Hollow coupling device for semiconductor wafer, Semiconductor wafer cleaning device

Abstract

The application provides a hollow coupling device for a semiconductor wafer, and a semiconductor wafer cleaning device. The hollow coupling device comprises a hollow coupling support for connecting a wafer clamping device and a driving motor. A hollow structure is arranged at the center of the hollow coupling support, and the hollow structure is used for accommodating a bearing and a hollow shaft. The hollow shaft is internally provided with a cooling water pipe. The bearing is arranged in the hollow structure and is sleeved on the outer diameter of the hollow shaft, and is used for allowing the hollow coupling support and the hollow shaft to rotate relative to each other. The application can be compatible with a heating disc added to the back of the wafer, does not increase the overall installation height of the wafer clamping device, and the hollow structure of the hollow coupling support can accommodate the cooling water pipe, so that the heating disc can be efficiently cooled.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and more specifically, to a hollow coupling device for semiconductor wafers and a semiconductor wafer cleaning device. Background Technology

[0002] In semiconductor wafer cleaning processes, adding a heating plate to the back of the wafer can improve temperature uniformity and cleaning performance. However, this improvement makes existing wafer clamping devices unsuitable for designs based on wafer height. Because the heating plate generates high temperatures during operation, it requires cooling through internal cooling water pipes within the hollow shaft; existing wafer clamping devices cannot meet these cooling requirements. Utility Model Content

[0003] This application provides a hollow coupling device and a semiconductor wafer cleaning device for semiconductor wafers, which can be compatible with a heating plate added to the back of the wafer without increasing the overall installation height of the wafer clamping device, and can accommodate cooling water pipes to ensure that the heating plate can dissipate heat efficiently.

[0004] In a first aspect, this application provides a hollow coupling device for semiconductor wafers, comprising:

[0005] A hollow coupling bracket is used to connect a wafer clamping device and a drive motor. The hollow coupling bracket has a hollow structure at its center, which is used to accommodate a bearing and a hollow shaft. The hollow shaft has a built-in cooling water pipe.

[0006] A bearing is disposed in the hollow structure and sleeved on the outer diameter of the hollow shaft, for allowing the hollow coupling bracket to rotate relative to the hollow shaft.

[0007] In some embodiments, the hollow coupling bracket includes a bracket upper cover and a bracket body; the bracket upper cover includes an upper cover body and an upper cover flange, the upper cover body is provided with a clamping device positioning surface for positioning and connecting a wafer clamping device, the bracket body is provided with a first body flange and a second body flange, the first body flange is connected to the upper cover flange, and the second body flange is positioned and connected to a drive motor.

[0008] In some embodiments, the upper cover body has a plurality of circumferentially distributed set screw holes; the hollow coupling device further includes a set screw, which is threadedly connected to the set screw hole.

[0009] In some embodiments, the hollow coupling bracket further includes a sensing bracket for mounting a sensor; the bracket body is provided with a sensing bracket mounting part, and the sensing bracket is fixedly mounted on the sensing bracket mounting part.

[0010] In some embodiments, the hollow coupling bracket further includes a counterweight block, the bracket body is provided with a counterweight block mounting part, and the counterweight block is fixedly installed in the counterweight block mounting part to balance the weight of the sensing bracket.

[0011] In some embodiments, the counterweight and the sensing bracket are symmetrically distributed with respect to the axial direction of the hollow coupling device.

[0012] In some embodiments, the outer wall surface of the bracket body is provided with a plurality of circumferentially distributed clearance grooves, which are used to avoid the locking member between the second body flange and the drive motor.

[0013] Secondly, embodiments of this application also provide a semiconductor wafer cleaning apparatus, including a heating plate, a wafer clamping device, a drive motor, a hollow coupling device, and a nitrogen distribution plate. The heating plate is disposed on the back of the wafer to be cleaned. The wafer clamping device is used to clamp the wafer to be cleaned. The hollow coupling device connects the wafer clamping device and the drive motor. The hollow structure of the hollow coupling device is used to accommodate a hollow tube and a cooling water pipe of the heating plate. The nitrogen distribution plate is fixed to the outer wall of the hollow coupling device and is used to provide nitrogen to the wafer to be cleaned. The hollow coupling device is the hollow coupling device for semiconductor wafers described in the above embodiments.

