Replaceable gas nozzle for semiconductor processing

Abstract

This utility model relates to the field of semiconductor processing equipment technology, and discloses a replaceable gas nozzle for semiconductor processing, including a gas pipe and a cavity. The gas pipe is connected to the cavity via a disassembly mechanism. A control mechanism is provided inside the cavity. The disassembly mechanism includes a connecting ring. The outer left end of the connecting ring is fixedly connected to one end of the gas pipe. A mating nozzle is fixedly connected to the inner side of the outer right end of the connecting ring. A control ring is rotatably connected to the outer side of the connecting ring. Multiple support blocks are fixedly connected to the outer right end of the connecting ring. In this utility model, the mating nozzle is positioned within a limiting groove in the cavity and adjusted within a sliding groove. This, combined with the cavity pressing against the sealing gasket inside the connecting ring, achieves precise alignment and high airtightness during nozzle assembly, stable fixation after assembly, and rapid separation during disassembly. This improves equipment maintenance efficiency and shortens nozzle replacement time.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, and in particular to a replaceable gas nozzle for semiconductor processing. Background Technology

[0002] The fabrication of integrated circuits involves numerous processes on the substrate in a processing chamber, such as deposition and etching. For example, chemical vapor deposition (CVD) processes require precise delivery of gas to the substrate surface to form a uniform thin film. Certain high-density plasma (HDP) enhanced CVD processes have even higher requirements for gas flow rate, pressure, and uniformity, necessitating high-performance gas nozzles. A typical semiconductor processing gas nozzle consists of a nozzle body, a connecting mechanism, and a sealing mechanism. The nozzle body serves as the core channel structure for gas injection. The connecting mechanism uses threads or flanges, with one end fixedly connected to the gas delivery pipeline and the other end precisely aligned with the nozzle body. The sealing mechanism typically has an elastic seal at the connection point between the connecting mechanism, the nozzle body, and the pipeline. The seal fills the interface gap by compressing and deforming the seal, blocking process gas leakage and preventing external air and impurities from entering the gas system. In existing technologies, during nozzle replacement and maintenance, the lack of a precise positioning structure between the connecting mechanism and the nozzle body makes it easy for operational errors to cause misalignment during nozzle replacement and assembly. This not only compromises the airtightness of the gas path but may also alter the gas injection direction and distribution, affecting subsequent process performance. Furthermore, the disassembly process of existing connecting mechanisms is cumbersome, requiring specialized tools to gradually remove fixed components, resulting in lengthy nozzle replacement times and significantly reducing equipment maintenance efficiency. Therefore, a replaceable gas nozzle for semiconductor processing is proposed to address these issues. Utility Model Content

[0003] To overcome the above shortcomings, this utility model provides a replaceable gas nozzle for semiconductor processing, aiming to improve the problems of misalignment, poor gas sealing performance, and cumbersome disassembly during the assembly of existing gas nozzles, which result in low equipment maintenance efficiency and long nozzle replacement time.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: A replaceable gas nozzle for semiconductor processing includes a gas tube and a cavity, wherein the gas tube is connected to the cavity via a disassembly mechanism and a control mechanism is provided inside the cavity. The disassembly mechanism includes a connecting ring, the outer left end of which is fixedly connected to one end of the trachea, a docking nozzle fixedly connected to the inner side of the outer right end of the connecting ring, a control ring rotatably connected to the outer side of the connecting ring, multiple support blocks fixedly connected to the outer right end of the connecting ring, each support block having a return spring sleeved inside, multiple sliding pillars slidably connected inside the connecting ring, each sliding pillar having a stop plate fixedly connected to an adjacent side, a sealing gasket fixedly connected to the inner side of the outer side of the connecting ring, and a cavity assembly installed inside the docking nozzle. As a further description of the above technical solution: The control mechanism includes a limiting groove, the outside of which is opened on the side of the cavity near the trachea, and the inside of the cavity near the limiting groove is provided with a sliding groove. A controller is fixedly connected to the top of the cavity, and a valve core is fixedly connected to the output end of the controller. Multiple flow control ports are provided inside the valve core. As a further description of the above technical solution: The cavity is threadedly connected to a nozzle at one end away from the air pipe, and an air outlet is fixedly connected to the other end of the nozzle. As a further description of the above technical solution: The cavity assembly includes a flow cavity and a docking cavity. The outside of the flow cavity is opened inside the docking nozzle, and the outside of the docking cavity is opened inside the cavity body. The outside of the flow cavity is connected to the outside of the docking cavity. As a further description of the above technical solution: The valve core is externally rotatably connected to the inside of the cavity, and the two ends of the flow control port are interconnected with the two ends of the cavity; As a further description of the above technical solution: The side of the abutment is snapped onto the outside of the cavity, and the cavity, i.e., the end near the trachea, is supported on the outside of the sealing gasket. As a further description of the above technical solution: The outer surface of the mating nozzle is slidably connected to the inside of the limiting groove, and the outer surface of the mating nozzle is rotatably connected to the inside of the sliding groove. As a further description of the above technical solution: The control ring is internally slidably connected to the opposite side of the slide column, and one end of the return spring is fixedly connected to the outside of the abutment plate.

