Busbar assembly

Abstract

A bus assembly includes a first bus, a second bus, an isolation plate, and a heat pipe extending vertically. In a left-right direction perpendicular to the vertical direction, the isolation plate is disposed between the first and second bus to electrically isolate them. The heat pipe is attached to the first and second bus and allows liquid to pass through for heat dissipation. A silicone thermally conductive gel and an insulating layer are disposed between the first and second bus and the heat pipe. The insulating layer is a polyimide film or graphene composite nanoceramic. In this invention, a polyimide film or graphene composite nanoceramic is disposed between the heat pipe and the bus, along with silicone thermally conductive gel. The silicone thermally conductive gel can fully fill the gap between the bus and the heat pipe, thereby effectively conducting the heat generated by the bus to the coolant in the heat pipe for heat dissipation, and it is pressure-resistant and reliable.

Description

Technical Field

[0001] This application relates to a bus assembly, and more particularly to a bus assembly with good heat dissipation performance and reliable pressure resistance. Background Technology

[0002] Busbar assemblies typically consist of a power busbar, a grounding busbar, and an isolation plate separating the power busbar and the grounding busbar for electrical isolation. To facilitate heat dissipation, heat pipes and thermally conductive adhesive are usually installed on the busbar. However, when handling higher power loads, existing technologies are insufficient to meet the heat dissipation and voltage withstand requirements of busbar assemblies.

[0003] Therefore, it is desirable to design an improved bus assembly to meet the requirements for heat dissipation and pressure resistance. Utility Model Content

[0004] The technical problem to be solved by this application is to provide a bus assembly that not only has good heat dissipation but also has reliable pressure resistance.

[0005] To solve the above problems, this application can adopt the following technical solution: a bus assembly, which includes a first bus, a second bus, an isolation plate, and a heat pipe extending in the vertical direction. In the left-right direction perpendicular to the vertical direction, the isolation plate is disposed between the first bus and the second bus to electrically isolate the first bus and the second bus. The heat pipe is attached to the first bus and the second bus and is used to pass liquid through to dissipate heat from the first bus and the second bus. A silicone thermal conductive gel and an insulating layer are disposed between the first bus and the second bus and the heat pipe. The insulating layer is a polyimide film or a graphene composite nano-ceramic.

[0006] Furthermore, in the left-right direction, the first busbar and the second busbar are provided with grooves for embedding the heat pipe.

[0007] Furthermore, in the left-right direction, the groove includes a first groove recessed on the outside of the first busbar and a second groove recessed on the outside of the second busbar. The heat pipe includes a first heat pipe embedded in the first groove and a second heat pipe embedded in the second groove. In the first groove, a silicone thermally conductive gel and an insulating layer are disposed between the first busbar and the first heat pipe. In the second groove, a silicone thermally conductive gel and an insulating layer are disposed between the second busbar and the second heat pipe.

[0008] Further, the insulating layer is a polyimide film, the polyimide film is disposed on the surfaces of the first bus bar and the second bus bar, and the silicone thermal conductive gel is disposed between the polyimide film and the heat pipe.

[0009] Further, the thickness of the polyimide film is 0.025 mm.

[0010] Further, the insulating layer is a graphene composite nanoceramic, the graphene composite nanoceramic is disposed on the outer surface of the heat pipe, and the silicone thermal conductive gel is disposed between the graphene composite nanoceramic and the first bus bar and the second bus bar.

[0011] Further, the graphene composite nanoceramic is disposed on the outer surfaces around the heat pipe.

[0012] Further, the thickness of the graphene composite nanoceramic is greater than 0.1 mm.

[0013] Further, the heat pipe, the first bus bar and the second bus bar are made of the same material, which is pure copper.

[0014] Compared with the prior art, in the present application, an insulating layer composed of a polyimide film or a graphene composite nanoceramic is disposed between the heat pipe and the bus bar, and is paired with a silicone thermal conductive gel to fully fill the gap between the bus bar and the heat pipe. Since the polyimide film or the graphene composite nanoceramic has reliable thermal conductivity and insulation performance, the heat generated by the bus bar can be effectively conducted to the coolant in the heat pipe for heat dissipation, and the voltage resistance is reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a perspective view of the bus bar assembly of the present utility model.

[0016] Figure 2 is an exploded view of the bus bar assembly of the present utility model.

