A silicon wafer feeding and processing system

Abstract

This utility model provides a silicon wafer feeding and processing system, relating to the technical field of silicon wafer processing equipment. The system includes a loading silicon wafer transfer assembly, a unloading silicon wafer transfer assembly, a turntable processing assembly, and a loading / unloading swing arm assembly. The turntable processing assembly includes a turntable assembly and a processing device for processing raw silicon wafers placed on the turntable assembly into finished silicon wafers. The loading / unloading swing arm assembly is used to transfer the raw silicon wafers from the loading silicon wafer transfer assembly to the turntable assembly, and to transfer the finished silicon wafers from the turntable assembly to the unloading silicon wafer transfer assembly. This silicon wafer feeding and processing system integrates the loading silicon wafer transfer assembly, the unloading silicon wafer transfer assembly, the turntable processing assembly, and the loading / unloading swing arm assembly to sequentially complete the loading of raw silicon wafers, the processing of raw silicon wafers into finished silicon wafers, and the unloading of finished silicon wafers. It features a compact structure, small footprint, and low operating cost.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic manufacturing equipment technology, and in particular to a silicon wafer feeding and processing system. Background Technology

[0002] A silicon wafer feeding and processing system is a complete system for transporting and processing silicon wafers. It is implemented in mass production lines. The system comprises multiple processing units, each completing one processing step. After completing one step, the wafers are sequentially transported to the next processing unit, ultimately completing the processing of the silicon wafers.

[0003] In related technologies, silicon wafer feeding and processing systems employ two robotic arms. One arm transfers raw silicon wafers from the loading silicon wafer assembly to the turntable, while the other arm transfers finished silicon wafers from the turntable to the unloading silicon wafer assembly. However, this requires extensive software programming for the coordination of the two handling devices, making implementation difficult and costly.

[0004] In view of this, a new technical solution is needed to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this invention is to provide a silicon wafer feeding and processing system that is compact, small in size, and low in operating cost.

[0006] To achieve the above objectives, the present invention employs the following technical means:

[0007] This utility model provides a silicon wafer feeding and processing system, including:

[0008] A silicon wafer feeding and conveying assembly is used for feeding raw silicon wafers.

[0009] A turntable processing assembly, comprising a turntable assembly and a processing apparatus for processing raw silicon wafers placed on the turntable assembly into finished silicon wafers;

[0010] A silicon wafer feeding and conveying assembly is used for feeding the finished silicon wafers.

[0011] The loading and unloading swing arm assembly is used to transfer the raw silicon wafer from the loading silicon wafer transfer assembly to the turntable assembly, and to transfer the finished silicon wafer from the turntable assembly to the unloading silicon wafer transfer assembly.

[0012] Optionally, the loading / unloading swing arm assembly includes a driving device, a supporting swing arm, and a suction cup. The two ends of the supporting swing arm are respectively connected to the driving device and the suction cup, and are used to drive the supporting swing arm to rotate, so as to drive the suction cup to rotate synchronously with the supporting swing arm.

[0013] Optionally, the loading / unloading swing arm assembly further includes a silicon wafer rotating structure, which is connected to the suction cup and is used to drive the suction cup to rotate.

[0014] Optionally, the silicon wafer rotation structure includes a servo motor arranged in a triangle and two sets of rotating components. A conveyor belt is fitted onto the output shaft of the servo motor and the two sets of rotating components. The servo motor drives the two sets of rotating components to rotate synchronously through the conveyor belt. The rotating components are fixedly connected to the suction cup and rotatably connected to the support swing arm.

[0015] Optionally, the loading / unloading swing arm assembly includes two supporting swing arms and two sets of suction cups. Each supporting swing arm is connected to each set of suction cups, and the two sets of supporting swing arms are arranged in the same horizontal plane and perpendicular to each other.

[0016] Optionally, a synchronizing rod is connected between the two supporting swing arms.

[0017] Optionally, it also includes a dust removal component for removing dust from the turntable assembly.

[0018] Optionally, the turntable assembly includes a rotary motor and a turntable body, the rotary motor driving the turntable body to rotate so that the silicon wafer moves between the left and right workstations of the turntable assembly.

[0019] Optionally, the silicon wafer feeding and transfer assembly includes a first wafer assembly device, a first wafer storage device, a first detection device, a first rejection device, and a second wafer assembly device arranged sequentially.

[0020] Optionally, the silicon wafer feeding and transfer assembly includes a second detection device, a third wafer forming device, a second rejection device, a second wafer storage device, and a fourth wafer forming device arranged sequentially.

