A light source assembly
By setting an isolation section between the mounting hole and the die bonding area, the contact area between the encapsulant layer and the substrate is enhanced, solving the problem of encapsulant layer detachment caused by fastener tightening, and improving the stability of LED chips and product yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU JUFEI OPTOELECTRONICS CO LTD
- Filing Date
- 2025-08-12
- Publication Date
- 2026-08-04
AI Technical Summary
During the LED chip manufacturing process, if the fasteners are tightened with excessive torque or are not up to the proper specifications, the adhesive layer on the substrate surface may delaminate from the substrate, causing the LED chip to lift up and fail.
An isolation section is provided between the mounting hole and the die bonding area to increase the contact area between the sealant layer and the substrate, thereby enhancing the bonding force between the two and preventing the sealant layer from detaching from the substrate due to tightening the fasteners.
It improves the adhesion between the encapsulation layer and the substrate, reduces the risk of the encapsulation layer detaching from the substrate, avoids damage to the LED chip, and improves the product yield.
Smart Images
Figure CN224596895U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, specifically to a light source component. Background Technology
[0002] In the production process of LED light sources, LED chips are transferred or die-bonded onto a substrate, and then colloid is cured on the surface of the substrate and covers the surface of the LED chip to form an adhesive layer, which can resist the erosion of external factors such as moisture and dust and protect the LED chip.
[0003] Areas on the substrate where no LED chips are located are usually provided with through holes. Fasteners are used to fix the display product by passing through the through holes and screwing them onto the component to be fixed. However, if the torque of the fastener is too high or the fastener specifications are not suitable, the adhesive layer on the substrate surface may be twisted and delaminated from the substrate. In severe cases, the LED chip may be pulled off the substrate along with the peeling adhesive layer, resulting in LED chip failure. Utility Model Content
[0004] This application aims to provide a light source component to improve the adhesion between the encapsulation layer and the substrate, thereby preventing LED chip failure due to encapsulation layer detachment.
[0005] This application provides a light source assembly, including:
[0006] A substrate, wherein a mounting area and a die-bonding area are provided on the same side of the substrate, the mounting area is provided with a mounting hole and an isolation portion, at least a portion of the isolation portion is located between the mounting hole and the die-bonding area; the mounting hole is used to be penetrated and fixed to the area to be mounted by a fastener;
[0007] A light-emitting chip, wherein the light-emitting chip is disposed in the die-bonding region;
[0008] An encapsulating layer is disposed on the die-bonding region and the mounting region of the substrate and covers the light-emitting chip;
[0009] The isolation portion is used to increase the contact area with the sealant layer disposed on the substrate, so as to increase the bonding force between the substrate and the sealant layer.
[0010] In some embodiments, along a direction perpendicular to the mounting region to the die-bonding region, the distance between the two distal ends of the isolation portion relative to its center is greater than or equal to the diameter of the mounting hole.
[0011] In some embodiments, the distance between the isolation portion and the die-bonding region is between 0.5 mm and 10 mm.
[0012] In some embodiments, the shape of the isolation portion is at least one of a straight line, a curved line, or a ring.
[0013] In some embodiments, the annular-shaped isolation portion surrounds the periphery of the mounting hole.
[0014] In some embodiments, along the direction from the mounting area to the die-bonding area, the projection area of the mounting hole coincides with the projection area of the isolation portion.
[0015] In some embodiments, the isolation portion is an isolation groove with a groove-shaped structure disposed in the installation area, and the cross-sectional shape of the isolation groove is rectangular.
[0016] In some embodiments, the depth of the isolation trench is between 5% and 70% of the thickness of the substrate.
[0017] In some embodiments, the width of the isolation groove along the direction from the mounting area to the die-bonding area is between 0.1 mm and 5 mm.
[0018] In some embodiments, a plurality of light-emitting chips are provided, and an array of the plurality of light-emitting chips is provided in the die-bonding region.
