Chip grasping module

Abstract

The utility model provides a kind of chip grabbing module, including fixed seat plate, adjustablely being provided with movable seat plate on fixed seat plate along vertical direction, movable seat plate is equipped with rotary adjustment seat, rotary adjustment seat is equipped with first suction nozzle, rotary adjustment seat rotatably assembled in movable seat plate, the rotation center axis of rotary adjustment seat coincides with the central axis of first suction nozzle, the central axis of first suction nozzle is parallel with vertical direction.The utility model's first suction nozzle is used to grab chip, movable seat plate can be equivalent to fixed seat plate and move along vertical direction, so that first suction nozzle can move along vertical direction after grabbing chip, so that the chip being grabbed is separated from carrier, while rotary adjustment seat rotates a certain angle, first suction nozzle rotates a certain angle in this process, the adjustment of chip posture is realized, compared with traditional mode, this scheme can save transit step, does not need additional rotating platform, reduces production cost, improves production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip transfer technology, and in particular to a chip gripping module. Background Technology

[0002] In the chip manufacturing process, there are often processing scenarios involving the transfer of chips. For example, in the chip eutectic stage, the chip needs to be transferred to the heating stage and heat sink for soldering in a specific posture. Due to the high precision requirements for the chip posture, the conventional method is to use a negative pressure nozzle to pick up the chip, transfer it to a rotating platform, rotate it at a certain angle to adjust its posture, and then use the nozzle to pick up the chip again and transfer it to the processing station. This process requires the configuration of a rotating platform, which increases production costs. At the same time, the process of unloading and reloading on the rotating platform affects production efficiency. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a chip gripping module that can adjust the chip angle during the chip gripping process, which helps to reduce production costs and improve efficiency.

[0004] The embodiments of this utility model are achieved through the following technical solutions:

[0005] A chip gripping module includes a fixed base plate, a movable base plate adjustable vertically on the fixed base plate, a rotary adjustment seat on the movable base plate, and a first suction nozzle mounted on the rotary adjustment seat. The rotary adjustment seat is rotatably mounted on the movable base plate, and the rotation center axis of the rotary adjustment seat coincides with the center axis of the first suction nozzle, which is parallel to the vertical direction. Here, the first suction nozzle grips the chip. The movable base plate can move vertically, equivalent to the fixed base plate, allowing the first suction nozzle to move vertically after gripping the chip, thus detaching the gripped chip from the carrier. Simultaneously, the rotary adjustment seat rotates a certain angle, during which the first suction nozzle rotates a certain angle, adjusting the chip's posture. Compared to traditional methods, this solution eliminates intermediate steps, does not require an additional rotating platform, reduces production costs, and improves production efficiency.

[0006] According to a preferred embodiment, the rotary adjustment seat includes a vertical plate, a deflection adjustment block is disposed on the vertical plate, a pressure sensor is disposed on the deflection adjustment block, and the first suction nozzle is assembled to the pressure sensor.

[0007] According to a preferred embodiment, the first suction nozzle is mounted on the pressure sensor via a limiting seat. The limiting seat includes a first limiting part and a second limiting part. The first limiting part is mounted on the pressure sensor, and the second limiting part is provided with a mounting hole for accommodating the first suction nozzle. An adjustment groove is formed on the second limiting part, and the adjustment groove communicates with the mounting hole. An extension plate is provided on the upright plate, and a limiting protrusion is provided on the first limiting part. The limiting protrusion is located on the lower side of the extension plate in the vertical direction. A first gap exists between the limiting protrusion and the extension plate.

[0008] According to a preferred embodiment, the rotary adjustment seat is rotatably mounted on the movable seat plate via an arcuate slide.

[0009] According to a preferred embodiment, the chip gripping module further includes a vision component disposed on the mounting plate.

[0010] According to a preferred embodiment, the top of the fixed base plate is provided with a top plate, on which a voice coil motor and a magnetic spring are provided, both of which are connected to the movable base plate.

[0011] According to a preferred embodiment, a limiting plate is disposed on the extension plate, the limiting plate being an L-shaped plate, and the pressure sensor is located between the extension plate and the limiting plate; the limiting plate is located below the pressure sensor, and a second gap exists between the limiting plate and the pressure sensor. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 A three-dimensional structural diagram of the chip grasping module provided in an embodiment of this utility model;

[0014] Figure 2 A first three-dimensional structural schematic diagram of the pressure sensor and first suction nozzle mounting structure provided in an embodiment of this utility model;

[0015] Figure 3 A second three-dimensional structural diagram of the pressure sensor and the first suction nozzle mounting structure provided in this embodiment of the utility model.

[0016] Icons: 1. Fixed base plate; 11. Top plate; 12. Voice coil motor; 13. Magnetic spring; 2. Movable base plate; 3. Rotary adjustment base; 31. Vertical plate; 32. Deflection adjustment block; 321. Pressure sensor; 4. Curved slide table; 5. First suction nozzle; 6. Limiting seat; 61. First limiting part; 611. Limiting protrusion; 62. Second limiting part; 621. Adjustment groove; 7. Extension plate; 71. Limiting plate; Z: Vertical direction. Detailed Implementation

[0017] To better understand and implement this invention, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.