[0021] Compared with the prior art, this utility model brings the following technical effects:

[0022] This utility model discloses a silicon wafer feeding and processing system that integrates a loading silicon wafer transfer assembly, a unloading silicon wafer transfer assembly, a turntable assembly, and a loading / unloading swing arm assembly. This allows for the sequential loading of raw silicon wafers, processing of the raw silicon wafers into finished silicon wafers, and unloading of the finished silicon wafers. The system features a compact structure, small footprint, and low operating costs. The silicon wafer feeding and processing system uses only the loading / unloading swing arm assembly to transfer raw silicon wafers from the loading assembly to the turntable, and then transfers finished silicon wafers from the turntable to the unloading assembly. This requires minimal programming, making implementation simple and cost-effective. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 The diagram shows a schematic representation of the silicon wafer feeding and processing apparatus according to some embodiments of the present invention.

[0025] Figure 2 A plan view of a silicon wafer feeding and processing apparatus according to some embodiments of the present invention is shown;

[0026] Figure 3 The diagram shows a schematic representation of the structure of a silicon wafer loading and transport assembly according to some embodiments of the present invention.

[0027] Figure 4 The diagram shows a structural schematic of the loading and unloading swing arm assembly according to some embodiments of the present invention;

[0028] Figure 5 It shows Figure 4 A schematic diagram of the rotating silicon wafer structure;

[0029] Figure 6 This diagram shows a first working state of the loading and unloading swing arm assembly according to some embodiments of the present invention;

[0030] Figure 7 This diagram shows a second working state of the loading / unloading swing arm assembly according to some embodiments of the present invention;

[0031] Figure 8 A schematic diagram of a turntable processing assembly according to some embodiments of the present invention is shown;

[0032] Figure 9 A schematic diagram of the structure of a silicon wafer feeding and conveying assembly according to some embodiments of the present invention is shown.

[0033] Explanation of key component symbols:

[0034] 100-Silicon Wafer Feeding and Processing System;

[0035] 10-Silicon wafer loading and transfer assembly; 11-First wafer assembly device; 12-First wafer storage device; 13-First detection device; 14-First rejection device; 15-Second wafer assembly device;

[0036] 20-Loading / unloading swing arm assembly; 21-Swing arm rotation power source; 22-Supporting swing arm; 23-First suction cup; 24-Second suction cup; 25-Silicon wafer rotation structure; 251-Servo motor; 252-Rotating component; 253-Transmission belt; 26-Synchronizing rod;

[0037] 30 - Rotary machining assembly; 31 - Rotary assembly; 31a - Left workstation; 31b - Right workstation; 32 - Machining device;

[0038] 40 - Wafer feeding and transfer assembly; 41 - Second inspection device; 42 - Third wafer assembly device; 43 - Second rejection device; 44 - Second wafer storage device; 45 - Fourth wafer assembly device. Detailed Implementation

[0039] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0040] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other. The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0041] Please see Figure 1 , Figure 2 and Figure 8 This utility model provides a silicon wafer feeding and processing system 100, including a silicon wafer loading and conveying assembly 10, a loading and unloading swing arm assembly 20, a turntable processing assembly 30, and a silicon wafer unloading and conveying assembly 40. The turntable processing assembly 30 includes a turntable assembly 31 and a processing device 32 for processing the raw silicon wafers placed on the turntable assembly 31 into finished silicon wafers.

[0042] The loading silicon wafer transport assembly 10 is used to transport and process upstream raw silicon wafers; the loading / unloading swing arm assembly 20 is used to transfer raw silicon wafers to the turntable assembly 31 and to transfer finished silicon wafers from the turntable assembly 31 to the unloading silicon wafer transport assembly 40; the turntable assembly 31 is used to receive silicon wafers, and the processing device 32 performs visual positioning, laser mark-addition, and laser processing on the raw silicon wafers on the turntable assembly 31 to process the raw silicon wafers into finished silicon wafers. The unloading silicon wafer transport assembly 40 is used to unload the finished silicon wafers.

[0043] The silicon wafer feeding and processing system 100 of this utility model integrates the loading silicon wafer transfer assembly 10, the loading / unloading swing arm assembly 20, the turntable processing assembly 30, and the unloading silicon wafer transfer assembly 40 into a single system. This results in a simple and compact structure, significantly reducing operating costs. The silicon wafer feeding and processing system 100 uses only the loading / unloading swing arm assembly 20 to transfer raw silicon wafers from the loading silicon wafer transfer assembly 10 to the turntable assembly 31. After the processing device 32 processes the raw silicon wafers into finished silicon wafers, the finished silicon wafers are then transferred from the turntable assembly 31 to the unloading silicon wafer transfer assembly. This requires minimal programming, making implementation simple and cost-effective.