[0014] In some embodiments, the nitrogen flow divider plate has a nitrogen flow channel and an air inlet inside, a sealing block is provided in the nitrogen flow channel, the sealing block extends toward the air inlet to form a gas pipe connector, and a pressure stabilizing groove is provided at the center of the nitrogen flow divider plate, the pressure stabilizing groove being connected to the nitrogen flow channel.

[0015] In some embodiments, the nitrogen distribution plate is further provided with a plurality of self-tapping sleeves.

[0016] The hollow coupling device for semiconductor wafers provided in this application, by setting a hollow coupling bracket, can be compatible with the heating plate added to the back of the wafer without increasing the overall installation height of the wafer clamping device. The hollow structure of the hollow coupling bracket can accommodate cooling water pipes to ensure that the heating plate can dissipate heat efficiently. The layout of this application is compact, does not occupy installation space, can improve heat dissipation efficiency, and ensure the cleaning efficiency and cleaning effect of semiconductor wafers. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a semiconductor wafer cleaning apparatus provided in some embodiments of this application;

[0019] Figure 2 A schematic diagram of the semiconductor wafer cleaning apparatus provided in some embodiments of this application from another perspective;

[0020] Figure 3 This is an assembly diagram of a hollow coupling device provided in some embodiments of this application;

[0021] Figure 4 This is a schematic diagram of the structure of a hollow coupling device provided in some embodiments of this application;

[0022] Figure 5 A structural schematic diagram of the hollow coupling device provided in some embodiments of this application from another perspective;

[0023] Figure 6 A schematic diagram of a nitrogen distribution plate in a hollow coupling device provided in some embodiments of this application;

[0024] Figure 7 for Figure 6 A cross-sectional view of part AA in the middle.

[0025] The attached figures are labeled as follows:

[0026] 1-Hollow coupling device; 2-Drive motor; 3-Nitrogen gas separator; 4-Hollow pipe;

[0027] 10-Hollow Coupling Support;

[0028] 101-Hollow structure; 11-Support top cover; 12-Support body; 13-Induction support; 14-Counterweight; 31-Air inlet; 32-Nitrogen flow channel; 33-Sealing block; 34-Pressure stabilizing groove; 35-Allowing hole; 36-Self-tapping screw sleeve;

[0029] 111-Upper cover body; 112-Upper cover flange; 121-First body flange; 122-Second body flange; 123-Allowing groove; 1111-Top screw hole. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish different objects, not to describe a particular order or hierarchy.

[0032] In this application, the reference to "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0034] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0035] In the embodiments of this application, the same reference numerals denote the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width, and other dimensions of various components in the embodiments of this application shown in the accompanying drawings, as well as the overall thickness, length, width, and other dimensions of the integrated device, are merely illustrative and should not constitute any limitation on this application.

[0036] In this application, "multiple" means two or more (including two).

[0037] Please refer to Figure 1 , Figure 2 and Figure 3This application provides a hollow coupling device for semiconductor wafers, including a hollow coupling bracket 10. The hollow coupling bracket 10 can be tubular, columnar, disc-shaped, etc., and can be made of high-strength steel to ensure strength and rigidity. The hollow coupling bracket 10 is used to connect the wafer clamping device and the drive motor 2. The hollow coupling bracket 10 can be installed and fixed with the wafer clamping device (e.g., a robotic arm or vacuum chuck) through connecting flanges, connectors, interfaces, etc., and can be connected with the drive motor 2 through connecting flanges, connectors, interfaces, etc. The hollow coupling bracket 10 can be rigidly connected to the wafer clamping device and the drive motor 2 to achieve...

