Soundproof enclosure for housing wafer inspection equipment

Abstract

This application discloses a soundproof enclosure for housing a wafer inspection device, comprising an enclosure body and a cover assembly. The enclosure body includes walls and a central control space enclosed by the walls. The central control space is used to accommodate the inspection device and the wafer to be inspected. The walls include two or more access doors located on different wall surfaces for multi-directional inspection of various components of the inspection device. A wafer transfer port, located on a different wall surface from the access doors, is used for interference-free transfer of the wafer to be inspected. The cover assembly includes door cover members, rotatably connected to the enclosure body and capable of closing onto each access door. Both the enclosure body and the cover assembly are plates made of sound-insulating structure to block sound wave transmission. The soundproof enclosure for housing the wafer inspection device of this application aims to simultaneously ensure the inspection accuracy and efficiency of the inspection equipment for wafers.

Description

Technical Field

[0001] This application belongs to the field of semiconductor testing equipment technology, and in particular relates to a soundproof box for housing a wafer testing device. Background Technology

[0002] In the semiconductor wafer manufacturing process, defect detection is a core step in ensuring quality, requiring high-precision optical defect detection equipment. However, during equipment operation, external noise can cause deviations in the detection signal, affecting the results and leading to lower wafer quality.

[0003] Currently, the common practice is to install soundproof panels on the outside of the testing equipment or place the testing equipment in a large, soundproof room for soundproofing. However, this method is not convenient for the installation and maintenance of the testing equipment, and it is also not convenient for the wafer to be transferred from the previous process to the testing equipment, thus affecting the testing efficiency. Utility Model Content

[0004] This application provides a soundproof enclosure for housing a wafer inspection device, which aims to simultaneously ensure the inspection accuracy and efficiency of the inspection device for wafers.

[0005] This application provides a soundproof enclosure for housing a wafer inspection device, comprising an enclosure body and a cover assembly. The enclosure body includes walls and a central control space enclosed by the walls. The central control space is used to accommodate the inspection device and the wafer to be inspected. The walls include two or more access doors located on different wall surfaces for multi-directional inspection of various components of the inspection device. A wafer transfer port, located on different wall surfaces, is used for interference-free transmission of the wafer to be inspected. The cover assembly includes a door cover, rotatably connected to the enclosure body and capable of covering each access door. Both the enclosure body and the cover assembly are plates made of soundproof structure to block the transmission of sound waves inside and outside the central control space.

[0006] The soundproof box for accommodating the wafer inspection device, as described above, has a polygonal cross-section perpendicular to the height direction of the box body, and the walls include first walls opposite each other along a first direction, each of which has an access door; wherein the first direction is perpendicular to the height direction.

[0007] The soundproof enclosure for housing the wafer inspection device, as described above, includes a second wall and a third wall that are opposite each other along a second direction. The second wall has a wafer transfer port for transferring the wafer to be inspected to the inspection device, and the third wall has an inspection door. The second direction is perpendicular to the first direction and the height direction.

[0008] The soundproof enclosure for housing the wafer inspection device, as shown above, has a wiring port on the third wall. In the height direction, the wiring port on the third wall is installed at a lower height than the maintenance door opening on the third wall.

[0009] The soundproof enclosure for housing the wafer inspection device, as shown above, includes a soundproof structure comprising a first soundproof layer, a second soundproof layer, and a protective layer stacked together. The first soundproof layer is located on the side facing the central control space and has multiple sound-absorbing holes facing the second soundproof layer. The protective layer is located on the side facing away from the central control space and is made of metal.

[0010] The soundproof box for accommodating a wafer inspection device, as described above, includes a second soundproof layer comprising a first sub-soundproof layer and a second sub-soundproof layer stacked together. The first sub-soundproof layer is made of a metamaterial, and the second sub-soundproof layer comprises a non-woven fabric layer and a fiber cotton layer, with the non-woven fabric layer disposed on at least one side of the fiber cotton layer.

[0011] The soundproof box for accommodating a wafer inspection device, as shown above, has a first sub-soundproof layer attached to a first soundproof layer and a second sub-soundproof layer attached to a protective layer.

[0012] The soundproof box for accommodating the wafer inspection device, as shown above, includes two door panel structures rotatably connected to the wall. The two door panel structures are double-door structures, and the end of each door panel structure away from its own rotation axis is a stepped structure. The stepped structures of the two door panel structures are adapted to each other and can overlap and cooperate with each other.

