Wafer detection probe station positioning device

Abstract

The application relates to a wafer detection probe station positioning device and relates to the technical field of wafer testing, which comprises a probe station plate, an adjustable positioning mechanism and a moving mechanism. The application has the advantages that when a wafer is placed into a detection hole, the edge of the wafer first contacts a buffer pad on the surface of a clamping plate, at this time, the spring is extruded to generate reverse elastic force, the clamping plate is driven to be attached to the wafer, and due to the elastic expansion and contraction characteristics of the spring, the clamping plate can automatically adjust the spacing according to the diameter and thickness difference of the wafer, so that different specifications of wafers can be adapted without replacing the detection hole assembly, thereby breaking the limitation that one detection hole corresponds to one wafer from the source, and meanwhile, after the clamping plate preliminarily fixes the wafer through the elastic force of the spring, the first electric push rod on the side of the vertical plate is started, the subsequent telescopic rod drives the extrusion block to move to the clamping plate, and finally the extrusion block is accurately inserted into the clamping plate.

Description

Technical Field

[0001] This application relates to the field of wafer testing technology, and in particular to a wafer testing probe station positioning device. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits (chips). Its surface has multiple microchip patterns. The main function of a wafer is to serve as the basic material for semiconductor devices. The wafer manufacturing process includes processes such as crystal pulling and slicing, which ultimately form tiny circuit structures that are widely used in various electronic devices. The materials used in wafers have undergone more than 60 years of technological evolution, mainly based on silicon, supplemented by new semiconductor materials.

[0003] Regarding the aforementioned technologies, in the current wafer manufacturing positioning process, to achieve precise wafer gripping, transfer, and processing positioning, the industry generally relies on detection holes as key positioning references. However, from the current application status of existing technologies, the detection holes adapted to most positioning devices are still limited to a single specification format. Whether it is the shape or diameter of the hole, or the distribution spacing of the hole at the edge of the wafer, it is often designed only for a certain type of wafer or specific process requirements, lacking compatibility with wafers of different specifications, which brings many inconveniences to the use. Utility Model Content

[0004] The purpose of this application is to provide a wafer inspection probe station positioning device, which has the advantages of high flexibility in adjusting the positioning of the inspection holes and solves the problems mentioned in the background art.

[0005] The wafer inspection probe station positioning device provided in this application adopts the following technical solution: it includes a probe station plate, an adjustable positioning mechanism and a moving mechanism, and the top of the probe station plate is provided with an inspection hole; The adjustable positioning mechanism includes several horizontal plates fixedly connected to the inner wall surface of the detection hole. A spring is fixedly connected to the side of the horizontal plate, and a clamping plate is fixedly connected to the surface of the spring. A buffer pad is provided on the surface of the clamping plate, and a slot is opened on the side of the clamping plate. Several vertical plates are fixedly connected to the top of the probe stage plate, and a first electric push rod is fixedly installed on the side of the vertical plate. A pressing block is fixedly connected to one end of the first electric push rod, and the pressing block is inserted into the slot.

[0006] By adopting the above technical solution and setting an adjustable positioning mechanism, when the wafer is placed into the inspection hole, the edge of the wafer will first contact the buffer pad on the surface of the clamping plate. At this time, the spring is compressed and generates a reverse elastic force, which drives the clamping plate to fit towards the wafer. Due to the elastic extension and contraction characteristics of the spring, the clamping plate can automatically adjust the spacing according to the difference in diameter and thickness of the wafer. It can adapt to wafers of different specifications without replacing the inspection hole assembly, breaking the limitation of one inspection hole corresponding to one wafer from the source. At the same time, after the clamping plate initially fixes the wafer by the spring force, the first step on the side of the vertical plate is activated. An electric push rod, followed by a telescopic rod, moves the extrusion block towards the clamping plate, ultimately ensuring that the extrusion block is precisely inserted into the slot on the side of the clamping plate. This step transforms the elastic clamping of the spring into rigid fixation, preventing the wafer from shifting due to vibration or contact with the test probe during the inspection process. Furthermore, the buffer pad on the surface of the clamping plate prevents the rigid clamping from causing scratches and indentations on the wafer edges. This ensures both positioning accuracy and protects the appearance and performance integrity of the wafer. This structure achieves the effect of adapting to multiple specifications with a single hole, enabling the switching of different wafers without frequent replacement of the positioning module.

