A case structure of an integrated heat pipe and an electronic device
By integrating a heat pipe chassis structure and utilizing a combination of heat pipes and natural radiators, the problems of low heat dissipation efficiency and high noise in nuclear systems are solved, achieving efficient and reliable heat dissipation. This structure is suitable for chassis structures of electronic equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NUCLEAR POWER INSTITUTE OF CHINA
- Filing Date
- 2025-09-05
- Publication Date
- 2026-08-04
AI Technical Summary
The low efficiency of natural heat dissipation and the high noise and short lifespan of forced air cooling in existing nuclear systems affect the stability and reliability of the equipment.
The chassis structure adopts an integrated heat pipe, including a mounting base plate, a heat dissipation side plate, a heat pipe, and a natural heat sink. The heat pipe efficiently transfers the heat of the board modules to the heat dissipation side plate, and the natural heat sink is used for heat dissipation, avoiding fan noise and internal power supply requirements.
It achieves efficient heat dissipation, long equipment life, high reliability, and eliminates the need for cooling fans, thus improving the cooling efficiency of the chassis in nuclear systems.
Smart Images
Figure CN224596841U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic equipment technology, specifically to a chassis structure and electronic equipment with an integrated heat pipe. Background Technology
[0002] As electronic equipment continues to evolve towards miniaturization, multifunctionality, and high performance, the heat generation and heat flux density of some high-power devices within these devices are constantly increasing. If effective heat dissipation design is not implemented, it will directly affect the realization of system functions and the stability of long-term operation. Currently, the main cooling methods in nuclear systems are natural cooling and forced air cooling. However, natural cooling is inefficient, while forced air cooling suffers from problems such as high noise levels, high requirements for ambient air purity, and limited fan lifespan and noise. Summary of the Invention
[0003] To address the technical problems of low heat dissipation efficiency of natural heat dissipation and high noise and short lifespan of forced air cooling in existing nuclear systems, this utility model provides a chassis structure and electronic equipment with integrated heat pipes. It can dissipate heat to the board modules and chassis body through the heat pipe substrate, which has high heat dissipation efficiency, no noise from fans, long equipment life and no need for internal power supply, and can improve the efficiency of chassis cooling in nuclear systems.
[0004] This utility model is achieved through the following technical solution: In a first aspect, this utility model provides a chassis structure with integrated heat pipes, comprising: a mounting base plate for mounting circuit board modules; a heat dissipation side plate mounted at one end of the mounting base plate; multiple heat pipes arranged in parallel, the heat pipes being laid on the upper end of the mounting base plate and the inner side of the heat dissipation side plate, capable of transferring the heat generated by the circuit board modules to the heat dissipation side plate; and a natural radiator mounted on the outer side of the heat dissipation side plate.
[0005] It should be noted that the cooling methods in nuclear systems are currently mainly natural heat dissipation and forced air cooling. However, natural heat dissipation is inefficient, while forced air cooling has problems such as high noise, high requirements for the purity of the ambient air, and limited fan lifespan and high noise.
[0006] In view of this, the integrated heat pipe chassis structure provided by this utility model includes a mounting base plate, a heat dissipation side plate, a heat-conducting heat pipe, and a natural heat sink. The mounting base plate is used to mount the board module so that the heat generated by the board module can be transferred to the mounting base plate. The heat dissipation side plate is mounted on one end of the mounting base plate. At the same time, the heat-conducting heat pipe is laid on the upper end of the mounting base plate and the inner side of the heat dissipation side plate. Thus, the heat generated by the board module is efficiently transferred to the heat dissipation side plate through the heat-conducting heat pipe, thereby achieving efficient heat dissipation of the board module. The natural heat sink is installed on the outer side of the heat dissipation side plate, thereby achieving natural heat dissipation through the self-heating heat sink.
[0007] Therefore, the integrated heat pipe chassis structure provided by this utility model dissipates heat to the board modules and chassis body through the heat pipe substrate, resulting in high heat dissipation efficiency. It does not require a cooling fan, eliminating fan noise. It also features long equipment life, no need for internal power supply, and high reliability, thereby improving the efficiency of chassis cooling in nuclear systems.
