A lens and a light emitting device having the same

CN224611186UActive Publication Date: 2026-08-07SHENZHEN JUFEI OPTOELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN JUFEI OPTOELECTRONICS CO LTD
Filing Date
2025-09-16
Publication Date
2026-08-07

AI Technical Summary

Technical Problem

[0004]本申请实施例的目的在于提供透镜,以解决现有技术中存在的透镜在封装过程中对位困难且容易发生偏移的技术问题

Benefits of technology

[0016] Optionally, the substrate assembly includes a substrate layer, substrate circuitry, and pads. The light-emitting chip is connected to the upper surface of the substrate layer via the substrate circuitry, and the pads are connected to the lower surface of the substrate layer. The substrate layer has conductive holes penetrating the upper and lower surfaces, and the substrate circuitry and the pads are electrically connected via the conductive holes.

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Abstract

The application belongs to the technical field of packaging, and particularly relates to a lens and a light emitting device with the lens. The lens comprises a first lens part and a second lens part. The first lens part and the second lens part each have an upper surface, a lower surface and a side surface. The upper surface of the second lens part is connected to the lower surface of the first lens part. The projection of the second lens part on the lower surface of the first lens part is smaller than the first lens part. The first step structure is formed between the exposed lower surface of the first lens part and the second lens part. The light emitting device comprises a substrate assembly, a dam, a light emitting chip and the lens. The lens and the substrate assembly are respectively connected to the upper and lower sides of the dam and form a containing cavity. The light emitting chip is connected to the substrate assembly and located in the containing cavity. The exposed lower surface of the first lens is connected to the upper end surface of the dam. The lens and the light emitting device provided by the application realize the rapid positioning of the lens and the dam, limit the relative displacement of the lens and the dam, and ensure the packaging effect.
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Description

Technical Field

[0001] This application belongs to the field of packaging technology, and more specifically, relates to a lens and a light-emitting device having the lens. Background Technology

[0002] In the field of packaging technology for light-emitting devices, UV-LED (Ultraviolet Light Emitting Diode) products are typically packaged using lenses. The lenses are glued to the substrate assembly (commonly known as semi-inorganic packaging process), or the lenses are metallized and then soldered to the substrate assembly (commonly known as fully inorganic packaging process), thereby achieving the packaging purpose.

[0003] In existing packaging technologies, misalignment is prone to occur when aligning the lens with the substrate assembly. This is especially true because the substrate assembly and the surrounding barrier are subjected to high temperatures during manufacturing, causing the barrier to deform and further exacerbating the misalignment problem. Furthermore, the bonding or welding process between the lens and the barrier involves high temperatures. Since a relatively sealed cavity is formed between the substrate assembly, the barrier, and the lens, the high temperature causes the gas within the cavity to expand, which can easily lead to misalignment between the lens and the barrier. Utility Model Content

[0004] The purpose of this application is to provide a lens to solve the technical problem in the prior art where the lens is difficult to align and is prone to displacement during the packaging process.

[0005] To achieve the above objectives, the technical solution adopted in the embodiments of this application is as follows: On one hand, this application provides a lens for connecting to a dam and encapsulating a light-emitting device. The lens includes a first lens portion and a second lens portion. Both the first lens portion and the second lens portion have an upper surface and a lower surface disposed opposite to each other, and a side surface located between the upper surface and the lower surface. The upper surface of the second lens portion is connected to the lower surface of the first lens portion. The projection of the second lens portion onto the lower surface of the first lens portion is smaller than that of the first lens portion. The exposed lower surface of the first lens portion and the second lens portion form a locking structure that causes the dam to abut against the second lens portion.

[0006] Optionally, the locking structure includes a first stepped structure between the exposed lower surface of the first lens portion and the second lens portion; or, The positioning structure includes a positioning groove formed by the second lens portion near the edge of the first lens portion.

[0007] Optionally, the central axis of the first lens portion coincides with the second central axis of the second lens portion, and / or, the upper surface of the first lens portion is a plane, an arc surface, or a sphere.

[0008] Optionally, the projection of the first lens portion onto the upper surface of the second lens portion is square or circular, and / or the projection of the second lens portion onto the lower surface of the first lens portion is square or circular.