[0044] Please see Figure 3 In one specific embodiment, the silicon wafer loading and transfer assembly 10 includes a first wafer assembly device 11, a first wafer storage device 12, a first detection device 13, a first rejection device 14, and a second wafer assembly device 15.

[0045] The first wafer straightening device 11 is used to straighten the upstream raw silicon wafers. The first wafer storage device 12 acts as a buffer for the silicon wafers based on the flow speed of the upstream and downstream silicon wafers. Specifically, when the upstream silicon wafer flow speed is fast and the downstream silicon wafer flow speed is slow, the first wafer storage device 12 buffers the silicon wafers. When the upstream silicon wafer flow speed is fast and the downstream silicon wafer flow speed is slow, the first wafer storage device 12 releases the buffered silicon wafers. The first detection device 13 is used to detect the quality of the incoming silicon wafers to distinguish between qualified and unqualified wafers. The first rejection device 14 rejects unqualified wafers to retain qualified wafers. The second wafer straightening device 15 is used to rearrange the position and angle of the qualified silicon wafers.

[0046] Please see Figure 4 In one specific embodiment, the loading / unloading swing arm assembly 20 includes a swing arm rotation power source 21, two supporting swing arms 22, and two sets of suction cups; one end of each supporting arm is connected to the swing arm rotation power source 21, and the other end is connected to each set of suction cups. Each set of suction cups has two suction cups, which can adsorb two sets of silicon wafers to improve the working efficiency of the loading / unloading swing arm assembly 20.

[0047] It should be noted that the silicon wafer feeding and conveying assembly 10 is equipped with a conveying device, which drives the raw silicon wafer placed on it to move sequentially along the first wafer assembly 11, the first wafer storage device 12, the first detection device 13, the first rejection device 14 and the second wafer assembly 15.

[0048] In one specific embodiment, two support arms 22 are arranged perpendicularly to each other in the same horizontal plane. The arrangement of the two support arms 22 can improve the transmission efficiency of the loading and unloading arm assembly 20.

[0049] In other embodiments, depending on the user's actual needs, the loading / unloading swing arm assembly 20 may have only one supporting swing arm 22 and one set of suction cups. The loading / unloading swing arm assembly 20 may also have three supporting swing arms 22 and three sets of suction cups, or four supporting swing arms 22 and four sets of suction cups.

[0050] Furthermore, a synchronizing rod 26 connects the two supporting swing arms 22.

[0051] In this embodiment, the loading / unloading swing arm assembly 20 can synchronize the rotation amplitude of the two supporting swing arms 22 through the synchronizing rod 26, so that the movement position of the suction cup is more accurate and the operation of the loading / unloading swing arm assembly 20 is stable and reliable.

[0052] Please see Figure 5 In one specific embodiment, the silicon wafer rotating structure 25 includes a servo motor 251 arranged in a triangle and two rotating components 252. The two rotating components 252 are fixedly connected to two suction cups respectively and rotatably connected to the support arm 22. A transmission belt 252 is sleeved on the servo motor 251 and the two rotating components 252. The driving component drives the two rotating components 252 to rotate synchronously through the transmission belt 252.

[0053] In this embodiment, the silicon wafer rotation structure 25 has a servo motor 251 that drives two rotating components 252 to move synchronously via a synchronous belt. The two rotating components 252 drive two suction cups to rotate synchronously. When the loading and unloading swing arm assembly 20 is working, two pieces of silicon material are adsorbed on the two suction cups. The suction cups will synchronously adjust the rotation angle of the silicon material, resulting in good consistency in silicon wafer adjustment.

[0054] Please see Figure 6 and Figure 7 For ease of explanation of the loading and unloading swing arm assembly 20 process below, the two sets of suction cups will be named the first suction cup 23 and the second suction cup 24.

[0055] Specifically, please refer to Figure 6 In the first working state, the swing arm rotation power source 21 drives the two supporting swing arms 22 to rotate until the first suction cup 23 is above the silicon wafer loading and transfer assembly 10, and the second suction cup 24 is above the turntable assembly 31. The first suction cup 23 adsorbs the raw silicon wafers on the silicon wafer loading and transfer assembly 10, and the second suction cup 24 adsorbs the finished silicon wafers that have undergone laser processing on the turntable assembly 31.