[0013] The soundproof enclosure for housing the wafer inspection device, as described above, also includes a flexible soundproof structure. The flexible soundproof structure is arranged around the periphery of the door panel structure to seal the gap between the door panel structure and the enclosure body, as well as the gap between the two door panel structures.

[0014] The soundproof enclosure for housing the wafer inspection device, as described above, includes a wafer transfer port cover assembly. The wafer transfer port cover assembly is movably mounted on the surface of the wall and is slidably disposed in a direction toward or away from the wafer transfer port to completely block or fully open the wafer transfer port.

[0015] The soundproof enclosure for housing a wafer inspection device of this application includes a enclosure body and a cover assembly. The enclosure body includes walls and a central control space formed by the walls. The inspection device can be installed in the central control space and perform defect inspection on the wafer to be inspected in the central control space.

[0016] The enclosure body has two or more access doors and wafer transfer ports connecting the external space and the central control space. The different access doors are located on different wall surfaces, and each access door has a corresponding rotatable cover. The wafer transfer port is located on a different side wall than the access doors, used for interference-free transfer of the wafer to be tested to the testing device in the central control space, allowing the testing device to perform testing on the wafer. During testing, each access door cover seals its corresponding access door, forming a relatively enclosed central control space. Because the enclosure body and cover components are made of sound-insulating panels, sound wave transmission is blocked, preventing external sound waves from affecting the internal testing device and ensuring the testing accuracy of the wafer.

[0017] When different components of the testing device in the central control space need to be repaired, the corresponding door cover can be opened, and the repair operation can be carried out through the corresponding repair door. This enables quick and accurate repair of the testing device, saves the time of installation and maintenance of the testing device, and thus ensures the testing efficiency of the testing device for the wafer to be tested. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the soundproof enclosure for housing a wafer inspection device in the closed state from a first-view perspective, according to an embodiment of this application.

[0020] Figure 2 This is a schematic diagram of the soundproof box for accommodating a wafer inspection device in the first view of an embodiment of this application.

[0021] Figure 3 This is a schematic diagram of the soundproof enclosure for housing a wafer inspection device in the closed state from a second perspective, according to an embodiment of this application.

[0022] Figure 4 This is a schematic diagram of the soundproof box for accommodating a wafer inspection device in the second view of an embodiment of this application.

[0023] Figure 5 This is a schematic diagram of the soundproof box for accommodating a wafer inspection device in the open state from a third-view perspective, according to an embodiment of this application.

[0024] Figure 6 This is a schematic diagram of the soundproofing structure of a soundproof box for accommodating a wafer inspection device according to an embodiment of this application.

[0025] Explanation of icon numbers:

[0026] 1. Box body; 11. Wall; 111. Inspection door opening; 112. Transmission port; 113. First wall; 114. Second wall; 115. Third wall; 116. Line connection port; 117. Exhaust vent; 118. Fan interface;

[0027] 2. Cover assembly; 21. Door opening cover assembly; 211. Door panel structure;

[0028] 3. Detection device; 31. Optical path module; 32. Transmission module; 33. Electrical module;

[0029] 4. Sound insulation structure; 41. First sound insulation layer; 42. Second sound insulation layer; 421. First sub-sound insulation layer; 422. Second sub-sound insulation layer; 43. Protective layer;

[0030] 5. Rollers;

[0031] X, the first direction; Y, the second direction. Detailed Implementation

[0032] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0033] like Figures 1 to 6 As shown, this application provides a soundproof enclosure for housing a wafer inspection device, comprising an enclosure body 1 and a cover assembly 2. The enclosure body 1 includes a wall portion 11 and a central control space enclosed by the wall portion 11. The central control space is used to accommodate the inspection device 3 and the wafer to be inspected. The wall portion 11 includes two or more inspection doors 111 located on different wall surfaces of the wall portion 11, for multi-directional inspection of various components of the inspection device 3. A wafer transfer port 112 is located on different wall surfaces of the wall portion 11, for interference-free transmission of the wafer to be inspected. The cover assembly 2 includes a door cover 21, which is rotatably connected to the enclosure body 1 and can cover each inspection door 111. Both the enclosure body 1 and the cover assembly 2 are plates made of sound insulation structure 4, used to block the transmission of sound waves inside and outside the central control space.

[0034] It should be noted that, in Figure 2In the diagram of the soundproof enclosure in the open state, the opening within the green box is the access door 111; while... Figure 1 In the schematic diagram of the soundproof enclosure in the closed state, the overall structure and the top structure within the red and blue boxes are the wall 11 of the enclosure body 1.