[0009] Optionally, the nearest point A to the lower surface edge of the first lens portion is the center point M of the first lens portion, and the line L connecting the center point M and the nearest point A forms an intersection point B between the projection edge of the second lens portion on the lower surface of the first lens portion and the line L, wherein MB ≥ AB.

[0010] Optionally, the exposed lower surface of the first lens portion is provided with an adhesive groove, which is located near the second lens portion and along the edge of the second lens portion.

[0011] Optionally, the lens further includes a third lens portion having an upper surface and a lower surface disposed opposite to each other, and a side surface located between the upper surface and the lower surface. The upper surface of the third lens portion is connected to the lower surface of the second lens portion. The projection of the third lens portion onto the lower surface of the second lens portion is smaller than that of the second lens portion. A second stepped structure is formed between the exposed lower surface of the second lens portion and the third lens portion.

[0012] Optionally, the side surface of the second lens portion, the exposed lower surface of the second lens portion, and the side surface of the third lens portion are all provided with an anti-ultraviolet coating.

[0013] The lens provided in this application embodiment has at least the following beneficial effects: Compared with the prior art, the lens provided in this application embodiment utilizes a relatively small second lens portion connected to a relatively large first lens portion, forming a first stepped structure between the first lens portion and the second lens portion. When the lens in this embodiment is used for packaging, the first stepped structure on the lens can be locked onto the end face of the dam of the packaging device, enabling the lens to be quickly positioned with the dam. Even if the substrate assembly and the dam are deformed during the molding process, the first stepped structure can still be quickly positioned. At the same time, when the lens and the dam are subjected to high temperatures during the bonding or welding process, the lens and the dam are not prone to displacement due to the limiting effect of the first stepped structure after assembly with the dam, and the two can maintain effective positioning.

[0014] On the other hand, embodiments of this application also provide a light-emitting device, including a substrate assembly, a dam, a light-emitting chip, and a lens as described above. The lens and the substrate assembly are respectively connected to the upper and lower sides of the dam and form a receiving cavity. The light-emitting chip is connected to the substrate assembly and located in the receiving cavity. The exposed lower surface of the first lens is in contact with the upper end face of the dam.

[0015] Optionally, the upper end face of the dam includes a first end face and a second end face with a drop, and a connecting surface connecting the first end face and the second end face. The first end face is connected to the exposed lower surface of the first lens portion, the second end face is connected to the lower surface of the second lens portion, and the connecting surface is connected to the side surface of the second lens portion.

[0016] Optionally, the substrate assembly includes a substrate layer, substrate circuitry, and pads. The light-emitting chip is connected to the upper surface of the substrate layer via the substrate circuitry, and the pads are connected to the lower surface of the substrate layer. The substrate layer has conductive holes penetrating the upper and lower surfaces, and the substrate circuitry and the pads are electrically connected via the conductive holes.

[0017] The light-emitting device provided in this application embodiment has at least the following beneficial effects: Compared with the prior art, the light-emitting device provided in this application embodiment uses the above-mentioned lens for encapsulation, and connects the exposed lower surface of the first lens part with the upper end face of the dam so that the first stepped structure of the lens is stuck on the upper end face of the dam, thereby realizing the rapid positioning of the lens and the dam, limiting the relative displacement of the lens and the dam, and ensuring the encapsulation effect. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 Schematic cross-section of the lens provided in Embodiment 1 of this application Figure 1 ; Figure 2 A schematic diagram of the shape and structure of the lens provided in Embodiment 1 of this application. Figure 1 ; Figure 3 A schematic diagram of the shape and structure of the lens provided in Embodiment 1 of this application. Figure 2 ; Figure 4 A schematic diagram of the shape and structure of the lens provided in Embodiment 1 of this application. Figure 3 ; Figure 5 Schematic cross-section of the lens provided in Embodiment 1 of this application Figure 2 ; Figure 6 This is a cross-sectional schematic diagram of the light-emitting device provided in Embodiment 1 of this application; Figure 7 for Figure 6 A magnified view of a section at point A in the middle; Figure 8 This is a cross-sectional schematic diagram of the lens provided in Embodiment 2 of this application.