[0038] The hollow coupling bracket 10 has a hollow structure 101 at its center, which runs vertically through the entire bracket. This hollow structure 101 can accommodate the bearing and the hollow shaft. The hollow shaft houses the cooling water pipes for the heater, and coolant is transported within the cooling water pipes to cool the heater. The hollow structure 101 allows the cooling water pipes to pass through, reducing external piping. The hollow structure 101 also reduces rotational inertia and improves motor response speed.

[0039] The hollow coupling device 1 for semiconductor wafers provided in this application embodiment has a drive motor 2 that drives the hollow coupling support 10 to rotate. The hollow coupling support 10 drives the wafer clamping device and the wafer on it to rotate. Cooling water flows into the heater from the inner tube of the hollow shaft and then flows out of the heater through the pipe, thereby circulating and dissipating heat from the heater.

[0040] The hollow coupling device 1 is also equipped with a bearing (not shown in the figure). The bearing is installed inside the hollow structure 101 of the hollow coupling bracket 10. The inner wall of the hollow structure 101 is provided with an installation step. The bearing is installed on the installation step and is fitted onto the hollow shaft. The drive motor 2 provides driving force to the wafer clamping device through the hollow coupling bracket 10. The wafer clamping device carries the wafer and rotates. The hollow shaft is stationary relative to the wafer clamping device. The bearing can realize frictionless relative rotation between the hollow coupling bracket 10 and the hollow shaft.

[0041] The hollow coupling device 1 for semiconductor wafers provided in this application embodiment integrates power transmission and heater and cooling water pipe installation functions, which can save installation space and improve wafer processing quality.

[0042] In some embodiments, the hollow coupling bracket 10 adopts a split structure to facilitate assembly and maintenance, such as... Figure 3As shown, specifically, the hollow coupling bracket 10 includes a bracket upper cover 11 and a bracket body 12. The bracket upper cover 11 includes an upper cover body 111 and an upper cover flange 112. The upper cover body 111 is provided with a clamping device positioning surface for positioning and connecting the wafer clamping device. The bracket body 12 is provided with a first body flange 121 and a second body flange 122. The first body flange 121 is connected to the upper cover flange 112, and the second body flange 122 is positioned and connected to the drive motor 2.

[0043] The positioning surface of the clamping device is located on the top or side of the upper cover body 111. This positioning surface should be a high-precision plane with multiple connection holes. It is precisely aligned with the wafer clamping device via locking components to ensure the wafer's positional accuracy. The upper cover flange 112 is located at the bottom of the upper cover body 111 and is fixed to the first body flange 121 of the support body 12 by bolts or positioning pins. An anti-misalignment guide structure can be provided on the flange contact surface to connect the upper cover flange 112 to the support body 12. The upper cover can be disassembled and replaced independently to accommodate different models of wafer clamping devices. The positioning surface of the clamping device reduces installation errors and improves positioning accuracy.

[0044] The support body 12 is provided with a first body flange 121 and a second body flange 122. The first body flange 121 is an annular structure that matches the upper cover flange 112 and is connected by bolts. The second body flange 122 and the first body flange 121 are respectively located at both ends of the support body 12 along the axial direction and are connected to the drive motor 2 by bolts or other locking devices. The hollow channel is a vertical through hole that passes through the support body 12 and the upper cover body 111, allowing cooling pipes to pass through. This achieves rigid torque transmission. The flange connection ensures the strength and reliability of the connection, ensures efficient power transmission, reduces vibration, and ensures the coaxial accuracy of the wafer clamping device and the drive motor 2 through the double cooperation of the flange and the positioning surface.

[0045] Multiple set screw holes 1111 are circumferentially distributed on the upper cover body 111, as shown in the reference. Figure 3 The set screw hole 1111 can be a threaded hole. The hollow coupling device 1 also includes set screws (not shown in the figure), which are threaded into the set screw hole 1111. By adjusting the distribution and screwing depth of the set screws, the dynamic balance can be adjusted. During high-speed rotation, when vibration or dynamic balance deviation occurs, it can be quickly corrected by adjusting the depth of the set screws without disassembling the entire device, significantly improving stability. In addition, the set screws can be used to push out the bracket cover 11, facilitating the replacement of bearings later.

