A micro high-precision chip pick-and-place device

Abstract

The utility model provides a kind of miniature high-precision chip pick-and-place device, comprising: including: pedestal, driving assembly, suction assembly, with pre-pressing guide rail and connecting piece, the driving end of the driving assembly is connected with the suction assembly by the connecting piece, the connecting piece is equipped with sliding block away from the suction assembly side, with pre-pressing guide rail one end is fixed with the pedestal, other end is slidably connected with the connecting piece, when driving assembly drives the motion of the suction assembly connecting piece and with pre-pressing guide rail opposite sliding. By setting with pre-pressing guide rail and connecting piece, driving assembly drives connecting piece movement and further drives the motion of suction assembly, the displacement change generated by driving assembly is converted into the position change of suction assembly by the sliding of with pre-pressing guide rail and connecting piece, and the precision of guidance can be effectively guaranteed by using with pre-pressing guide rail for guiding, effectively reducing corresponding vibration, with stable high characteristics, and further ensuring the yield of product.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip technology, specifically to a miniature high-precision chip pick-and-place device. Background Technology

[0002] China's semiconductor industry is rapidly rising, and the demand for semiconductor chip equipment is increasing day by day. As semiconductor technology develops towards smaller processes and higher integration, the physical size of chips is shrinking and the internal structure is becoming more refined. The vibration problem during chip handling has an increasingly significant impact on product yield.

[0003] Chips need to be moved to the packaging carrier by pick-and-place equipment. Even slight displacement, tilting or vibration during the operation may cause physical damage (such as scratches or cracks). Since the chip itself and related components are fragile, the requirements for the force and angle of pick-and-place are extremely high. Currently, robotic arms or motors are used, but vibrations are easily generated during pick-and-place, which can lead to displacement and other deviations, thus affecting the product yield. Utility Model Content

[0004] The main purpose of this invention is to provide a miniature high-precision chip pick-and-place device, which aims to solve the problem that the yield of existing miniature high-precision chip pick-and-place devices is easily affected by displacement deviation.

[0005] To achieve the above objectives, this utility model proposes a miniature high-precision chip picking and placing device, comprising: a base, a driving component, a suction component, a pre-loaded guide rail, and a connector. The driving end of the driving component is connected to the suction component through the connector. A slider is provided on the side of the connector away from the suction component. One end of the pre-loaded guide rail is fixed to the base, and the other end is slidably connected to the connector. When the driving component drives the suction component to move, the connector slides relative to the pre-loaded guide rail.

[0006] In one alternative embodiment, the connector includes a first connecting plate connected to the drive end of the drive assembly and a second connecting plate perpendicularly connected to the first connecting plate. The lower end of the second connecting plate extends to form an extension portion connected to the suction assembly, and the slider is disposed on the side away from the extension portion.

[0007] In one alternative embodiment, the micro high-precision chip pick-and-place device further includes a buffer assembly. The buffer assembly includes an elastic buffer member disposed above the connection position between the second connecting plate and the pick-up assembly, and a limiting plate disposed above the elastic buffer member. The limiting plate is fixedly connected to the base, and both ends of the elastic buffer member abut against the limiting plate and the connecting member, respectively.

[0008] In one alternative embodiment, the elastic buffer is a spring-loaded buffer sleeve, and a gasket is further provided between the buffer sleeve and the connecting member.

[0009] In one alternative embodiment, the suction assembly includes an upper suction rod, a lower suction rod, and a suction cup connected to the end of the lower suction rod. The top of the upper suction rod is connected to an air tube interface, and the upper suction rod and the lower suction rod are detachably connected via a quick-release assembly.

[0010] In one alternative embodiment, the front end of the lower suction rod is sleeved inside the upper suction rod, the front end of the lower suction rod has an annular groove, the upper suction rod has at least one through hole at the corresponding position, the quick-release assembly includes at least one ball and a rubber sleeve, the ball passes through the inner side of the through hole and abuts against the annular groove and at least partially protrudes from the through hole on the outer side, and the rubber sleeve is sleeved on the outer side of the upper suction rod corresponding to the position of the ball.