[0008] In an optional embodiment of this application, two heat dissipation side plates are provided, which are respectively located at both ends of the mounting base plate along its length. Both heat dissipation side plates are equipped with the natural heat sink to dissipate heat through both sides of the chassis simultaneously, ensuring that the chassis has sufficient heat dissipation efficiency.
[0009] In an optional embodiment of this application, both the mounting base plate and the heat dissipation side plate are made of metal, so that the mounting base plate and the heat dissipation side plate have sufficient thermal conductivity and can also dissipate heat, thereby further improving the heat dissipation capacity of the chassis structure.
[0010] In an optional embodiment of this application, the heat dissipation side plate is brazed to the mounting base to ensure that the heat dissipation side plate and the mounting base have sufficient connection strength, while ensuring that the heat generated by the mounting base can be efficiently transferred to the heat dissipation side plate.
[0011] In an optional embodiment of this application, the heat pipe is embedded in the upper end of the mounting substrate and the inner side of the heat dissipation side plate, and the heat pipe is sintered with metal powder in the upper end of the mounting substrate and the inner side of the heat dissipation side plate, so that the heat pipe can efficiently absorb the heat of the mounting substrate and efficiently transfer it to the heat dissipation side plate, thereby improving the heat dissipation efficiency.
[0012] In an optional embodiment of this application, it further includes: a back panel surrounding the rear side of the mounting base plate and the two heat dissipation side panels; and an upper cover plate covering the upper end of the back panel and the two heat dissipation side panels; wherein the cavity formed by the mounting base plate, the two heat dissipation side panels, the back panel and the upper cover plate can accommodate multiple board modules to ensure that the chassis structure can provide sufficient protection for the board modules.
[0013] Secondly, this utility model provides an electronic device, including: the aforementioned integrated heat pipe chassis structure; multiple board modules, each of which is arranged parallel to the heat dissipation side plate, and the multiple board modules are arranged longitudinally on the mounting base plate.
[0014] The electronic device provided by this utility model has a board module installed in the aforementioned chassis structure. It can efficiently transfer the heat generated by the board module to the heat dissipation side plate through the heat pipe, thereby achieving efficient heat dissipation of the board module. The natural heat sink is installed on the outside of the heat dissipation side plate, and then the heat is dissipated naturally through the self-heating heat sink. It not only has high heat dissipation efficiency, but also does not require a cooling fan, eliminating the noise caused by the fan. It has the characteristics of long equipment life, no need for internal power supply, and high reliability, and can improve the efficiency of chassis cooling in nuclear systems.
[0015] Furthermore, most current chassis use rear-out signal cables, which makes maintenance difficult in scenarios where rear maintenance space is limited. To address this, in an optional embodiment of this application, the wiring ports of the circuit board module are all located on the front panel of the circuit board module, enabling front-out wiring, which is suitable for situations where rear maintenance space is limited.
[0016] In an optional embodiment of this application, the board module includes: a board housing, which is a hollow metal shell structure with an electronic chip installed inside; a heat dissipation substrate, which covers the cover side of the board housing; and heat-conducting protrusions, with their two ends respectively attached to the inner sidewalls of the corresponding electronic chip and the heat dissipation substrate, so as to ensure that the heat generated by the electronic chip can be quickly transferred to the chassis structure.
[0017] In an optional embodiment of this application, both the side of the circuit board enclosure and the heat dissipation substrate are provided with heat dissipation holes to ensure that the circuit board enclosure has sufficient heat dissipation capacity.
[0018] Compared with the prior art, the present invention has the following advantages and beneficial effects: 1. The integrated heat pipe chassis structure provided by this utility model includes a mounting base plate, a heat dissipation side plate, heat-conducting heat pipes, and a natural heat sink. The mounting base plate is used to mount the circuit board module so that the heat generated by the circuit board module can be transferred to the mounting base plate. The heat dissipation side plate is installed at one end of the mounting base plate. At the same time, multiple heat-conducting heat pipes are arranged in parallel and laid on the upper end of the mounting base plate and the inner side of the heat dissipation side plate. Thus, the heat generated by the circuit board module is efficiently transferred to the heat dissipation side plate through the heat-conducting heat pipes, thereby achieving efficient heat dissipation of the circuit board module. The natural heat sink is installed on the outer side of the heat dissipation side plate, and then natural heat dissipation is achieved through the self-heating heat sink. It not only has high heat dissipation efficiency, but also does not require a cooling fan, eliminating the noise caused by the fan. It has the characteristics of long equipment life, no need for internal power supply, and high reliability, and can improve the efficiency of chassis cooling in nuclear systems.