[0046] refer to Figure 4The hollow coupling bracket 10 is also equipped with a sensing bracket 13, which is specifically installed on the hollow coupling bracket 10. The bracket body 12 is provided with a mounting part for the sensing bracket 13, and the sensing bracket 13 is fixedly installed on the mounting part. The sensor is fixedly installed on the sensing bracket 13, thereby integrating the sensor on the hollow coupling bracket 10. This allows for real-time monitoring of the rotation angle or position of the hollow coupling bracket 10, ensuring the accurate installation of the wafer clamping device and improving processing precision.

[0047] refer to Figure 5 Since the mass distribution of the sensing bracket 13 may disrupt the dynamic balance of the hollow coupling bracket 10, a counterweight 14 can be set on the opposite side of the bracket body 12. The mass of the counterweight 14 matches the mass of the sensing bracket 13 and the sensor to eliminate centrifugal force during rotation and avoid vibration.

[0048] Furthermore, the specific positional relationship between the counterweight 14 and the sensing bracket 13 is not limited in this embodiment. Optionally, as... Figure 5 As shown, there is one counterweight 14, which is symmetrically distributed with respect to the axis of the induction support 13 relative to the hollow coupling device 1, and has the same mass as the induction support 13 and the sensor on it. This design can balance the mass distribution of the induction support 13, thereby reducing the influence of the induction support 13 on the rotation process of the hollow coupling support 10, and helping to improve the motion accuracy of the wafer clamping device.

[0049] Of course, in other embodiments, multiple counterweights 14 can be provided, circumferentially distributed in the hollow coupling bracket 10. Together with the sensing bracket 13 and the sensor on it, they form a uniformly distributed mass structure to balance the mass distribution of the hollow coupling bracket 10 circumferentially. In addition, the mass can be finely adjusted by adding or removing shims or changing materials to accommodate different weight differences of the sensing bracket 13 and sensor.

[0050] Continue to refer to Figure 5 The outer wall of the bracket body 12 is provided with a plurality of circumferentially distributed clearance grooves 123. The clearance grooves 123 are used to avoid the locking parts between the second body flange 122 and the drive motor 2, so as to avoid interference with the locking parts and ensure the compact layout of the overall structure in a limited space. In addition, the clearance grooves 123 remove part of the material of the bracket body 12, which can reduce the rotational inertia load and improve the motor response speed.

[0051] Furthermore, this application embodiment also provides a semiconductor wafer cleaning apparatus, including a heating plate, a wafer clamping device, a drive motor 2, a hollow coupling device 1, and a nitrogen distribution plate 3. The heating plate is disposed on the back of the wafer to be cleaned. The wafer clamping device is used to clamp the wafer to be cleaned. The hollow coupling device 1 connects the wafer clamping device and the drive motor 2. The hollow structure 101 of the hollow coupling device 1 is used to accommodate the hollow tube 4 and the cooling water pipe of the heating plate. The nitrogen distribution plate 3 is fixed to the outer wall surface of the hollow coupling device 1 and is used to provide nitrogen to the wafer to be cleaned. The hollow coupling device 1 is the hollow coupling device 1 for semiconductor wafers in the above embodiment.

[0052] A heating plate is mounted on the back of the wafer to be cleaned, and is in close contact with the wafer through a thermally conductive material (such as ceramic or metal alloy). Cooling water pipes are integrated into the hollow tube 4 of the hollow coupling device 1 and extend into the heating plate, forming a closed-loop cooling circuit. The heating plate directly contacts the back of the wafer, achieving rapid heating and uniform heat dissipation, improving the stability of the cleaning process. The built-in design of the cooling water pipes within the hollow shaft saves space and avoids interference from external piping. The wafer clamping device is bolted to the upper cover of the hollow coupling bracket 10, using electrostatic adsorption or vacuum adsorption to clamp the wafer, ensuring that the wafer does not shift during high-speed rotation. The rigid connection prevents vibration and ensures the wafer's positional accuracy during the cleaning process. The modular structure facilitates maintenance and adaptation to wafers of different sizes.