[0020] The following are the labeling elements in the figure: 1. Lens; 11. First lens section; 12. Second lens section; 13. Third lens section; 14. Adhesive reservoir; 15. Anti-UV coating; 16. Positioning groove; 2. Enclosure; 21. First end face; 22. Second end face; 23. Connecting surface; 3. Substrate assembly; 31. Conductive via; 32. Substrate circuitry; 33. Substrate layer; 34. Solder pad; 4. Light-emitting chip; 51. Glue for vertical positions; 52. Glue for horizontal positions. Detailed Implementation

[0021] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0022] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0023] It should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0024] The various specific technical features and embodiments described in the detailed implementation can be combined in any suitable manner without contradiction. For example, different implementation methods can be formed by combining different specific technical features / implementations / implementation methods. In order to avoid unnecessary repetition, the various possible combinations of the various specific technical features / implementations / implementation methods in this application will not be described separately.

[0025] Example 1: Please refer to this as well. Figure 1 and Figure 2 This application provides a lens 1, which can be used in the packaging of a light-emitting device. The lens 1 includes a first lens portion 11 and a second lens portion 12. Both the first lens portion 11 and the second lens portion 12 have an upper surface, a lower surface and a side surface. The upper surface and the lower surface are arranged opposite to each other. The side surface is located between the upper surface and the lower surface. The upper side of the side surface is connected to the upper surface and the lower side of the side surface is connected to the lower surface. Figure 1 This is a cross-sectional view of lens 1 provided in an embodiment of this application. Figure 1 In the middle, the first lens part 11 and the second lens part 12 are stacked one on top of the other. Taking the first lens part 11 as an example, the upper part of the first lens part 11 is the upper surface, the lower part is the lower surface, and the vertical direction is the side surface. The upper surface, lower surface and side surface mentioned below can be compared by analogy.

[0026] The upper surface of the second lens portion 12 is connected to the lower surface of the first lens portion 11. The projection of the second lens portion 12 onto the lower surface of the first lens portion 11 is smaller than that of the first lens portion 11, so that a portion of the lower surface of the first lens portion 11 is covered by the second lens portion 12, while the remaining area is exposed. A locking structure is formed between the exposed lower surface of the first lens portion 11 and the second lens portion 12. The locking structure allows the second lens portion 12 of the lens 1 to abut against the enclosure 2 of the light-emitting device during the packaging process, so that the displacement of the lens 1 can be restricted, ensuring the stability of the connection between the lens 1 and the enclosure 2.

[0027] In this embodiment, when lens 1 is used for encapsulation, the locking structure on lens 1 can be locked onto the end face of the dam 2 of the encapsulated device (see reference). Figure 6 and Figure 7 This allows the lens 1 to be quickly positioned with the dam 2. Even if the substrate assembly 3 and the dam 2 are deformed during the molding process, the first step structure can still be quickly positioned, effectively overcoming the technical problem of poor positioning effect caused by high temperature deformation during the molding process of the substrate assembly 3 and the dam 2 in the prior art, and effectively improving the packaging effect of the light-emitting device.

[0028] Meanwhile, after the lens 1 and the dam 2 are positioned, even if the lens 1 and the dam 2 are subjected to high temperatures during the bonding or welding process, the lens 1 and the dam 2 are not prone to displacement due to the limiting effect of the locking structure after assembly with the dam 2, and the two can maintain effective positioning.

[0029] Please refer to Figure 1 and Figure 2 As one of the optional implementations of this embodiment, the positioning structure includes a first stepped structure between the exposed lower surface of the first lens part 11 and the second lens part 12. The first stepped structure allows the side of the second lens part 12 to abut against the inner side of the dam 2, thereby achieving rapid positioning of the lens 1 and the dam 2. At the same time, under the constraint of the first stepped structure, the lens 1 and the dam 2 can maintain a good connection and avoid relative displacement.

[0030] For example, the exposed lower surface of the first lens portion 11 and the side surface of the second lens portion 12 can be flat to facilitate assembly with the dam 2. Of course, in other embodiments, the exposed lower surface of the first lens portion 11 and the side surface of the second lens portion 12 can be arc-shaped or curved to increase the contact area with the dam 2, reduce the possibility of misalignment after connection, and improve the connection reliability of the two.

