Semiconductor leadframe placement bin

Abstract

The utility model provides a semiconductor lead frame placement bin, it can be together with built -in semiconductor lead frame whole body transfer, has reduced the wear rate of semiconductor lead frame, has improved the yield rate. It includes: the assembly bottom plate component, it includes at least one bottom plate, the face domain of each bottom plate is provided with frame jacking avoidance slot, frame jacking avoidance slot is used for jacking semiconductor lead frame, the periphery of bottom plate is provided with a plurality of edge column mounting hole, one pair of short sides of bottom plate is provided with positioning pin hole, the position area of the bottom surface of bottom plate at least four corners is provided with the recessed magnet mounting blind hole, a plurality of edge columns, a plurality of magnets and bin support plate, the bottom of edge column is inserted in the corresponding edge column mounting hole, and the surrounding formation corresponding semiconductor lead frame's placement cavity is formed after all edge columns are inserted in place, adjacent edge columns are arranged at intervals, the magnet is embedded in the corresponding magnet mounting blind hole.

Description

Technical Field

[0001] This utility model relates to the technical field of lead frame hoppers, specifically to semiconductor lead frame placement hoppers. Background Technology

[0002] Existing semiconductor leadframe hoppers are all fixedly mounted on hopper support plates. In actual use, external transfer equipment is required to remove the leadframes from the hoppers before the leadframes can be transferred. Consequently, each workstation needs to have its own independent semiconductor leadframe hopper during the transfer process, requiring a large number of semiconductor leadframes. Furthermore, during actual operation, the semiconductor leadframes are subject to wear and tear as they are transferred between different hoppers via a transfer structure, leading to a decrease in yield. Therefore, there is an urgent need to develop a semiconductor leadframe placement hopper that can connect the hoppers to the semiconductor leadframes for overall frame transfer. Utility Model Content

[0003] To address the aforementioned issues, this invention provides a semiconductor lead frame placement hopper, which can be transported as a whole along with the built-in semiconductor lead frame, thereby reducing the wear rate of the semiconductor lead frame and improving the yield.

[0004] A semiconductor lead frame placement hopper, characterized in that it comprises: An assembly base plate includes at least one base plate. Each base plate has a frame lifting clearance groove on its surface for lifting semiconductor lead frames. The base plate has a plurality of side post mounting holes arranged around its perimeter. Locating pin holes are arranged on a pair of short sides of the base plate. Recessed magnet mounting blind holes are arranged at at least four corners of the bottom surface of the base plate. Several side pillars; Several magnets; And the silo support plate; The bottom of each side post is inserted into the corresponding side post mounting hole. After all the side posts are inserted into place, they form a placement cavity for the corresponding semiconductor lead frame. Adjacent side posts are spaced apart. The magnet is embedded in the corresponding magnet mounting blind hole. The hopper support plate is provided with an upwardly protruding positioning pin corresponding to the position of the positioning pin hole. The hopper support plate is supported by ferrous material, and the positioning pin holes of the corresponding bottom plate are arranged in a positioning pin configuration.

[0005] Its further features are: The assembled base plate assembly is composed of two base plates, namely the first base plate and the second base plate. The side posts on each base plate independently enclose an independent placement cavity. The hopper support plate is provided with two side baffles corresponding to the width area of ​​the overall hopper after the two base plates are assembled. A convex C-shaped area is provided in the middle of the adjacent area of ​​the first base plate and the second base plate along the length direction. Convex stop edges are provided at both ends of the adjacent area of ​​the second base plate and the first base plate along the length direction. After the first base plate and the second base plate are positioned by positioning pins, the first base plate and the second base plate are respectively provided with two lifting clearance grooves. The convex stop edges and the convex C-shaped area together form a boundary, which makes the overall area occupied small. The two side baffles of the hopper support plate are respectively fixed with lower guide blocks. The inner side of each set of lower guide blocks is fixed with a corresponding lifting cylinder. The upper output end of each set of lifting cylinders is fixed to two corresponding lifting plates through connecting blocks. When the hopper position is not fixed and the semiconductor lead frame needs to be moved, the two lifting plates of each set will push out the semiconductor lead frame in the corresponding placement cavity under the drive of the corresponding lifting cylinder.

[0006] With the structure of this utility model, the hopper can be removed from the hopper support plate. Since the bottom of the base plate is embedded with magnets, the hopper can be taken out for easy loading. After completion, the positioning pins on the hopper support plate are aligned and placed through the positioning pin holes. At the same time, because of the magnets adsorbing at the bottom, the base plate will not move with the hopper even when the product is lifted. Compared with the previous structure, it is more flexible and convenient for manual loading and unloading. Multiple hopper placement cavities can be set up at the same time according to the area of ​​the hopper support plate, reducing material change time. Moreover, it can be transported as a whole with the built-in semiconductor lead frame, reducing the wear rate of the semiconductor lead frame and improving the yield. Attached Figure Description

[0007] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a schematic diagram of the assembly of the base plate, side posts, and magnets of this utility model; The names corresponding to the serial numbers in the diagram are as follows: Assembled base plate assembly 10, frame lifting clearance groove 11, side column mounting hole 12, positioning pin hole 13, magnet mounting blind hole 14, first base plate 101, second base plate 102, side convex C-shaped area 103, side convex stop edge 104, side column 20, magnet 30, hopper support plate 40, positioning pin 41, side baffle 42, lower guide block 43, semiconductor lead frame 50, placement cavity 60, lifting cylinder 70, connecting block 71, lifting upright plate 72. Detailed Implementation

