Solder dipping fixture for superconducting coils

Abstract

This application provides a soldering fixture for superconducting coils, comprising: a first cover plate and an immersion platform that can be stacked and connected by a fastening device; the first cover plate is provided with a solder inflow channel and a solder outflow channel; the immersion platform is provided with an immersion tank for accommodating the superconducting coil to be immersed, and after the superconducting coil to be immersed is placed into the immersion tank, there is a gap between the superconducting coil and the tank wall; the immersion platform is provided with a solder inlet and a solder outlet communicating with the immersion tank, the solder inlet being correspondingly provided with the solder inflow channel and the solder outlet being correspondingly provided with the solder outflow channel; a cover plate anti-sticking plate is also provided between the first cover plate and the immersion platform, the shape of the anti-sticking plate being consistent with the shape of the immersion tank, which can ensure the flatness of the upper surface of the superconducting coil after immersion, and at the same time, when the first cover plate of the fixture is removed, it prevents the solder in the immersion tank from sticking to the first cover plate, thus preventing some solder from peeling off, ensuring the uniformity of solder immersion, and improving the solder immersion effect.

Description

Technical Field

[0001] This application relates to the field of superconducting magnet technology, and in particular to a soldering fixture for superconducting coils. Background Technology

[0002] Superconducting non-insulated coils, due to their characteristics such as low inter-turn resistance, strong quench self-protection, high current carrying capacity, and fast transient response, have become a core component of magnetic confinement fusion devices. Maintaining the stable operation of magnetic confinement fusion devices has become an urgent problem to be solved in the field of nuclear fusion, and maintaining the performance stability of superconducting coils, especially the mechanical stability during operation, is the key to solving this problem.

[0003] To address the mechanical instability of superconducting coils under extreme conditions, impregnation is commonly used to fix the coil and achieve superior mechanical properties. Currently, the most common methods are epoxy resin impregnation, paraffin wax impregnation, and solder impregnation. However, the use of epoxy resin and paraffin wax impregnation can cause problems such as increased inter-turn resistance, thermal expansion mismatch, and low-temperature embrittlement, thus affecting the performance of the superconducting coil.

[0004] Solder, as a conductive material, not only fixes coils and enhances their mechanical stability but also does not increase the inter-turn resistance of superconducting coils, making it the current mainstream impregnation method. However, solder impregnation requires a high degree of uniformity. Existing solder impregnation fixtures, in order to withstand the high temperatures required during impregnation, are often made of metal. Because solder has wettability on metal materials, it may adhere during demolding, causing localized solder peeling and resulting in uneven impregnation and poor impregnation effect.

[0005] Therefore, how to improve the uniformity of solder impregnation has become an urgent technical problem to be solved. Utility Model Content

[0006] This application provides a solder impregnation fixture for superconducting coils, solving the existing technical problem of how to improve the uniformity of solder impregnation.

[0007] According to an embodiment of this application, a soldering fixture for superconducting coils is provided, comprising: a first cover plate and an immersion platform that can be stacked and connected by a fastening device; wherein, the first cover plate is provided with a solder inflow channel and a solder outflow channel; the immersion platform is provided with an immersion tank for accommodating a superconducting coil to be immersed, and after the superconducting coil to be immersed is placed in the immersion tank, there is a gap between the superconducting coil to be immersed and the tank wall of the immersion tank; the immersion platform is provided with a solder inlet and a solder outlet communicating with the immersion tank, the solder inlet being correspondingly provided with the solder inflow channel and the solder outlet being correspondingly provided with the solder outflow channel; a cover plate anti-sticking plate is also provided between the first cover plate and the immersion platform, the shape of the anti-sticking plate being consistent with the shape of the immersion tank.

[0008] In one embodiment, the depth of the impregnation tank is greater than or equal to the sum of the height of the superconducting coil to be impregnated and the thickness of the anti-stick plate.

[0009] In one embodiment, the anti-stick plate is a copper plate or a stainless steel plate.