[0031] Please refer to Figure 1 and Figure 2 As one of the optional embodiments of this example, the central axis of the first lens portion 11 can coincide with the second central axis of the second lens portion 12, so as to facilitate the processing and forming of the first stepped structure, and also to facilitate the automated equipment to quickly obtain the center position of the lens 1 during the packaging process, making it convenient to grasp the lens 1.

[0032] For example, please refer to Figure 1 and Figure 5 The upper surface of the first lens portion 11 can be a plane, an arc surface, or a sphere, and the lower surface of the first lens portion 11 can be a plane. In specific applications, the upper surface of the first lens portion 11 can be reasonably selected according to the actual packaged light-emitting device, and this embodiment does not impose any restrictions.

[0033] Please refer to Figures 2 to 4 As one of the optional embodiments of this example, the projection of the first lens portion 11 onto the upper surface of the second lens portion 12 can be square or circular, that is, the first lens portion 11 can be circular or square when viewed from the upper surface of the first lens portion 11.

[0034] As one of the optional embodiments of this example, the projection of the second lens portion 12 onto the lower surface of the first lens portion 11 can be square or circular, that is, the second lens portion 12 can be circular or square when viewed from the upper surface of the second lens portion 12.

[0035] In specific applications, the shapes of the first lens section 11 and the second lens section 12 can be reasonably selected according to the shape and structure of the actual dam 2 and substrate assembly 3, as well as the specific application of the light-emitting device.

[0036] For example, please refer to Figure 2 The first lens portion 11 and the second lens portion 12 can both be square sheet-like structures (that is, the upper surfaces of the first lens portion 11 and the second lens portion 12 are square).

[0037] For example, please refer to Figure 3 The first lens portion 11 and the second lens portion 12 can both be circular thin sheet structures (that is, the upper surfaces of the first lens portion 11 and the second lens portion 12 are circular).

[0038] For example, please refer to Figure 4 The first lens portion 11 can be a square sheet structure (that is, the upper surface of the first lens portion 11 is square), and the second lens portion 12 can be a circular sheet structure (that is, the upper surface of the second lens portion 12 is circular).

[0039] Of course, in other embodiments, the first lens portion 11 and the second lens portion 12 may also have other shapes and structures.

[0040] As one of the optional implementation methods in this embodiment, please refer to Figure 2 The lower surface of the first lens section 11 has a center point M, and the edge of the lower surface of the first lens section 11 has a closest point A to the center point M. A line L is formed connecting the center point M and the closest point A, such that the projection edge of the second lens section 12 on the lower surface of the first lens section 11 intersects the line L at point B, where MB + AB = MA and MB ≥ AB. This limits the size of the first stepped structure, keeping it within a reasonable range and preventing the first stepped structure from interfering with the light emitted from the light-emitting device through the lens 1.

[0041] For example, MB:AB = 1:1, or MB:AB = 2:1.

[0042] As one of the optional implementation methods in this embodiment, please refer to [the previous text]. Figure 1 The exposed lower surface of the first lens portion 11 is provided with an adhesive groove 14. The adhesive groove 14 can be located close to the second lens portion 12 and along the edge of the second lens portion 12. It should be noted that the adhesive groove 14 being close to the second lens portion 12 means that the adhesive groove 14 is closer to the edge of the second lens portion 12 than the edge of the first lens portion 11.

[0043] Please refer to Figure 6 and Figure 7With this design, when the lens 1 is glued to the dam 2, the space between the first lens part 11 of the lens 1 and the dam 2 will be filled with glue. When the two are glued, the glue between them will be squeezed. At this time, the glue that is squeezed and rebounds can flow into the glue container 14, which prevents the rebounding glue from pushing the lens 1 to move and ensures the positioning effect of the lens 1 and the dam 2.

[0044] Specifically, the adhesive groove 14 can be arranged around the edge of the second lens portion 12. When the second lens 1 is circular, the adhesive groove 14 is an annular groove. Similarly, when the second lens 1 is square, the adhesive groove 14 is a square groove.

