Shielding module and power supply device

Abstract

The utility model provides a kind of shielding module and power supply device for power module, power module includes primary power unit and secondary power unit, shielding module includes: PCB substrate, it is adjacent power module setting;First shielding unit, it is set in the side of PCB substrate adjacent primary power unit, first shielding unit includes first electric connection part, it is configured as first shielding unit electrically connected to primary power unit;Second shielding unit, it is set in the side of PCB substrate adjacent secondary power unit, second shielding unit includes second electric connection part, it is configured as second shielding unit electrically connected to secondary power unit;Wherein, interval is formed between first shielding unit and second shielding unit.The shielding module of the utility model realizes EMI shielding to primary side and secondary side of power module by first and second shielding unit, and isolation performance and shielding effect are better and suitable for standardization and automation manufacturing, and manufacturing cost is lower.

Description

Technical Field

[0001] This utility model relates to the field of electromagnetic shielding, and in particular to a shielding module and a power supply device. Background Technology

[0002] With the widespread use of power products such as USB chargers and sockets in consumer electronics, electromagnetic interference (EMI) has become increasingly prominent as power modules trend towards miniaturization and high power density. Particularly in isolated power modules, high-frequency interference coupling can easily occur between the primary and secondary sides. If effective shielding is not implemented, this can lead to excessive radiation levels, non-compliance, and even interference with the normal operation of surrounding equipment.

[0003] Currently, traditional EMI shielding involves manually soldering metal components to one side of the primary and secondary windings of the power module and then electrically insulating them with insulating materials. This type of shielding typically only provides single-sided shielding and cannot simultaneously cover both the primary and secondary sides, thus limiting its effectiveness. Furthermore, since the metal components used for shielding are not insulating devices, they require Mylar sheets or insulating tape for electrical isolation, posing a risk of short circuits during installation. In addition, most of the metal components need to be manually soldered to the power module, resulting in high labor and material costs.

[0004] Therefore, there is an urgent need for a shielding module that can simultaneously shield both the primary and secondary power modules, has a simple structure, good shielding effect, and is suitable for automated production. Utility Model Content

[0005] One objective of this invention is to address at least one aspect of the aforementioned problems and defects existing in the prior art.

[0006] To address the aforementioned problems, this utility model discloses a shielding module for a power module. The power module includes a primary power unit and a secondary power unit. The shielding module includes: a PCB substrate disposed adjacent to the power module; a first shielding unit disposed on the side of the PCB substrate adjacent to the primary power unit, the first shielding unit including a first electrical connection portion configured to electrically connect the first shielding unit to the primary power unit; and a second shielding unit disposed on the side of the PCB substrate adjacent to the secondary power unit, the second shielding unit including a second electrical connection portion configured to electrically connect the second shielding unit to the secondary power unit; wherein a gap is formed between the first shielding unit and the second shielding unit.

[0007] According to an exemplary embodiment of the present invention, both the first shielding unit and the second shielding unit are conductive areas disposed on the PCB substrate.

[0008] According to an exemplary embodiment of the present invention, the conductive region includes copper foil deposited on the PCB substrate.

[0009] According to an exemplary embodiment of the present invention, both the first electrical connection portion and the second electrical connection portion include a spring probe connector.

[0010] According to an exemplary embodiment of the present invention, the PCB substrate includes a double-sided panel, and a window area is formed on the side of the double-sided panel opposite to the power module for heat dissipation treatment of the shielding module.

[0011] According to an exemplary embodiment of the present invention, the interval is not less than 3 mm.

[0012] This utility model also discloses a power supply device, comprising: a power module, including: a primary power unit configured to acquire high-voltage power; a secondary power unit coupled to the primary power unit and configured to provide low-voltage power; a shielding module disposed adjacent to the power module, including: a PCB substrate; a first shielding unit disposed on the side of the PCB substrate adjacent to the primary power unit, the first shielding unit including a first electrical connection portion configured to electrically connect the first shielding unit to the primary power unit; and a second shielding unit disposed on the side of the PCB substrate adjacent to the secondary power unit, the second shielding unit including a second electrical connection portion configured to electrically connect the second shielding unit to the secondary power unit; wherein a gap is formed between the first shielding unit and the second shielding unit.

[0013] According to an exemplary embodiment of the present invention, both the first shielding unit and the second shielding unit are copper foils deposited on the PCB substrate.

[0014] According to an exemplary embodiment of the present invention, both the first electrical connection portion and the second electrical connection portion include a spring probe connector.

[0015] According to an exemplary embodiment of the present invention, the interval is not less than 3 mm.

[0016] In the foregoing exemplary embodiments of this invention, compared with the prior art, EMI shielding of both the primary and secondary sides of the power module is achieved simultaneously through the first and second shielding units, resulting in better isolation performance and shielding effect, and making it suitable for standardized and automated manufacturing. In industrial manufacturing, it can also reduce labor and material costs. Attached Figure Description

[0017] The features, advantages, and other aspects of the various embodiments of this utility model will become more apparent from the accompanying drawings and the following detailed description. Several embodiments of this utility model are shown herein by way of example and not limitation, in the drawings:

[0018] Figure 1 This is a schematic diagram of the structure of a power supply device 100 according to an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the structure of the shielding module 20 according to an embodiment of the present invention. Detailed Implementation

[0020] The technical solution of this utility model will be further described in detail below through embodiments and in conjunction with the accompanying drawings. In this specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of this utility model with reference to the accompanying drawings is intended to explain the overall inventive concept of this utility model and should not be construed as a limitation thereof.