[0010] In one embodiment, the impregnation platform is further provided with a current-passing terminal groove that extends through the impregnation platform and communicates with the impregnation tank; the current-passing terminal is disposed in the current-passing terminal groove and is capable of contacting the superconducting coil to be impregnated.

[0011] In one embodiment, the impregnation tank has an impregnation channel that is the same as the winding path of the superconducting coil to be impregnated, and the conductor of the superconducting coil to be impregnated can be placed along the impregnation channel; there are two current-carrying terminal slots, which are respectively disposed at the beginning and end of the impregnation channel.

[0012] In one embodiment, the solder inlet and the solder outlet are respectively located at the two ends of the immersion channel, and the solder inlet and the solder outlet are respectively connected to the immersion channel through the flow terminal.

[0013] In one embodiment, the first cover plate is provided with first sealing grooves in the areas corresponding to the outer and central areas of the impregnation tank, respectively.

[0014] In one embodiment, the solder immersion fixture for the superconducting coil further includes a second cover plate disposed opposite to the first cover plate on the other side of the immersion platform. The immersion platform and the first cover plate are connected by the fastening device to form a structure in which the first cover plate, the immersion platform and the second cover plate are stacked in sequence.

[0015] In one embodiment, the fastening device includes bolts, and bolt holes that mate with the bolts are evenly distributed on the outer periphery of the first cover plate, the immersion platform, and the second cover plate.

[0016] In one embodiment, the bolt holes are further provided in the central region of the first cover plate, the immersion platform, and the second cover plate.

[0017] The technical solutions provided by the embodiments of this application have the following beneficial effects:

[0018] The soldering fixture for superconducting coils includes a first cover plate and an immersion platform that can be stacked and connected by a fastening device. The first cover plate has a solder inflow channel and a solder outflow channel. The soldering platform has an immersion tank for accommodating the superconducting coil to be immersed. After the superconducting coil is placed into the immersion tank, there is a gap between it and the tank wall. The immersion platform has a solder inlet and a solder outflow opening communicating with the immersion tank. The solder inlet is corresponding to the solder inflow channel, and the solder outflow opening is corresponding to the solder outflow channel. A non-stick plate is also provided between the first cover plate and the immersion platform. The shape of the non-stick plate is consistent with the shape of the immersion tank. After the superconducting coil to be immersed is placed in the immersion tank, the non-stick plate is placed above the superconducting coil in the immersion tank. The upper surface of the non-stick plate is flush with the upper surface of the immersion platform. The shape of the non-stick plate is consistent with the immersion tank. It is used to ensure the flatness of the upper surface of the superconducting coil after immersion. At the same time, when the first cover plate of the tooling is removed, it prevents the solder in the immersion tank from sticking to the first cover plate, which would cause some of the solder to peel off, thus ensuring the uniformity of solder immersion and improving the solder immersion effect.

[0019] Furthermore, the impregnation platform is also provided with a current-carrying terminal slot, which penetrates the impregnation platform and communicates with the impregnation tank; the current-carrying terminal is disposed in the current-carrying terminal slot and can contact the superconducting coil to be impregnated. After impregnation, there is no need to remove the coil, and it can be directly energized for testing, avoiding the risks of deformation and solder detachment during coil demolding, while also improving work efficiency.

[0020] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0022] Figure 1 This is a schematic diagram of the structure of a solder immersion fixture for a superconducting coil from a first perspective, according to an exemplary embodiment.

[0023] Figure 2 This is a schematic diagram of an impregnation platform for a solder impregnation fixture for a superconducting coil, according to an exemplary embodiment.

[0024] Figure 3 This is a schematic diagram of the structure of a solder immersion fixture for a superconducting coil from a second perspective, according to an exemplary embodiment.

[0025] Figure 4 This is a schematic diagram of the structure of a solder immersion fixture for a superconducting coil, according to another exemplary embodiment.

[0026] Figure 5 This is a schematic diagram of the structure of a solder immersion fixture for a superconducting coil after it has been secured in place, according to an exemplary embodiment.