[0035] In specific implementation, the soundproof box for accommodating the wafer inspection device of this application includes a box body 1 and a cover assembly 2. The box body 1 includes a wall 11 and a central control space formed by the wall 11. The inspection device 3 can be installed in the central control space and perform defect inspection on the wafer to be inspected in the central control space.

[0036] The wall 11 of the enclosure body 1 has two or more maintenance doors 111 and a wafer transfer port 112 that connect the external space and the central control space. The different maintenance doors 111 are located on different surfaces of the wall 11, and each maintenance door 111 is equipped with a rotatable door cover 21. The wafer transfer port 112 is located on a different surface from the maintenance door 111 and is used to transfer the wafer to be tested to the testing device 3 in the central control space without interference, enabling the testing device 3 to test the wafer. During testing, each door cover 21 seals the corresponding maintenance door 111 to form a relatively enclosed central control space. Since both the enclosure body 1 and the cover assembly 2 are made of sound-insulating structure 4, they can block sound wave transmission, preventing external sound waves from affecting the internal testing device 3 and ensuring the testing accuracy of the wafer.

[0037] When different components of the detection device 3 in the central control space need to be repaired, the corresponding door opening cover 21 can be opened, and the repair operation can be carried out through the corresponding repair door opening 111. This enables quick and accurate repair of the detection device 3, saves the time of installation and maintenance of the detection device 3, and thus ensures the detection efficiency of the detection device 3 for the wafer to be tested.

[0038] Specifically, such as Figure 1 As shown, the bottom of the box body 1 is also equipped with multiple rollers 5 that can be rolled. By rolling the multiple rollers 5, the soundproof box can be moved as a whole, which is convenient for wafer defect detection in different positions and in different environments.

[0039] like Figure 1 and Figure 3 As shown in the embodiment of this application, the soundproof box for accommodating the wafer inspection device has a polygonal cross-section in the height direction of the box body 1. The wall portion 11 includes first wall portions 113 opposite each other along a first direction. Each first wall portion 113 is provided with an inspection door 111 for inspecting the optical path modules 31 of the inspection device 3 on both sides of the first direction X. The first direction X is perpendicular to the height direction.

[0040] In specific implementation, the box body 1 is provided with first wall portions 113 on opposite sides in the first direction X, and each first wall portion 113 is provided with a maintenance door opening 111 corresponding to the optical path module 31. When the optical path module 31 needs to be maintained, the door opening cover 21 corresponding to the first wall portion 113 is opened to realize the connection between the central control space and the external space. The operator can quickly maintain the corresponding optical path module 31 through the maintenance door opening 111 at the first wall portion 113 without disassembling the detection device 3 as a whole, thus improving the maintenance efficiency of the detection device 3.

[0041] like Figures 1 to 5 As shown in the embodiment of this application, the soundproof box for accommodating the wafer inspection device includes a second wall portion 114 and a third wall portion 115 that are opposite each other along the second direction Y. The second wall portion 114 has a wafer transfer port 112 for transferring the wafer to be inspected to the wafer transfer module 32 on the second direction Y side of the inspection device 3. The third wall portion 115 has an inspection doorway 111 and a wiring connection port 116 for inspecting and connecting the electrical module 33 located on the other side of the second direction Y of the inspection device 3, respectively. The second direction Y is perpendicular to the first direction X and the height direction.

[0042] In specific implementation, the cross-section of the box body 1 perpendicular to the height direction is rectangular. The box body 1 is provided with a second wall 114 and a third wall 115 on opposite sides of the second direction Y. The second wall 114 has a wafer transfer port 112. Therefore, on the side where the second wall 114 is located, the wafer transfer operation can be performed along the second direction Y through the wafer transfer port 112, so that the wafer to be tested can pass through the wafer transfer port 112 into the central control space and accurately reach the position of the wafer transfer module 32 for subsequent wafer transfer and testing, ensuring the accuracy of wafer transfer and improving the wafer testing efficiency.

[0043] The maintenance doorway 111 and the wiring connection port 116 are arranged at intervals along the height direction on the third wall portion 115, opposite to the position of the electrical module 33 on the other side of the second direction Y. This allows the electrical module 33 to be inspected through the maintenance doorway 111 and external water, electricity and gas lines to be connected to the electrical module 33 through the wiring connection port 116. This enables the detection device 3 as a whole to achieve accurate detection and improves the detection accuracy of the wafer.

