Packaging machine for epoxy plastic packaging material production

Abstract

This utility model belongs to the technical field of packaging machines for epoxy molding compound production, specifically disclosing a packaging machine for epoxy molding compound production of semiconductor devices. It includes a device body with a connecting mechanism, which includes a pressing component. An adjusting component is located in the lower section of the device body, and a receiving component is located in the middle section. A motor drives a rotating shaft in the pressing component to rotate. The shaft, through a transmission wheel set, moves a rotating top block, achieving quantitative feeding of the epoxy molding compound. The linkage between the transmission wheel and the rotating shaft allows the receiving tray to be synchronously conveyed by the transmission belt. This, combined with the packaging frame and hinged pressing block, completes the material fixation, achieving precise feeding, quantitative filling, and initial packaging fixation of the epoxy molding compound. The docking of the packaging frame and the storage box, along with the anti-detachment design of the limiting strip, prevents material accumulation and uneven compression, reducing the risk of epoxy molding compound clumping or surface damage.

Description

Technical Field

[0001] This utility model relates to the technical field of packaging machines for epoxy molding compound production, specifically a packaging machine for epoxy molding compound production. Background Technology

[0002] In the semiconductor device manufacturing process, the packaging of epoxy molding compounds is a critical step before the devices leave the factory, directly affecting the storage stability, transportation safety, and the appearance and performance quality of the final product. As the semiconductor industry rapidly develops towards higher precision and miniaturization, the market demands increasingly stringent requirements for the production efficiency, packaging accuracy, and protective performance of epoxy molding compounds.

[0003] Traditional epoxy molding compound packaging for semiconductor devices relies heavily on manual labor or semi-automatic equipment, which has many drawbacks: manual packaging is not only labor-intensive and inefficient, but also prone to metering errors and insufficient sealing due to improper operation, leading to moisture absorption and contamination of the molding compound, which seriously affects the packaging quality and reliability of subsequent semiconductor devices; semi-automatic equipment is often single-function and cannot achieve integrated operation from precise delivery and quantitative filling of epoxy molding compound to packaging, and its adjustment flexibility is poor when adapting to the epoxy molding compound packaging requirements of different specifications of semiconductor devices (such as packaging capacity and sealing level), requiring frequent shutdowns to adjust equipment parameters or replace parts, which seriously restricts the continuous operation of semiconductor device production lines and makes it difficult to meet the mass production needs of large-scale, high-precision semiconductor manufacturing. Based on this, a packaging machine for epoxy molding compound production is proposed to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a packaging machine for epoxy molding compound production, in order to solve the problem mentioned in the background art that traditional epoxy molding compound packaging for semiconductor devices relies mainly on manual or semi-automatic equipment. Manual packaging is not only labor-intensive and inefficient, but also prone to problems such as measurement deviation of molding compound and insufficient sealing due to improper operation, which in turn leads to moisture absorption and contamination of the molding compound, seriously affecting the packaging quality and reliability of subsequent semiconductor devices. Semi-automatic equipment is often single-function and cannot achieve integrated operation from accurate delivery and quantitative filling of epoxy molding compound to packaging, which seriously restricts the continuous operation of semiconductor device production lines and makes it difficult to meet the mass production needs of large-scale, high-precision semiconductor manufacturing.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a packaging machine for producing epoxy molding compound, comprising a device body, wherein the device body is provided with a connecting mechanism, the connecting mechanism includes a pressing component disposed in the upper section of the device body, an adjusting component disposed in the lower section of the device body, and a receiving component disposed in the middle section of the device body; The pressing assembly includes a fixing block 1 fixedly installed on the outer wall of the device body. A motor 1 is fixedly installed on one end of the back of the fixing block 1. A rotating shaft is fixedly connected to one end of the front of the motor 1. A transmission wheel 1 is fixedly connected to the outer wall of the rotating shaft. A transmission wheel 2 is driven to the outer wall of the transmission wheel 1 via a transmission belt 1. A transmission rod 1 is fixedly connected to the inner wall of the transmission wheel 2. A transmission wheel 3 is fixedly connected to the outer wall of the transmission rod 1. A transmission wheel 4 is driven to the outer wall of the transmission wheel 3 via a transmission belt 2. A transmission wheel 5 is driven to the outer wall of the transmission belt 2. A transmission rod 2 is fixedly connected to the inner wall of the transmission wheel 5. Storage boxes are fixedly installed on both sides of the top of the device body. A limit plate is fixedly connected to the bottom of the inner side of the storage box. An installation plate is fixedly connected to the inner side of the limit plate. A rotating top block is fixedly installed on the inner side of the installation plate.