[0045] As one of the optional implementation methods in this embodiment, please refer to Figure 5 Lens 1 may further include a third lens portion 13, which also has an upper surface, a lower surface, and a side surface. The upper and lower surfaces are arranged opposite to each other, and the side surface is located between the upper and lower surfaces. The upper side of the side surface is connected to the upper surface, and the lower side of the side surface is connected to the lower surface. The upper surface of the third lens portion 13 is connected to the lower surface of the second lens portion 12. The projection of the third lens portion 13 onto the lower surface of the second lens portion 12 is smaller than that of the second lens portion 12. A second stepped structure is formed between the exposed lower surface of the second lens portion 12 and the third lens portion 13. The structure and function of the second stepped structure are similar to those of the first stepped structure. The second stepped structure can further limit the relative displacement between lens 1 and the dam 2, and further improve the encapsulation effect of lens 1.

[0046] For details, please refer to Figure 6 and Figure 7 An anti-ultraviolet coating 15 is provided on the side surface of the second lens portion 12, the exposed lower surface of the second lens portion 12, and the side surface of the third lens portion 13. When the lens 1 and the dam 2 are bonded with adhesive, the anti-ultraviolet coating 15 can effectively reflect ultraviolet light from the light-emitting device and the outside world, slow down the aging of the adhesive, and improve the lifespan of the encapsulating adhesive, thereby improving the service life of the light-emitting device.

[0047] In specific applications, the UV-resistant coating 15 on the side of the third lens 13 can prevent the light generated by the light-emitting device from directly shining on the adhesive 52 in the horizontal position. The UV-resistant coating 15 on the exposed lower surface of the second lens 1 can prevent the light emitted by the light-emitting device from being reflected by the lens 1 to the adhesive in the horizontal position. The UV-resistant coating on the side of the second lens 1 can prevent ultraviolet rays from shining on the adhesive 51 in the vertical position. In this way, the UV-resistant coating can cover the adhesive used for encapsulation in all directions, extending the service life of the light-emitting device.

[0048] The lens 1 provided in this application embodiment has at least the following beneficial effects: Compared with the prior art, the lens 1 provided in this application embodiment utilizes a relatively small second lens portion 12 connected to a relatively large first lens portion 11, so that a first stepped structure is formed between the first lens portion 11 and the second lens portion 12. When the lens 1 in this embodiment is used for packaging, the first stepped structure on the lens 1 can be locked onto the end face of the dam 2 of the packaging device, so that the lens 1 can be quickly positioned with the dam 2. Even if the substrate assembly 3 and the dam 2 are deformed during the molding process, the first stepped structure can still be quickly positioned. At the same time, when the lens 1 and the dam 2 are subjected to high temperature during the bonding or welding process, the lens 1 and the dam 2 are not easily offset due to the limiting effect of the first stepped structure after assembly with the dam 2, and the two can maintain effective positioning.

[0049] This application also provides a light-emitting device, please refer to... Figure 6 and Figure 7 The light-emitting device includes a substrate assembly 3, a dam 2, a light-emitting chip 4, and a lens 1 as described above. The lens 1 is connected to the upper side of the dam 2, and the substrate assembly 3 is connected to the lower side of the dam 2. The lens 1, the substrate assembly 3, and the dam 2 form a receiving cavity. The light-emitting chip 4 is connected to the substrate assembly 3 and located in the receiving cavity. The exposed lower surface of the first lens 1 is in contact with the upper end face of the dam 2, that is, the first stepped structure of the lens 1 is engaged with the upper end face of the dam 2, so that the lens 1 and the dam 2 can be quickly positioned and their relative displacement is limited.

[0050] As one of the optional implementation methods in this embodiment, please continue to refer to... Figure 6 and Figure 7 The upper end face of the dam 2 includes a first end face 21, a second end face 22, and a connecting surface 23. The first end face 21 and the second end face 22 have a height difference. The upper side of the connecting surface 23 is connected to the first end face 21, and the lower side of the connecting surface 23 is connected to the second end face 22. The first end face 21, the second end face 22, and the connecting surface 23 form a stepped structure that cooperates with the first stepped structure. Specifically, the first end face 21 is connected to the exposed lower surface of the first lens part 11, the second end face 22 is connected to the lower surface of the second lens part 12, and the connecting surface 23 is connected to the side surface of the second lens part 12.

