower is installed inside the housing and located on one side of the ventilation component; The radiator is installed inside the housing and located between the ventilation components and the air blowing components; At least two sets of functional components are installed on both sides of the radiator; among them, The radiator is configured to dissipate heat generated by the functional components, and the blower blows the hot air inside the radiator to the ventilation components.
[0007] Optionally, the radiator includes a body and a ventilation channel disposed within the body. The ventilation channel includes a first end and a second end disposed opposite to each other. The first end is close to the air blowing element, and the second end is disposed at a distance from the air blowing element.
[0008] Optionally, the body also includes at least one set of spacer arms that extend from the first end to the second end and divide the ventilation channel into at least two sets of sub-ventilation channels.
[0009] Optionally, the top cover of the body is equipped with a thermally conductive patch to seal the space above the ventilation channel.
[0010] Optionally, it also includes at least two sets of capacitors installed inside the housing, with the two sets of capacitors located on opposite sides of the heat sink.
[0011] Optionally, it also includes at least two sets of radiators and a blower corresponding to the at least two sets of radiators, the blower blowing hot air from the radiator to the ventilation component.
[0012] Optionally, it also includes a circuit board installed inside the housing. The circuit board has a surface mount structure, and the blower and heat sink are both mounted on the circuit board.
[0013] Optionally, the ventilation component is at least two rows of through holes arranged along the length of the outer side wall.
[0014] Optionally, the number of through holes per unit area from the bottom to the top of the housing is positively correlated with the distance from the bottom of the housing.
[0015] Optionally, the ventilation component is a row of through holes arranged along the length of the outer side wall.
[0016] Compared with the prior art, the technical solution of the embodiments of this utility model has the following beneficial effects: This invention, by installing at least two sets of functional components on both sides of the heat sink, allows for a more even distribution of heat across the heat sink. This enables the heat sink to efficiently and quickly dissipate the heat generated by the functional components, effectively avoiding localized overheating problems caused by concentrated functional components. Simultaneously, the blower directs hot air from the heat sink to the ventilation component, forming a complete heat dissipation path. This allows hot air to flow quickly and effectively from the heat sink to the ventilation component and then be discharged through the ventilation component, significantly improving heat dissipation efficiency. This ensures that the power supply maintains a suitable temperature even under high loads, guaranteeing stable operation of the power supply and normal functioning of the components. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the power supply structure according to a preferred embodiment of the present utility model.
[0018] Figure 2 yes Figure 1 A schematic diagram of the power supply after the cover has been removed.
[0019] The components in the attached diagram are labeled as follows: 1. Housing, 11. Base, 111. Base plate, 112. Outer wall, 113. Circuit board, 113. Cover, 12. Ventilation component, 13. Blower component, 2. Heat sink, 3. Body, 31. Side arm, 311. Spacer arm, 312. Ventilation channel, 32. First end, 321. Second end, 322. Functional component, 4. Capacitor, 5. Built-in power supply, 6. Power supply 100. Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0021] It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and / or processing steps closely related to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.
[0022] Additionally, it should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0023] Please see Figures 1 to 2 As shown, an embodiment of this utility model provides a power supply 100. The power supply 100 includes a housing 1 and electronic components disposed within the housing 1. Since the electronic components inside the power supply 100 are common, for ease of drawing and without affecting the understanding of the technology by those skilled in the art, [the following is omitted as it is not part of the original text]. Figure 1 The power supply 100 is drawn in a simplified manner, omitting the drawing of common electronic components. The housing 1 includes a base 11 and a cover 12 that encloses the base 11. The base 11 includes a bottom plate 111 and four outer side walls 112 extending upward from the bottom plate 111. A ventilation element 13 is provided on one of the outer side walls 112. A blower 2 is provided on the inner side of the outer side wall 112 opposite to the ventilation element 13, configured to blow hot air from inside the housing 1 to the ventilation element 13.
[0024] In some embodiments, the ventilator 13 consists of multiple rows of through holes arranged along the length of the outer wall 112. Furthermore, the closer to the top, the greater the number of through holes per unit area, or the larger the total area occupied by all the through holes. Since hot air has a lower density, it naturally rises. By providing more through holes near the top of the outer wall 112, the airflow channels are increased, and the airflow resistance is reduced, allowing hot air to be more effectively guided from around the electronic components to the ventilator 13, thereby accelerating the exhaust of hot air. This design utilizes the natural convection of hot air, improving heat dissipation efficiency.