[0019] 2. The electronic device provided by this utility model has a board module installed in the aforementioned chassis structure. It can efficiently transfer the heat generated by the board module to the heat dissipation side plate through the heat pipe, thereby efficiently dissipating the heat of the board module. The natural heat sink is installed on the outside of the heat dissipation side plate, and then the heat is dissipated naturally through the self-heating heat sink. It not only has high heat dissipation efficiency, but also does not require a cooling fan, eliminating the noise caused by the fan. It has the characteristics of long equipment life, no need for internal power supply, and high reliability, and can improve the efficiency of chassis cooling in nuclear systems. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this utility model and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0021] In the attached diagram: Figure 1 An exploded view of the electronic device provided in an embodiment of this utility model; Figure 2 A schematic diagram showing the connection between the mounting base plate, heat dissipation side plate, and heat-conducting heat pipe of the integrated heat pipe chassis structure provided in this embodiment of the utility model. Figure 3 A schematic diagram of the structure of a natural radiator provided in an embodiment of this utility model; Figure 4 This is an exploded view of the board module provided in an embodiment of the present utility model.
[0022] The attached figures include reference numerals and their corresponding component names: 10-Mounting base plate, 11-Guide rail groove, 20-Board module, 21-Wiring port, 22-Board housing, 23-Heat dissipation base plate, 24-Heat conduction boss, 25-Electronic chip, 30-Heat dissipation side plate, 40-Heat conduction heat pipe, 50-Natural heat sink, 60-Back panel, 70-Top cover plate. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0024] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0025] It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0026] In the description of the embodiments of this application, the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in when in use, or the orientation or positional relationship that is commonly understood by those skilled in the art. It is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.
[0027] In the description of this application, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0028] It should be noted that the cooling methods in nuclear systems are currently mainly natural heat dissipation and forced air cooling. However, natural heat dissipation is inefficient, while forced air cooling has problems such as high noise, high requirements for the purity of the ambient air, and limited fan lifespan and high noise.
[0029] To this end, the inventors have innovatively designed the following technical solutions, and the specific implementation scheme of this application will be described in detail below with reference to the accompanying drawings.
[0030] Example 1 Combination Figure 1 and Figure 2 This embodiment provides a chassis structure with integrated heat pipes, including: a mounting base plate 10 for mounting a board module 20; a heat dissipation side plate 30 mounted at one end of the mounting base plate 10; multiple heat pipes 40 arranged in parallel, the heat pipes 40 being laid on the upper end of the mounting base plate 10 and the inner side of the heat dissipation side plate 30, capable of transferring the heat generated by the board module 20 to the heat dissipation side plate 30; and a natural radiator 50 mounted on the outer side of the heat dissipation side plate 30.
[0031] In this embodiment, two heat dissipation side plates 30 are provided, which are respectively located at both ends of the mounting base plate 10 along its length. Both heat dissipation side plates 30 are equipped with the natural heat sink 50 to dissipate heat through both sides of the chassis simultaneously, ensuring that the chassis has sufficient heat dissipation efficiency.
[0032] It is understood that both the mounting base plate 10 and the heat dissipation side plate 30 are made of metal, so that the mounting base plate 10 and the heat dissipation side plate 30 have sufficient thermal conductivity and can also dissipate heat, further improving the heat dissipation capacity of the chassis structure.
[0033] The heat dissipation side plate 30 is brazed to the mounting base plate 10 to ensure that the heat dissipation side plate 30 and the mounting base plate 10 have sufficient connection strength, while ensuring that the heat generated by the mounting base plate 10 can be efficiently transferred to the heat dissipation side plate 30.
[0034] Combination Figure 2 The heat pipe 40 is embedded in the upper end of the mounting substrate 10 and the inner side of the heat dissipation side plate 30. At the same time, the heat pipe 40 is sintered with metal powder in the upper end of the mounting substrate 10 and the inner side of the heat dissipation side plate 30, so that the heat pipe 40 can efficiently absorb the heat of the mounting substrate 10 and efficiently transfer it to the heat dissipation side plate 30, thereby improving the heat dissipation efficiency.