[0056] The swing arm rotation power source 21 drives the two supporting swing arms 22 to rotate 90° clockwise, switching from the first working state to the second working state. The direction of rotation of the supporting swing arms 22 is shown in the figure. Figure 6 As indicated by the middle arrow.

[0057] Please see Figure 7In the second operating state, the swing arm rotation power source 21 drives the two supporting swing arms 22 to rotate until the first suction cup 23 is above the turntable assembly 31 and the second suction cup 24 is above the unloading silicon wafer transfer assembly 40. The first suction cup 23 unloads the raw silicon wafer onto the turntable assembly 31, and the second suction cup 24 unloads the laser-processed finished silicon wafer onto the unloading silicon wafer transfer assembly 40. The unloading silicon wafer transfer assembly 40 then transfers the finished silicon wafer placed on it.

[0058] The swing arm rotation power source 21 drives the two supporting swing arms 22 to rotate counterclockwise by 90°, resetting from the second working state to the first working state. The direction of rotation of the supporting swing arms 22 is shown in the figure. Figure 7 As indicated by the middle arrow.

[0059] In summary, the loading / unloading swing arm assembly 20 completes one cycle of silicon wafer transfer by switching from the first station to the second station and then resetting from the second station to the first station. The station switching is achieved by the swing arm rotation power source 21 driving the two supporting swing arms 22 to rotate, thereby driving the two sets of suction cups to rotate synchronously. The structure is simple and compact, occupies little space, and has high working efficiency.

[0060] In one specific embodiment, the silicon wafer feeding and processing device 32 employs two sets of loading silicon wafer transfer components 10, loading and unloading swing arm components 20, turntable processing components 30, and unloading silicon wafer transfer components 40. This further improves the integration level of the silicon wafer feeding and processing system, further reduces the space occupied by the equipment, and lowers operating costs.

[0061] Please see Figure 1 and Figure 8 In one specific embodiment, the turntable assembly 31 includes a rotary motor (not shown) and a turntable body, the rotary motor driving the turntable body to rotate. The turntable body has two workstations, and the rotary motor drives the positions of the two workstations to switch between each other.

[0062] Specifically, the turntable assembly 31 has two stations: a left station 31a and a right station 31b. The left station 31a has three functions: first, loading and unloading wafers; second, visual positioning before rotating to the right station 31b; and third, adding mark points for the laser. The right station 31b has two functions: first, laser processing of the raw silicon wafers; and second, dust removal before laser processing to ensure the stability of the laser power.

[0063] Correspondingly, the processing device 32 includes a vision positioning device, an optical positioning device, and a laser.

[0064] Furthermore, the left station 31a of the turntable assembly 31 is used to cooperate with the loading / unloading swing arm assembly 20, and the right station 31b is used to cooperate with the laser as a reference. A visual positioning device is provided near the left station 31a of the turntable assembly 31. The visual positioning device is used to acquire a target image to determine whether the raw silicon wafer is placed in the left station 31a. Furthermore, the visual positioning device can also be used to determine whether the raw silicon wafer is within a preset angle range. The visual positioning device can be a camera or a video camera.

[0065] An optical positioning device is also installed near the left station 31a of the turntable assembly 31. The optical positioning device is used to set the laser's mark points on the raw silicon wafer. The laser identifies the mark points through a camera, which can clearly understand the size and layout of the raw silicon wafer, and thus perform precise cutting according to the designed processing plan, resulting in a high yield of silicon wafers.

[0066] A laser is located near the right station 31b of the turntable assembly 31. The laser is used to perform laser processing on the raw silicon wafer located at the right station 31b of the turntable assembly 31.

[0067] A dust removal component (not shown) is provided near the right station 31b of the turntable assembly 31. The dust removal component is used to clean the dust deposited on the right station 31b of the turntable assembly 31. The dust is generated during the laser processing.

[0068] For example, the dust removal component can be a fan, with the fan outlet facing the right station 31b of the rotary table assembly 31. In this way, the dust is blown away from the right station 31b of the rotary table assembly 31 by the air outlet of the fan.

[0069] For example, the dust removal assembly may also be a drive motor and a brush, with the output shaft of the drive motor connected to the brush to drive the brush to reciprocate near the right station 31b of the turntable assembly 31, so as to clean the right station 31b of the turntable assembly 31.