[0005] This utility model has the following beneficial effects: 1. In this utility model, the nozzle is positioned in the limiting groove of the cavity and adjusted in the sliding groove. It works in conjunction with the sealing gasket on the inner side of the cavity pressing connecting ring. The outer control ring of the connecting ring is rotated, causing it to slide and engage with the sliding column. The rotational motion is converted into the linear motion of the sliding column, so that the abutment plate on the side of the sliding column approaches the cavity. The return spring in the support block deforms and stores energy. The control ring is rotated in the opposite direction to reset, and the return spring releases energy to pull the abutment plate, causing the sliding column to slide in the opposite direction, so that the abutment plate is separated from the cavity. This achieves precise docking and high airtight sealing during nozzle assembly, stable fixation after assembly, and rapid separation during disassembly, thereby improving equipment maintenance efficiency and shortening nozzle replacement time.

[0006] 2. In this utility model, the cooperation between the limiting groove and the sliding groove allows the nozzle to be precisely positioned within the limiting groove and slightly rotated within the sliding groove, preventing misalignment between the nozzle and the cavity during installation, which could lead to obstruction or leakage of gas transmission. Simultaneously, the sliding cooperation between the nozzle and the limiting groove allows for easy insertion or removal of the nozzle from the cavity. With the cooperation of the controller and the valve core, the controller can accurately drive the valve core to rotate smoothly within the cavity after receiving a signal. Furthermore, the connection between the flow control port and the cavity allows gas to pass smoothly through the valve core, thus solving the problems of easy misalignment during nozzle installation, inconvenient disassembly and assembly, and inaccurate gas flow regulation. Attached Figure Description

[0007] Figure 1 This is a three-dimensional schematic diagram of the replaceable gas nozzle for semiconductor processing proposed in this utility model; Figure 2 This is a schematic diagram of the connecting nozzle of the replaceable gas nozzle for semiconductor processing proposed in this utility model. Figure 3 This is a schematic diagram of the cavity structure for the replaceable gas nozzle for semiconductor processing proposed in this utility model; Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 This is a schematic diagram of the abutment plate for the replaceable gas nozzle used in semiconductor processing proposed in this utility model.

