Dynamic plantar pressure-resistive impedance dual-mode detection insole

Abstract

The application discloses a dynamic plantar pressure-resistive impedance dual-mode detection insole, and belongs to the medical detection sensor field. The technical points are as follows: from top to bottom, the insole comprises a resistive impedance sensing assembly, a shock insulation-insulation layer, a pressure sensor assembly, a middle layer of the insole and an insole body; the resistive impedance sensing assembly and the pressure sensor assembly are respectively embedded on the upper surface and the lower surface of the shock insulation-insulation layer; the resistive impedance sensing assembly comprises first to third resistive impedance sensor arrays, which correspond to the detection of the metatarsal region, the arch region and the calcaneal region; the pressure sensor assembly comprises first to third pressure sensor arrays, which correspond to the detection of the plantar pressure of the metatarsal region, the arch region and the calcaneal region. The application aims to provide a dynamic plantar pressure-resistive impedance dual-mode detection insole.

Description

Technical Field

[0001] This utility model belongs to the field of medical detection sensors, specifically relating to a dynamic plantar pressure-electrical impedance dual-mode detection insole. Background Technology

[0002] Currently, most common foot pressure insoles (such as CN212280170U, CN205215232U, CN117653441B) use a single pressure sensor (piezoresistive, piezoelectric, or capacitive) for detection. The above methods have the following shortcomings: (1) It can only obtain the plantar pressure distribution and cannot simultaneously reflect the changes in electrical impedance caused by plantar soft tissue blood perfusion or fatigue edema.

[0003] (2) In high-impact sports (such as boxing back step and fighting whip kick), the sensor is prone to problems such as signal drift and interlayer peeling, which can cause the sensor to fail to work.

[0004] In summary, the main research direction of this application is to develop a dynamic plantar pressure-electrical impedance dual-mode detection insole that can combine plantar pressure and electrical impedance information. Utility Model Content

[0005] The purpose of this invention is to solve the problems existing in the prior art and provide a dynamic plantar pressure-electrical impedance dual-mode detection insole.

[0006] The technical solution of this utility model is as follows: A dynamic plantar pressure-electrical impedance dual-mode detection insole, comprising, from top to bottom: an electrical impedance sensing component, a shock-absorbing-insulating layer, a pressure sensor component, an insole middle layer, and an insole body; The impedance sensing component and the pressure sensor component are respectively embedded in the upper and lower surfaces of the vibration isolation-insulation layer; The impedance sensing component includes: a first to a third impedance sensor array, which correspond to the detection of the metatarsal region, the arch region, and the calcaneal region; The pressure sensor assembly includes: a first to a third pressure sensor array, which correspond to the detection of plantar pressure in the metatarsal region, arch region, and calcaneal region.

[0007] Furthermore, the vibration isolation-insulation layer is made of a 0.1 mm thick rigid PI film.

[0008] Furthermore, the impedance sensing component includes multiple microneedle electrodes, which are silver chloride electrodes with a diameter of 0.5-1 mm and a height of 0.2-0.4 mm.

[0009] Furthermore, the first impedance sensor array adopts a 2×4 matrix array, the second impedance sensor array adopts a 4×4 matrix array, and the third impedance sensor array adopts a 2×4 matrix array.

[0010] Furthermore, the first pressure sensor array adopts a 2×4 matrix array, the second pressure sensor array adopts a 4×4 matrix array, and the third pressure sensor array adopts a 2×4 matrix array.

[0011] Furthermore, the microneedle electrodes of the impedance sensing component correspond one-to-one with the positions of the pressure sensors in the pressure sensor component.

[0012] Furthermore, the pressure sensor employs a flexible piezoresistive thin film unit, and the spacing between adjacent pressure sensors in the first to third pressure sensor arrays is 2.5 mm.

[0013] Furthermore, the insole body is made of 3 layers of 0.8mm thick super elastic EVA-R foam layer by hot pressing, and has hollowed-out mesh in the heel and forefoot areas.

[0014] Furthermore, the insole middle layer is bonded to the insole body using Velcro.

[0015] Furthermore, it also includes: a signal processing and wireless transmission module, which is used to collect pressure and impedance signals and output the signals wirelessly; The processing and wireless transmission module includes: a micro PCB board, an MCU, and a battery; The miniature PCB board is connected to the various sensors of the impedance sensing component and pressure sensor component via flexible connecting wires. The micro PCB integrates an MCU, which is used to transmit pressure and impedance signals to the computer.

[0016] The advantages of this utility model's technical solution are mainly reflected in: (1) This application proposes a dynamic plantar pressure-electrical impedance dual-mode detection insole, the core design of which is: a. The impedance sensing component and the pressure sensor component are respectively embedded on the upper and lower surfaces of the vibration isolation-insulation layer. The vibration isolation-insulation layer is placed between the impedance sensing component and the pressure sensor component to: 1) avoid signal interference between the impedance sensor (micro-needle electrode) and the pressure sensor; and 2) prevent sensor peeling during high-impact movements.