[0025] In other embodiments, the ventilation element 13 is a row of through holes arranged along the length of the outer wall 112 to further improve heat dissipation efficiency. This arrangement not only increases the space for airflow but also provides a clear airflow path, allowing hot air to be exhausted from the power supply 100 in a predetermined direction. This design reduces airflow resistance and improves the efficiency of hot air exhaust. Furthermore, heat dissipation efficiency can be improved by adjusting the shape of the through holes; generally, the through holes are rectangular.
[0026] Preferably, the through-hole is shaped like a trumpet, wider at the top and narrower at the bottom, which can further optimize airflow and make it easier for hot air to be discharged from the ventilation component 13.
[0027] A circuit board 113 is mounted on the base 11. The circuit board 113 employs a surface-mount structure, reducing the space between electronic components and lowering thermal resistance, thereby improving heat dissipation efficiency. The surface-mount structure has a larger surface area, which helps to better transfer heat from the components to the circuit board 113, facilitating subsequent heat dissipation. A blower 2, a heat sink 3, a capacitor 5, and a built-in power supply 6 are mounted on the circuit board 113. The built-in power supply 6 is configured to power the blower 2, the heat sink 3, and the capacitor 5.
[0028] In this embodiment, the blower 2 is a fan. In other embodiments, the blower 2 may be other components that can accelerate airflow, and no limitation is set here.
[0029] A heat sink 3 is provided on the side of the blower 2 near the ventilation component 13. The heat sink 3 is directly mounted on the circuit board 113, which can effectively conduct the heat generated by the electronic components to the heat sink 3, and then the blower 2 accelerates the airflow to quickly expel the heat out of the housing 1. This arrangement reduces the accumulation of heat in the electronic components and reduces the risk of failure due to overheating.
[0030] The heat sink 3 includes a body 31. The body 31 includes a bottom wall and two sets of side arms 311 disposed on both sides of the bottom wall and extending upwards from the bottom wall. Functional components 4 are respectively mounted on the outer sides of the two sets of side arms 311, allowing the heat generated by the functional components 4 to be more evenly distributed on the heat sink 3. Furthermore, by dissipating the heat generated by the functional components 4 through the sides of the heat sink 3, the heat distribution is optimized, heat accumulation is reduced, and localized overheating is avoided. In this embodiment, the functional component 4 is a chip.
[0031] The main body 31 is also provided with a ventilation channel 32. The ventilation channel 32 is located between the two side arms 311. The ventilation channel 32 includes a first end 321 near the blower 2 and a second end 322 near the ventilator 13. The blower 2 blows hot air from the first end 321 to the second end 322 of the ventilation channel 32, and can quickly blow the hot air from the second end 322 to the ventilator 13, through which the hot air is quickly discharged outside the housing 1, rapidly cooling the inside of the power supply 100.
[0032] Specifically, the radiator 3 also has several sets of spacer arms 312 between the two side arms 311. The spacer arms 312 extend from the first end 321 to the second end 322, dividing the ventilation channel 32 into several sub-ventilation channels. The more sub-ventilation channels there are, the more uniform the airflow becomes, reducing local air stagnation. This optimized airflow can more effectively remove heat from the surface of the radiator 3, further improving heat dissipation efficiency.
[0033] For example, the radiator 3 has a set of spacer arms 312, which divide the ventilation channel 32 into two sets of sub-ventilation channels. The sub-ventilation channels are located between adjacent side walls 311 and spacer arms 312.
[0034] In some preferred embodiments, the radiator 3 is provided with four sets of spacer arms 312, which divide the ventilation channel 32 into five sub-ventilation channels. A sub-ventilation channel is formed between two adjacent spacer arms 312, and a sub-ventilation channel is formed between adjacent sidewalls 311 and spacer arms 312.
[0035] In some preferred embodiments, the top of the body 31 is covered with a heat-conducting patch (not shown), which extends from the first end 321 to the second end 322 to seal the space above the ventilation channel 32, making the air blown out by the blower 2 more concentrated and quickly blowing the hot air in the ventilation channel 32 to the ventilation component 13, thereby improving the heat dissipation efficiency.
[0036] The number of heat sinks 3 provided inside the power supply 100 is related to the power of the power supply 100. In some embodiments, two heat sinks 3 are provided inside the power supply 100. Similarly, two air blowers 2 are provided, and both are installed on the side of the heat sink 3 away from the ventilation component 13, which can more quickly blow the hot air from the heat sink 3 to the ventilation component 13, reduce the stagnation of hot air between the heat sink 3 and the ventilation component 13, and improve the efficiency of airflow.
