Array structure, device and functional device for electrochemical or chemical reaction

Abstract

The application relates to the technical field of array structures, and discloses an array structure, a device and a functional device for electrochemical reaction or chemical reaction. The array structure comprises a plurality of array units arranged in a staggered manner, the width W of the array units is 1-50 microns, the height H of the array units is 1-50 microns, and the gap J between adjacent array units is 10-100 microns. The application can improve the thickness uniformity of a workpiece coating and simultaneously consider high-efficiency production.

Description

Technical Field

[0001] This application relates to the technical field of array structures, and more particularly to an array structure, device, and functional device for electrochemical or chemical reactions. Background Technology

[0002] In industrial production, batches of workpieces can be arranged in a specific array structure on a fixture for electrochemical or chemical reactions, thereby achieving large-scale and high-efficiency production. However, due to edge effects, the coating thickness of workpieces at different positions in the array structure is prone to be uneven, limiting the improvement of the quality of the coated workpieces. Utility Model Content

[0003] In order to improve the uniformity of the coating thickness of the workpiece while ensuring high-efficiency production, this application discloses an array structure, device and functional device for electrochemical or chemical reactions.

[0004] In a first aspect, embodiments of this application provide an array structure for use in electrochemical or chemical reactions. The array structure includes a plurality of array units arranged in a staggered manner. The width W of each array unit is 1 μm to 50 μm, the height H is 1 μm to 50 μm, and the gap J between adjacent array units is 10 μm to 100 μm.

[0005] As an optional implementation, in the embodiments of this application, the width W of the array unit is 12μm to 25μm, the height H of the array unit is 10μm to 30μm, and the gap J between adjacent array units is 40μm to 100μm.

[0006] As an optional implementation, in the embodiments of this application, 0.5 <W / H<0.75。

[0007] As an optional implementation, in the embodiments of this application, 2 <J / W<3。

[0008] As an optional implementation, in the embodiments of this application, the misalignment spacing of the array cells between adjacent rows is D, where D is equal to 0.5 × (W + J).

[0009] As an optional implementation, in the embodiments of this application, the shape of the array unit is a regular geometric shape, including any one of rectangle, hemisphere or cylinder.

[0010] Secondly, embodiments of this application provide an apparatus for electrochemical or chemical reactions, wherein the apparatus for solvent chemical reactions includes the array structure described in the first aspect.

[0011] As an optional implementation, the apparatus includes any one of an electroplating tank, an electroless plating tank, an electrodialysis tank, or a dialysis tank.

[0012] As an optional implementation, the device further includes a hanger on which the array structure is disposed.

[0013] Thirdly, embodiments of this application provide a functional device.

[0014] A functional device having an array structure as mentioned in the first aspect; the functional device includes any one of a metal battery, a microelectronic component, a sensor, a supercapacitor, a solar cell device, a synthesis catalyst, a metal thin film, or a one-dimensional array current collector.

[0015] Compared with the prior art, the beneficial effects of this application are as follows:

[0016] This application provides an array structure for electrochemical or chemical reactions. By limiting the gaps, widths, and heights of the staggered array units within a specific range, it not only improves space utilization but also enhances the uniformity of current density distribution. This reduces the edge effect of the plating layer on the staggered array units, effectively improving the uniformity of the deposited coating thickness distribution. When the gaps are too small, the ion flow channels become too narrow, causing ions to diffuse through complex paths, increasing flow resistance and resulting in large local current density differences, thus exacerbating coating thickness variations. Conversely, excessively large gaps not only reduce space utilization but also increase coating thickness variations. Limiting the width and height range avoids the impact of improper dimensions on current density distribution, thereby controlling deposition thickness variations, improving coating thickness uniformity, and ensuring workpiece quality. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 a is a schematic diagram of an electrolytic cell for electroplating copper in an electrolyte solution. Figure 1 b is a schematic diagram showing the thickness distribution of copper plating on the workpiece in the electrolyte (the color bars from top to bottom indicate decreasing thickness);

[0019] Figure 2 This is a schematic diagram of an array structure in which the array elements are arranged in a rectangular pattern.