[0017] b. By setting up impedance sensing components and pressure sensor components, the plantar pressure impact curve and the tissue impedance timing curve can be obtained simultaneously, which can be used for the timing analysis of plantar force exertion in boxing punches / kicks.

[0018] (2) This application proposes a dynamic plantar pressure-electrical impedance dual-mode detection insole with a quick disassembly function. The sensor layer (i.e., electrical impedance sensing component, shock-absorbing-insulating layer, pressure sensor component, and insole middle layer) and the insole body (i.e., EVA body) are bonded together with Velcro, which enables quick disassembly of the sensor layer and the insole body, making it easy to clean and dry, and suitable for daily use during high-intensity training.

[0019] (3) This application proposes a dynamic plantar pressure-electrical impedance dual-mode detection insole, which can be built into boxing, fighting training shoes or sports shoes to collect the plantar pressure distribution and tissue electrical impedance changes of athletes in real time, so as to conduct competitive status assessment, injury warning and technical movement optimization. Attached Figure Description

[0020] The present application will be further described in detail below with reference to the embodiments in the accompanying drawings, but this does not constitute any limitation on the present application.

[0021] Figure 1 This is an exploded three-dimensional structural diagram of a dynamic plantar pressure-electrical impedance dual-mode detection insole according to this application.

[0022] Figure 2 This is an exploded view of the structure of a dynamic plantar pressure-electrical impedance dual-mode detection insole from another perspective, according to this application.

[0023] Figure 3 This is a three-dimensional structural schematic diagram of a dynamic plantar pressure-electrical impedance dual-mode detection insole according to this application.

[0024] Figure 4 This is a structural design drawing of the impedance sensing component, vibration isolation-insulation layer, and pressure sensor component of this application.

[0025] Figure 5 This is a structural design diagram of the impedance sensing component, vibration isolation-insulation layer, and pressure sensor component of this application from another perspective. Figure 6 This is a top view of the impedance sensing component of this application.

[0026] Figure 7 This is a bottom view of the pressure sensor assembly of this application.

[0027] The annotations in the attached figures are explained as follows: The impedance sensing component 100, the microneedle electrode 101, the first impedance sensor array 110, the second impedance sensor array 120, and the third impedance sensor array 130; Vibration isolation - insulation layer 200; Pressure sensor assembly 300, first pressure sensor array 310, second pressure sensor array 320, third pressure sensor array 330;

[0028] Insole middle layer 400; Insole body 500; Signal processing and wireless transmission module 600. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] <Example 1: A Dynamic Plantar Pressure-Electrical Impedance Dual-Mode Detection Insole> Combined with appendix Figure 1-7 As shown, a dynamic plantar pressure-electrical impedance dual-mode detection insole includes, from top to bottom: (1) An impedance sensing component 100, comprising a plurality of microneedle electrodes 101; the microneedle electrodes 101 are silver chloride (Ag / AgCl) electrodes with a diameter of 0.5-1 mm and a height of 0.2-0.4 mm. The local impedance Z is measured using a four-electrode method with 50 kHz AC excitation and a resolution of 0.1 Ω.

[0031] The impedance sensing component 100 includes a first impedance sensor array 110, a second impedance sensor array 120, and a third impedance sensor array 130, which correspond to the detection of the metatarsal region, the arch region, and the calcaneal region.

[0032] The first impedance sensor array 110 uses a 2×4 matrix array, the second impedance sensor array 220 uses a 4×4 matrix array, and the third impedance sensor array 130 uses a 2×4 matrix array.

[0033] (2) Vibration isolation-insulation layer 200, which serves as the carrier for the impedance sensing component 100 and the pressure sensor component 300. The vibration isolation-insulation layer 200 is made of a 0.1 mm thick rigid PI film. The vibration isolation-insulation layer 200 is positioned between the piezoresistive layer and the electrode layer to prevent impact crosstalk and ensure electrical insulation.

[0034] (3) Pressure sensor assembly 300, which includes: a first pressure sensor array 310, a second pressure sensor array 320 and a third pressure sensor array 330, which correspond to the detection of plantar pressure in the metatarsal region, arch region and calcaneal region.

[0035] The first pressure sensor array 310 uses a 2×4 matrix array, the second pressure sensor array 320 uses a 4×4 matrix array, and the third pressure sensor array 330 uses a 2×4 matrix array.

[0036] The pressure sensor uses a flexible piezoresistive thin film unit, and the spacing between adjacent pressure sensors in the first to third pressure sensor arrays is 2.5 mm.

[0037] The flexible piezoresistive thin film unit has a range of 0-250N and a thickness of 0.2mm.