[0008] Legend: 1. Trachea; 2. Cavity; 3. Disassembly mechanism; 31. Connecting ring; 32. Connecting nozzle; 33. Control ring; 34. Support block; 35. Return spring; 36. Sliding column; 37. Support plate; 38. Sealing gasket; 39. Cavity assembly; 391. Flow cavity; 392. Docking cavity; 4. Control mechanism; 41. Limiting groove; 42. Sliding groove; 43. Controller; 44. Valve core; 45. Flow control port; 46. Nozzle; 47. Air jet port. Detailed Implementation

[0009] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0010] Example: Replaceable gas nozzles for semiconductor processing, see reference Figure 1 , Figure 3 and Figure 4 It includes a trachea 1 and a cavity 2. The trachea 1 is connected to the cavity 2 through a disassembly mechanism 3. The trachea 1 serves as the initial channel for gas delivery and can stably receive the gas source of semiconductor processing equipment technology, ensuring that the processing gas is transmitted to the cavity 2. The cavity 2 is equipped with a control mechanism 4, and the cavity 2 provides a closed and stable installation space for the control mechanism 4. The disassembly mechanism 3 includes a connecting ring 31. The outer left end of the connecting ring 31 is fixedly connected to one end of the trachea 1. The connecting ring 31 serves as the component connecting the trachea 1 and the cavity 2, enabling precise docking between the two. A docking nozzle 32 is fixedly connected to the inner side of the outer right end of the connecting ring 31. The docking nozzle 32 can penetrate deep into the cavity 2, forming a guiding channel for gas transmission, ensuring that the gas in the trachea 1 can directionally enter the cavity 2. A control ring 33 is rotatably connected to the outside of the connecting ring 31. The control ring 33 can drive the sliding column 36 to move by rotating, providing convenient operation for locking and unlocking the disassembly mechanism 3. Multiple support blocks 34 are fixedly connected to the outer right end of the connecting ring 31. The support blocks 34 provide stable mounting support for the return spring 35, preventing the return spring 35 from shifting during extension and retraction. Each support block 34 is fitted with a return spring 35. The return spring 35 can provide continuous tension to the abutment 37 through its own elastic deformation, ensuring that the abutment 37 is stably moved away from the cavity 2 when opened. Multiple sliding pillars 36 are slidably connected inside the connecting ring 31. The sliding pillars 36 can slide within the connecting ring 31, driving the abutment 37 to lock and release the cavity 2. A stop plate 37 is fixedly connected to each adjacent side of the cavity 2. The stop plate 37, through its engagement with the cavity 2, can stably fix the cavity 2 and the connecting ring 31. A sealing gasket 38 is fixedly connected to the inner side of the outer side of the connecting ring 31. The sealing gasket 38 can fill the gap between the connecting ring 31 and the cavity 2 to achieve a high airtight seal. A cavity assembly 39 is installed inside the nozzle 32. The adjacent side of the stop plate 37 is engaged with the outer side of the cavity 2. Through the engagement action of the stop plate 37, the cavity 2 and the disassembly mechanism 3 can be quickly fixed, shortening the nozzle replacement time. The end of the cavity 2 that is close to the air tube 1 is supported by the sealing gasket 39. The cavity 2 compresses the gasket 38 outside the sealing gasket 38, further enhancing the sealing effect of the gasket 38 and ensuring no leakage during gas transmission. The control ring 33 is internally slidably connected to the opposite side of the slide column 36. The sliding cooperation between the control ring 33 and the slide column 36 can convert the rotational motion of the control ring 33 into the linear motion of the slide column 36, realizing convenient operation of the disassembly mechanism 3. One end of the return spring 35 is fixedly connected to the outside of the back plate 37. The fixed connection between the return spring 35 and the back plate 37 can ensure that the elastic force of the return spring 35 can directly act on the back plate 37. Specifically, the trachea 1 is connected to the cavity 2 via the disassembly mechanism 3, which can stably receive the equipment's gas source and deliver the processed gas to the cavity 2. The control mechanism 4 inside the cavity 2 can operate stably within its enclosed space. The connecting ring 31 of the disassembly mechanism 3 connects the trachea 1 and the cavity 2. After the docking nozzle 32 on its right inner side penetrates into the cavity 2, it can guide the gas in the trachea 1 to enter the cavity 2 in a directional manner. When the control ring 33 outside the connecting ring 31 rotates, it can drive the sliding column 36, which facilitates the locking and unlocking of the disassembly mechanism 3. The support block 34 on the right outer side of the connecting ring 31 can fix the return spring 35 to prevent the return spring 35 from shifting when it extends or retracts. When the sliding column 36 inside the connecting ring 31 slides, it can drive the abutment plate 37. This allows for the locking or unlocking of the cavity 2. After the abutment plate 37 on the side of the sliding column 36 engages with the cavity 2, the cavity 2 and the disassembly mechanism 3 can be quickly fixed, reducing the time spent on nozzle replacement. After the sealing gasket 38 on the inner side of the connecting ring 31 is squeezed by the cavity 2, it can fill the gap between the two to achieve high airtightness and prevent gas transmission leakage. The cavity component 39 in the docking nozzle 32 can assist the gas to pass smoothly through the docking nozzle 32. When the control ring 33 and the sliding column 36 slide together, the rotational motion of the control ring 33 can be converted into the linear motion of the sliding column 36, improving the ease of operation of the disassembly mechanism 3. One end of the return spring 35 is fixed on the abutment plate 37, allowing the elastic force to act directly on the abutment plate 37, ensuring that the abutment plate 37 is stably away from the cavity 2 when it is opened.