[0011] In one alternative embodiment, the lower end of the upper suction rod is provided with a connecting hole, and the front end of the lower suction rod is also provided with a first limiting step, and the first limiting step is provided with a connecting hole for inserting the connecting post.

[0012] In one alternative, the drive component is a small cylinder mounted on the base.

[0013] In one alternative, the suction cup is an anti-static suction cup.

[0014] In one alternative, the micro high-precision chip pick-and-place device is grounded.

[0015] In this invention, by setting a preloaded guide rail and a connector, when the driving component drives the connector to move and thus drives the suction component to move, the displacement change generated by the driving component is converted into a position change of the suction component through the sliding of the preloaded guide rail and the connector. Using the preloaded guide rail for guidance can effectively ensure the accuracy of guidance, effectively reduce the corresponding vibration, and has a stable high characteristic, thereby ensuring the yield of the product. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a front view of the miniature high-precision chip picking and placing device of this utility model; Figure 2 This is an exploded view of the overall structure of the miniature high-precision chip picking and placing device of this utility model.

[0018] Explanation of icon numbers: 1. Base; 2. Drive assembly; 21. Miniature cylinder; 22. Cylinder rod; 23. Intake connector; 3. Suction assembly; 31. Upper suction rod; 311. Second limiting step; 312. Perforation; 32. Lower suction rod; 321. Annular groove; 322. First limiting step; 323. Connecting post; 33. Suction cup; 34. Air tube connector; 35. Quick release assembly; 351. Ball bearing; 352. Rubber sleeve; 4. Equipped with preloaded guide rails; 5. Connector; 51. First connecting plate; 52. Second connecting plate; 521. Extension; 53. Slider; 6. Buffer assembly; 61. Limiting plate; 62. Buffer sleeve; 63. Gasket.

[0019] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if the word "and / or" appears throughout the text, it means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0023] In this embodiment of the invention, a miniature high-precision chip pick-and-place device is provided. This device is mainly used for high-precision pick-up, handling and release of chips during semiconductor manufacturing, which can effectively reduce the possibility of chip damage and improve its yield.

[0024] Specifically, such as Figure 1-2 As shown, the miniature high-precision chip picking and placing device includes: a base 1, a driving component 2, a suction component 3, a pre-pressurized guide rail 4, and a connector 5. The driving end of the driving component 2 is connected to the suction component 3 through the connector 5. The connector 5 has a slider 53 on the side away from the suction component 3. One end of the pre-pressurized guide rail 4 is fixed to the base 1, and the other end is slidably connected to the connector 5. When the driving component 2 drives the suction component 3 to move, the connector 5 slides relative to the pre-pressurized guide rail 4.

[0025] The preloaded guide rail 4 is the core of the device's motion accuracy. It is a high-precision linear sliding guide pair that applies preload to eliminate the gap between the slider 53 and the guide rail. One end of the preloaded guide rail 4 is fixedly connected to the base 1, and the other end is equipped with a slide rail for engaging with the slider 53 of the connector 5. "Preloaded" here means that a preload is applied to the slider 53 and the preloaded guide rail 4 during assembly, effectively eliminating the gap between the guide rail and the slider 53 and preventing wobbling and backlash during movement. Its preload characteristic effectively eliminates backlash errors during reverse movement, ensuring that the pick-up assembly 3 does not wobble or shift during high-speed reciprocating motion, greatly improving the positional repeatability accuracy of chip picking and placing.

[0026] Specifically, the drive end of the drive component 2 is connected to the suction component 3 via the connector 5, thereby transmitting the driving force to the suction component 3 at the end. A slider 53 is provided on the side of the connector 5 away from the suction component 3, which is slidably arranged with the preloaded guide rail 4 to form a sliding pair. When the drive component 2 is started and drives the suction component 3 to perform the pick-up and put-down action, the connector 5 slides relative to the preloaded guide rail 4, thereby converting the output motion of the drive component 2 into high-precision linear displacement of the suction component 3.