[0007] Preferably, a robotic arm is fixedly mounted on the top of the probe stage, and a detection probe body is fixedly mounted on the bottom of the robotic arm by studs.

[0008] By adopting the above technical solution and setting up a robotic arm and a detection probe body, the robotic arm can achieve multi-dimensional position adjustment. During inspection, the operator does not need to manually move the detection probe body. They only need to control the robotic arm to accurately align the detection probe body with the detection point on the wafer. This not only reduces human operation error, but also adapts to the detection needs of different positions on the wafer surface, greatly improving the flexibility of inspection.

[0009] Preferably, a support plate is fixedly connected to the top of the probe station plate, and a lighting lamp is fixedly installed on the top of the support plate.

[0010] By adopting the above technical solution, and by setting up a support plate and a lighting lamp, the support plate can provide fixed support for the lighting lamp. When the ambient light is insufficient, turning on the lighting lamp can directly illuminate the detection hole and the wafer surface, making it convenient for operators to observe the wafer positioning status and the contact status of the detection probe body, and avoiding operational errors caused by blurred vision.

[0011] Preferably, the bottom of the probe station plate is fixedly connected to two fixing boxes, the inside of the fixing boxes is slidably connected to drawers, and the sides of the drawers are fixedly connected to fixing posts.

[0012] By adopting the above technical solution, and by setting up a fixed box, drawer and fixed column, the fixed box can provide a sliding track for the drawer. When in use, the operator can put the tools required for testing into the drawer, and then pull the drawer with the fixed column to retrieve them conveniently. There is no need to set up an additional tool storage rack, saving workshop space, and at the same time avoiding tools from being lost or getting dusty.

[0013] Preferably, the top of the probe station is provided with a dustproof pad.

[0014] By adopting the above technical solution and setting up a dustproof pad, dust in the air can be prevented from falling into the detection hole or adhering to the wafer surface, thus avoiding dust affecting positioning accuracy or causing wafer contamination.

[0015] Preferably, the bottom of the probe station plate is fixedly connected to several base plates, and the bottom of the base plates is fixedly connected to silicone blocks.

[0016] By adopting the above technical solution, and by setting a base plate and a silicone block, a rigid support can be provided for the overall device. At the same time, in addition to being anti-slip, the silicone block can also buffer the vibration during the operation of the equipment, reducing the impact of vibration on the contact stability between the detection probe body and the wafer.

[0017] Preferably, fastening plates are fixedly connected to the sides of several of the base plates.

[0018] By adopting the above technical solution and setting fastening plates, a rigid connection can be provided between several base plates.

[0019] Preferably, the moving mechanism includes support boxes that are fixedly connected to the sides of several base plates. The support boxes have storage compartments inside. A second electric push rod is fixedly installed inside the storage compartment. A wheel is fixedly installed at the bottom end of the second electric push rod. A pusher is fixedly connected to the side of the probe platform.

[0020] By adopting the above technical solution and setting up a moving mechanism, in the non-moving state, the storage compartment can completely store the second electric push rod and the wheel. At this time, the wheel does not contact the ground, and the silicone block at the bottom of the base plate directly adheres to the ground. The high coefficient of friction of the silicone block can prevent the device from sliding due to vibration during the testing process. At the same time, the fastening plate on the side of the base plate further enhances the connection stability of multiple base plates, ensuring that the probe platform plate remains level and providing a stable foundation for the accurate contact of the test probe body. In the moving state, when it is necessary to adjust the position of the device, the second electric push rod in the support box is activated. Then, the telescopic rod will drive the wheel to extend downward into the storage compartment until the wheel contacts the ground and lifts the entire device. At this time, the operator can easily push the device to the target position through the push handle on the side of the probe platform plate. After it is in place, the second electric push rod is retracted, the wheel is stored again, and the silicone block is placed back on the ground and fixed, thus achieving the purpose of convenient position movement.