[0020] Figure 3It is a vector diagram of the electrolyte current density of a rectangular array structure (the color bars from top to bottom indicate decreasing current density);

[0021] Figure 4 This is a schematic diagram of an array structure in which the array elements are arranged in a staggered manner.

[0022] Figure 5 It is a vector diagram of the electrolyte current density of an array structure with staggered arrangement (the color bars from top to bottom indicate decreasing current density);

[0023] Figure 6 This is a deposition thickness distribution diagram used in this application to illustrate the array cells (the color bars from top to bottom indicate decreasing thickness);

[0024] Figure 7 This is a comparison diagram of the deposition thickness variation with column width W in the array structure of Embodiment 1 and Comparative Example 1 of this application;

[0025] Figure 8 This is a comparison diagram of the deposition thickness variation with column height H in the array structures of Embodiment 1 and Comparative Example 1 of this application;

[0026] Figure 9 This is a comparison diagram showing the deposition thickness variation with spacing J in the array structures of Embodiment 1 and Comparative Example 1 of this application.

[0027] Reference numerals: 1. Array unit. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0030] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0031] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0032] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0033] When plating a workpiece surface, the current distribution in the electrolyte is prone to localized imbalances due to the complexity of the workpiece structure or differences in its mounting position on the fixture. For example, in Figure 1 As shown in Figure a, when electroplating metals with copper in a copper sulfate bath, the surface of the plated workpiece is prone to a noticeable edge effect. Specifically, for example... Figure 1 As shown in b, compared with the top center area and the bottom of the workpiece, the coating thickness in the top edge area of ​​the workpiece is significantly thicker, resulting in poor overall thickness uniformity of the workpiece.

[0034] To address the issue of uneven thickness distribution that easily occurs during coating deposition, this application conducts an in-depth investigation into coating deposition. The study reveals that a key reason for the edge effect lies in the difference in electric field line distribution—the current density in the edge region is significantly higher than in the central region due to the shorter conductive path, resulting in a decrease in coating thickness from the edge to the center. This finding indicates a direct correlation between the spatial distribution of current density and the arrangement of array elements. Figure 2 When the rectangular array is arranged as shown, the ion flow selection direction ( Figure 2 (Arrows indicate direction) are relatively simple, and through Figure 3 As shown in the current density vector diagram, the current density distribution is relatively uniform, which gives the rectangular arrangement better coating uniformity. However, due to the ineffective utilization of gaps, the space filling density of array unit 1 is low.

[0035] Misaligned arrangement refers to an arrangement method in which the array cells 1 in adjacent rows or columns are periodically offset according to a specific pattern (such as a horizontal offset of approximately half the width of an array cell per row). Its core characteristic lies in the regular and orderly offset (rather than random misalignment). Figure 2 and Figure 4 The comparison shows that, given the same surface area of ​​the container (such as a hanger) used to place the array units 1, the staggered arrangement has a higher space filling density, containing more array units 1 than the rectangular arrangement, thus effectively increasing the number of workpieces processed. However, the staggered arrangement has a lower proportion of gap areas not occupied by array units 1, forming narrower ion diffusion channels, and allowing for more directional selection of the ion flow. Figure 4 (The arrow indicates the direction). However, this also forces the ion flow to diffuse in a circuitous manner within a complex path, which not only prolongs the ion migration path but also increases local flow resistance, thereby exacerbating local current density differences and inhibiting the rapid and uniform distribution of the ion flow. For example... Figure 5 The current density vector diagram shows that although the staggered array structure has the advantage of processing a higher number of workpieces, the current density distribution is less uniform, the workpiece surface exhibits a more significant edge effect, and the coating uniformity is worse.

[0036] Furthermore, during electrodeposition, current flows from the anode surface to the cathode in the electrolyte. Taking a cylindrical array unit 1 as an example, for each individual array unit 1, the current density is highest at the top surface of the column closest to the anode surface and lowest at the boundary furthest from the anode surface. Since the current density is proportional to the plating thickness, the thickness distribution and current distribution are consistent, with the minimum deposition thickness occurring at the bottom surface of the column and the maximum deposition thickness occurring at the top surface. Therefore, increasing the column width and height of the array unit 1 is detrimental to the uniformity of the overall plating thickness distribution.