[0027] Furthermore, the base 1 serves as the mounting foundation for the entire device, and it can be fixed to an external motion mechanism, such as to a robotic arm of another mechanism, using fasteners.

[0028] The drive assembly 2 is fixedly mounted on the base 1. In this preferred embodiment, the drive assembly 2 uses a small cylinder 21, with its cylinder rod 22 serving as the power output end. The air inlet 23 of the small cylinder 21 is connected to an external positive pressure air source via an air pipe and is controlled by an external solenoid valve. When positive pressure gas is introduced, the cylinder rod 22 extends upward; when the positive pressure gas is cut off, the cylinder rod 22 automatically retracts under the action of an internal spring. In other embodiments, the drive assembly 2 may also use components capable of providing linear driving force, such as an electric cylinder or a linear motor.

[0029] The connector 5 connects the drive end of the drive assembly 2 and the suction assembly 3, and transmits the driving force to the suction assembly 3. Specifically, the connector 5 includes a first connecting plate 51 connected to the end of the cylinder rod 22, and a second connecting plate 52 perpendicularly fixedly connected to the first connecting plate 51. The slider 53 is disposed on the second connecting plate 52, and an extension 521 is provided on the side of the second connecting plate 52 away from the slider 53 for connection with the suction assembly 3. When the cylinder rod 22 extends or retracts, it drives the entire connector 5 and the components fixed thereto to move precisely up and down along the preloaded guide rail 4.

[0030] Specifically, in one embodiment, the structural positions are as follows: a small cylinder 21 is disposed on the upper end of the base 1, and the cylinder rod 22 is extended upwards. The preloaded guide rail 4 is fixed on one side of the base 1, and its slide rail is disposed on the side away from the base 1. The first connecting member 5 is disposed laterally on the upper end of the cylinder rod 22. The second connecting member 5 is slidably disposed on the side of the preloaded guide rail 4, and the other side of the second connecting member 5 is connected to the suction rod assembly.

[0031] In a preferred embodiment, when the small cylinder 21 retracts, in order to further reduce the impact of chip placement, the micro high-precision chip pick-and-place device further includes a buffer component 6. The buffer component 6 includes an elastic buffer disposed above the connection position between the connector 5 and the suction component 3 and a limiting plate 61 disposed above the elastic buffer. The limiting plate 61 is fixedly connected to the base 1, and the two ends of the elastic buffer abut against the limiting plate 61 and the connector 5, respectively.

[0032] The buffer assembly 6 is used to absorb the impact energy when the cylinder rod 22 retracts, achieving a "soft landing" of the chip on the suction assembly 3, thereby preventing crushing or damage to the chip. The limiting plate 61 has a through hole 312 that allows the second connecting plate 52 to pass through, and the end of the limiting plate away from the suction assembly 3 is fixedly connected to the base 1. The two ends of the elastic buffer abut against the extension 521 and the limiting plate 61. It is compressed when the suction assembly 3 moves upward, and when the cylinder rod 22 retracts, the buffer assembly 6 uses its elastic restoring force to slowly move the suction assembly 3 downward.

[0033] In this embodiment, the elastic buffer is preferably a spring-loaded buffer sleeve 62, with its two ends abutting against the lower surface of the limiting plate 61 and the upper surface of the extension 521, respectively. Preferably, a gasket 63 may be added between the elastic buffer and the extension 521 to improve the force distribution. In other embodiments, the corresponding elastic buffer may simply be a spring wound around the outside of the suction assembly 3.

[0034] In this utility model, the suction assembly 3 includes an upper suction rod 31, a lower suction rod 32, and a suction cup 33 connected to the end of the lower suction rod 32. The top end of the upper suction rod 31 is connected to an air tube interface. The upper suction rod 31 and the lower suction rod 32 are detachably connected by a quick-release assembly 35.