[0011] The cavity assembly 39 includes a flow cavity 391 and a docking cavity 392. The outside of the flow cavity 391 is opened inside the docking nozzle 32. The flow cavity 391 can serve as a gas transmission channel within the docking nozzle 32, ensuring that the gas flows evenly through the docking nozzle 32. The outside of the docking cavity 392 is opened inside the cavity 2. The docking cavity 392 can be precisely docked with the flow cavity 391 to form a continuous gas channel, avoiding turbulence at the junction. The outside of the flow cavity 391 is connected to the outside of the docking cavity 392. The connection between the flow cavity 391 and the docking cavity 392 enables seamless gas transmission from the air tube 1 to the cavity 2, ensuring stable gas flow. Specifically, the flow chamber 391 of the cavity assembly 39 is located inside the docking nozzle 32. In addition to serving as a gas transmission channel to ensure uniform gas flow, it can also reduce gas flow resistance through the smooth structure of its inner wall, ensuring that the gas entering the docking chamber 392 maintains a stable pressure. The docking chamber 392, located inside the cavity 2, forms a continuous channel with the flow chamber 391 through precise docking. The inner diameter of the cavity 2 can be consistent with that of the flow chamber 391. The connection design between the flow chamber 391 and the docking chamber 392 not only enables seamless gas transmission from the gas tube 1 to the cavity 2, but also allows the gas to maintain a stable flow field state before entering the control mechanism 4, providing a stable gas foundation for the subsequent controller 43 to drive the valve core 44 to adjust the flow rate.