[0006] Preferably, the adjustment assembly includes a fixing block two fixedly connected to the bottom of the device body, a motor two fixedly mounted on the outer end of the fixing block two, an output shaft fixedly connected to the inner output end of the motor two, a transmission wheel six fixedly connected to the outer wall of the output shaft, a transmission belt three connected to the outer wall of the transmission wheel six, a transmission frame one fixedly connected to the top outer wall of the transmission belt three, a sliding plate fixedly connected to the top of the transmission frame one, a fixing block fixedly connected to the bottom of the device body, a fixing slide rod fixedly connected to the inner wall of the fixing block, and a limit slider slidably connected to the outer wall of the fixing slide rod.

[0007] Preferably, the receiving assembly includes a transmission wheel seven, a transmission belt four is driven to the outer wall of the transmission wheel seven, a transmission frame two is fixedly connected to the top of the transmission belt four, a receiving plate is fixedly connected to the top of the transmission frame two, mounting seats are fixedly connected to the top two sides of the receiving plate, a hinged pressure block is hinged to the inner wall of the mounting seat, a limit strip is fixedly connected to the front top of the receiving plate, and a packaging frame is fixedly installed on the top two sides of the receiving plate.

[0008] Preferably, the rotating shaft is rotatably connected to the inner wall of the device body, the transmission wheel is equidistantly arranged on the outer wall of the rotating shaft, and the transmission rod is rotatably connected to the inner wall of the device body; the epoxy-sealed material stored in the storage boxes symmetrically arranged on both sides of the top of the device body is quantitatively pushed under the action of the rotating top block, the rotating top block is installed on the mounting plate inside the limiting plate, and the limiting plate is fixedly connected to the bottom of the inner side of the storage box.

[0009] Preferably, the top of the limiting slider is fixedly connected to the bottom of the sliding plate; the fixed slide rod on the inner wall of the fixed block at the bottom of the device body provides guidance for the limiting slider. Since the top of the limiting slider is fixedly connected to the bottom of the sliding plate, the sliding of the sliding plate drives the limiting slider to move stably along the fixed slide rod, ensuring the smoothness of the sliding plate's movement.

[0010] Preferably, the transmission wheel seven is fixedly connected to the outer wall of the rotating shaft, the packaging frame is symmetrically arranged on both sides of the top of the receiving tray, and the top of the hinged pressure block is hinged to the top of the outer end of the packaging frame; when the rotating shaft rotates under the drive of the motor one, the transmission wheel seven rotates synchronously, driving the transmission belt four on the outer wall to rotate, thereby causing the transmission frame two fixed at the top of the transmission belt four to drive the receiving tray to be horizontally transported.

[0011] Preferably, the storage boxes are symmetrically arranged on both sides of the top of the device body, and the material is stored in the inner cavity of the storage boxes; the power is transmitted to the transmission wheel 2 through the transmission belt 1, causing the transmission rod 1 fixed on the inner wall of the transmission wheel 2 to rotate. The transmission rod 1 is also rotatably connected to the inner wall of the device body, further improving the structural stability; when the transmission rod 1 rotates, the transmission wheel 3 on its outer wall drives the transmission wheel 4 and transmission wheel 5 to rotate through the transmission belt 2, and the transmission wheel 5 drives the transmission rod 2 fixed on the inner wall to operate.