[0018] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0020] Please refer to Figures 1 to 3 A chip gripping module includes a fixed base plate 1, a movable base plate 2 adjustable along the vertical direction Z on the fixed base plate 1, a rotary adjustment seat 3 disposed on the movable base plate 2, and a first suction nozzle 5 disposed on the rotary adjustment seat 3. The rotary adjustment seat 3 is rotatably mounted on the movable base plate 2, and the rotation center axis of the rotary adjustment seat 3 coincides with the center axis of the first suction nozzle 5, which is parallel to the vertical direction Z. In this embodiment, the first suction nozzle 5 is used to grip the chip. The movable base plate 2 can move in the vertical direction Z, equivalent to the fixed base plate 1, so that the first suction nozzle 5 can move along the vertical direction Z after gripping the chip, thereby detaching the gripped chip from the carrier. Simultaneously, the rotary adjustment seat 3 rotates a certain angle, and during this process, the first suction nozzle 5 rotates a certain angle to adjust the chip's posture. Compared with the traditional mode, this solution can eliminate the transfer step, does not require an additional rotating platform, reduces production costs, and improves production efficiency.

[0021] It should be noted that the above steps are usually implemented in conjunction with a vision component (not shown in the figure). Specifically, the vision component is mounted on the fixed base plate 1. The vision component is a CCD camera, which is used to take pictures of the chip before the first suction nozzle 5 picks up the chip in order to identify the chip's posture and thus determine the angle that the rotation adjustment base 3 needs to be rotated and adjusted.

[0022] like Figure 1 As shown, a top plate 11 is provided on the top of the fixed base plate 1. A voice coil motor 12 and a magnetic spring 13 are provided on the top plate 11. Both the voice coil motor 12 and the magnetic spring 13 are connected to the movable base plate 2. The movable base plate 2 is slidably connected to the fixed base plate 1 in the vertical direction Z by a cross roller guide. The voice coil motor 12 is used to drive the movable base plate 2 to move in the vertical direction Z. The magnetic spring 13 is used to balance the weight of the movable base plate 2 and the structure assembled on the movable base plate 2.

[0023] Furthermore, the rotary adjustment base 3 includes a vertical plate 31, on which a deflection adjustment block 32 is disposed, and on which a pressure sensor 321 is disposed, with the first suction nozzle 5 mounted on the pressure sensor 321. The vertical plate 31, i.e., the rotary adjustment base 3, is rotatably mounted on the movable base plate 2 via the arc-shaped slide 4. Here, the pressure sensor 321 is used to detect the force applied to the chip by the first suction nozzle 5 during the process of the first suction nozzle 5 abutting against the chip. When the force exceeds a threshold, the voice coil motor 12 drives the first suction nozzle 5 to move upward in the vertical direction Z to transfer the chip.

[0024] like Figure 2 and Figure 3 As shown, the first suction nozzle 5 is assembled to the pressure sensor 321 via a limiting seat 6. The limiting seat 6 includes a first limiting part 61 and a second limiting part 62. The first limiting part 61 is assembled to the pressure sensor 321, and the second limiting part 62 is provided with an assembly hole for accommodating the first suction nozzle 5. An adjustment groove 621 is provided on the second limiting part 62, which communicates with the assembly hole. An extension plate 7 is provided on the upright plate 31. A limiting protrusion 611 is provided on the first limiting part 61, and the limiting protrusion 611 is located on the lower side of the extension plate 7 in the vertical direction Z. In this embodiment, there is a first gap between the limiting protrusion 611 and the extension plate 7, which leaves space for the pressure sensor 321 to deform under pressure, and at the same time limits the upward deformation of the pressure sensor 321. The tightness of the assembly of the first suction nozzle 5 is adjusted by bolts (not shown in the figure) on the second limiting part 62 in conjunction with the adjustment groove 621.

[0025] Furthermore, a limiting plate 71 is disposed on the extension plate 7. The limiting plate 71 is an L-shaped plate, and the pressure sensor 321 is located between the extension plate 7 and the limiting plate 71. Here, the limiting plate 71 is located below the pressure sensor 321, and there is a second gap between the limiting plate 71 and the pressure sensor 321, which is used to limit the deformation distance of the pressure sensor 321 on the lower side in the vertical direction Z.

[0026] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A chip grasping module, characterized by, The device includes a fixed base plate, on which a movable base plate is adjustable in the vertical direction. A rotary adjustment seat is disposed on the movable base plate, and a first suction nozzle is disposed on the rotary adjustment seat. The rotary adjustment seat is rotatably mounted on the movable base plate, and the rotation center axis of the rotary adjustment seat coincides with the center axis of the first suction nozzle. The center axis of the first suction nozzle is parallel to the vertical direction. The rotary adjustment seat includes a vertical plate, on which a deflection adjustment block is disposed, and a pressure sensor is disposed on the deflection adjustment block. The first suction nozzle is assembled to the pressure sensor. The first suction nozzle is mounted on the pressure sensor via a limiting seat. The limiting seat includes a first limiting part and a second limiting part. The first limiting part is mounted on the pressure sensor. The second limiting part is provided with an assembly hole for accommodating the first suction nozzle. An adjustment groove is provided on the second limiting part, and the adjustment groove is connected to the assembly hole. An extension plate is provided on the upright plate, and a limiting protrusion is provided on the first limiting part. The limiting protrusion is located on the lower side of the extension plate in the vertical direction. There is a first gap between the limiting protrusion and the extension plate.

2. The die gripping module of claim 1, wherein, The rotary adjustment seat is rotatably mounted on the movable seat plate via an arc-shaped slide.

3. The die gripping module of claim 1, wherein, The chip grasping module also includes a vision component, which is disposed on the fixed base plate.

4. The die gripping module of claim 1, wherein, The fixed base plate is equipped with a top plate, on which a voice coil motor and a magnetic spring are mounted. Both the voice coil motor and the magnetic spring are connected to the movable base plate.

5. The die gripping module of claim 1, wherein, A limiting plate is provided on the extension plate. The limiting plate is an L-shaped plate, and the pressure sensor is located between the extension plate and the limiting plate. The limiting plate is located below the pressure sensor, and there is a second gap between the limiting plate and the pressure sensor.

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