[0021] In summary, this application includes at least one of the following beneficial technical effects: This wafer inspection probe station positioning device, through the inclusion of an adjustable positioning mechanism, ensures that when a wafer is placed into the inspection hole, its edge first contacts the buffer pad on the surface of the clamping plate. At this point, the spring is compressed, generating a reverse elastic force that pulls the clamping plate towards the wafer. Due to the elasticity of the spring, the clamping plate automatically adjusts its spacing according to the wafer's diameter and thickness, adapting to wafers of different specifications without requiring replacement of the inspection hole assembly. This breaks the limitation of one inspection hole corresponding to one type of wafer. Furthermore, after the clamping plate initially fixes the wafer using spring force, the vertical plate side is activated. The first electric push rod, followed by the telescopic rod, drives the extrusion block to move towards the clamping plate, ultimately ensuring that the extrusion block is precisely inserted into the slot on the side of the clamping plate. This step transforms the elastic clamping of the spring into rigid fixation, preventing the wafer from shifting due to vibration or contact with the detection probe body during the inspection process. Furthermore, the buffer pad on the surface of the clamping plate prevents the rigid clamping from causing scratches and indentations on the wafer edges. This ensures both positioning accuracy and protects the appearance and performance integrity of the wafer. This structure achieves the effect of adapting to multiple specifications with a single hole, enabling the switching of different wafers without frequent replacement of the positioning module. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall front view structure of this application; Figure 2 for Figure 1 Exploded view of the adjustable positioning mechanism from the side; Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure of China Mobile's organizational structure viewed from below. Figure 4 for Figure 1 Enlarged structural diagram at point A in the middle; Figure 5 for Figure 1 Enlarged structural diagram at point B.

[0023] In the picture: 1. Probe stage; 2. Detection hole; 3. Adjustable positioning mechanism; 301. Horizontal plate; 302. Spring; 303. Clamping plate; 304. Buffer pad; 305. Slot; 306. Vertical plate; 307. First electric push rod; 308. Extrusion block; 4. Robotic arm; 5. Support plate; 6. Lighting lamp; 7. Fixing box; 8. Drawer; 9. Fixing column; 10. Dustproof pad; 11. Base plate; 12. Moving mechanism; 1201. Support box; 1202. Storage compartment; 1203. Second electric push rod; 1204. Wheel; 13. Push handle; 14. Detection probe body; 15. Silicone block; 16. Fastening plate. Detailed Implementation

[0024] The following is in conjunction with the appendix Figure 1 -Appendix Figure 5 This application will be described in further detail below.

[0025] Example 1: A wafer inspection probe station positioning device, referring to... Figure 1 and Figure 2 It includes a probe stage plate 1, an adjustable positioning mechanism 3 and a moving mechanism 12, and a detection hole 2 is provided on the top of the probe stage plate 1; The adjustable positioning mechanism 3 includes several horizontal plates 301 fixedly connected to the inner wall surface of the detection hole 2. A spring 302 is fixedly connected to the side of each horizontal plate 301. A clamping plate 303 is fixedly connected to the surface of each spring 302. A buffer pad 304 is provided on the surface of the clamping plate 303. A slot 305 is provided on the side of the clamping plate 303. Several vertical plates 306 are fixedly connected to the top of the probe station plate 1. A first electric push rod 307 is fixedly installed on the side of each vertical plate 306. A pressing block 308 is fixedly connected to one end of the first electric push rod 307. The pressing block 308 is inserted into the slot 305. By setting the adjustable positioning mechanism 3, when the wafer is placed into the detection hole 2, the edge of the wafer will first contact the buffer pad 304 on the surface of the clamping plate 303. At this time, the spring 302 is compressed, generating a reverse elastic force, which drives the clamping plate 303 to conform to the wafer. Due to the elastic expansion and contraction characteristics of the spring 302, the clamping plate 303 can adjust according to the diameter and thickness of the wafer. The spacing is automatically adjusted to accommodate different wafer sizes without requiring replacement of the detection hole 2 component. This breaks the limitation that one detection hole 2 corresponds to one type of wafer. After the clamping plate 303 initially fixes the wafer with the elastic force of the spring 302, the first electric push rod 307 on the side of the vertical plate 306 is activated. The subsequent telescopic rod will drive the pressing block 308 to move towards the clamping plate 303, so that the pressing block 308 is precisely inserted into the slot 305 on the side of the clamping plate 303. This step transforms the elastic clamping of the spring 302 into rigid fixation, preventing the wafer from shifting due to vibration or contact with the detection probe body 14 during the detection process. In addition, the buffer pad 304 on the surface of the clamping plate 303 can prevent the rigid clamping from causing scratches and indentations on the wafer edge. This ensures positioning accuracy and protects the appearance and performance integrity of the wafer. This structure achieves the effect of one hole adapting to multiple specifications, and can complete the switching of different wafers without frequent replacement of the positioning module.