[0012] Reference Figure 2 , Figure 3 and Figure 5 The control mechanism 4 includes a limiting groove 41, which is located on the side of the cavity 2 closest to the air pipe 1. The limiting groove 41 positions the nozzle 32, ensuring accurate alignment between the nozzle 32 and the cavity 2 and preventing misalignment from affecting gas transmission. A sliding groove 42 is located inside the cavity 2, on the side closest to the limiting groove 41. The sliding groove 42 allows the nozzle 32 to rotate slightly within the cavity 2, accommodating the installation and adjustment of the disassembly mechanism 3. A controller 43 is fixedly connected to the top of the cavity 2. The controller 43 receives signals from semiconductor processing equipment and precisely controls the rotation angle of the valve core 44. The output end of the controller 43 is fixedly connected to the valve core 44. Rotation of the valve core 44 changes the overlap area between the flow control port 45 and the cavity 2 channel, thus regulating the gas flow rate. Multiple flow control ports 45 are located inside the valve core 44. Different sized flow control ports 45 correspond to different gas flow requirements, satisfying the flow requirements of different semiconductor processes. A nozzle 46 is threadedly connected to the end of the cavity 2 furthest from the air pipe 1. The threaded connection facilitates the disassembly and replacement of the nozzle 46, allowing for the replacement of nozzles 46 with different spray angles according to process requirements. The other end of the nozzle 46 is fixedly connected to an air outlet 47, which evenly sprays the regulated gas from the cavity 2. The valve core 44 is externally and rotatably connected to the inside of the cavity 2. This rotatable connection ensures smooth rotation of the valve core 44, preventing jamming from affecting flow regulation accuracy. The two ends of the flow control port 45 are interconnected with the two ends of the cavity 2. The connection of 2 ensures that the gas can pass smoothly through the valve core 44 to achieve the flow regulation function. The external sliding connection of the docking nozzle 32 is inside the limiting groove 41. The sliding cooperation between the docking nozzle 32 and the limiting groove 41 makes it easy for the docking nozzle 32 to be inserted into or pulled out of the cavity 2, improving the ease of operation of the disassembly mechanism 3. The external rotating connection of the docking nozzle 32 is inside the sliding groove 42. The rotating connection between the docking nozzle 32 and the sliding groove 42 allows for fine adjustment of the angle of the docking nozzle 32 during the installation of the disassembly mechanism 3, ensuring precise docking with the cavity 2. Specifically, in the control mechanism 4, the limiting groove 41 on the side of the cavity 2 near the air tube 1 is slidably connected to the docking nozzle 32. This not only ensures accurate docking between the docking nozzle 32 and the cavity 2 through positioning to avoid misalignment affecting gas transmission, but also facilitates the insertion or removal of the docking nozzle 32 from the cavity 2 through sliding cooperation, improving the ease of operation of the disassembly mechanism 3. The sliding groove 42 inside the cavity 2 near the limiting groove 41 is rotatably connected to the docking nozzle 32, allowing for fine adjustment of the angle of the docking nozzle 32 during the installation of the disassembly mechanism 3, further ensuring docking accuracy. After receiving the signal from the semiconductor processing equipment, the controller 43 at the top of the cavity 2 can precisely control the rotation of the valve core 44 at the output end. The valve core 44 is rotatably connected to the cavity 2, ensuring smooth rotation and avoiding jamming that could affect the accuracy of flow regulation. Multiple flow control ports 45 inside the valve core 44 are connected to both ends of the cavity 2, allowing gas to pass smoothly through the valve core 44 to achieve flow regulation. Different sizes of flow control ports 45 can be used to match different gas flow requirements to meet different semiconductor process requirements. The nozzle 46 is threadedly connected to the end of the cavity 2 away from the gas pipe 1, which makes it easy to disassemble and replace the nozzle 46 with different spray angles according to process requirements. The air outlet 47 at the other end of the nozzle 46 can evenly spray the regulated gas in the cavity 2, ensuring the semiconductor process effect.

[0013] The implementation principle of this application embodiment is as follows: During semiconductor processing, the gas source is delivered to the disassembly mechanism 3 through the gas pipe 1. The gas first enters the connecting ring 31 and is guided by the docking nozzle 32. It then passes through the flow chamber 391 of the cavity assembly 39 inside the docking nozzle 32, and then enters the cavity 2 through the docking chamber 392 connected to the flow chamber 391. At this time, the controller 43 of the control mechanism 4 receives the technical signal of the semiconductor processing equipment and drives the valve core 44 to rotate in the cavity 2. The gas flow rate is adjusted by changing the overlapping area of ​​the flow control port 45 on the valve core 44 and the channel of the cavity 2. The adjusted gas is then evenly sprayed from the jet nozzle 47 to the processing area through the nozzle 46 threaded at the end of the cavity 2.