[0027] In the figure, 10 is the first cover plate; 11 is the solder inflow channel; 12 is the solder outflow channel; 13 is the first sealing groove; 20 is the immersion platform; 21 is the immersion tank; 22 is the solder inlet; 23 is the solder outlet; 30 is the anti-stick plate; 40 is the current-passing terminal groove; 41 is the current-passing terminal; 50 is the second cover plate; 51 is the sealing groove; and 60 is the fastening device. Detailed Implementation

[0028] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of this application, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0029] In the accompanying drawings of the embodiments of this application, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0030] In the description of this application, unless otherwise expressly specified and limited, the term "connection" or similar designation indicating a connection between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] This application provides a soldering fixture for superconducting coils, such as... Figure 1-5 As shown, the soldering fixture for superconducting coils includes: a first cover plate 10 and an immersion platform 20 that can be stacked and connected by a fastening device 60. The first cover plate 10 is provided with a solder inflow channel 11 and a solder outflow channel 12. The soldering platform is provided with an immersion tank 21 for accommodating the superconducting coil to be immersed. After the superconducting coil to be immersed is placed into the immersion tank 21, there is a gap between it and the tank wall of the immersion tank 21. The immersion platform 20 is provided with a solder inlet 22 and a solder outlet 23 that communicate with the immersion tank 21. The solder inlet 22 is correspondingly arranged with the solder inflow channel 11, and the solder outlet 23 is correspondingly arranged with the solder outflow channel 12. An anti-stick plate 30 is also provided between the first cover plate 10 and the immersion platform 20. The shape of the anti-stick plate 30 is consistent with the shape of the immersion tank 21.

[0032] In this application, after the superconducting coil to be impregnated is placed in the impregnation tank 21, the anti-stick plate 30 is placed above the superconducting coil in the impregnation tank 21, with its upper surface flush with the upper surface of the impregnation platform 20. The shape of the anti-stick plate 30 is consistent with that of the impregnation tank 21, which is used to ensure the flatness of the upper surface of the superconducting coil after impregnation. At the same time, when the first cover plate 10 of the tooling is removed, it prevents the solder in the impregnation tank 21 from sticking to the first cover plate 10, which would cause some of the solder to peel off, thus ensuring the uniformity of solder impregnation and improving the solder impregnation effect.

[0033] In one embodiment, when impregnating the superconducting coil to be impregnated, the superconducting coil is placed in the impregnation tank 21 of the impregnation platform 20. The impregnation tank 21 is an impregnation channel with the same winding path as the superconducting coil to be impregnated. The superconducting coil to be impregnated is placed in the impregnation tank 21, and the impregnation channel can support and fix the superconducting coil to be impregnated, further improving the mechanical stability of the coil. Exemplarily, the superconducting coil to be impregnated can be wound in a spiral manner, and the impregnation channels in the impregnation tank 21 are distributed in a spiral manner. The superconducting coil to be impregnated is wound along the impregnation channel, and the impregnation channel supports and fixes the superconducting coil to be impregnated.

[0034] In one embodiment, the gap between the superconducting coil to be impregnated and the wall of the impregnation tank 21 after the coil is placed in the impregnation tank 21 can be set to 0.1-0.2 mm to ensure that the superconducting coil to be impregnated can be smoothly placed into the impregnation tank 21. In addition, the solder can form a solder layer on the outside of the superconducting coil to be impregnated, ensuring the uniformity of coil impregnation and improving the solder impregnation effect.

[0035] In one embodiment, the depth of the immersion tank 21 is greater than or equal to the sum of the height of the superconducting coil to be immersed and the thickness of the anti-stick plate 30, to ensure that gaps are avoided when the first cover plate 10 and the immersion platform 20 are fastened together, thus achieving a sealed connection. The anti-stick plate 30 is a copper or stainless steel cover plate with a thickness of 0.5-1 mm. During solder immersion, the superconducting coil to be immersed is placed in the immersion tank 21, and the copper cover plate covers the immersion tank 21. After the immersion tank 21 is filled with solder, the copper cover plate ensures the flatness of the upper surface when the liquid solder solidifies into solid solder, while preventing the solder in the solder tank from sticking to the upper cover plate and causing some solder to peel off.