[0044] Furthermore, the spacing between the inspection doorway 111 and the wiring connection port 116 avoids interference between them, allowing the water, electricity, and gas lines to be accurately and stably laid within the wiring connection port 116 and connected to the electrical module 33. At the same time, it also prevents the water, electricity, and gas lines from interfering with maintenance operations when maintenance personnel are accessing the electrical module 33 through the inspection doorway 111.

[0045] Specifically, the maintenance doorway 111 of the first wall portion 113 has a larger opening area, allowing both sides to be fully open, thus enabling maintenance personnel to inspect each module of the testing device 3 from both sides in the first direction X, improving maintenance efficiency; while the maintenance doorway 111 of the third wall portion 115 has a smaller opening area, providing space for the arrangement of the line connection port 116, and the opening areas of the chip transfer port 112 and the line connection port 116 are even smaller, allowing only the chip and water, electricity and gas lines to pass through.

[0046] Specifically, please combine them together. Figure 4 and Figure 5 The detection device 3 includes an optical path module 31, a wafer transfer module 32, and an electrical module 33. When the detection device 3 is installed in the central control space, the optical path module 31 is located on both sides of the detection device 3 in the first direction X to provide a detection light source to the wafer to be detected. The wafer transfer module 32 and the electrical module 33 are respectively located on both sides of the detection device 3 in the second direction Y. The wafer transfer module 32 can further transfer the wafer transferred from the wafer transfer port 112, thereby realizing optical defect detection at the detection position of the detection device 3. The electrical module 33 is connected to the external water, electricity and gas lines to realize the comprehensive control of the overall detection device 3, so that the detection device 3 can realize the detection function.

[0047] like Figure 5 As shown in the embodiment of this application, the soundproof box for accommodating a wafer inspection device has the following characteristics: in the height direction, the installation height of the line connection port 116 in the third wall portion 115 is lower than the installation height of the maintenance door opening 111 in the third wall portion 115.

[0048] In practice, the wiring connection port 116 is set at a low height on the third wall 115, close to the bottom of the box body 1, which facilitates the routing and connection of external water, electricity and gas lines. There is no need to set up additional supports for the water, electricity and gas lines on the outside, which reduces the difficulty of wiring connection and installation.

[0049] The inspection door 111 is positioned at a height higher than the wiring connection port 116 on the third wall section 115, which facilitates maintenance personnel to open the corresponding door cover 21 to inspect the electrical modules 33 inside the central control space.

[0050] Specifically, the wall portion 11 also has a top wall and a bottom wall perpendicular to the height direction. The first wall portion 113, the second wall portion 114 and the third wall portion 115 are all connected between the top wall and the bottom wall and are all arranged parallel to the height direction.

[0051] Specifically, the third wall 115 is also provided with an exhaust vent 117, and the top wall is provided with a fan interface 118. The fan interface 118 and the exhaust vent 117 are connected by a pipe located in the central control space to form a ventilation and heat dissipation system for the soundproof box, so as to achieve the heat dissipation effect for the internal detection device 3.

[0052] Optionally, a control panel and control switch may also be provided on the wall 11 and the door cover assembly 21 to observe and control the status of the detection device 3 at the soundproof box.

[0053] like Figure 6 As shown in the embodiment of this application, a soundproof box for accommodating a wafer inspection device includes a soundproof structure 4 comprising a first soundproof layer 41, a second soundproof layer 42, and a protective layer 43 stacked together. The first soundproof layer 41 is disposed on the side facing the central control space and has a plurality of sound-absorbing holes disposed facing the second soundproof layer 42. The protective layer 43 is disposed on the side away from the central control space and is made of metal material.

[0054] In specific implementation, the first sound insulation layer 41, the second sound insulation layer 42, and the protective layer 43 are stacked. The protective layer 43 is located on the side facing away from the central control space, that is, on the outermost surface of the soundproof box. It is made of metal material and can protect the first sound insulation layer 41 and the second sound insulation layer 42 located on the inner side, as well as the detection device 3 inside. When the soundproof box is subjected to external impact, it can reduce the damage to the first sound insulation layer 41 and the second sound insulation layer 42, so that the sound insulation structure 4 can maintain the sound insulation effect.

[0055] The stacked arrangement of the first sound insulation layer 41 and the second sound insulation layer 42 can achieve a dual noise reduction effect against external noise, so that external noise can be gradually weakened when passing through the sound insulation structure 4, which greatly reduces the impact of external noise on the detection of the internal detection device 3 and ensures the detection accuracy of the chip.