[0026] Please see Figure 1 and Figure 4A robotic arm 4 is fixedly mounted on the top of the probe stage 1, and a detection probe body 14 is fixedly mounted on the bottom of the robotic arm 4 via studs. By setting up the robotic arm 4 and the detection probe body 14, the robotic arm 4 can achieve multi-dimensional position adjustment. During detection, the operator does not need to manually move the detection probe body 14. They only need to control the robotic arm 4 to accurately align the detection probe body 14 with the detection point on the wafer. This not only reduces human operation error, but also adapts to the detection needs of different positions on the wafer surface, greatly improving detection flexibility. A support plate 5 is fixedly connected to the top of the probe stage 1, and an illumination lamp 6 is fixedly mounted on the top of the support plate 5. By setting up the support plate 5 and the illumination lamp 6, the support plate 5 can provide fixed support for the illumination lamp 6. When the ambient light is insufficient, turning on the illumination lamp 6 can directly illuminate the detection hole 2 and the wafer surface, making it convenient for the operator to observe the wafer positioning status and the contact status of the detection probe body 14, avoiding operational errors caused by blurred vision.

[0027] Please see Figure 1 The bottom of the probe station plate 1 is fixedly connected to two fixing boxes 7. The inside of the fixing box 7 is slidably connected to a drawer 8. The side of the drawer 8 is fixedly connected to a fixing post 9. By setting the fixing box 7, the drawer 8 and the fixing post 9, the fixing box 7 can provide a sliding track for the drawer 8. When in use, the operator can put the tools required for testing into the drawer 8, and then pull the drawer 8 through the fixing post 9 to retrieve them conveniently. There is no need to set up an additional tool storage rack, saving workshop space and preventing tools from being lost or contaminated with dust. The top of the probe station plate 1 is provided with a dustproof pad 10. By setting the dustproof pad 10, dust in the air can be prevented from falling into the test hole 2 or adhering to the wafer surface, avoiding dust from affecting the positioning accuracy or causing wafer contamination.

[0028] Please see Figure 1 , Figure 3 and Figure 5The probe stage 1 has several base plates 11 fixedly connected to its bottom, and silicone blocks 15 fixedly connected to the bottom of each base plate 11. By setting the base plates 11 and silicone blocks 15, rigid support is provided for the entire device. In addition to being anti-slip, the silicone blocks 15 also buffer vibrations during operation, reducing the impact of vibrations on the stability of the contact between the probe body 14 and the wafer. Fastening plates 16 are fixedly connected to the sides of each base plate 11, providing a rigid connection between them. The moving mechanism 12 includes support boxes 1201 fixedly connected to the sides of each base plate 11. A storage compartment 1202 is provided inside the support box 1201, and a second electric push rod 1203 is fixedly installed inside the storage compartment 1202. A wheel 1204 is fixedly installed at the bottom of the second electric push rod 1203. A push handle 13 is fixedly connected to the side of the probe stage 1. By setting the moving mechanism 12, the storage compartment 1202 can move the second electric push rod in a non-moving state. When 1203 and wheel 1204 are fully retracted, wheel 1204 is not in contact with the ground. The silicone block 15 at the bottom of the base plate 11 is directly attached to the ground. The high coefficient of friction of the silicone block 15 can prevent the device from sliding due to vibration during the test. At the same time, the fastening plate 16 on the side of the base plate 11 further enhances the connection stability of multiple base plates 11, ensuring that the probe station plate 1 remains level and providing a stable foundation for the accurate contact of the test probe body 14. In the moving state, when it is necessary to adjust the position of the device, the second electric push rod 1203 in the support box 1201 is activated. Then the telescopic rod will drive the wheel 1204 to extend downward into the storage compartment 1202 until the wheel 1204 contacts the ground and lifts the entire device. At this time, the operator can easily push the device to the target position through the push handle 13 on the side of the probe station plate 1. After it is in place, the second electric push rod 1203 is retracted, the wheel 1204 is retracted, and the silicone block 15 is fixed on the ground again, realizing the purpose of convenient position movement.