[0036] To further prevent solder overflow during the immersion process, the first cover plate 10 is provided with a first sealing groove 13 in the outer and central areas of the immersion tank 21. The first sealing groove 13 is distributed in the outer and central areas of the immersion tank 21, completely sealing the area where the immersion tank 21 is located, ensuring the sealing effect of the immersion area where the immersion tank 21 is located, and preventing solder overflow during the immersion process.

[0037] In one embodiment, the impregnation platform 20 is further provided with a current-carrying terminal groove 40, which penetrates the impregnation platform 20 and communicates with the impregnation tank 21; the current-carrying terminal 41 is disposed in the current-carrying terminal groove 40 and can contact the superconducting coil to be impregnated. After impregnation, there is no need to remove the coil, and it can be directly energized for testing, avoiding the risks of deformation and solder detachment during coil demolding, while also improving work efficiency.

[0038] There are two current-carrying terminal slots 40, which can be set at both ends of the immersion channel in the immersion tank 21. After the current-carrying terminal 41 is set in the current-carrying terminal slot 40, the current-carrying terminal 41 is fastened to the immersion platform 20 by bolts. The solder inlet 22 and the solder outlet 23 are set at both ends of the immersion channel in the immersion tank 21 and can be connected to the immersion channel through the current-carrying terminal 41. Liquid solder flows in from the solder inlet 22, and after passing through the current-carrying terminal 41, the immersion tank 21, the current-carrying terminal 41 and the solder outlet 23, the current-carrying terminal 41 and the superconducting coil to be immersed can be solidified into one piece. After the superconducting coil to be immersed is immersed, it can be directly connected to the current-carrying terminal 41 for power supply testing.

[0039] In one embodiment, the solder immersion fixture for the superconducting coil further includes a second cover plate 50, which is disposed opposite to the first cover plate 10 on the other side of the immersion platform 20. The immersion platform 20 and the first cover plate 10 are connected by a fastening device 60 to form a sandwich structure in which the first cover plate 10, the immersion platform 20 and the second cover plate are stacked.

[0040] In one embodiment, the second cover plate 50 is provided with a second sealing groove 51 in the area corresponding to the outer and central areas of the impregnation tank 21. The second sealing groove 51 is distributed in the outer and central areas of the impregnation tank 21 to completely seal the area where the impregnation tank 21 is located, ensuring the sealing effect of the impregnation area where the impregnation tank 21 is located and preventing solder from overflowing during the impregnation process.

[0041] In one embodiment, the fastening device 60 may be a bolt. The fastening device 60 includes bolts, and bolt holes for engaging with the bolts are evenly distributed on the outer periphery of the first cover plate 10, the immersion platform 20, and the second cover plate 50. The bolt holes on the first cover plate 10 and the immersion platform 20 may be through holes, while the bolt holes on the second cover plate 50 may be threaded holes. The bolts pass through the through holes and are then fastened to the threaded holes, thus fastening the first cover plate 10, the immersion platform 20, and the second cover plate 50 together. In an optional embodiment, the fastening device 60 may also employ a quick-release snap-fit ​​structure, evenly distributed on the outer periphery to fasten the first cover plate 10, the immersion platform 20, and the second cover plate 50 together.

[0042] To further secure the first cover plate 10, the immersion platform 20, and the second cover plate 50 and prevent solder overflow, bolt holes are also provided in the central area of ​​the first cover plate 10, the immersion platform 20, and the second cover plate 50. This allows for simultaneous securing in both the central and peripheral areas of the first cover plate 10, the immersion platform 20, and the second cover plate 50, thereby further improving the tightness and sealing effect.