[0037] In other embodiments, the number of heat sinks 3 may also be different, and a blower 2 is correspondingly installed on the side of each heat sink 3 away from the ventilation component 13. By setting different numbers of heat sinks 3 and blower 2 according to the power of the power supply 100, the heat dissipation requirements of power supplies 100 with different power ratings can be met. For high-power power supplies 100, increasing the number of heat sinks 3 and blower 2 can significantly improve heat dissipation efficiency and ensure stable operation of the power supply 100 under high loads.
[0038] At least two sets of capacitors 5 are distributed on both sides of the heat sink 3, allowing heat to be distributed more evenly on the circuit board 113 and avoiding the problem of localized overheating caused by concentrated capacitors 5. This distributed layout reduces the thermal resistance during heat conduction, and the hot air near the capacitors 5 is then blown to the ventilation component 13 by the air blower 2 on the outer wall 112, effectively improving heat dissipation efficiency and ensuring stable operation of the power supply 100 under high load. Each set of capacitors 5 includes two capacitors 5, making the current flow smoother. When the current passes through the capacitors 5, it can be more evenly distributed to the two capacitors 5, reducing current concentration and congestion at the capacitors 5, lowering the current density, and helping to reduce the heat generated by excessive current in the capacitors 5, further improving the efficiency and reliability of the power supply 100.
[0039] In summary, this invention, by installing at least two sets of functional components 4 on both sides of the heat sink 3, allows heat to be distributed more evenly on the heat sink 3. This enables the heat sink 3 to efficiently and quickly dissipate the heat generated by the functional components 4, effectively avoiding the problem of localized overheating caused by the concentrated placement of functional components 4. Simultaneously, the blower 2 blows hot air from the heat sink 3 to the ventilation component 13, forming a complete heat dissipation path. This allows hot air to flow quickly and effectively from the heat sink 3 to the ventilation component 13 and then out of the power supply 100 through the ventilation component 13, greatly improving heat dissipation efficiency and ensuring that the power supply 100 maintains a suitable temperature even under high load, guaranteeing stable operation of the power supply 100 and normal operation of electronic components. Compared with the prior art, this invention, by placing the blower 2 on the opposite side of the ventilation component 13, forms a good cooperation with the heat sink 3, allowing hot air to flow quickly from the heat sink 3 to the ventilation component 13, optimizing the heat dissipation effect and improving the heat dissipation performance and reliability of the power supply 100.
[0040] The above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model.
Claims
1. A power supply, characterized by, include: The casing has ventilation components on its outer side wall; A blower is installed inside the housing and located on one side of the ventilation component; A radiator is installed inside the housing and located between the ventilation component and the air blowing component; At least two sets of functional components are respectively installed on both sides of the heat sink; wherein, The radiator is configured to dissipate heat generated by the functional component, and the blower blows hot air from the radiator to the ventilation component.
2. The power supply of claim 1, wherein, The radiator includes a body and a ventilation channel disposed within the body. The ventilation channel includes a first end and a second end disposed opposite to each other. The first end is close to the air blower, and the second end is spaced apart from the air blower.
3. The power supply of claim 2, wherein, The body is further provided with at least one set of spacer arms, which extend from the first end to the second end and divide the ventilation channel into at least two sets of sub-ventilation channels.
4. The power supply of claim 2, wherein, The top of the main body is covered with a thermally conductive patch to seal the space above the ventilation channel.
5. The power supply of claim 2, wherein, It also includes at least two sets of capacitors installed inside the housing, with the at least two sets of capacitors located on both sides of the heat sink.
6. The power supply of any one of claims 1 to 5, wherein It also includes at least two sets of radiators and a blower corresponding to the at least two sets of radiators, the blower blowing hot air from the radiator to the ventilation component.
7. The power supply of claim 2, wherein It also includes a circuit board installed inside the housing. The circuit board has a surface mount structure, and the blower and the heat sink are both mounted on the circuit board.
8. The power supply of claim 2, wherein, The ventilation component consists of at least two rows of through holes arranged along the length of the outer side wall.
9. The power supply of claim 8, wherein, From the bottom to the top of the housing, the number of through holes per unit area is positively correlated with the distance from the bottom of the housing.
10. The power supply of claim 2, wherein, The ventilation component is a row of through holes arranged along the length of the outer side wall.