[0008] Semiconductor lead frame placement hopper, see Figure 1 , Figure 2 It includes an assembled base plate assembly 10, several side posts 20, several magnets 30, and a hopper support plate 40; The assembly base plate assembly 10 includes at least one base plate. Each base plate has a frame lifting clearance groove 11 on its surface, which is used to lift the semiconductor lead frame 50. The perimeter of the base plate has a plurality of side post mounting holes 12. A pair of short sides of the base plate have locating pin holes 13. At least four corners of the bottom surface of the base plate have recessed magnet mounting blind holes 14. The bottom of the side post 20 is inserted into the corresponding side post mounting hole 12. After all the side posts 20 of each base plate are inserted into place, they form the placement cavity 60 of the corresponding semiconductor lead frame 50. Adjacent side posts 20 are spaced apart. The magnet 30 is embedded in the corresponding magnet mounting blind hole 14. The hopper support plate 40 is provided with an upwardly protruding positioning pin 41 corresponding to the positioning pin hole 13. The hopper support plate 40 is supported by ferrous material. The positioning pin hole 13 of the corresponding base plate is arranged opposite to the positioning pin 41.

[0009] In a specific embodiment, the assembled base plate assembly 10 is composed of two base plates joined together. The two base plates are a first base plate 101 and a second base plate 102. The side posts on each base plate independently enclose and form an independent placement cavity 60. The hopper support plate 40 is provided with two side baffles 42 corresponding to the width area of ​​the overall hopper after the two base plates are joined together. A convex C-shaped region 103 is provided in the middle of the length direction of the adjacent area of ​​the first base plate 101 and the second base plate 102. A convex stop edge 104 is provided at both ends of the length direction of the adjacent area of ​​the second base plate 102 and the first base plate. After the first base plate 101 and the second base plate 102 are positioned by positioning pins 41, the first base plate 101 and the second base plate 102 are respectively provided with two lifting clearance grooves 11. The convex stop edge 104 and the convex C-shaped region 103 together form a boundary, so that the overall area occupied is small.

[0010] In a specific embodiment, the two side baffles 42 of the hopper support plate 40 are respectively fixedly equipped with lower guide blocks 43. The inner side of each set of lower guide blocks 43 is respectively fixedly equipped with a corresponding lifting cylinder 70. The upper output end of each set of lifting cylinders 70 is respectively fixedly connected to two corresponding lifting plates 72 through connecting blocks 71. When the hopper position is not fixed and the semiconductor lead frame 50 needs to be moved, the two lifting plates 72 of each set are driven by the corresponding lifting cylinders 70 to push out the semiconductor lead frame 50 in the corresponding placement cavity 60 through the lifting clearance groove 11.

[0011] This hopper can be removed from the hopper support plate. Because the bottom of the base plate is embedded with magnets, the hopper can be taken out for easy loading. After completion, the positioning pins on the hopper support plate are aligned through the positioning pin holes. At the same time, because of the magnets adhering to the bottom, the base plate will not move with the hopper even when the product is lifted. Compared with the previous structure, it is more flexible and facilitates manual loading and unloading. Multiple hopper placement cavities can be set up at the same time according to the area of ​​the hopper support plate, reducing material change time. In addition, it can be transported together with the built-in semiconductor lead frame, reducing the wear rate of the semiconductor lead frame and improving the yield.

[0012] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0013] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor lead frame placement hopper, characterized in that, It includes: An assembly base plate includes at least one base plate. Each base plate has a frame lifting clearance groove on its surface for lifting semiconductor lead frames. The base plate has a plurality of side post mounting holes arranged around its perimeter. Locating pin holes are arranged on a pair of short sides of the base plate. Recessed magnet mounting blind holes are arranged at at least four corners of the bottom surface of the base plate. Several side pillars; Several magnets; And the silo support plate; The bottom of each side post is inserted into the corresponding side post mounting hole. After all the side posts are inserted into place, they form a placement cavity for the corresponding semiconductor lead frame. Adjacent side posts are spaced apart. The magnet is embedded in the corresponding magnet mounting blind hole. The hopper support plate is provided with an upwardly protruding positioning pin corresponding to the position of the positioning pin hole. The hopper support plate is supported by ferrous material, and the positioning pin holes of the corresponding bottom plate are arranged in a positioning pin configuration.

2. The semiconductor lead frame placement hopper according to claim 1, characterized in that: The assembled base plate assembly consists of two base plates joined together, namely the first base plate and the second base plate. The side posts on each base plate independently enclose and form an independent placement cavity. The hopper support plate is provided with two side baffles corresponding to the width area of ​​the overall hopper after the two base plates are joined together.

3. The semiconductor lead frame placement hopper according to claim 2, characterized in that: A convex C-shaped area is provided in the middle of the adjacent area of ​​the first base plate and the second base plate along the length direction. Convex stop edges are provided at both ends of the adjacent area of ​​the second base plate and the first base plate along the length direction. After the first base plate and the second base plate are positioned by positioning pins, the first base plate and the second base plate are respectively provided with two lifting clearance grooves. The convex stop edges and the convex C-shaped area together form a boundary.

4. The semiconductor lead frame placement hopper according to claim 3, characterized in that: The two side baffles of the hopper support plate are respectively fixed with lower guide blocks. The inner side of each set of lower guide blocks is fixed with a corresponding lifting cylinder. The upper output end of each set of lifting cylinders is fixed to two corresponding lifting plates through connecting blocks. When the hopper position is not fixed and the semiconductor lead frame needs to be moved, the two lifting plates of each set will push out the semiconductor lead frame in the corresponding placement cavity under the drive of the corresponding lifting cylinder.

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