[0070] Of course, the dust removal component can also be a fan, and a combination of a motor and a brush. This utility model is only used to illustrate the form of the dust removal component, and the specific form of the dust removal component is not limited to the limitations of this utility model.

[0071] To facilitate the description of the specific working process of the rotary assembly 31, the silicon wafers that enter the rotary assembly 31 sequentially are named the first raw material silicon wafer and the second raw material silicon wafer. The specific process is as follows:

[0072] In the initial position, neither the left station 31a nor the right station 31b of the turntable body has silicon wafers arranged.

[0073] The loading and unloading swing arm assembly 20 drives the suction cup to rotate above the left station 31a of the turntable body, and releases the raw material silicon wafer on the left station 31a, so that the first raw material silicon wafer exists on the left station 31a of the turntable body.

[0074] The visual positioning device controls the visual positioning of the first raw silicon wafer entering the left station 31a, and the optical positioning device sets the laser mark point on the first raw silicon wafer entering the left station 31a.

[0075] The control turntable assembly 31 rotates to drive the first raw material silicon wafer of the left station 31a into the right station 31b. The loading and unloading swing arm assembly 20 drives the suction cup to rotate above the left station 31a of the turntable body and releases the second raw material silicon wafer on the left station 31a.

[0076] The laser is controlled to process the first raw silicon wafer entering the right station 31b, so as to process the first raw silicon wafer into a finished silicon wafer. The visual positioning device performs visual positioning on the second raw silicon wafer entering the left station 31a, and the optical positioning device sets the laser's mark point on the second raw silicon wafer entering the left station 31a.

[0077] The control turntable body continues to rotate to rotate the finished silicon wafer at the right station 31b back to the left station 31a, and simultaneously rotates the second raw material silicon wafer to the right station 31b. The loading and unloading swing arm assembly 20 uses a suction cup to pick up the finished silicon wafer at the left station 31a. The laser processes the second raw material silicon wafer that enters the right station 31b to process the second raw material silicon wafer into a finished silicon wafer.

[0078] The control turntable body is reset to the initial position, and the finished silicon wafer on the turntable assembly 31 rotates to the left station 31a, while the right station 31b is left idle.

[0079] In this embodiment, the turntable operates in a cyclical manner to process the raw material using laser technology, and it coordinates with the loading silicon wafer transfer assembly 10, the loading / unloading swing arm assembly 20, and the unloading silicon wafer transfer assembly 40. Furthermore, since the loading / unloading swing arm assembly 20 places the raw silicon wafer and picks up the finished silicon wafer on the left side of the turntable assembly 31, the orientation of the raw and finished silicon wafers remains consistent, facilitating subsequent processing and resulting in high work efficiency.

[0080] Please see Figure 9 In one specific embodiment, the wafer feeding and transfer assembly 40 includes a second detection device 41, a third wafer forming device 42, a second rejection device 43, a second wafer storage device 44, and a fourth wafer forming device 45.

[0081] The second inspection device 41 is used to inspect the process quality and whether the finished silicon wafers are damaged. The second rejection device 43 is used to reject finished silicon wafers that do not meet the process quality standards or are damaged.

[0082] The third wafer assembly unit 42 is used to process the finished silicon wafers.

[0083] If the second detection device 41 detects that the finished silicon wafer has not met the process requirements or has been damaged, the second rejection device 43 will push the finished silicon wafer that has not met the process requirements or has been damaged out of the finished silicon wafer transport path.

[0084] The second wafer storage device 44 acts as a buffer for silicon wafers based on the flow rates of the upstream and downstream wafers. Specifically, when the upstream wafer flow rate is fast and the downstream wafer flow rate is slow, the second wafer storage device 44 buffers the silicon wafers. When the upstream wafer flow rate is fast and the downstream wafer flow rate is slow, the second wafer storage device 44 releases the buffered silicon wafers.

[0085] The fourth wafer assembly 45 is used to perform final finishing on the silicon wafers that are about to be transferred out of the system.

[0086] Please see Figure 1 and Figure 2 This utility model also provides a silicon wafer feeding and processing method for use in the silicon wafer feeding and processing system of any of the above embodiments. The silicon wafer feeding and processing method includes:

[0087] s10: Controls the feeding silicon wafer transfer assembly 10 to transfer upstream raw material silicon wafers and screens out qualified raw material silicon wafers;

[0088] s20: The qualified silicon wafers are transported to the left station 31a of the turntable assembly 31 by the loading and unloading swing arm 20;

[0089] s30: Control the vision positioning device to perform vision positioning on the qualified feed silicon wafer at the left station 31a of the turntable assembly 31, control the optical positioning device to mark the qualified feed silicon wafer, control the turntable assembly 31 to rotate the feed silicon wafer to the right station 31b of the turntable assembly 31, and control the laser to perform laser processing on the raw silicon wafer at the right station 31b of the turntable assembly 31 to obtain the finished silicon wafer.