[0051] As one of the optional implementation methods in this embodiment, please refer to Figure 6 The substrate assembly 3 includes a substrate layer 33, a substrate circuit 32, and a pad 34. The light-emitting chip 4 is connected to the upper surface of the substrate layer 33 through the substrate circuit 32, and the pad 34 is connected to the lower surface of the substrate layer 33. The substrate layer 33 has a conductive hole 31 that penetrates the upper and lower surfaces. The substrate circuit 32 and the pad 34 are electrically connected through the conductive hole 31.

[0052] For example, the light-emitting chip 4 can be a UV-LED chip, the substrate layer 33 can be a ceramic substrate, and the first lens part 11, the second lens part 12 and the third lens part 13 can be integrally formed of glass material, specifically quartz glass or sapphire glass.

[0053] For example, the packaging of light-emitting devices using a semi-inorganic packaging process will be used as an example for illustration: ① Chip die bonding, Flip chip packaging: Flux can be applied to the substrate circuit 32 first (or no flux can be used), and the light-emitting chip 4 is fixed on the flux. The pad 34 of the flip chip 4 can be a gold-tin alloy. The substrate circuit 32 needs to be plated with nickel and gold, with a nickel layer thickness ≥3um and a gold layer thickness ≥0.05um. Forward chip packaging: Apply die bond adhesive to the substrate circuit 32, fix the light-emitting chip 4 to the die bond adhesive, and bake at high temperature to cure the die bond adhesive, so that the chip is bonded to the substrate layer 33 (the purpose of die bond adhesive is to act as solder to bond the light-emitting chip 4 to the substrate layer 33. For forward chips, the die bond adhesive can be insulating glue or silver paste, while vertical chips must use silver paste). The substrate circuit 32 needs to be plated with nickel, palladium and gold, with the following thickness requirements: nickel layer thickness ≥ 3um, palladium layer thickness ≥ 0.05um, and gold layer thickness ≥ 0.05um. ② Welding / Wire Welding Flip chip packaging: The light-emitting chip 4 and the substrate layer 33 are bonded firmly in a eutectic furnace. The temperature of the eutectic furnace can be between 280℃ and 340℃. Vacuum or nitrogen is used for protection to reduce the solder void rate of the light-emitting chip 4 and prevent high-temperature oxidation of the chip electrodes. Formal chip packaging: The electrodes of the light-emitting chip 4 are connected to the substrate circuit 32 by wire bonding machine; ③ Apply adhesive: Apply adhesive to the upper end face of the dam 2; ④ Anti-ultraviolet coating 15: An anti-ultraviolet coating 15 is provided at the corresponding position of lens 1; ⑤ Cover lens 1, place lens 1 on the upper end face of the dam 2, so that the first step structure and the second step structure are engaged with the dam 2; ⑥ Glue container 14, excess rebound glue flows into glue container 14; ⑦ Adhesive curing: Depending on the type of adhesive used, the adhesive may be cured by baking or UV light.

[0054] In specific applications, for those using an all-inorganic packaging process, the side of the lens 1 connected to the dam 2 needs to be metallized. For example, the exposed lower surfaces of the first lens part 11 and the second lens part 12, as well as the sides of the second lens part 12 and the third lens part 13, can be electroplated with a gold-tin alloy (80% gold and 20% tin).

[0055] The light-emitting device provided in this application embodiment has at least the following beneficial effects: Compared with the prior art, the light-emitting device provided in this application embodiment uses the above-mentioned lens 1 for encapsulation, and connects the exposed lower surface of the first lens part 11 with the upper end face of the dam 2, so that the first stepped structure of the lens 1 is stuck on the upper end face of the dam 2, thereby realizing the rapid positioning of the lens 1 and the dam 2, and limiting the relative displacement of the lens 1 and the dam 2, ensuring the encapsulation effect.

[0056] Example 2: Please refer to Figure 8 The difference between this embodiment and embodiment one lies in the different locking structure. Specifically, the locking structure of this embodiment includes a positioning groove 16 formed by the second lens part 12 at the position of the first lens part 11 near the edge. The bottom of the positioning groove 16 can be the exposed lower surface of the first lens part 11, and the side wall of the positioning groove 16 can be the side of the second lens part 12.

[0057] In specific applications, when the lens 1 of this embodiment is connected to the dam 2, the end face of the dam 2 can extend into the positioning groove 16 and abut against the second lens part 12 and the first lens part 11 to achieve the limit of rapid positioning of the lens 1 and the dam 2, and ensure the reliability of the connection between the lens 1 and the dam 2.