[0038] The pressure sensor of the pressure sensor assembly 300 corresponds to the microneedle electrode 101 of the impedance sensing assembly 100. That is, the microneedle electrode is placed above the flexible piezoresistive film unit and can directly contact the foot.

[0039] (4) The middle layer 400 of the insole serves as the base of the pressure sensing component, preventing the pressure sensor component 300 from directly contacting the hollow part of the insole body 500.

[0040] (5) The insole body is 500, which is made of 3 layers of 0.8mm thick super elastic EVA-R foam layer by hot pressing. Hollow mesh is provided in the heel and forefoot areas to reduce weight.

[0041] A dynamic plantar pressure-impedance dual-mode detection insole further includes a signal processing and wireless transmission module 600, which simultaneously collects pressure and impedance signals and outputs the signals wirelessly.

[0042] The signal processing and wireless transmission module includes: (1) A 4mm thick micro PCB (which can be placed inside the insole body), the PCB board is connected to each sensor of the impedance sensing component 100 and the pressure sensor component 300 through flexible connecting wires, and its signals are connected to the PCB board. (2) The ultra-low power MCU (nRF52840) integrated on the micro PCB board is synchronously sampled at 1 kHz and transmits the signal to the computer in real time via the BLE 5.0 protocol to analyze the sensor signal; (3) The replaceable 3.7 V 150 mAh lithium polymer battery installed on the PCB board has a battery life of ≥6 hours.

[0043] The above-described embodiments are preferred embodiments of the present utility model and are only used to facilitate the illustration of the present utility model. They are not intended to limit the present utility model in any way. Any person skilled in the art who makes partial modifications or alterations to the technical content disclosed in the present utility model without departing from the scope of the technical features of the present utility model shall still fall within the scope of the technical features of the present utility model.

Claims

1. A dynamic plantar pressure-electrical impedance dual-mode detection insole, characterized in that, From top to bottom, the following components are connected: impedance sensing assembly, shock-absorbing and insulating layer, pressure sensor assembly, insole middle layer, and insole body; The impedance sensing component and the pressure sensor component are respectively embedded in the upper and lower surfaces of the vibration isolation-insulation layer; The impedance sensing component includes: a first to a third impedance sensor array, which correspond to the detection of the metatarsal region, the arch region, and the calcaneal region; The pressure sensor assembly includes: a first to a third pressure sensor array, which correspond to the detection of plantar pressure in the metatarsal region, arch region, and calcaneal region.

2. The dynamic plantar pressure-electrical impedance dual-mode detection insole according to claim 1, characterized in that, The vibration isolation-insulation layer is made of a 0.1 mm thick rigid PI film.

3. The dynamic plantar pressure-electrical impedance dual-mode detection insole according to claim 1, characterized in that, The impedance sensing component includes multiple microneedle electrodes, which are silver chloride electrodes with a diameter of 0.5-1 mm and a height of 0.2-0.4 mm.

4. The dynamic plantar pressure-electrical impedance dual-mode detection insole according to claim 1, characterized in that, The first impedance sensor array uses a 2×4 matrix array, the second impedance sensor array uses a 4×4 matrix array, and the third impedance sensor array uses a 2×4 matrix array.

5. The dynamic plantar pressure-electrical impedance dual-mode detection insole according to claim 1, characterized in that, The first pressure sensor array uses a 2×4 matrix array, the second pressure sensor array uses a 4×4 matrix array, and the third pressure sensor array uses a 2×4 matrix array.

6. The dynamic plantar pressure-electrical impedance dual-mode detection insole according to claim 3, characterized in that, The microneedle electrodes of the impedance sensing component correspond one-to-one with the positions of the pressure sensors in the pressure sensor component.

7. The dynamic plantar pressure-electrical impedance dual-mode detection insole according to claim 1, characterized in that, The pressure sensor uses a flexible piezoresistive thin film unit, and the spacing between adjacent pressure sensors in the first to third pressure sensor arrays is 2.5 mm.

8. The dynamic plantar pressure-electrical impedance dual-mode detection insole according to claim 1, characterized in that, The insole body is made of 3 layers of 0.8mm thick super elastic EVA-R foam layer by hot pressing, and has hollowed-out mesh in the heel and forefoot areas.

9. A dynamic plantar pressure-electrical impedance dual-mode detection insole according to claim 1, characterized in that, The middle layer of the insole is bonded to the main body of the insole using Velcro.

10. A dynamic plantar pressure-electrical impedance dual-mode detection insole according to claim 1, characterized in that, Also includes: The signal processing and wireless transmission module is used to acquire pressure and impedance signals and output the signals wirelessly. The processing and wireless transmission module includes: a micro PCB board, an MCU, and a battery; The micro PCB board is connected to the various sensors of the impedance sensing component and the pressure sensor component via flexible connecting wires. The micro PCB integrates an MCU, which is used to transmit pressure and impedance signals to the computer.

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