[0035] The suction component 3 is the part that directly contacts the chip and is used to complete the suction and release actions. The upper suction rod 31 and the lower suction rod 32 have interconnected airflow channels to allow gas flow. The upper end of the upper suction rod 31 is provided with an air pipe interface for connecting a vacuum generator and a positive pressure gas source via a flexible hose. The extension 521 of the second connecting plate 52 is connected to the upper suction rod 31. A second limiting step 311 can be provided on the upper suction rod 31. The extension 521 is sleeved on the upper suction rod 31 and abuts against the second limiting step 311 to achieve the connection between the second connecting plate 52 and the upper suction rod 31. In other embodiments, the fixing position or fixing method of the second connecting plate 52 and the suction component 3 can be varied and is not limited here.

[0036] In this embodiment, the suction cup 33 is an anti-static suction cup 33, whose surface resistivity is controlled within the range of 10^6-10^9Ω, which can effectively adsorb chips and prevent static electricity accumulation.

[0037] Furthermore, the upper suction rod 31 and the lower suction rod 32 are detachably connected by a quick-release assembly 35, which facilitates the replacement of lower suction rods 32 and suction cups 33 of different specifications to accommodate chips of different sizes.

[0038] The specific connection method between the upper suction rod 31 and the lower suction rod 32 is as follows: the outer diameter of the front end of the lower suction rod 32 is smaller than the inner diameter of the lower end of the upper suction rod 31, and the front end of the lower suction rod 32 is fitted into the mounting hole at the lower end of the upper suction rod 31. An annular groove 321 is formed on the outer wall of the front end of the lower suction rod 32. At least one radial through hole 312 is formed on the side wall of the upper suction rod 31 corresponding to the position of the annular groove 321. The quick-release assembly 35 includes ball bearings 351 and a rubber sleeve 352. The number of ball bearings 351 is the same as the number of through holes 312. Each ball bearing 351 is accommodated in one through hole 312, and its inner part can be inserted into the annular groove 321 of the lower suction rod 32, while its outer part protrudes out of the through hole 312. The rubber sleeve 352 is made of an elastic material (such as rubber or silicone), and it fits tightly on the outside of the upper suction rod 31, covering all the ball bearings 351. The number of the ball bearings 351 and the perforations 312 is preferably two and symmetrically arranged to ensure the stable connection between the upper suction rod 31 and the lower suction rod 32.

[0039] In its natural state, the rubber sleeve 352 presses inward against the ball bearing 351, causing it to lock tightly into the annular groove 321, thereby locking the upper suction rod 31 and the lower suction rod 32. When disassembly is required, simply pull the rubber sleeve 352 upward to release the pressure on the ball bearing 351, and the lower suction rod 32 can be easily pulled out. This quick-release structure facilitates compatibility with chips of various sizes.

[0040] Furthermore, to ensure circumferential positioning after the upper suction rod 31 and the lower suction rod 32 are connected, a connecting hole is provided at the lower end of the upper suction rod 31, and a first limiting step 322 is provided at the front end of the lower suction rod 32. A connecting post 323 that is inserted into the connecting hole extends upward from the first limiting step 322. The outer diameter of the first limiting step 322 is greater than or equal to the outer diameter of the lower end of the upper suction rod 31, so that when the front end of the lower suction rod 32 is inserted into the upper suction rod 31, the first limiting step 322 can abut against the lower end of the upper suction rod 31. At the same time, when the upper suction rod 31 and the lower suction rod 32 are inserted relative to each other, the connecting post 323 is inserted into the connecting hole to prevent relative rotation and positioning. The number of connecting posts 323 and connecting holes is preferably set to two or more.

[0041] In this invention, to further reduce the damage to the chip caused by static electricity accumulation, in addition to using an anti-static chuck 33, the miniature high-precision chip picking and placing device is grounded to conduct static electricity away and prevent damage to the chip from static electricity accumulation. Specifically, a grounding wire can be placed on the first connecting plate 51, or grounded on the base 1, etc., without limitation.