[0035] It should be understood that the mounting base plate 10 and the heat dissipation side plate 30 form an upward-facing U-shaped structure. Both the upper end of the mounting base plate 10 and the inner side of the heat dissipation side plate 30 have longitudinally arranged mounting grooves for accommodating the heat pipe 40. The heat pipe 40 is installed in the mounting groove and sintered into the mounting groove using metal powder (such as aluminum powder). Correspondingly, a guide rail groove is also provided laterally on the mounting base plate 10. The guide rail groove is used to accommodate the guide protrusion of the board module 20, and the bottom of the guide rail groove should be higher than the upper side of the end of the heat pipe 40 located inside the mounting base plate 10 to avoid damage to the heat pipe 40 when installing the board module 20.
[0036] In addition, in this embodiment, the heat pipe 40 is an L-shaped heat pipe, and multiple heat pipes are arranged side by side. The two adjacent heat pipes 40 are arranged alternately, that is, the horizontal sections of the two adjacent heat pipes 40 are arranged on the mounting base plate 10 with an adjacent interval, while their vertical sections are arranged on the corresponding heat dissipation side plates 30, thereby ensuring uniform heat dissipation.
[0037] Recombined Figure 1 This embodiment also includes: a rear backplate 60, surrounding the rear side of the mounting base plate 10 and the two heat dissipation side plates 30; and an upper cover plate 70, covering the upper ends of the rear backplate 60 and the two heat dissipation side plates 30. The cavity formed by the mounting base plate 10, the two heat dissipation side plates 30, the rear backplate 60, and the upper cover plate 70 can accommodate multiple board modules 20 to ensure that the chassis structure can provide sufficient protection for the board modules 20.
[0038] It is understandable that the mounting base plate 10, heat dissipation side plate 30, rear back plate 60, and top cover plate 70 are combined to form a front-opening enclosure structure, so that the board module 20 can be installed into the enclosure from the front opening. In this embodiment, the mounting base plate 10, heat dissipation side plate 30, rear back plate 60, and top cover plate 70 are all brazed together to form a whole, eliminating the traditional crossbeam guide rail design, thereby simplifying the enclosure structure and reducing material and assembly time costs.
[0039] Combination Figure 3 It is known that the natural radiator 50 is a plate-shaped radiator with multiple heat dissipation fins arranged in an array, which can efficiently dissipate heat naturally. Of course, a convection-type natural radiator can also be used.
[0040] In summary, the integrated heat pipe chassis structure provided in this embodiment includes a mounting base plate 10, a heat dissipation side plate 30, a heat-conducting heat pipe 40, and a natural heat sink 50. The mounting base plate 10 is used to mount the board module 20, allowing the heat generated by the board module to be transferred to the mounting base plate 10. The heat dissipation side plate 30 is mounted at one end of the mounting base plate 10. The heat-conducting heat pipe 40 is laid on the upper end of the mounting base plate 10 and the inner side of the heat dissipation side plate 30, thereby efficiently transferring the heat generated by the board module 20 to the heat dissipation side plate 30, thus achieving efficient heat dissipation for the board module 20. The natural heat sink 50 is mounted on the outer side of the heat dissipation side plate 30, thereby achieving natural heat dissipation through self-heating.
[0041] In summary, the integrated heat pipe chassis structure provided in this embodiment dissipates heat to the board module 20 and the chassis body through the heat pipe substrate, resulting in high heat dissipation efficiency. It does not require a cooling fan, eliminating fan noise. It also features long equipment life, no need for internal power supply, and high reliability, thereby improving the efficiency of chassis cooling in nuclear systems.
[0042] Example 2 Combination Figure 1 This embodiment provides an electronic device, including: the chassis structure with integrated heat pipe described in Embodiment 1; multiple board modules 20, each of which is arranged parallel to the heat dissipation side plate 30, and the multiple board modules 20 are arranged longitudinally on the mounting base plate 10.
[0043] Understandably, most computer cases currently use rear-out signal cables, which makes later repairs difficult for applications with limited rear maintenance space.