[0019] According to the light source assembly of the above embodiment, the isolation portion can ensure that the encapsulating layer can adhere to the isolation portion, increase the contact area with the substrate, and improve the bonding force between the encapsulating layer and the substrate between the mounting hole and the die bonding area. This reduces or avoids the risk of the encapsulating layer between the mounting hole and the die bonding area detaching from the substrate due to tightening the fasteners, further avoids damage to the light-emitting chip, and improves the product yield. Attached Figure Description
[0020] Figure 1 A front view of the light source assembly provided in this application;
[0021] Figure 2 A cross-sectional view of the light source assembly provided in this application;
[0022] Figure 3 This is a front view of the substrate in the light source assembly provided in this application;
[0023] Figure 4 A cross-sectional view of the substrate in the light source assembly provided in this application;
[0024] Figure 5 A front view of the substrate in the light source assembly provided in this application in a first embodiment;
[0025] Figure 6 A front view of the substrate in the light source assembly provided in this application in a second embodiment;
[0026] Figure 7 A front view of the substrate in the light source assembly provided in this application in a third embodiment.
[0027] Figure label:
[0028] The light source assembly 100 includes a substrate 10, a first surface 11, a mounting area 111, a mounting hole 1111, an isolation portion 1112, an isolation groove 11120, a distal end 11121, a die-bonding area 112, a second surface 12, a light-emitting chip 20, and an encapsulating layer 30. Detailed Implementation
[0029] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.
[0030] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments, and the operational steps involved in each embodiment can also be rearranged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for clearly describing a particular embodiment and do not imply that they represent the necessary components and / or order.
[0031] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).
[0032] The LED chips in LED light source products can be, for example, micron-sized Micro LED or Mini LED chips. LED light source products made from these chips can be used as decorative light sources or backlights for displays, such as in automotive backlighting panels for a decorative purpose. These LED light source products are fixed to the installation location by screws through through-holes in the substrate; for example, as automotive backlights installed in the car's headliner, or as backlights for displays installed on the rear of the screen. However, due to screw specifications or the torque applied when tightening the screws, the adhesive layer on the LED chip surface can easily peel off, and in severe cases, this can pull the LED chip detach from the substrate, leading to LED chip failure.
[0033] To address the aforementioned issues, this application provides a light source assembly that increases the contact area of the encapsulant layer between the mounting hole and the die-bonding area by providing an isolation portion between them. This enhances the adhesion of the encapsulant layer to the substrate between the mounting hole and the die-bonding area, thereby reducing or preventing the encapsulant layer from lifting due to insufficient adhesion when tightening fasteners inserted into the mounting hole.
[0034] See Figures 1-4 As shown, the light source assembly 100 provided in this application includes a substrate 10, a light-emitting chip 20, and an encapsulating layer 30. The substrate 10 has a mounting area 111 and a die-bonding area 112 on the same side. The substrate 10 is in the shape of a plate and has a first surface 11 and a second surface 12. Generally, the first surface 11 can be considered as the front side of the substrate 10 and the second surface 12 as the back side of the substrate 10. The mounting area 111 and the die-bonding area 112 are disposed on the first surface 11 of the substrate 10.
[0035] like Figure 1 and Figure 2 As shown, the light-emitting chip 20 is disposed in the die-bonding region 112. The light-emitting chip 20 can emit light under the action of electrical energy. The encapsulating layer 30 is disposed in the die-bonding region 112 and the mounting region 111 of the substrate 10 and covers the light-emitting chip 20.
[0036] In this embodiment, multiple light-emitting chips 20 can be provided, and multiple light-emitting chips 20 can form a light-emitting chip array, such as... Figure 1 As shown, a rectangular array of multiple light-emitting chips 20 is used. The connection method of the multiple light-emitting chips 20 can be flexibly set according to the needs of series, parallel or series-parallel connection to meet different application scenarios such as backlight display or lighting decoration. The encapsulation layer 30 covering the light-emitting chips 20 can isolate moisture, dust and other substances to avoid problems such as corrosion, damage and short circuit of the light-emitting chips 20.