[0014] When assembling the nozzle, the cavity 2 is fitted with the docking nozzle 32, so that the docking nozzle 32 is positioned in the limiting groove 41 of the cavity 2 and adjusted in the sliding groove 42. This allows the sealing gasket 38 on the inner side of the connecting ring 31 to achieve high airtightness due to the compression of the cavity 2, preventing gas leakage. Then, the control ring 33 outside the connecting ring 31 is rotated. The control ring 33 slides with the slide column 36, converting the rotational motion into the linear motion of the slide column 36 within the connecting ring 31. The slide column 36 drives the abutment plate 37 on the adjacent side to approach the cavity 2. At this time, the return spring 35 sleeved in the support block 34 undergoes elastic deformation due to the movement of the abutment plate 37, providing continuous tension. This ensures that the abutment plate 37 is stably detached from the cavity 2 when the nozzle is replaced. During disassembly, the operation is reversed. The control ring 33 resets, causing the return spring 35 to pull the abutment plate 37, which in turn causes the slide column 36 to move the abutment plate 37 away from the cavity 2, quickly separating the cavity 2 from the disassembly mechanism 3 and shortening the replacement time.

[0015] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A replaceable gas nozzle for semiconductor processing, comprising a gas tube (1) and a cavity (2), characterized in that: The trachea (1) is connected to the cavity (2) through the disassembly mechanism (3), and the cavity (2) is provided with a control mechanism (4). The disassembly mechanism (3) includes a connecting ring (31), the outer left end of the connecting ring (31) is fixedly connected to one end of the air tube (1), the inner side of the outer right end of the connecting ring (31) is fixedly connected to a docking nozzle (32), the outer side of the connecting ring (31) is rotatably connected to a control ring (33), the outer right end of the connecting ring (31) is fixedly connected to multiple support blocks (34), each support block (34) is fitted with a return spring (35), the inner side of the connecting ring (31) is slidably connected to multiple sliding columns (36), each sliding column (36) is fixedly connected to a stop plate (37) on a similar side, the inner side of the connecting ring (31) is fixedly connected to a sealing gasket (38), and the inner side of the docking nozzle (32) is fitted with a cavity assembly (39).

2. The replaceable gas nozzle for semiconductor processing according to claim 1, characterized in that: The control mechanism (4) includes a limiting groove (41), the outside of which is opened on the side of the cavity (2) near the air tube (1), and the inside of the cavity (2) near the side of the limiting groove (41) is provided with a sliding groove (42). A controller (43) is fixedly connected to the top of the cavity (2), and a valve core (44) is fixedly connected to the output end of the controller (43). Multiple flow control ports (45) are opened inside the valve core (44).

3. The replaceable gas nozzle for semiconductor processing according to claim 2, characterized in that: The cavity (2) is threaded to a nozzle (46) at one end away from the air pipe (1), and the other end of the nozzle (46) is fixedly connected to an air outlet (47).

4. The replaceable gas nozzle for semiconductor processing according to claim 1, characterized in that: The cavity assembly (39) includes a flow cavity (391) and a docking cavity (392). The outside of the flow cavity (391) is opened inside the docking nozzle (32), and the outside of the docking cavity (392) is opened inside the cavity body (2). The outside of the flow cavity (391) is connected to the outside of the docking cavity (392).

5. The replaceable gas nozzle for semiconductor processing according to claim 3, characterized in that: The valve core (44) is externally rotatably connected to the inside of the cavity (2), and the two ends of the flow control port (45) are interconnected with the two ends of the cavity (2).

6. The replaceable gas nozzle for semiconductor processing according to claim 1, characterized in that: The side of the abutment (37) is engaged with the outside of the cavity (2), and the cavity (2), that is, the end of the trachea (1) that is close to the end of the sealing gasket (38), is supported on the outside of the sealing gasket (38).

7. The replaceable gas nozzle for semiconductor processing according to claim 2, characterized in that: The external part of the docking nozzle (32) is slidably connected to the inside of the limiting groove (41), and the external part of the docking nozzle (32) is rotatably connected to the inside of the sliding groove (42).

8. The replaceable gas nozzle for semiconductor processing according to claim 1, characterized in that: The control ring (33) is internally slidably connected to the opposite side of the slide column (36), and one end of the return spring (35) is fixedly connected to the outside of the abutment plate (37).

Images