[0012] Compared with the prior art, the beneficial effects of this utility model are: 1. This epoxy molding compound packaging machine uses a motor to drive the rotating shaft in the pressing assembly. The shaft, through a transmission wheel set, moves the rotating top block, quantitatively pushing the epoxy molding compound material in the storage box. Simultaneously, through the linkage between the transmission wheel and the rotating shaft, the receiving tray is synchronously conveyed by the transmission belt. This, combined with the packaging frame and hinged pressing block, secures the material, achieving precise conveying, quantitative filling, and initial packaging fixation of the epoxy molding compound material. This solves the problems of metering deviations and insufficient packaging sealing caused by improper operation in traditional semi-automatic equipment. The docking of the packaging frame and the storage box, along with the anti-detachment design of the limiting strip, prevents material accumulation and uneven compression, reducing the risk of epoxy molding compound clumping or surface damage.

[0013] 2. This epoxy molding compound packaging machine uses a motor to drive the output shaft, transmission wheel six, and transmission belt three to move the sliding plate. Combined with the guiding action of the fixed slide rod and limit slider, the sliding plate is stably adjusted, changing the conveying trajectory of the receiving tray in the receiving assembly. With symmetrically arranged storage boxes and packaging frames, it meets the packaging needs of epoxy molding compound products of different specifications. This solves the problem of poor adjustment flexibility in traditional semi-automatic equipment when adapting to different product specifications, requiring frequent shutdowns to adjust equipment parameters or replace parts. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the back side structure of this utility model; Figure 3 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle; Figure 4This is a partial structural diagram of the pressing assembly of this utility model; Figure 5 This is a partial structural diagram of the receiving component of this utility model; Figure 6 This is a partial structural diagram of the adjustment component of this utility model.

[0015] In the diagram: 1. Device body; 2. Connecting mechanism; 21. Pressing assembly; 211. Fixing block one; 212. Motor one; 213. Rotating shaft; 214. Transmission wheel one; 215. Transmission belt one; 216. Transmission wheel two; 217. Transmission rod one; 218. Transmission wheel three; 219. Transmission wheel four; 2110. Transmission belt two; 2111. Transmission wheel five; 2112. Transmission rod two; 2113. Storage box; 2114. Limiting plate; 2115. Mounting plate; 2116. Rotating top block; 2 2. Adjustment components; 221. Fixing block two; 222. Motor two; 223. Output shaft; 224. Transmission wheel six; 225. Transmission belt three; 226. Transmission frame one; 227. Sliding plate; 228. Fixing block; 229. Fixing slide rod; 2210. Limiting slider; 23. Receiving components; 231. Transmission wheel seven; 232. Transmission belt four; 233. Transmission frame two; 234. Receiving support plate; 235. Mounting base; 236. Hinge pressure block; 237. Limiting strip; 238. Packaging frame. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Example 1 Traditional epoxy molding compound packaging for semiconductor devices relies heavily on manual labor or semi-automatic equipment. Manual packaging is not only labor-intensive and inefficient, but also prone to errors in molding compound metering and insufficient sealing due to improper operation, leading to moisture absorption and contamination of the molding compound, severely impacting the packaging quality and reliability of subsequent semiconductor devices. Semi-automatic equipment often has limited functionality and cannot achieve integrated operations from precise delivery and quantitative filling of epoxy molding compound to packaging, severely restricting the continuous operation of semiconductor device production lines and failing to meet the mass production demands of large-scale, high-precision semiconductor manufacturing. This embodiment provides a packaging machine for epoxy molding compound production; please refer to... Figures 1-6An embodiment provides a packaging machine for producing epoxy molding compound, including a device body 1. The device body 1 is provided with a connecting mechanism 2, which includes a pressing component 21 disposed on the upper section of the device body 1, an adjusting component 22 disposed on the lower section of the device body 1, and a receiving component 23 disposed on the middle section of the device body 1. The pressing component 21 includes a fixing block 211 fixedly installed on the outer wall of the device body 1. A motor 212 is fixedly installed on one end of the back of the fixing block 211. A rotating shaft 213 is fixedly connected to one end of the front of the motor 212. A transmission wheel 214 is fixedly connected to the outer wall of the rotating shaft 213. The outer wall of the transmission wheel 214 is connected to a transmission belt 215. Drive wheel 216, drive wheel 216 has a drive rod 217 fixedly connected to its inner wall, drive wheel 3 218 fixedly connected to its outer wall, drive wheel 4 219 is connected to its outer wall via drive belt 2110, drive wheel 5 2111 is connected to its inner wall via drive belt 2110, drive rod 2112 is fixedly connected to its inner wall, storage boxes 2113 are fixedly installed on both sides of the top of the device body 1, limit plate 2114 is fixedly connected to the bottom of the inner side of storage box 2113, mounting plate 2115 is fixedly connected to the inner side of limit plate 2114, and rotating top block 2116 is fixedly installed on the inner side of mounting plate 2115.