[0037] The light-emitting chip 20 can be an LED chip, for example, a Micro LED chip or Mini LED chip with micron-scale size and self-emissive characteristics. The size of the light-emitting chip 20 is between 50μm and 200μm. It is assembled into the die-bonding region 112 of the light source component 10 to form a high-density light-emitting chip array. Since the size of the light-emitting chip is on the micron scale, it has the advantage of high integration.
[0038] The substrate 10 is typically made of an insulating material. It should be understood that the substrate 10 can be a rigid substrate, for example, made of, but not limited to, phenolic paper laminate, epoxy paper laminate, polyester glass mat laminate, epoxy glass cloth laminate, BT resin board, etc. The substrate 10 can also be a flexible substrate, for example, made of, but not limited to, polyester film, polyimide film, fluorinated ethylene propylene film, etc. As the mounting structure for the light-emitting chip 20, the substrate 10 typically has a driving circuit, etc., printed on it to ensure that the light-emitting chip 20 can emit light under electrical energy. This driving circuit electrically connects the light-emitting chip 20 to a power source to drive the light-emitting chip 20 to emit light under electrical energy.
[0039] The encapsulating layer 30 is an adhesive layer, and its encapsulation method is divided into two types: Panel On Board (POB) and Chip On Board (COB). POB encapsulation involves first encapsulating the LED chip into a lamp bead and then attaching it to the light source assembly; COB encapsulation involves directly attaching the chip to the light source assembly and then performing overall encapsulation. The encapsulating layer 30 in this application preferably adopts COB encapsulation technology. The light-emitting chip 20 can emit light under electrical drive, and the encapsulating layer 30 should have light-transmitting and diffusing functions, allowing the light emitted by the light-emitting chip 20 to penetrate the encapsulating layer 30 and diffuse.
[0040] In view of the light transmittance and diffusion characteristics of the encapsulation layer 30, the encapsulation layer 30 can be made of a colloid made of materials such as transparent adhesive, polystyrene, and polymethyl methacrylate. The transparent adhesive has the characteristics of good light transmittance and curability, such as epoxy resin. Specifically, materials such as polystyrene and polymethyl methacrylate can be mixed with transparent adhesive to form a colloid with diffusion effect. The colloid is bonded to the first surface 11 of the substrate 10 by spraying adhesive, and can form an integral structure with the substrate 10 and the light-emitting chip 20. After the colloid is cured, the encapsulation is completed, and the encapsulation layer 30 is formed.
[0041] See also Figures 1-4 As shown, in the light source assembly 100 provided in this application, the mounting area 111 is provided with a mounting hole 1111 and an isolation portion 1112. The mounting hole 1111 penetrates the substrate 10, and at least a portion of the isolation portion 1112 is located between the mounting hole 1111 and the die-bonding area 112. It should be understood that the isolation portion 1112 being formed between the mounting hole 1111 and the die-bonding area 112 means that, along the same direction, the projection area of the mounting hole 1111 onto the die-bonding area 112 coincides with the projection area of the isolation portion 1112 onto the die-bonding area 112.
[0042] Mounting holes 1111 are used for fasteners to penetrate and fix the light source assembly 100 to the area to be installed. Depending on the application of the light source assembly 100, the area to be installed can be a vehicle trim part, a backlight mounting part of a display, etc. The fasteners can be bolts or self-tapping screws. After the fasteners penetrate the mounting holes 1111, they are screwed into the area to be installed to fix the light source assembly 100 to the area to be installed.
[0043] The isolation portion 1112 is used to increase the contact area with the sealant layer 30 disposed on the substrate 10, so as to increase the bonding force between the substrate 10 and the sealant layer 30.