[0021] The terms “comprising,” “including,” and similar terms as used herein should be understood as open-ended terms, meaning “including / including but not limited to,” implying that other content may also be included. The term “based on” means “at least partially based on.” The term “one embodiment” means “at least one embodiment”; the term “another embodiment” means “at least one additional embodiment,” and so on.

[0022] As mentioned earlier, the EMI shielding methods used in the prior art involve welding metal parts to one side of the primary and secondary windings of the power module. This method has limited shielding effectiveness, poses a risk of short circuits during installation, and is relatively expensive. To address these issues, this invention proposes a shielding module that not only offers better shielding and isolation performance but is also more suitable for standardized and automated manufacturing, and boasts lower material and manufacturing costs.

[0023] The following will use the exemplary shielding module of this utility model as an example for detailed explanation.

[0024] Figure 1 A schematic diagram of the structure of a power supply device 100 according to an embodiment of the present invention is shown; Figure 2 A schematic diagram of the structure of a shielding module 20 according to an embodiment of the present invention is shown. (Refer to...) Figure 1 and Figure 2An exemplary power supply device 100 includes a power module 10 and a shielding module 20. The power module 10 includes a primary power unit 11 and a secondary power unit 12. The primary power unit 11 is configured to obtain high-voltage power, such as household 220V AC. The secondary power unit 12 is coupled to the primary power unit 11 and provides low-voltage power, such as 5V DC, to electrical devices connected to the primary power unit 11. The power module 10 may further include an isolation transformer 13 disposed between the primary power unit 11 and the secondary power unit 12 to electrically isolate them. The isolation transformer 13 is capable of transforming the high-voltage power input from the primary power unit 11, which is electrically connected to one end, into low-voltage power output to the secondary power unit 12, which is electrically connected to the other end.

[0025] A shielding module 20, disposed adjacent to the power module 10, includes a PCB substrate 21, a first shielding unit 22, and a second shielding unit 23. The first shielding unit 22 is disposed on the side of the PCB substrate 21 adjacent to the primary power unit 11. The first shielding unit 22 includes a first electrical connection portion 24 configured to electrically connect the first shielding unit 22 to the primary power unit 11. The second shielding unit 23 is disposed on the side of the PCB substrate 21 adjacent to the secondary power unit 12. The second shielding unit 23 includes a second electrical connection portion 25 configured to electrically connect the second shielding unit 23 to the secondary power unit 12. A gap is formed between the first shielding unit 22 and the second shielding unit 23. Since the first shielding unit 22 and the second shielding unit 23 are disposed on the side closest to the primary power unit 11 and the secondary power unit 12, and no insulating layer is provided in between, the gap between the first shielding unit 22 and the second shielding unit 23 can provide electrical insulation.

[0026] In some embodiments, both the first shielding unit 22 and the second shielding unit 23 are conductive areas disposed on the PCB substrate 21. The position, size, shape, and number of conductive areas can be determined based on the position of the interfering device on the primary power supply unit 11 and the secondary power supply unit 12, as well as the shielding test results.

[0027] In some embodiments, the conductive region comprises copper foil deposited on the PCB substrate 21. In some embodiments, the conductive region may also be made of other materials with good conductivity, such as aluminum foil. Copper, as a standard conductive material for PCBs, has excellent conductivity, and the use of copper foil allows for direct utilization of PCB etching processes, enabling standardized and automated production at a lower cost.

[0028] In some embodiments, both the first electrical connection portion 24 and the second electrical connection portion 25 include spring probe connectors. Both the primary power supply unit 11 and the secondary power supply unit 12 include multiple traces, with pads (not shown) provided on the traces adjacent to the first shielding unit 22 and the second shielding unit 23. Spring probe connectors are disposed on the first shielding unit 22 and the second shielding unit 23 corresponding to the pads. When the spring probe connectors contact the pads, the first shielding unit 22 is electrically connected to the primary power supply unit 11, and the second shielding unit 23 is electrically connected to the secondary power supply unit 12.

[0029] In some embodiments, both the first electrical connection portion 24 and the second electrical connection portion 25 include pin headers. A female connector (not shown) is provided on the side of the power module 10 adjacent to the shielding module 20, corresponding to the pin headers for insertion. When the pin headers on the first shielding unit 22 and the second shielding unit 23 are inserted into the female connector on the power module, the first shielding unit 22 is electrically connected to the primary power unit 11, the second shielding unit 23 is electrically connected to the secondary power unit 12, and the shielding module 20 can be fixed to the power module 10.