[0037] In order to improve the uniformity of the thickness distribution of array unit 1 and achieve a better uniform distribution of deposition thickness, this application provides an array structure, device and functional device for electrochemical reaction or chemical reaction.

[0038] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0039] In a first aspect, embodiments of this application provide an array structure for use in electrochemical or chemical reactions.

[0040] Reference Figure 4 The array structure includes several array units 1 arranged in a staggered manner. The width W of the array unit 1 is 1μm to 50μm, the height H is 1μm to 50μm, and the gap J between adjacent array units is 10μm to 100μm.

[0041] This application finds that by limiting the gaps, widths, and heights of the staggered array units 1 within a specific range, not only can the space utilization be improved, but the uniformity of the current density distribution can also be improved, thereby reducing the coating edge effect of the staggered array units 1 and effectively improving the uniformity of the deposited coating thickness distribution.

[0042] When the gap is too small, the ion flow channel becomes too narrow, causing ions to diffuse through complex paths, increasing flow resistance and resulting in large local current density differences, which in turn exacerbates coating thickness variations. Conversely, if the gap is too large, it not only reduces space utilization but also increases coating thickness variations. Limiting the width and height range can prevent improper dimensions from affecting the current density distribution, thereby controlling deposition thickness variations, improving coating thickness uniformity, and ensuring workpiece quality.

[0043] It is evident that if the values ​​W, H, and J defined for the misaligned arrangement are too large or too small, the difference in deposition thickness on the surface of array unit 1 will be continuously increased, resulting in a significant thickness difference in the coating and reducing the coating quality on the workpiece surface. For example, the width W of array unit 1 can be 1μm, 5μm, 10μm, 12μm, 16μm, 19μm, 23μm, or 30μm, etc.; the height H of array unit 1 can be 1μm, 5μm, 10μm, 16μm, 18μm, 21μm, 27μm, 34μm, 38μm, or 40μm; and the spacing between adjacent array units 1 can be 10μm, 20μm, 30μm, 36μm, 47μm, 59μm, 72μm, 83μm, 95μm, or 100μm, etc.

[0044] The aforementioned array structure can be used in workpiece coatings involving electrochemical reactions, such as electroplating and electrodialysis, where the workpiece to be coated is arranged according to the array unit 1 in this application. In addition, this application is also applicable to other solvent-based chemical reaction depositions, including but not limited to any one of electroless plating or dialysis.

[0045] It should be noted that the width W refers to the horizontal width of array cell 1 (i.e., ...). Figure 4 , Figure 6 The dimension (in the X direction shown) refers to the lateral extension length of the array unit 1 itself, such as the diameter of the cylindrical array unit 1 or the side length of the square array unit 1. The height H refers to the vertical dimension of the array unit 1 (i.e., the dimension in the X direction). Figure 6 The dimension (in the Z direction shown) refers to the vertical extension height of array cell 1 from bottom to top. The gap J refers to the minimum horizontal or vertical spacing between adjacent array cells 1 (e.g., ...). Figure 4 As shown in the figure, this is the minimum spacing between the outer edges of adjacent array cells 1.

[0046] In some embodiments, the width W of the array unit 1 is 12 μm to 25 μm, the height H of the array unit 1 is 10 μm to 30 μm, and the gap J between adjacent array units 1 is 40 μm to 100 μm.

[0047] By further controlling the width, height, and gap of the array unit 1 within the above ranges, it is possible to optimize the space utilization while better reducing the edge effect of the coating. The thickness distribution uniformity of the coating on the workpiece surface is better, thereby improving the coating quality of the workpiece surface. This can better meet the application scenarios with high coating precision and expand the application potential of this array structure in the high-end manufacturing field, such as the manufacturing of precision electronic components with extremely high requirements for coating uniformity.

[0048] In some embodiments, 0.5 < W / H < 0.75.

[0049] By limiting the ratio of the width to the height of the array unit 1 to 0.5 < W / H < 0.75, the size of a single array unit 1 is limited within a specific range, which is more conducive to improving the uniformity of the array unit 1 during the coating process. This helps to optimize the dispersion of the ion flow during electroplating and avoid uneven current density distribution caused by unreasonable size ratios of the array unit 1, thereby playing a positive role in improving the consistency of the coating thickness of the array unit 1 and achieving the best coating thickness distribution. Exemplarily, the value of W / H is 0.5, 0.56, 0.65, 0.71, or 0.75, etc.