[0044] The isolation portion 1112 can be a protruding structure protruding from the first surface 11 of the substrate 10, or a recessed structure recessed from the first surface 11 of the substrate 10. The encapsulating layer 30 disposed on the first surface 11 of the substrate 10 can be attached to the isolation portion 1112, increasing the contact area with the first surface 11 of the substrate 10 and improving the bonding force between the encapsulating layer 30 between the mounting hole 1111 and the die bonding area 112 and the first surface 11 of the substrate 10. This configuration can reduce or avoid the risk of the encapsulating layer 30 between the mounting hole 1111 and the die bonding area 112 detaching from the first surface 11 of the substrate 10 due to tightening the fasteners. It further avoids the problem of the encapsulating layer 30 falling off during tightening of the fasteners causing the light-emitting chip 20 to detach from the substrate 10 and damage the light-emitting chip 20, thereby improving the product yield.
[0045] See Figure 3 As shown, the direction from the mounting area 111 to the die-bonding area 112 is the negative direction of the Y-axis, and the direction perpendicular to the mounting area 111 to the die-bonding area 112 is the positive direction of the X-axis. Along the direction perpendicular to the mounting area 111 to the die-bonding area 112, the isolation portion 1112 has two distal ends 11121 relative to its center. The two distal ends 11121 are located at the ends farthest from the center of the isolation portion 1112 along the positive and negative directions of the X-axis, respectively. The distance between the two distal ends 11121 is greater than or equal to the diameter of the mounting hole 1111, which ensures that at least part of the isolation portion 1112 is located between the mounting area 1111 and the die-bonding area 112.
[0046] like Figure 3 As shown, along the direction from the mounting area 111 to the die-bonding area 112 (negative Y-axis direction), the width of the isolation portion 1112 is between 0.1mm and 5mm. The cross-section of the isolation portion 1112 can be of any shape. A larger width can ensure that the sealant layer 30 attached to the isolation portion 1112 has sufficient adhesion.
[0047] In this application, the isolation section 1112 is linear in shape (e.g., ...). Figure 1 and Figure 3 As shown), curved type (such as...) Figure 5 and Figure 6 As shown), ring-shaped (such as) Figure 7 At least one of the following (shown): For the curved isolation portion 1112, it can be an arc shape, a wave shape, a mixture of arc and wave shapes, etc. The shape of the isolation portion 1112 only needs to satisfy that at least a portion of the isolation portion 1112 is located between the mounting hole 1111 and the die bonding region 112, and is not limited here.
[0048] like Figure 7 As shown, the annular isolation portion 1112 surrounds the periphery of the mounting hole 1111, significantly improving the adhesion between the sealant layer 30 between the periphery of the mounting hole 1111 and the isolation portion 1112 and the first surface 11 of the substrate 10.
[0049] like Figure 1 , Figure 3 and Figures 5-7 As shown, along the direction from the mounting area 111 to the die-bonding area 112, the projection area of the mounting hole 1111 onto the die-bonding area 112 coincides with the projection area of the isolation portion 1112 onto the die-bonding area 112, so as to ensure that at least part of the isolation portion 1112 is located between the mounting hole 1111 and the die-bonding area 112.
[0050] like Figure 2 and Figure 4 As shown, the isolation portion 1112 is an isolation groove 11120 with a groove-shaped structure provided in the mounting area 111. In other words, the isolation portion 1112 is a groove structure recessed from the first surface 11 of the substrate 10. This arrangement ensures that the first surface 11 of the substrate 10 is formed in a flat state, so as to avoid interference with the installation of other structures of the product.
[0051] The preferred cross-sectional shape of the isolation groove 11120 is rectangular. A rectangular isolation groove 11120 can be formed using a machine tool, facilitating product processing and reducing the manufacturing difficulty. The sealant layer 30 attached to the first surface 11 can adhere to the bottom and side walls of the isolation groove 11120. The rectangular isolation groove 11120 allows for a large contact area with the sealant layer 30, resulting in a strong bond between the isolation groove 11120 and the sealant layer 30. Of course, the cross-sectional shape of the isolation groove 11120 can also be other shapes that meet the requirements of the manufacturing process and bonding strength; this invention does not impose specific limitations on this.