[0029] The implementation principle of this application embodiment is as follows: First, the initial state confirmation and environmental preparation of the device are completed. Check whether the moving mechanism 12 is in a non-working state, that is, the second electric push rod 1203 in the support box 1201 is retracted, the wheel 1204 is stored in the storage compartment 1202, and the silicone block 15 at the bottom of the base plate 11 is completely in contact with the ground. At the same time, the fastening plate 16 on the side of the base plate 11 confirms that the multiple base plates 11 are connected firmly to ensure that the probe station plate 1 is level as a whole. If the ambient light is insufficient, turn on the lighting lamp 6 on the top of the support plate 5 to focus the light on the detection hole 2 area on the top of the probe station plate 1, so as to provide a clear view for subsequent operations. In addition, the drawer 8 in the fixing box 7 can be pulled open through the fixing column 9 to take out the tools required for testing, namely the wafer cleaning cloth and spare studs, and place the wafer to be tested on the dustproof pad 10 on the top of the probe station plate 1 to avoid direct contact and contamination, thus completing the preliminary preparation. Then, the wafer is initially positioned and held elastically. The wafer to be tested is picked up from the dust pad 10 and slowly placed into the test hole 2 at the top of the probe station plate 1. At this time, the edge of the wafer first contacts the buffer pad 304 on the surface of the clamping plate 303 connected to the horizontal plate 301 on the inner wall of the test hole 2. As the wafer is continuously placed in, the buffer pad 304 drives the clamping plate 303 to press the spring 302 towards the horizontal plate 301. The spring 302 is compressed and generates a reverse elastic force, pushing the clamping plate 303 to fit tightly against the edge of the wafer. Since the spring 302 has elastic extension and contraction characteristics, multiple sets of clamping plates 303 will automatically adjust the spacing according to the diameter and thickness of the wafer until the wafer is initially fixed in the center position of the test hole 2. The adaptation of wafers of different specifications can be completed without replacing any test hole 2 components. Then, the adjustable positioning mechanism 3 is activated to achieve rigid locking of the wafer. After the wafer is initially fixed by the spring 302 and the clamping plate 303, the first electric push rod 307 on the side of the top vertical plate 306 of the probe stage plate 1 is activated. The telescopic rod of the first electric push rod 307 slowly extends, driving the pressing block 308 at its end to move towards the clamping plate 303. As the telescopic rod continues to advance, the pressing block 308 gradually approaches and finally accurately inserts into the preset slot 305 on the side of the clamping plate 303, transforming the original elastic clamping state into a rigid fixed state. This step can effectively avoid the displacement of the wafer caused by equipment vibration or contact of the detection probe body 14 during subsequent testing. At the same time, the buffer pad 304 on the surface of the clamping plate 303 can isolate the direct force of rigid extrusion on the edge of the wafer, preventing scratches and indentations. Subsequently, the position of the detection probe is adjusted to align with the wafer detection point. The robotic arm 4 fixed on the top of the probe stage 1 is then activated. Through the multi-dimensional control functions of the robotic arm 4, namely, vertical lifting, horizontal movement, or rotation adjustment, the detection probe body 14 fixed at its bottom by studs is moved. The operator can then observe and slowly adjust the detection probe body 14 to be directly above the target point of the wafer to be inspected until the tip of the detection probe body 14 and the wafer detection point maintain a preset vertical distance. During this process, there is no need to manually touch the detection probe body 14, which greatly reduces human operation error. At the same time, the position of the robotic arm 4 can be flexibly adjusted according to the needs of different detection points on the wafer surface to adapt to multi-area inspection. Afterwards, the wafer inspection operation is performed and the data is recorded. After confirming that the position of the inspection probe body 14 is accurate, the robotic arm 4 is controlled to slowly lower the inspection probe body 14 and make the tip of the inspection probe body 14 make stable contact with the wafer inspection point. Then, the electrical performance or structural integrity data of the wafer are collected through the inspection probe body 14. During the inspection process, the dustproof pad 10 continuously blocks dust in the air from falling into the inspection hole 2 or the wafer surface to avoid dust interfering with the accuracy of the inspection data. The silicone block 15 buffers the slight vibration generated during the operation of the equipment to ensure the stability of the contact between the inspection probe body 14 and the wafer and ensure the reliability of the inspection data. If it is necessary to change the tool during the inspection process, i.e., clean the lint-free cloth of the inspection probe body 14, it can be used at any time by pulling open the drawer 8 through the fixing column 9 without interrupting the inspection process. Finally, after completing the equipment reset and wafer removal following the inspection, the robotic arm 4 is first controlled to lift the inspection probe body 14 away from the wafer surface and return to its initial position. Then, the first electric push rod 307 is activated, causing its telescopic rod to retract, which in turn causes the pressing block 308 to disengage from the slot 305 of the clamping plate 303, releasing the rigid lock on the clamping plate 303. Subsequently, the operator gently removes the wafer from the inspection hole 2 using a tool. At this point, the spring 302 loses its squeezing force on the wafer, gradually returning to its original state and moving the clamping block... The holding plate 303 is reset to its initial position. If it is necessary to move the device to another workstation, the second electric push rod 1203 in the support box 1201 is activated, so that its telescopic rod extends and drives the wheel 1204 to descend until the wheel 1204 lifts the device. Then, the operator pushes the device to the target position through the pusher 13, retracts the second electric push rod 1203 to store the wheel 1204, and the silicone block 15 is fixed back to the ground. Finally, the lighting 6 is turned off, the testing tools are put back into the drawer 8 and pushed tightly, and the entire testing process and equipment reset are completed.