[0056] like Figure 6 As shown in the embodiment of this application, the soundproof box for accommodating a wafer inspection device includes a second soundproof layer 42 comprising a first sub-soundproof layer 421 and a second sub-soundproof layer 422 stacked together. The first sub-soundproof layer 421 is made of a metamaterial, and the second sub-soundproof layer 422 comprises a nonwoven fabric layer and a fiber cotton layer, with the nonwoven fabric layer disposed on at least one side of the fiber cotton layer.

[0057] In specific implementation, the second sound insulation layer 42 further includes a first sub-sound insulation layer 421 and a second sub-sound insulation layer 422 stacked together. The first sub-sound insulation layer 421 is made of a metamaterial. When noise passes through the metamaterial of the first sub-sound insulation layer 421, because the size of the metamaterial is smaller than the working wavelength of the sound wave, it can achieve efficient low-frequency sound absorption through the design of local resonant units, thereby achieving a preliminary reduction effect on noise. The second sub-sound insulation layer 422 includes a non-woven fabric layer and a fiber cotton layer. The fiber cotton is a multi-fiber structural material. After the sound wave enters the fiber cotton, it will be reflected, superimposed, and collided between the fibers, realizing energy conversion. Therefore, the setting of the second sub-sound insulation layer 422 further reduces the propagation of noise. The non-woven fabric layer is located on at least one side of the fiber cotton layer, which not only further increases the thickness of the second sub-sound insulation layer 422, but also improves the fixing strength of the fiber cotton, making the second sub-sound insulation layer 422 more stable.

[0058] Specifically, the non-woven fabric layer is located on both sides of the fiber cotton layer and is wrapped around the fiber cotton layer, so that the fiber cotton layer can be stably connected with the layer structure on both sides, further improving the stability of the second sub-sound insulation layer 422.

[0059] like Figure 6 As shown in the embodiment of this application, a soundproof box for accommodating a wafer inspection device is provided, wherein a first sub-soundproof layer 421 is attached to a first soundproof layer 41, and a second sub-soundproof layer 422 is attached to a protective layer 43.

[0060] In practice, the second sub-sound insulation layer 422 is attached to the protective layer 43. Since the protective layer 43, made of metal material, has a smooth surface, and the second sub-sound insulation layer 422 includes a non-woven fabric layer and a fiber cotton layer, the second sub-sound insulation layer 422 can be stably connected to the protective layer 43, ensuring the connection stability between the layers of the sound insulation structure 4.

[0061] like Figures 1 to 5 As shown in the embodiment of this application, the soundproof box for accommodating the wafer inspection device includes two door panel structures 211 rotatably connected to the wall portion 11. The two door panel structures 211 are double-door structures, and the end of each door panel structure 211 away from its own rotation axis is a stepped structure. The stepped structure shapes of the two door panel structures 211 are adapted to each other and can overlap and cooperate with each other.

[0062] In practice, when the two door panel structures 211, which are configured as double doors, close the maintenance doorway 111, the stepped structures at the ends of the two door panel structures 211 that are away from their own rotation axes can overlap and cooperate with each other, thereby sealing the gap between the two door panel structures 211 and further improving the sound insulation effect.

[0063] Optionally, other edges of the door panel structure 211 may also be stepped structures, and the wall portion 11 that matches the edge of the door panel structure 211 may also be set as a stepped structure, thereby further sealing the gap between the door panel structure 211 and the wall portion 11 when the door panel structure 211 is closed, and further improving the sound insulation effect.

[0064] like Figures 1 to 5 As shown in the embodiment of this application, the soundproof box for accommodating the wafer inspection device further includes a flexible soundproof structure. The flexible soundproof structure is arranged around the peripheral edge of the door panel structure 211 to seal the gap between the door panel structure 211 and the box body 1, as well as the gap between the two door panel structures 211.

[0065] In practice, the deformable structure of the flexible sound insulation structure can further seal the gap between the door panel structure 211 and the box body 1, as well as the gap between the two door panel structures 211, thereby further improving the sound insulation effect.

[0066] Specifically, the flexible sound insulation structure is made of rubber material.

[0067] In another embodiment of this application, a soundproof box for accommodating a wafer inspection device is provided, wherein the cover assembly 2 further includes a wafer transfer port cover, which is movably mounted on the surface of the wall portion 11 and is slidably disposed in a direction toward or away from the wafer transfer port 112 to completely block or completely open the wafer transfer port 112.