[0017] Figure 3 is a schematic diagram of an implementation manner of the combination of the bus bar and the heat pipe of the bus bar assembly of the present utility model.

[0018] Figure 4 is a schematic diagram of another implementation manner of the combination of the bus bar and the heat pipe of the bus bar assembly of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The following detailed description will further illustrate the present application in conjunction with the above-mentioned drawings.

[0020] Refer Figure 1 and Figure 2As shown, the present application discloses a busbar assembly 100, which includes a first busbar 10a, a second busbar 10b, a separator plate 20, and a heat pipe 30 that extend in the up-down direction. One of the first busbar 10a and the second busbar 10b is a power busbar and the other is a grounding loop busbar. The separator plate 20 is disposed between the first busbar 10a and the second busbar 10b in the left-right direction perpendicular to the up-down direction to electrically isolate the first busbar 10a and the second busbar 10b. The heat pipe 30 is attached to the first busbar 10a and the second busbar 10b, and the heat pipe 30 is filled with liquid to dissipate heat from the first busbar 10a and the second busbar 10b. In the present utility model, the first busbar 10a, the second busbar 10b, and the heat pipe 30 are all made of semi-rigid pure copper, which has excellent thermal conductivity, electrical conductivity, and processing performance.

[0021] As shown in Figure 3 and Figure 4 As shown, in the left-right direction, the first busbar 10a and the second busbar 10b are provided with grooves 101 for embedding the heat pipe 30. A silicone thermal conductive gel 40 and an insulating layer 50 are provided between the first busbar 10a and the second busbar 10b and the heat pipe 30. The insulating layer 50 is used to electrically isolate the heat pipe 30 from the first busbar 10a and the second busbar 10b, avoiding electrical breakdown between the heat pipe 30 and the first busbar 10a and the second busbar 10b. The silicone thermal conductive gel 40 can effectively fill the gaps between the heat pipe 30 and the first busbar 10a and the second busbar 10b, and has reliable thermal conductivity, so as to effectively ensure the heat dissipation of the heat pipe 30 to the first busbar 10a and the second busbar 10b.

[0022] In a specific embodiment of the present utility model, in the left-right direction, the groove 101 includes a first groove 101a recessed on the outer side of the first busbar 10a and a second groove 101b recessed on the outer side of the second busbar 10b, that is, the first groove 101a and the second groove 101b are respectively recessed from the opposite surfaces of the first busbar 10a and the second busbar 10b. The heat pipe 30 includes a first heat pipe 30a embedded in the first groove 101a of the first busbar 10a and a second heat pipe 30b embedded in the second groove 101b. In the first groove 101a, a silicone thermal conductive gel 40 and an insulating layer 50 are provided between the first busbar 10a and the first heat pipe 30a. In the second groove 101b, a silicone thermal conductive gel 40 and an insulating layer 50 are provided between the second busbar 10b and the second heat pipe 30b.

[0023] Figure 3 In one embodiment of this utility model, since the cooperation between the first busbar 10a and the first heat pipe 30a is the same as the cooperation between the second busbar 10b and the second heat pipe 30b, the cooperation between the first busbar 10a and the first heat pipe 30a will be used as an example for explanation. In this embodiment, the insulating layer 50 is a polyimide film, which is disposed on the surface of the first busbar 10a and at least within the first groove 101a to block the first busbar 10a from the first heat pipe 30a, thus preventing electrical breakdown between the first busbar 10a and the first heat pipe 30a. The polyimide film has a thickness of 0.025 mm. While ensuring electrical isolation between the first busbar 10a and the first heat pipe 30a, the polyimide film not only adheres fully to the first groove 101a but also has good thermal conductivity. The silicone thermal conductive gel 40 is disposed between the insulating layer 50, which is composed of a polyimide film, and the first heat pipe 30a. It fully fills the gap between the insulating layer 50 and the first heat pipe 30a. By disposing of the polyimide film and the silicone thermal conductive gel 40 with good thermal conductivity between the first busbar 10a and the first heat pipe 30a, the electrical isolation and thermal conduction between the first busbar 10a and the first heat pipe 30a are effectively guaranteed.

