Packaging structures, electrical components and electronic devices
By directly fixing the reinforcing ring to the core layer of the substrate, the problem of easy force release of the metal reinforcing ring when the temperature changes is solved, achieving more effective substrate warpage compensation and improving the stability of the packaging structure.
CN224627160UActive Publication Date: 2026-08-11MOORE THREADS TECHNOLOGY (SHANGHAI) CO LTD
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Patent Information
- Application Number
- CN202521667871.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-06
- Publication Date
- 2026-08-11
- Estimated Expiration
- 2035-08-06
AI Technical Summary
Technical Problem
In the prior art, the metal reinforcing ring is fixed to the green oil layer of the substrate with adhesive, which makes it easy to release the force when the temperature changes, and cannot effectively counteract the warping of the substrate.
Method used
The reinforcing ring is directly fixed to the core layer of the substrate, so that it acts directly on the rigid area to counteract the warping of the substrate.
Benefits of technology
By directly acting on the rigid core layer, it effectively counteracts the warping of the substrate and improves stability under temperature changes.
✦ Generated by Eureka AI based on patent content.
Abstract
This disclosure relates to a packaging structure, electrical device, and electronic device. The packaging structure includes a substrate, a chip, and a reinforcing ring. The substrate includes a core layer; the chip is disposed on the substrate; and the reinforcing ring surrounds the chip circumferentially and is fixedly connected to the core layer. With this arrangement, the reinforcing ring disposed circumferentially on the chip is directly fixedly connected to the core layer of the substrate. Since the core layer is typically rigid or nearly rigid, when the temperature changes, the force exerted by the reinforcing ring on the substrate acts directly on the rigid region of the substrate, which, compared to related technologies, can more effectively counteract substrate warping.
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