[0042] The working principle of this utility model is as follows: When picking up the chip, after the suction cup 33 contacts the chip, the suction component 3 is connected to the vacuum source through the air pipe connector 34. The vacuum firmly holds the chip to the suction cup 33. Positive pressure air enters the small cylinder 21 through the connector of the small cylinder 21. The small cylinder 21 extends and drives the first connecting plate 51 and the second connecting plate 52 to rise, which in turn drives the suction component 3 to rise. The chip is then guided by the micro guide rail slider 53 with pre-pressure and high precision.

[0043] When placing the chip, the miniature high-precision chip pick-and-place device of this invention is moved to the chip placement position by an external device. The positive pressure air supply is stopped, the small cylinder 21 retracts by the internal spring structure, and the suction component 3 descends by the elastic restoring force of the buffer component 6. At the same time, the miniature guide rail slider 53 is pre-pressurized and highly precise guided. When the position is reached, the suction component 3 introduces positive pressure air through the air pipe connector 34 to separate the chip from the suction cup 33 and accurately place the chip in the required position.

[0044] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

[0045] The above description is only an optional embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A miniature high-precision chip pick-and-place device, characterized in that, include: The system includes a base, a drive assembly, a suction assembly, a pre-loaded guide rail, and a connector. The drive end of the drive assembly is connected to the suction assembly via the connector. The connector has a slider on the side away from the suction assembly. One end of the pre-loaded guide rail is fixed to the base, and the other end is slidably connected to the connector. When the drive assembly drives the suction assembly to move, the connector slides relative to the pre-loaded guide rail.

2. The miniature high-precision chip pick-and-place device according to claim 1, characterized in that, The connector includes a first connecting plate connected to the driving end of the driving assembly and a second connecting plate perpendicularly connected to the first connecting plate. The lower end of the second connecting plate extends to form an extension portion connected to the suction assembly, and the slider is disposed on the side away from the extension portion.

3. The miniature high-precision chip pick-and-place device according to claim 2, characterized in that, The micro high-precision chip pick-and-place device further includes a buffer assembly, which includes an elastic buffer member disposed above the connection position between the second connecting plate and the pick-up assembly, and a limiting plate disposed above the elastic buffer member. The limiting plate is fixedly connected to the base, and the two ends of the elastic buffer member abut against the limiting plate and the connecting member, respectively.

4. The miniature high-precision chip pick-and-place device according to claim 3, characterized in that, The elastic buffer is a spring-loaded buffer sleeve, and a gasket is also provided between the buffer sleeve and the connecting member.

5. The miniature high-precision chip pick-and-place device according to any one of claims 1-4, characterized in that, The suction assembly includes an upper suction rod, a lower suction rod, and a suction cup connected to the end of the lower suction rod. The top of the upper suction rod is connected to an air tube interface. The upper suction rod and the lower suction rod are detachably connected by a quick-release assembly.

6. The miniature high-precision chip pick-and-place device according to claim 5, characterized in that, The lower suction rod is sleeved inside the upper suction rod. The lower suction rod has an annular groove at its front end. The upper suction rod has at least one through hole at the corresponding position. The quick-release assembly includes at least one ball and a rubber sleeve. The ball passes through the inside of the through hole and abuts against the annular groove, and its outer side at least partially protrudes from the through hole. The rubber sleeve is sleeved on the outside of the upper suction rod at the position corresponding to the ball.

7. The miniature high-precision chip pick-and-place device according to claim 6, characterized in that, The lower end of the upper suction rod is provided with a connecting hole, and the front end of the lower suction rod is also provided with a first limiting step, and the first limiting step is provided with a connecting hole for inserting the connecting post.

8. The miniature high-precision chip pick-and-place device according to claim 1, characterized in that, The drive component is a small cylinder, which is mounted on the base.

9. The miniature high-precision chip pick-and-place device according to claim 5, characterized in that, The suction cup is an anti-static suction cup.

10. The miniature high-precision chip pick-and-place device according to claim 5, characterized in that, The micro high-precision chip pick-and-place device is grounded.

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