[0018] In this embodiment, the pressing assembly 21 is the core for material conveying and preliminary processing. After startup, the fixing block 211, which is fixedly installed on the outer wall of the device body 1, provides stable support for the motor 212. The motor 212 outputs power to drive the rotating shaft 213 at one end of the front side to rotate. Since the rotating shaft 213 is rotatably connected to the inner wall of the device body 1, the stability of the rotation process is ensured. When the rotating shaft 213 rotates, the transmission wheels 214, which are equidistantly arranged on its outer wall, rotate synchronously. The power is transmitted to the transmission wheel 216 through the transmission belt 215, causing the transmission rod 217, which is fixed to the inner wall of the transmission wheel 216, to rotate. The transmission rod 217 is also rotatably connected to the inner wall of the device body 1, further improving the structural stability. During rotation, the transmission wheel 218 on its outer wall drives the transmission wheel 219 and the transmission wheel 2111 to rotate via the transmission belt 2110. The transmission wheel 2111 then drives the transmission rod 2112 fixed on the inner wall to operate. During this process, the epoxy-sealed material stored in the storage boxes 2113 symmetrically arranged on both sides of the top of the device body 1 is pushed by the rotating top block 2116. The rotating top block 2116 is installed on the mounting plate 2115 inside the limiting plate 2114. The limiting plate 2114 is fixedly connected to the bottom of the inner side of the storage box 2113, which not only limits the material but also provides a mounting base for the mounting plate 2115 and the rotating top block 2116, ensuring that the material can fall accurately into the receiving component 23 below.

[0019] Furthermore, the rotating shaft 213 is rotatably connected to the inner wall of the device body 1, the transmission wheel 214 is equidistantly arranged on the outer wall of the rotating shaft 213, and the transmission rod 217 is rotatably connected to the inner wall of the device body 1; the storage box 2113 is symmetrically arranged on both sides of the top of the device body 1, and the material is stored in the inner cavity of the storage box 2113.

[0020] Furthermore, power is transmitted to transmission wheel 216 via transmission belt 215, causing transmission rod 217 fixed to the inner wall of transmission wheel 216 to rotate. Transmission rod 217 is also rotatably connected to the inner wall of the device body 1, further improving structural stability. When transmission rod 217 rotates, transmission wheel 218 on its outer wall drives transmission wheel 219 and transmission wheel 2111 to rotate via transmission belt 2110. Transmission wheel 2111 then drives transmission rod 2112 fixed to the inner wall to operate.

[0021] Example 2 Based on Embodiment 1, the adjustment component 22 includes a fixing block 221 fixedly connected to the bottom of the device body 1. A motor 222 is fixedly mounted on the outer end of the fixing block 221. An output shaft 223 is fixedly connected to the inner output end of the motor 222. A transmission wheel 224 is fixedly connected to the outer wall of the output shaft 223. A transmission belt 225 is drivenly connected to the outer wall of the transmission wheel 224. A transmission frame 226 is fixedly connected to the top outer wall of the transmission belt 225. A sliding plate 227 is fixedly connected to the top of the transmission frame 226. A fixing block 228 is fixedly connected to the bottom of the device body 1. The inner wall of the fixing block 228 is fixedly connected to... There is a fixed slide bar 229, and a limit slider 2210 is slidably connected to the outer wall of the fixed slide bar 229; the receiving component 23 includes a transmission wheel 231, a transmission belt 232 is connected to the outer wall of the transmission wheel 231, a transmission frame 233 is fixedly connected to the top of the transmission belt 232, a receiving plate 234 is fixedly connected to the top of the transmission frame 233, mounting seats 235 are fixedly connected to the top two sides of the receiving plate 234, a hinged pressure block 236 is hinged to the inner wall of the mounting seat 235, a limit strip 237 is fixedly connected to the front top of the receiving plate 234, and a packaging frame 238 is fixedly installed on the top two sides of the receiving plate 234.