[0053] The drive motor 2 is fixed to the through hole at the bottom of the hollow coupling bracket 10 body by bolts, and the clearance groove 123 is used to avoid screw interference. The motor output shaft rotates synchronously with the hollow coupling device 1, driving the wafer clamping device to rotate. The drive motor 2 directly drives the coupling bracket, reducing intermediate transmission losses and improving energy utilization.

[0054] The hollow coupling 1 connects the wafer clamping device and the drive motor 2. An internal bearing supports the hollow shaft, which remains stationary. Cooling water and nitrogen pipes pass through the hollow shaft, and its outer wall mates with the inner ring of the bearing. A sensing bracket 13 is mounted on the bracket body 12 and carries a sensor to monitor the rotational position.

[0055] like Figure 6 and Figure 7 As shown, the nitrogen distribution plate 3 can be made of PTFE material. The inner ring of the nitrogen distribution plate 3 is fixed to the outer wall of the hollow coupling device 1 and connected to the nitrogen pipeline inside the hollow shaft. The internal design includes a pressure stabilizing groove 34 and a channel to guide the nitrogen to diffuse evenly around the wafer, forming a positive pressure nitrogen environment. This isolates the metal parts from acid and alkali gases that corrode them. The pressure stabilizing groove 34 ensures that the nitrogen is quickly filled and evenly distributed, avoiding local airflow disturbances that could affect the process.

[0056] The semiconductor wafer cleaning apparatus provided in this application integrates heating, cooling, driving, and nitrogen sealing functions into one compact structure, which can reduce equipment space occupation, improve processing efficiency, and improve cleaning efficiency and wafer yield.

[0057] Furthermore, the nitrogen distribution plate 3 is equipped with self-tapping sleeves 36 to facilitate its removal. The nitrogen distribution plate 3 also has clearance holes 35, which allow the rotating shaft of the rotary cylinder next to the drive motor 2 and the drive block on the shaft to pass through, thus preventing the rotation shaft and drive block from passing. The nitrogen distribution plate 3 internally has a nitrogen flow channel 32 and an air inlet 31. The air inlet 31 has an annular pressure-stabilizing groove 34. A sealing block 33 is installed inside the nitrogen flow channel 32, tightly fitting the flow channel to prevent gas leakage and maintain a positive pressure environment. The sealing block 33 extends towards the air inlet 31 to form a connector for the gas pipe fitting. A pressure-stabilizing groove 34 is located at the center of the nitrogen distribution plate 3, connecting to the nitrogen flow channel 32. The annular design of the air inlet 31 ensures uniform nitrogen entry into the nitrogen distribution plate 3, avoiding localized pressure unevenness and improving the pressure stability of subsequent flow channels. The sealing block 33 extends to form a connector connection part, which is used to fix the external gas pipe connector to achieve quick connection and sealing. The sealing block 33 integrates the connector to realize the integral molding of the sealing block 33 and the flow channel. The extended part is machined with threaded holes or snap-fit ​​structures to fix the gas pipe connector, thereby reducing nitrogen pressure loss.

[0058] In this way, the pressure-stabilizing groove 34 in the center of the nitrogen distribution plate 3 is connected to the nitrogen flow channel 32, which is connected to the air inlet 31, forming a gas buffer area. The volume of the pressure-stabilizing groove 34 is calculated to match the nitrogen flow rate to avoid sudden pressure changes. The pressure-stabilizing groove 34 and the nitrogen flow channel 32 work together to ensure uniform nitrogen distribution. This scheme achieves dynamic pressure balance through the annular air inlet of the pressure-stabilizing groove 34, avoiding process defects caused by uneven airflow distribution.