[0043] In one embodiment, the method of impregnation using a solder impregnation fixture for superconducting coils is as follows:

[0044] The superconducting coil to be impregnated is placed in the impregnation tank 21 of the impregnation platform 20, and an anti-stick plate 30 is placed on it. After the anti-stick plate 30 is in place, the first cover plate 10, the impregnation platform 20 and the second cover plate 50 are fastened together by the fastening device 60. After the impregnation fixture is evacuated to a vacuum state, the solder is heated so that the solder liquid enters the impregnation tank 21 along the solder inflow channel 11 and the solder inlet 22 of the first cover plate 10. Nitrogen gas is injected into the solder inflow channel 11 to pressurize it, so that the solder flows along the solder tank until the solder flows out through the solder outlet 23 and the solder outflow channel 12 on the first cover plate 10. The pressure is maintained for a period of time so that the solder can better enter the interlayer of the superconducting coil. The coil is left to stand and wait for the solder to solidify. The first cover plate 10 and the second cover plate 50 are removed to complete the impregnation of the superconducting coil. After removing the impregnation platform 20, the current-carrying terminal is connected to the power supply for power-on testing.

[0045] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the appended claims.

[0046] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A solder impregnation fixture for superconducting coils, characterized in that, include: The first cover plate and the immersion platform can be stacked and connected by fastening devices; wherein... The first cover plate is provided with a solder inflow channel and a solder outflow channel; The impregnation platform is provided with an impregnation tank for accommodating the superconducting coil to be impregnated. After the superconducting coil to be impregnated is placed in the impregnation tank, there is a gap between it and the tank wall. The immersion platform is provided with a solder inlet and a solder outlet that are connected to the immersion tank. The solder inlet is provided in correspondence with the solder inflow channel, and the solder outlet is provided in correspondence with the solder outflow channel. A cover plate anti-sticking plate is also provided between the first cover plate and the immersion platform, and the shape of the anti-sticking plate is consistent with the shape of the immersion tank.

2. The solder impregnation fixture for superconducting coils as described in claim 1, characterized in that, The depth of the impregnation tank is greater than or equal to the sum of the height of the superconducting coil to be impregnated and the thickness of the anti-stick plate.

3. The solder impregnation fixture for superconducting coils as described in claim 1 or 2, characterized in that, The anti-stick plate is made of copper or stainless steel.

4. The solder impregnation fixture for superconducting coils as described in claim 1, characterized in that, The impregnation platform is also provided with a current-passing terminal slot, which passes through the impregnation platform and communicates with the impregnation tank; A current-passing terminal is disposed in the current-passing terminal slot and is capable of contacting the superconducting coil to be impregnated.

5. The solder impregnation fixture for superconducting coils as described in claim 4, characterized in that, The impregnation tank has an impregnation channel that is the same as the winding path of the superconducting coil to be impregnated, and the conductor of the superconducting coil to be impregnated can be placed along the impregnation channel; There are two flow terminal slots, which are respectively located at the beginning and end of the impregnation channel.

6. The solder dip tooling for a superconducting coil of claim 5, wherein, The solder inlet and the solder outlet are respectively located at the two ends of the immersion channel, and the solder inlet and the solder outlet are respectively connected to the immersion channel through the flow terminal.

7. The solder dip tooling for a superconducting coil of claim 1, wherein, The first cover plate is provided with first sealing grooves in the areas corresponding to the outer and central areas of the impregnation tank, respectively.

8. The solder dip tooling for a superconducting coil of claim 1, wherein, It also includes a second cover plate, which is disposed on the other side of the impregnation platform opposite to the first cover plate. The impregnation platform and the first cover plate are connected by the fastening device to form a structure in which the first cover plate, the impregnation platform and the second cover plate are stacked in sequence.

9. The solder dip tooling for a superconducting coil of claim 8, wherein, The fastening device includes bolts, and bolt holes that mate with the bolts are evenly arranged on the outer periphery of the first cover plate, the immersion platform, and the second cover plate.

10. The solder dip tooling for a superconducting coil of claim 9, wherein, The bolt holes are also provided in the central area of ​​the first cover plate, the immersion platform, and the second cover plate.

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