[0044] In this embodiment, the wiring ports 21 of the board module 20 are all located on the panel of the board module 20 to enable wiring from the front of the chassis, which is suitable for working conditions where the maintenance space at the rear of the chassis is limited.
[0045] Combination Figure 4 The board module 20 includes: a board box 22, which is a hollow metal shell structure, and an electronic chip 25 is installed inside; a heat dissipation substrate 23, which covers the box cover side of the board box 22; and a heat-conducting protrusion 24, with its two ends respectively attached to the inner sidewall of the corresponding electronic chip 25 and the heat dissipation substrate 23, so as to ensure that the heat generated by the electronic chip 25 can be quickly transferred to the chassis structure.
[0046] It is understood that the sides of the board enclosure 22 and the heat dissipation substrate 23 are provided with heat dissipation holes to ensure that the board enclosure 22 has sufficient heat dissipation capacity.
[0047] In summary, the electronic device provided in this embodiment has a board module 20 installed in the aforementioned chassis structure. The heat pipe 40 can efficiently transfer the heat generated by the board module 20 to the heat dissipation side plate 30, thereby efficiently dissipating heat from the board module 20. The natural heat sink 50 is installed on the outside of the heat dissipation side plate 30, and then the device can dissipate heat naturally through the self-heating heat sink. This not only has high heat dissipation efficiency, but also does not require a cooling fan, eliminating the noise caused by a fan. It has the characteristics of long device life, no need for internal power supply, and high reliability, and can improve the efficiency of chassis cooling in nuclear systems.
[0048] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.
Claims
1. An integrated heat pipe case structure, characterized by comprising: include: Mounting substrate (10), the mounting substrate (10) is used to mount board module (20); A heat dissipation side plate (30) is mounted on one end of the mounting base plate (10); Multiple heat pipes (40) are arranged in parallel. The heat pipes (40) are laid on the upper end of the mounting base plate (10) and the inner side of the heat dissipation side plate (30), and can transfer the heat generated by the board module (20) to the heat dissipation side plate (30). Natural radiator (50), which is installed on the outside of the heat dissipation side plate (30).
2. The integrated heat pipe case structure according to claim 1, wherein Two heat dissipation side plates (30) are provided, and the two heat dissipation side plates (30) are respectively located at both ends of the mounting base plate (10) in the length direction, and the natural heat sink (50) is installed on both heat dissipation side plates (30).
3. The integrated heat pipe case structure according to claim 2, wherein Both the mounting base plate (10) and the heat dissipation side plate (30) are made of metal.
4. The integrated heat pipe case structure according to claim 3, wherein The heat dissipation side plate (30) is brazed to the mounting base plate (10).
5. The integrated heat pipe case structure according to claim 3, wherein The heat pipe (40) is embedded in the upper end of the mounting substrate (10) and the inner side of the heat dissipation side plate (30), and the heat pipe (40) is sintered with metal powder in the upper end of the mounting substrate (10) and the inner side of the heat dissipation side plate (30).
6. The integrated heat pipe case structure of claim 2, wherein Also includes: The rear panel (60) surrounds the rear side of the mounting base plate (10) and the two heat dissipation side panels (30); The upper cover (70) covers the upper ends of the rear back plate (60) and the two heat dissipation side plates (30); The cavity formed by the mounting base plate (10), the two heat dissipation side plates (30), the back plate (60) and the top cover plate (70) can accommodate multiple board modules (20).
7. An electronic device, comprising: include: The chassis structure of the integrated heat pipe as described in any one of claims 1 to 6; Multiple board modules (20) are provided, each board module (20) is arranged parallel to the heat dissipation side plate (30), and the multiple board modules (20) are arranged longitudinally on the mounting base plate (10).
8. The electronic device of claim 7, wherein, The wiring ports (21) of the board module (20) are all located on the panel of the board module (20).
9. The electronic device of claim 7, wherein, The board module (20) includes: The board box (22) is a hollow metal shell structure, and an electronic chip (25) is installed inside. The heat dissipation substrate (23) is covered on the cover side of the board box (22); The heat-conducting protrusion (24) is attached at both ends to the inner sidewalls of the corresponding electronic chip (25) and the heat dissipation substrate (23).
10. The electronic device of claim 9, wherein, Both the side of the board box (22) and the heat dissipation substrate (23) are provided with heat dissipation holes.