[0022] In this embodiment, the receiving component 23 is responsible for receiving the materials conveyed by the pressing component 21 and completing the packaging pretreatment. Its power source is directly linked to the pressing component 21. The transmission wheel 231 is fixedly connected to the outer wall of the rotating shaft 213. When the rotating shaft 213 rotates under the drive of the motor 212, the transmission wheel 231 rotates synchronously, driving the transmission belt 232 on the outer wall to rotate. This causes the transmission frame 233 fixed at the top of the transmission belt 232 to drive the receiving pallet 234 to perform horizontal conveying. During the movement of the receiving pallet 234, the packaging frames 238 on both sides of the top... The symmetrically positioned, precisely aligned discharge ports of the storage box 2113 receive the falling epoxy molding compound. Simultaneously, the limiting strip 237 at the front top of the receiving pallet 234 acts as a barrier to prevent material slippage during transport. Hinged pressure blocks 236, hinged to the inner walls of the mounting seats 235 on both sides of the top, are hinged to the top of the outer end of the packaging frame 238. When material enters the packaging frame 238, the hinged pressure blocks 236 rotate downwards under gravity or external force, confining the packaging frame 238 to the top of the receiving pallet 234, completing the initial fixation for subsequent... The packaging process is prepared; the adjusting component 22 is mainly used to adjust the position of the receiving component 23 according to packaging requirements, ensuring the flexibility and adaptability of the packaging process; the fixing block 221 fixedly connected to the bottom of the device body 1 supports the motor 222. After the motor 222 is started, the output shaft 223 at the inner output end drives the transmission wheel 224 on the outer wall to rotate. The transmission wheel 224 drives the transmission frame 226 to move through the transmission belt 225, thereby causing the sliding plate 227 at the top of the transmission frame 226 to slide accordingly; the fixing block 228 at the bottom of the device body 1... The fixed slide bar 229 of the wall provides guidance for the limiting slider 2210. Since the top of the limiting slider 2210 is fixedly connected to the bottom of the sliding plate 227, the sliding of the sliding plate 227 drives the limiting slider 2210 to move stably along the fixed slide bar 229, ensuring the smoothness of the movement of the sliding plate 227. The movement of the sliding plate 227 indirectly adjusts the overall position of the receiving component 23, so that the receiving tray 234 can change the conveying trajectory according to the material specifications or packaging requirements, ensuring that the packaging frame 238 and the discharge port of the pressing component 21 are always accurately connected, improving packaging efficiency and accuracy.

[0023] Furthermore, the rotating shaft 213 is rotatably connected to the inner wall of the device body 1, the transmission wheel 214 is equidistantly arranged on the outer wall of the rotating shaft 213, and the transmission rod 217 is rotatably connected to the inner wall of the device body 1; the top of the limiting slider 2210 is fixedly connected to the bottom of the sliding plate 227; the packaging frame 238 is symmetrically arranged on both sides of the top of the receiving plate 234, and the top of the hinged pressure block 236 is hinged to the top of the outer end of the packaging frame 238.

[0024] Furthermore, after the material enters the packaging frame 238, the hinged pressing block 236 rotates downward under the action of gravity or external force, pressing the material tightly inside the packaging frame 238, completing the initial fixation and preparing for the subsequent packaging process; the fixing block 221 fixedly connected to the bottom of the device body 1 supports the motor 222. After the motor 222 is started, the output shaft 223 of the inner output end drives the transmission wheel 224 on the outer wall to rotate. The transmission wheel 224 drives the transmission frame 226 to move through the transmission belt 225, thereby causing the sliding plate 227 on the top of the transmission frame 226 to slide accordingly. The packaging machine uses motor 212 to drive the pressing component 21 to convey materials, while the receiving component 23 is linked to complete the material receiving and initial fixation. Then, the adjusting component 22 adjusts the position according to the needs. The three work together to realize the automated and continuous operation of epoxy sealing material from conveying to packaging pretreatment, effectively improving production efficiency and packaging quality.