Claims

1. A wafer inspection probe station positioning device, comprising a probe station plate (1), an adjustable positioning mechanism (3) and a moving mechanism (12), characterized in that: The probe station plate (1) has a detection hole (2) on its top. The adjustable positioning mechanism (3) includes several horizontal plates (301) fixedly connected to the inner wall surface of the detection hole (2). A spring (302) is fixedly connected to the side of the horizontal plate (301). A clamping plate (303) is fixedly connected to the surface of the spring (302). A buffer pad (304) is provided on the surface of the clamping plate (303). A slot (305) is opened on the side of the clamping plate (303). Several vertical plates (306) are fixedly connected to the top of the probe station plate (1). A first electric push rod (307) is fixedly installed on the side of the vertical plate (306). A pressing block (308) is fixedly connected to one end of the first electric push rod (307). The pressing block (308) is inserted into the inside of the slot (305).

2. The wafer inspection probe station positioning apparatus of claim 1, wherein: A robotic arm (4) is fixedly installed on the top of the probe stage plate (1), and a detection probe body (14) is fixedly installed on the bottom of the robotic arm (4) by studs.

3. The wafer inspection probe station positioning apparatus of claim 1, wherein: A support plate (5) is fixedly connected to the top of the probe station plate (1), and a lighting lamp (6) is fixedly installed on the top of the support plate (5).

4. The wafer inspection probe station positioning apparatus of claim 1, wherein: The bottom of the probe station plate (1) is fixedly connected to two fixing boxes (7), and the inside of the fixing box (7) is slidably connected to a drawer (8), and the side of the drawer (8) is fixedly connected to a fixing post (9).

5. The wafer inspection probe station positioning apparatus of claim 1, wherein: The top of the probe station plate (1) is provided with a dustproof pad (10).

6. The wafer inspection probe station positioning device according to claim 1, characterized in that: The probe stage plate (1) has several base plates (11) fixedly connected to its bottom, and silicone blocks (15) are fixedly connected to the bottom of the base plates (11).

7. A wafer inspection probe station positioning device according to claim 6, characterized in that: Fastening plates (16) are fixedly connected to the sides of several of the base plates (11).

8. The wafer inspection probe station positioning device according to claim 1, characterized in that: The moving mechanism (12) includes a support box (1201) that is fixedly connected to the sides of several base plates (11). The support box (1201) has a storage compartment (1202) inside. A second electric push rod (1203) is fixedly installed inside the storage compartment (1202). A wheel (1204) is fixedly installed at the bottom end of the second electric push rod (1203). A pusher (13) is fixedly connected to the side of the probe plate (1).

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