[0090] s40: Controls the loading and unloading swing arm assembly 20 to transfer the laser-processed silicon wafers from the right station 31b of the turntable assembly 31 to the unloading silicon wafer transfer assembly 40;

[0091] S50: Controls the feeding silicon wafer transport assembly 40 to transport upstream finished silicon wafers and screen out qualified wafers.

[0092] The silicon wafer feeding and processing method of this embodiment integrates the loading silicon wafer transfer assembly 10, the loading / unloading swing arm assembly 20, the turntable assembly 31, and the unloading silicon wafer transfer assembly 40 into a single system, resulting in a simple and compact structure and significantly reduced operating costs. Furthermore, the silicon wafer feeding and processing system 100 uses only the loading / unloading swing arm assembly 20 to transfer raw silicon wafers from the loading silicon wafer transfer assembly 10 to the turntable assembly 31. After the processing device 32 processes the raw silicon wafers into finished silicon wafers, the finished silicon wafers are then transferred from the turntable assembly 31 to the unloading silicon wafer transfer assembly 40. This eliminates the need for extensive programming, ensures stable and reliable operation, and reduces operating costs.

[0093] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom still fall within the protection scope of this invention.

Claims

1. A silicon wafer feeding and processing system, characterized in that, include: A silicon wafer feeding and conveying assembly is used for feeding raw silicon wafers. A turntable processing assembly, comprising a turntable assembly and a processing apparatus for processing raw silicon wafers placed on the turntable assembly into finished silicon wafers; A silicon wafer feeding and conveying assembly is used for feeding the finished silicon wafers. The loading and unloading swing arm assembly is used to transfer the raw silicon wafer from the loading silicon wafer transfer assembly to the turntable assembly, and to transfer the finished silicon wafer from the turntable assembly to the unloading silicon wafer transfer assembly. The loading / unloading swing arm assembly includes a driving device, a supporting swing arm, and a suction cup. The two ends of the supporting swing arm are respectively connected to the driving device and the suction cup, and are used to drive the supporting swing arm to rotate, so as to drive the suction cup to rotate synchronously with the supporting swing arm.

2. The silicon wafer feeding and processing system according to claim 1, characterized in that, The loading and unloading swing arm assembly also includes a silicon wafer rotation structure, which is connected to the suction cup and is used to drive the suction cup to rotate.

3. The silicon wafer feeding and processing system according to claim 2, characterized in that, The silicon wafer rotation structure includes a servo motor arranged in a triangle and two sets of rotating components. A transmission belt is fitted onto the output shaft of the servo motor and the two sets of rotating components. The servo motor drives the two sets of rotating components to rotate synchronously through the transmission belt. The rotating components are fixedly connected to the suction cup and rotatably connected to the support swing arm.

4. The silicon wafer feeding and processing system according to claim 1, characterized in that, The loading and unloading swing arm assembly includes two supporting swing arms and two sets of suction cups. Each supporting swing arm is connected to each set of suction cups, and the two sets of supporting swing arms are arranged in the same horizontal plane and perpendicular to each other.

5. The silicon wafer feeding and processing system according to claim 4, characterized in that, A synchronizing rod connects the two supporting swing arms.

6. The silicon wafer feeding and processing system according to claim 1, characterized in that, It also includes a dust removal component for removing dust from the turntable assembly.

7. The silicon wafer feeding and processing system according to claim 1, characterized in that, The turntable assembly includes a rotary motor and a turntable body. The rotary motor drives the turntable body to rotate, so that the silicon wafer moves between the left and right workstations of the turntable assembly.

8. The silicon wafer feeding and processing system according to claim 1, characterized in that, The silicon wafer feeding and transfer assembly includes a first wafer assembly device, a first wafer storage device, a first detection device, a first rejection device, and a second wafer assembly device arranged in sequence.

9. The silicon wafer feeding and processing system according to claim 1, characterized in that, The silicon wafer feeding and transport assembly includes a second detection device, a third wafer assembly device, a second rejection device, a second wafer storage device, and a fourth wafer assembly device arranged in sequence.

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