[0052] The thickness of substrate 10 is the distance between its first surface 11 and its second surface 12, such as... Figure 4As shown, the depth H of the isolation trench 11120 is between 5% and 70% of the thickness of the substrate 10. On the one hand, this ensures that the isolation trench 11120 has a certain depth, increasing the contact area between the sealant layer 30 and the bottom and side walls of the isolation trench 11120. On the other hand, the isolation trench 11120 keeps the mounting area 111 and the die bonding area 112 continuous, thus ensuring the structural strength of the substrate 10.
[0053] like Figure 3 As shown, the distance L between the isolation groove 11120 and the die-bonding area 112 is between 0.5mm and 10mm. In a preferred embodiment, this distance is the shortest distance between the side of the isolation portion 1112 near the die-bonding area 112 and the side of the die-bonding area 112 near the isolation portion 1112. Since the mounting hole 1111 penetrates the first surface 11 and the second surface 12 of the substrate 10, setting the distance between 0.5mm and 10mm further ensures the strength of the substrate 10.
[0054] In summary, the isolation portion provided in this application ensures that the encapsulating layer can adhere to the isolation portion, increasing the contact area with the substrate and improving the bonding force between the encapsulating layer and the substrate between the mounting hole and the die bonding area. This reduces or avoids the risk of the encapsulating layer between the mounting hole and the die bonding area detaching from the substrate due to tightening fasteners, further preventing damage to the light-emitting chip and improving product yield.
[0055] The above-described specific examples are for illustrative purposes only and are not intended to limit the scope of this invention. Those skilled in the art to which this invention pertains can make various simple deductions, modifications, or substitutions based on the concept of this invention.
Claims
1. A light source assembly, characterized by include: A substrate, wherein a mounting area and a die-bonding area are provided on the same side of the substrate, the mounting area is provided with a mounting hole and an isolation portion, at least a portion of the isolation portion is located between the mounting hole and the die-bonding area; the mounting hole is used to be penetrated and fixed to the area to be mounted by a fastener; A light-emitting chip, wherein the light-emitting chip is disposed in the die-bonding region; An encapsulating layer is disposed on the die-bonding region and the mounting region of the substrate and covers the light-emitting chip; The isolation portion is used to increase the contact area with the sealant layer disposed on the substrate, so as to increase the bonding force between the substrate and the sealant layer.
2. The light source assembly of claim 1, wherein, Along a direction perpendicular to the mounting area to the die-bonding area, the distance between the two distal ends of the isolation portion relative to its center is greater than or equal to the diameter of the mounting hole.
3. The light source assembly of claim 1, wherein, Along the direction from the mounting area to the die-bonding area, the width of the isolation portion is between 0.1 mm and 5 mm.
4. The light source assembly of claim 1, wherein, The shape of the isolation section is at least one of the following: straight, curved, and ring-shaped.
5. The light source assembly of claim 4, wherein the light source assembly is configured to be mounted to a printed circuit board. The annular-shaped isolation portion surrounds the periphery of the mounting hole.
6. The light source assembly of claim 1, wherein, Along the direction from the mounting area to the die-bonding area, the projection area of the mounting hole coincides with the projection area of the isolation portion.
7. A light source assembly according to any one of claims 1-6, characterized in that The isolation section is a groove-shaped isolation groove disposed in the installation area, and the cross-sectional shape of the isolation groove is rectangular.
8. The light source assembly of claim 7, wherein the light source assembly is configured to be mounted to a printed circuit board. The depth of the isolation trench is between 5% and 70% of the thickness of the substrate.
9. The light source assembly of claim 7, wherein the light source assembly is configured to be mounted on a printed circuit board. The distance between the isolation groove and the die-bonding region is between 0.5 mm and 10 mm.
10. The light source assembly of claim 1, wherein, The light-emitting chips are provided in multiple ways, and the array of multiple light-emitting chips is provided in the die-bonding region.