[0030] In some embodiments, the first electrical connection 24 and the second electrical connection 25 may further include solder wires. When the first electrical connection 24 and the second electrical connection 25 use pin headers or solder wires, they need to be manually soldered to the first shielding unit 22 and the second shielding unit 23. When the first electrical connection 24 and the second electrical connection 25 use spring probe connectors, they can be directly soldered to the surface of the PCB substrate 21 using SMT (Surface Mount Technology) technology, which enables automated assembly, high production efficiency, and reduced manual soldering costs.

[0031] In some embodiments, the PCB substrate 21 is a single-sided board. In some embodiments, the PCB substrate 21 is a double-sided board. When the PCB substrate 21 is a double-sided board, a window area (not shown in the figure) can be formed on the side of the double-sided board facing away from the power module 10. The window area can provide heat dissipation for the shielding module 20. The window area can be created by removing the solder mask layer on the PCB substrate 21, exposing the underlying copper foil. Since copper has excellent thermal conductivity, the copper foil partially exposed in the window area can directly contact the air, accelerating heat transfer and enhancing heat conduction, thus effectively dissipating heat from the shielding module 20.

[0032] In some embodiments, the distance between the first shielding unit 22 and the second shielding unit 23 is not less than 3 mm. Since the first shielding unit 22 and the second shielding unit 23 are electrically connected to the primary power supply unit 11 and the secondary power supply unit 12, and the primary power supply unit 11 obtains and uses high-voltage power, the higher the voltage, the greater the safety clearance and creepage distance required in the PCB design. If the safety clearance and creepage distance on the PCB are insufficient, it can lead to circuit breaks, arcing, leakage in humid environments, and other safety problems, as well as parasitic capacitance effects. Therefore, to prevent the primary power supply unit 11 from interfering with the circuits or modules on the secondary power supply unit 12 through the shielding module 10, the distance between the first shielding unit 22 and the second shielding unit 23 is not less than 3 mm. The distance can be set according to actual production needs; for example, the minimum distance required by US safety regulations is 4.8 mm, and the minimum distance required by Chinese safety regulations is 6.5 mm.

[0033] The shielding module for power modules of this invention achieves simultaneous EMI shielding for both the primary and secondary sides of the power module through first and second shielding units, resulting in better isolation performance and shielding effect, and is suitable for standardized and automated manufacturing. In industrial manufacturing, it can also reduce labor and material costs.

[0034] The above description is merely an optional embodiment of the present utility model and is not intended to limit the embodiments of the present utility model. For those skilled in the art, the embodiments of the present utility model can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of the present utility model should be included in the protection of the embodiments of the present utility model.

[0035] While embodiments of the present invention have been described with reference to several specific examples, it should be understood that the embodiments of the present invention are not limited to the specific embodiments disclosed. The embodiments of the present invention are intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. The scope of the appended claims is to be interpreted in the broadest sense, thereby encompassing all such modifications and equivalent structures and functions.

Claims

1. A shielding module for a power supply module, the power supply module comprising a primary power supply unit and a secondary power supply unit, characterized in that, The shielding module includes: A PCB substrate is disposed adjacent to the power module; A first shielding unit is disposed on the side of the PCB substrate adjacent to the primary power supply unit. The first shielding unit includes a first electrical connection portion configured to electrically connect the first shielding unit to the primary power supply unit. A second shielding unit is disposed on the side of the PCB substrate adjacent to the secondary power supply unit. The second shielding unit includes a second electrical connection portion configured to electrically connect the second shielding unit to the secondary power supply unit. There is a gap between the first shielding unit and the second shielding unit.

2. The shielding module according to claim 1, characterized in that, Both the first shielding unit and the second shielding unit are conductive areas disposed on the PCB substrate.

3. The shielding module according to claim 2, characterized in that, The conductive area includes copper foil deposited on the PCB substrate.

4. The shielding module according to claim 1, characterized in that, Both the first electrical connection portion and the second electrical connection portion include a spring probe connector.

5. The shielding module according to claim 1, characterized in that, The PCB substrate includes a double-sided panel, and a window area is formed on the side of the double-sided panel opposite to the power module for heat dissipation treatment of the shielding module.

6. The shielding module according to claim 1, characterized in that, The interval is not less than 3mm.

7. A power supply device, characterized in that, include: The power module includes: Primary power supply unit, configured to obtain high-voltage power; A secondary power supply unit is coupled to the primary power supply unit and is configured to provide low-voltage power. A shielding module, disposed adjacent to the power module, includes: PCB substrate; A first shielding unit is disposed on the side of the PCB substrate adjacent to the primary power supply unit. The first shielding unit includes a first electrical connection portion configured to electrically connect the first shielding unit to the primary power supply unit. A second shielding unit is disposed on the side of the PCB substrate adjacent to the secondary power supply unit. The second shielding unit includes a second electrical connection portion configured to electrically connect the second shielding unit to the secondary power supply unit. There is a gap between the first shielding unit and the second shielding unit.

8. The power supply device according to claim 7, characterized in that, Both the first shielding unit and the second shielding unit are copper foils deposited on the PCB substrate.

9. The power supply device according to claim 7, characterized in that, Both the first electrical connection portion and the second electrical connection portion include a spring probe connector.

10. The power supply device according to claim 7, characterized in that, The interval is not less than 3mm.

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