[0068] In practice, the wafer transfer port cover assembly can move to fully open the wafer transfer port 112 when wafer transfer is required, without affecting the wafer transfer operation from the outside to the central control space. It can also move to block the wafer transfer port 112 when the detection device 3 detects the wafer, further improving the sealing effect on the central control space, thereby further improving the sound insulation effect.

[0069] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0070] The above description is merely a specific implementation of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

Claims

1. A soundproof enclosure for housing a wafer inspection device, characterized in that, The device includes a housing body (1) and a cover assembly (2). The housing body (1) includes a wall portion (11) and a central control space enclosed by the wall portion (11). The central control space is used to accommodate a detection device (3) and a wafer to be tested. The wall portion (11) includes: Two or more inspection doors (111) are located on different wall surfaces of the wall (11) for multi-directional inspection of various components of the detection device (3); A wafer transfer port (112) and an inspection doorway (111) are located on different wall surfaces of the wall portion (11) for non-interference transmission of the wafer to be tested; The cover assembly (2) includes: Door opening cover (21) is rotatably connected to the box body (1) and can be closed to each of the maintenance door openings (111). The box body (1) and the cover assembly (2) are both made of sound insulation structure (4) to block the transmission of sound waves inside and outside the central control space.

2. The soundproof enclosure for housing a wafer inspection device according to claim 1, characterized in that, The cross section of the box body (1) perpendicular to the height direction is polygonal, and the wall part (11) includes a first wall part (113) opposite to each other along the first direction (X), and each first wall part (113) is provided with the maintenance door opening (111). Wherein, the first direction (X) is perpendicular to the height direction.

3. The soundproof enclosure for housing a wafer inspection device according to claim 2, characterized in that, The wall portion (11) further includes a second wall portion (114) and a third wall portion (115) opposite each other along the second direction (Y). The second wall portion (114) has the wafer transfer port (112) for transferring the wafer to be tested to the testing device (3). The third wall portion (115) has the maintenance doorway (111). The second direction (Y) is perpendicular to the first direction (X) and the height direction.

4. The soundproof enclosure for housing a wafer inspection device according to claim 3, characterized in that, The third wall portion (115) also has a line connection port (116), and in the height direction, the installation height of the line connection port (116) on the third wall portion (115) is lower than the installation height of the maintenance door opening (111) on the third wall portion (115).

5. The soundproof enclosure for housing a wafer inspection device according to claim 1, characterized in that, The sound insulation structure (4) includes a first sound insulation layer (41), a second sound insulation layer (42), and a protective layer (43) stacked together. The first sound insulation layer (41) is located on the side facing the central control space and has a plurality of sound-absorbing holes facing the second sound insulation layer (42). The protective layer (43) is located on the side away from the central control space and is made of metal material.

6. The soundproof enclosure for housing a wafer inspection device according to claim 5, characterized in that, The second sound insulation layer (42) includes a first sub-sound insulation layer (421) and a second sub-sound insulation layer (422) stacked together. The first sub-sound insulation layer (421) is made of a metamaterial. The second sub-sound insulation layer (422) includes a non-woven fabric layer and a fiber cotton layer. The non-woven fabric layer is disposed on at least one side of the fiber cotton layer.

7. The soundproof enclosure for housing a wafer inspection device according to claim 6, characterized in that, The first sub-sound insulation layer (421) is attached to the first sound insulation layer (41), and the second sub-sound insulation layer (422) is attached to the protective layer (43).

8. The soundproof enclosure for housing a wafer inspection device according to claim 1, characterized in that, Each of the door opening cover components (21) includes two door panel structures (211) rotatably connected to the wall portion (11). The two door panel structures (211) are double door structures, and the end of each door panel structure (211) away from its own rotation axis is a stepped structure. The stepped structures of the two door panel structures (211) are adapted to each other and can overlap and cooperate with each other.

9. The soundproof enclosure for housing a wafer inspection device according to claim 8, characterized in that, The soundproof box also includes a flexible soundproof structure, which is arranged around the periphery of the door panel structure (211) to seal the gap between the door panel structure (211) and the box body (1) as well as the gap between the two door panel structures (211).

10. The soundproof enclosure for housing a wafer inspection device according to claim 1, characterized in that, The cover assembly (2) further includes a transfer port cover, which is movably mounted on the surface of the wall portion (11) and is slidably disposed in a direction toward or away from the transfer port (112) to completely block or completely open the transfer port (112).

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