[0059] The hollow coupling device and semiconductor wafer cleaning device for semiconductor wafers provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the methods and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A hollow coupling device for semiconductor wafers, characterized in that, include: A hollow coupling bracket (10) is used to connect the wafer clamping device and the drive motor (2). A hollow structure (101) is provided at the center of the hollow coupling bracket (10). The hollow structure (101) is used to accommodate the bearing and the hollow shaft. The hollow shaft has a built-in cooling water pipe. The bearing is disposed in the hollow structure (101) and sleeved on the outer diameter of the hollow shaft, for the hollow coupling bracket (10) to rotate relative to the hollow shaft.

2. The hollow coupling device for semiconductor wafers according to claim 1, characterized in that, The hollow coupling bracket (10) includes a bracket cover (11) and a bracket body (12). The bracket cover (11) includes a cover body (111) and a cover flange (112). The cover body (111) is provided with a clamping device positioning surface for positioning and connecting the wafer clamping device. The bracket body (12) is provided with a first body flange (121) and a second body flange (122). The first body flange (121) is connected to the cover flange (112), and the second body flange (122) is positioned and connected to the drive motor (2).

3. The hollow coupling device for semiconductor wafers according to claim 2, characterized in that, The upper cover body (111) has a plurality of circumferentially distributed top screw holes (1111). The hollow coupling device also includes a set screw, which is threaded into the set screw hole (1111).

4. The hollow coupling device for semiconductor wafers according to claim 2, characterized in that, The hollow coupling bracket (10) also includes a sensing bracket (13) for mounting sensors; the bracket body (12) is provided with a sensing bracket mounting part, and the sensing bracket (13) is fixedly mounted on the sensing bracket mounting part.

5. The hollow coupling device for semiconductor wafers according to claim 4, characterized in that, The hollow coupling bracket (10) also includes a counterweight (14). The bracket body (12) is provided with a counterweight mounting part. The counterweight (14) is fixedly installed in the counterweight mounting part to balance the weight of the sensing bracket (13).

6. The hollow coupling device for semiconductor wafers according to claim 5, characterized in that, The counterweight (14) and the sensing bracket (13) are symmetrically distributed with respect to the axial direction of the hollow coupling device.

7. The hollow coupling device for semiconductor wafers according to any one of claims 2 to 6, characterized in that, The outer wall of the bracket body (12) is provided with a plurality of circumferentially distributed clearance grooves (123), which are used to avoid the locking member between the second body flange (122) and the drive motor (2).

8. A semiconductor wafer cleaning apparatus, characterized in that, The device includes a heating plate, a wafer clamping device, a drive motor (2), a hollow coupling device (1), and a nitrogen distribution plate (3). The heating plate is located on the back of the wafer to be cleaned. The wafer clamping device is used to clamp the wafer to be cleaned. The hollow coupling device (1) connects the wafer clamping device and the drive motor (2). The hollow structure (101) of the hollow coupling device (1) is used to accommodate the hollow tube (4) and the cooling water pipe of the heating plate. The nitrogen distribution plate (3) is fixed to the outer wall of the hollow coupling device (1) and is used to provide nitrogen to the wafer to be cleaned. The hollow coupling device (1) is the hollow coupling device for semiconductor wafers as described in any one of claims 1 to 7.

9. The semiconductor wafer cleaning apparatus according to claim 8, characterized in that, The nitrogen flow divider (3) is provided with a nitrogen flow channel (32) and an air inlet (31) inside. A sealing block (33) is provided inside the nitrogen flow channel (32). The sealing block (33) extends toward the air inlet (31) to form a gas pipe connector. A pressure stabilizing groove (34) is provided in the center of the nitrogen flow divider (3). The pressure stabilizing groove (34) is connected to the nitrogen flow channel (32).

10. The semiconductor wafer cleaning apparatus according to claim 9, characterized in that, The nitrogen gas distribution plate (3) is also provided with multiple self-tapping sleeves (36).

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