[0025] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A packaging machine for producing epoxy molding compound, comprising a device body (1), characterized in that: The device body (1) is provided with a connecting mechanism (2), the connecting mechanism (2) includes a pressing component (21) provided in the upper section of the device body (1), an adjusting component (22) provided in the lower section of the device body (1), and a receiving component (23) provided in the middle section of the device body (1). The pressing assembly (21) includes a fixing block (211) fixedly installed on the outer wall of the device body (1). A motor (212) is fixedly installed on one end of the back of the fixing block (211). A rotating shaft (213) is fixedly connected to one end of the front of the motor (212). A transmission wheel (214) is fixedly connected to the outer wall of the rotating shaft (213). A transmission wheel (216) is driven to the outer wall of the transmission wheel (214) via a transmission belt (215). A transmission rod (217) is fixedly connected to the inner wall of the transmission wheel (216). A transmission wheel (218) is fixedly connected to the outer wall of the transmission rod (217). The outer wall of the transmission wheel three (218) is connected to the transmission wheel four (219) via the transmission belt two (2110). The transmission belt two (2110) is connected to the transmission wheel five (2111). The inner wall of the transmission wheel five (2111) is fixedly connected to the transmission rod two (2112). The top two sides of the device body (1) are fixedly installed with storage boxes (2113). The bottom of the inner side of the storage box (2113) is fixedly connected to the limit plate (2114). The inner side of the limit plate (2114) is fixedly connected to the mounting plate (2115). The inner side of the mounting plate (2115) is fixedly installed with a rotating top block (2116).

2. The packaging machine for producing epoxy molding compound according to claim 1, characterized in that: The adjustment component (22) includes a fixing block two (221) fixedly connected to the bottom of the device body (1). A motor two (222) is fixedly installed on the outer end of the fixing block two (221). An output shaft (223) is fixedly connected to the inner output end of the motor two (222). A transmission wheel six (224) is fixedly connected to the outer wall of the output shaft (223). A transmission belt three (225) is driven to the outer wall of the transmission wheel six (224). A transmission frame one (226) is fixedly connected to the top outer wall of the transmission belt three (225). A sliding plate (227) is fixedly connected to the top of the transmission frame one (226). A fixing block (228) is fixedly connected to the bottom of the device body (1). A fixing slide rod (229) is fixedly connected to the inner wall of the fixing block (228). A limit slider (2210) is slidably connected to the outer wall of the fixing slide rod (229).

3. The packaging machine for producing epoxy molding compound according to claim 1, characterized in that: The receiving component (23) includes a transmission wheel seven (231), the outer wall of the transmission wheel seven (231) is connected to a transmission belt four (232), the top of the transmission belt four (232) is fixedly connected to a transmission frame two (233), the top of the transmission frame two (233) is fixedly connected to a receiving plate (234), the top two sides of the receiving plate (234) are fixedly connected to mounting seats (235), the inner wall of the mounting seat (235) is hinged to a hinged pressure block (236), the front top section of the receiving plate (234) is fixedly connected to a limit strip (237), and the top two sides of the receiving plate (234) are fixedly installed with packaging frames (238).

4. The packaging machine for producing epoxy molding compound according to claim 1, characterized in that: The rotating shaft (213) is rotatably connected to the inner wall of the device body (1), the first transmission wheel (214) is equidistantly arranged on the outer wall of the rotating shaft (213), and the first transmission rod (217) is rotatably connected to the inner wall of the device body (1).

5. A packaging machine for producing epoxy molding compound according to claim 2, characterized in that: The top of the limiting slider (2210) is fixedly connected to the bottom of the sliding plate (227).

6. A packaging machine for producing epoxy molding compound according to claim 3, characterized in that: The transmission wheel seven (231) is fixedly connected to the outer wall of the rotating shaft (213), the packaging frame (238) is symmetrically arranged on both sides of the top of the receiving plate (234), and the top of the hinged pressure block (236) is hinged to the top of the outer end of the packaging frame (238).

7. A packaging machine for producing epoxy molding compound according to claim 1, characterized in that: The storage boxes (2113) are symmetrically arranged on both sides of the top of the device body (1), and the material is stored in the inner cavity of the storage boxes (2113).

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