[0050] In some embodiments, 2 < J / W < 3.

[0051] The ratio of the width to the spacing of the array unit 1 being 2 < J / W < 3 can optimize the distribution of the array unit 1. It enables the coating of the array unit 1 to achieve a lower electroplating thickness difference. At the same time, it helps to form a more uniform current density distribution during electroplating and improve the coating quality. When the array units 1 are too sparsely distributed, it not only reduces the density of the array units 1 but also reduces the non-uniformity of the electroplating thickness distribution and the coating quality. Exemplarily, the value of J / W is 2, 2.2, 2.5, or 3, etc.

[0052] In some embodiments, referring to Figure 4 , the misalignment spacing between adjacent rows or columns of the array units 1 is D, and D is equal to 0.5×(W + J).

[0053] In the array structure, the "misalignment spacing D" refers to the horizontal lateral offset of adjacent rows or columns of the array units 1. Specifically, as Figure 4 shown, when the array units 1 are arranged in a misaligned manner, the adjacent rows (or columns) of the array units 1 are not vertically aligned but are错开 by a certain distance in the row direction (horizontally), and this distance is D.

[0054] The array structure of this application, which is arranged in a staggered manner, satisfies the condition that the three nearest neighbor array elements form an isosceles triangle D. The size of D can be changed by controlling the two variables W and J.

[0055] The above arrangement staggers the array cells 1 of adjacent rows or columns by approximately half a cell width, making full use of space while avoiding a surge in local resistance due to the increased complexity of the ion flow path. This design reduces the thickness variation of the coating, significantly improving the surface quality of the workpiece.

[0056] In some embodiments, the array unit 1 has a regular geometric shape, including any one of a rectangle, a hemisphere, or a cylinder.

[0057] By defining the shape of array unit 1, the array structure can achieve good electroplating results under array unit 1 with different shapes. This provides flexibility for selecting the appropriate shape of array unit 1 according to specific process requirements and device characteristics in practical applications, and helps to further optimize ion flow dispersion and current density distribution during the electroplating process, ensuring the consistency of coating thickness.

[0058] Secondly, embodiments of this application provide an apparatus for electrochemical or chemical reactions.

[0059] An apparatus for electrochemical or chemical reactions, comprising the array structure mentioned in the first aspect. This apparatus is a physical device specifically designed for electrochemical or chemical reactions (such as electrodeposition, electroless plating, electrodialysis, etc.). Exemplarily, the apparatus may be any one of an electroplating tank, an electroless plating tank, an electrodialysis tank, or a dialysis tank.

[0060] Furthermore, the device includes a hanger on which the array structure is mounted. For example, in the electroplating process, when multiple workpieces need to be electroplated simultaneously, especially complex or large metal objects, they are usually mounted on the hanger before being placed in the electroplating bath. When the array structure is fixed on the hanger, the hanger provides mechanical support, effectively reducing the installation dimensional errors of the array units. During use, arranging the array units 1 on the hanger according to specific dimensional requirements can improve space utilization while better reducing the impact of edge effects and improving the uniformity of the plating on the workpiece surface.

[0061] Thirdly, embodiments of this application provide a functional device.

[0062] A functional device having an array structure as mentioned in the first aspect, the functional device including any one of a metal battery, a microelectronic component, a sensor, a supercapacitor, a solar cell device, a synthesis catalyst, a metal thin film, or a one-dimensional array current collector.

[0063] In the fabrication of functional devices such as metal batteries, microelectronic components, sensors, supercapacitors, solar cell devices, synthetic catalysts, metal thin films, or one-dimensional array current collectors, when a coating is required, the staggered array unit arrangement described in this application can be used to increase the array unit filling density. Simultaneously, this allows the coating material to diffuse uniformly within the array gaps during electroplating or electroless plating, improving the uniformity of the coating thickness distribution. For example, the metal battery can be a lithium battery, and the sensor can be a biosensor.

[0064] The technical solution of this application will be further described below with reference to embodiments and comparative examples.