[0058] It should be noted that, in this embodiment, "closer to the edge" refers to a position closer to the edge of the first lens portion 11 than to the center of the first lens portion 11.

[0059] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A lens for connecting to a dam (2) and encapsulating a light-emitting device, characterized in that, The lens includes a first lens portion (11) and a second lens portion (12). The first lens portion (11) and the second lens portion (12) each have an upper surface and a lower surface that are disposed opposite to each other, and a side surface located between the upper surface and the lower surface. The upper surface of the second lens portion (12) is connected to the lower surface of the first lens portion (11). The projection of the second lens portion (12) on the lower surface of the first lens portion (11) is smaller than that of the first lens portion (11). The exposed lower surface of the first lens portion (11) and the second lens portion (12) form a locking structure that causes the dam (2) to abut against the second lens portion (12).

2. The lens as claimed in claim 1, characterized in that, The positioning structure includes a first stepped structure between the exposed lower surface of the first lens portion (11) and the second lens portion (12); or, The positioning structure includes a positioning groove (16) formed by the second lens portion (12) near the edge of the first lens portion (11).

3. The lens as described in claim 2, characterized in that, The central axis of the first lens part (11) coincides with the second central axis of the second lens part (12), and / or the upper surface of the first lens part (11) is a plane, an arc surface, or a sphere.

4. The lens as described in claim 2, characterized in that, The projection of the first lens portion (11) onto the upper surface of the second lens portion (12) is square or circular, and / or the projection of the second lens portion (12) onto the lower surface of the first lens portion (11) is square or circular.

5. The lens as described in claim 2, characterized in that, The edge of the lower surface of the first lens part (11) is closest to the center point M of the first lens part (11) at point A. The line connecting the center point M and the closest point A is L. The projection edge of the second lens part (12) on the lower surface of the first lens part (11) intersects the line L at point B, where MB≥AB.

6. The lens as claimed in claim 1, characterized in that, The exposed lower surface of the first lens part (11) is provided with a glue-containing groove (14), which is close to the second lens part (12) and is provided along the edge of the second lens part (12).

7. The lens as claimed in any one of claims 1 to 6, characterized in that, The lens also includes a third lens portion (13), which has an upper surface and a lower surface disposed opposite to each other, and a side surface located between the upper surface and the lower surface. The upper surface of the third lens portion (13) is connected to the lower surface of the second lens portion (12). The projection of the third lens portion (13) onto the lower surface of the second lens portion (12) is smaller than that of the second lens portion (12). A second stepped structure is formed between the exposed lower surface of the second lens portion (12) and the third lens portion (13).

8. The lens as claimed in claim 7, characterized in that, An anti-ultraviolet coating (15) is provided on the side surface of the second lens part (12), the exposed lower surface of the second lens part (12), and the side surface of the third lens part (13).

9. A light-emitting device, characterized in that, The device includes a substrate assembly (3), a dam (2), a light-emitting chip (4), and a lens as described in any one of claims 1 to 8. The lens and the substrate assembly (3) are respectively connected to the upper and lower sides of the dam (2) and form a receiving cavity. The light-emitting chip (4) is connected to the substrate assembly (3) and located in the receiving cavity. The exposed lower surface of the first lens is in contact with the upper end face of the dam (2).

10. The light-emitting device as described in claim 9, characterized in that, The upper end face of the dam (2) includes a first end face (21) and a second end face (22) with a drop, and a connecting surface (23) connecting the first end face (21) and the second end face (22). The first end face (21) is connected to the exposed lower surface of the first lens part (11), the second end face (22) is connected to the lower surface of the second lens part (12), and the connecting surface (23) is connected to the side of the second lens part (12). The substrate assembly (3) includes a substrate layer (33), substrate lines (32), and pads (34). The light-emitting chip (4) is connected to the upper surface of the substrate layer (33) through the substrate lines (32), and the pads (34) are connected to the lower surface of the substrate layer (33). The substrate layer (33) has conductive holes (31) penetrating the upper and lower surfaces. The substrate lines (32) and the pads (34) are electrically connected through the conductive holes (31).