[0024] Figure 4 In another embodiment of this utility model, the cooperation between the first busbar 10a and the first heat pipe 30a is also used as an example for explanation. In this embodiment, the insulating layer 50 is graphene composite nanoceramic. The graphene composite nanoceramic is disposed on the outer surface of the first heat pipe 30a, at least on the outer surface corresponding to where the first heat pipe 30a is embedded in the first groove 101a. Preferably, the outer surfaces of the first heat pipe 30a are all provided with an insulating layer 50 composed of graphene composite nanoceramic, and the thickness of the graphene composite nanoceramic is greater than 0.1 mm. Graphene composite nanoceramic has excellent thermal conductivity and insulation properties. When the first heat pipe 30a is embedded in the first groove 101a, the insulating layer 50 composed of graphene composite nanoceramic can not only ensure electrical isolation between the first busbar 10a and the first heat pipe 30a, preventing electrical breakdown, but also reliably conduct the heat generated by the first busbar 10a to the first heat pipe 30a through the graphene composite nanoceramic, ensuring reliable heat dissipation. To further improve heat dissipation and pressure resistance, a thermally conductive silicone thermal gel 40 is provided between the insulating layer 50, which is composed of graphene composite nano-ceramics, and the first busbar 10a. The silicone thermal gel 40 fills the gap between the first busbar 10a and the first heat pipe 30a in the first groove 101a, thereby further improving heat dissipation and pressure resistance.

[0025] It is worth noting that in this invention, the first groove and the second groove can also be recessed from the opposite surfaces of the first busbar 10a and the second busbar 10b, respectively. In this case, the heat pipe 30 can be two independent heat pipes respectively disposed in the first groove and the second groove, or it can be a shared heat pipe disposed in the first groove and the second groove. Correspondingly, a polyimide film or graphene composite nano-ceramic ring is disposed on the peripheral surface of the heat pipe, and silicone thermal conductive gel is disposed in the first groove and the second groove to prevent the first busbar 10a and the second busbar 10b from becoming conductive or breaking down.

[0026] In summary, the above are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Any simple equivalent changes and modifications made in accordance with the claims and description of the present utility model should still fall within the scope of the present utility model patent.

Claims

1. A bus assembly comprising a first bus, a second bus, an isolation plate, and a heat pipe extending in a vertical direction; wherein, in a left-right direction perpendicular to the vertical direction, the isolation plate is disposed between the first bus and the second bus to electrically isolate the first bus and the second bus; and the heat pipe is attached to the first bus and the second bus and is used to pass liquid through them for heat dissipation, characterized in that: A silicone thermally conductive gel and an insulating layer are disposed between the first busbar and the second busbar and the heat pipe, wherein the insulating layer is a polyimide film or a graphene composite nanoceramic.

2. The bus assembly as described in claim 1, characterized in that: In the left-right direction, the first busbar and the second busbar are provided with grooves for embedding the heat pipe.

3. The bus assembly as described in claim 2, characterized in that: In the left-right direction, the groove includes a first groove recessed on the outside of the first busbar and a second groove recessed on the outside of the second busbar. The heat pipe includes a first heat pipe embedded in the first groove and a second heat pipe embedded in the second groove. In the first groove, a silicone thermally conductive gel and an insulating layer are disposed between the first busbar and the first heat pipe. In the second groove, a silicone thermally conductive gel and an insulating layer are disposed between the second busbar and the second heat pipe.

4. The bus assembly as described in claim 1, characterized in that: The insulating layer is a polyimide film, which is disposed on the surface of the first busbar and the second busbar, and the silicone thermal conductive gel is disposed between the polyimide film and the heat pipe.

5. The bus assembly as described in claim 4, characterized in that: The polyimide film has a thickness of 0.025 mm.

6. The bus assembly as described in claim 1, characterized in that: The insulating layer is a graphene composite nanoceramic, which is disposed on the outer surface of the heat pipe, and the silicone thermal conductive gel is disposed between the graphene composite nanoceramic and the first busbar and the second busbar.

7. The bus assembly as described in claim 6, characterized in that: The graphene composite nanoceramics are disposed on all four outer surfaces of the heat pipe.

8. The bus assembly as described in claim 6, characterized in that: The thickness of the graphene composite nanoceramic is greater than 0.1 mm.

9. The bus assembly as described in claim 1, characterized in that: The heat pipe, the first busbar, and the second busbar are all made of the same material, pure copper.

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