[0065] Example

[0066] An array structure includes several array elements arranged in a staggered manner, wherein the array elements are cylindrical.

[0067] Comparative Example

[0068] An array structure includes several array units arranged in a rectangular shape, wherein the array units are cylindrical.

[0069] The values ​​of column width W, column height H, and spacing J of the array units in the above embodiments and comparative examples are shown in Tables 1, 2, and 3.

[0070] experiment

[0071] Based on the array structure settings of the embodiments and comparative examples, simulation software was used to simulate and calculate the difference in electroplating deposition thickness of the array units under different conditions.

[0072] like Figure 5 As shown, in the deposition thickness distribution of the array cells, the thickness is highest at the top, which is closest to the anode surface (above), and lowest at the bottom boundary, which is farthest from the anode surface. Therefore, the deposition thickness difference is defined as the difference between the top deposition thickness and the bottom deposition thickness of the array cells.

[0073] The simulation software used in the test was COMSOL Multiphysics. The test conditions were as follows:

[0074] Test a: As shown in Table 1, under the condition that the column height H of the array unit is kept constant at 25 μm and the gap J between adjacent array units is kept constant at 25 μm, the deposition thickness difference of the embodiment and the deposition thickness difference of the comparative example are tested as the column width W varies.

[0075] Table 1

[0076]

[0077] Test b: As shown in Table 2, under the condition that the column width W of the array unit is 52um and the gap J between adjacent array units is 25um, the deposition thickness difference of the embodiment and the deposition thickness difference of the comparative example are tested as the column height H changes.

[0078] Table 2

[0079]

[0080]

[0081] Test c: As shown in Table 3, while keeping the column height H of the array unit constant at 25 μm and the column width W constant at 52 μm, the deposition thickness difference of the embodiment and the deposition thickness difference of the comparative example are tested as the gap J between adjacent array units varies.

[0082] Table 3

[0083]

[0084]

[0085] The test results for test a above are shown in [link to test results]. Figure 7 The test results for test b can be found in [link to test results]. Figure 8 The test results for test c are shown below. Figure 9 .

[0086] Reference Figure 7 , Figure 8 and Figure 9 Compared to rectangular arrangement, the width W of the staggered array unit is in the range of 10μm to 30μm, the height H is in the range of 10μm to 40μm, and the gap J between adjacent array units is in the range of 20μm to 100μm. The resulting array structure not only improves space utilization, but also minimizes the difference in deposition thickness of a single array unit, thereby effectively improving the uniformity of coating thickness.

[0087] The technical solutions disclosed in the embodiments of this application have been described in detail above. Specific examples have been used in this article to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core inventive points of the embodiments of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An array structure for use in electrochemical or chemical reactions, characterized in that, The array structure includes several array units arranged in a staggered manner. The width W of each array unit is 1μm to 50μm, the height H is 1μm to 50μm, and the gap J between adjacent array units is 10μm to 100μm.

2. The array structure according to claim 1, characterized in that, The width W of the array unit is 12μm to 25μm, the height H of the array unit is 10μm to 30μm, and the gap J between adjacent array units is 40μm to 100μm.

3. The array structure according to claim 1, characterized in that, 0.5 <W / H<0.75。 4. The array structure according to claim 1, characterized in that, 2 <J / W<3。 5. The array structure according to any one of claims 1-4, characterized in that, The misalignment spacing of the array cells between adjacent rows is D, where D is equal to 0.5 × (W + J).

6. The array structure according to any one of claims 1-4, characterized in that, The array unit has a regular geometric shape, including any one of rectangle, hemisphere or cylinder.

7. An apparatus for electrochemical or chemical reactions, characterized in that, Includes the array structure described in any one of claims 1-6.

8. The apparatus according to claim 7, characterized in that, The apparatus includes any one of an electroplating tank, an electroless plating tank, an electrodialysis tank, or a dialysis tank.

9. The apparatus according to claim 7 or 8, characterized in that, The device also includes a hanger, and the array structure is disposed on the hanger.

10. A functional device, characterized in that, The functional device has an array structure as described in any one of claims 1-6; the functional device includes any one of a metal battery, microelectronic components, sensors, supercapacitors, solar cell devices, synthesis catalysts, metal thin films, or one-dimensional array current collectors.

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