Automatic feeding device for semiconductor device production

Abstract

The utility model relates to the technical field of semiconductor device production, and disclose a kind of semiconductor device production automatic feeding device, including two side plates, and one of the outer surface of the side plate is fixedly installed motor, the outer surface of two transmission roller is around with transmission belt, the top outer surface of the connecting box is fixedly connected with negative pressure box, the inner surface of the connecting box is fixedly installed air pump, the top outer surface of the negative pressure box is equipped with a plurality of first through-hole.In the utility model, the suction force is generated in the air pump in suction pipe, thereby generating negative pressure in negative pressure box, semiconductor device is adsorbed, transmission roller is driven to rotate by motor, transmission roller drives transmission belt transmission, thereby conveying semiconductor device, and the quality of semiconductor device is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device manufacturing technology, specifically to an automatic feeding device for semiconductor device manufacturing. Background Technology

[0002] Semiconductor devices are electronic devices whose conductivity lies between that of a good conductor and an insulator. They utilize the special electrical properties of semiconductor materials to perform specific functions. They can be used to generate, control, receive, transform, and amplify signals and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium, or gallium arsenide. They can be used as rectifiers, oscillators, light emitters, amplifiers, photometers, and other equipment. When processing semiconductor devices, they need to be transported to processing equipment first, and then the processing work can be carried out on them.

[0003] An existing patent (publication number: CN113213192B) discloses an automatic feeding system for an automatic feeding machine used in semiconductor device processing. This invention relates to the field of semiconductor device processing feeding technology, and includes a feeding hopper. Both sides of the feeding hopper are provided with protruding plates, and a feeding component is disposed between the upper surfaces of the two protruding plates. An anti-blocking component is disposed at the middle position of one side of the feeding hopper. The device has a main bevel gear fixedly connected to the middle position of the upper surfaces of two transmission discs, and a corresponding driven bevel gear fixedly connected to one end of each disc. The driven bevel gears mesh with the main bevel gears. When feeding semiconductor devices, the device can perform quantitative feeding, ensuring a consistent amount of semiconductor devices entering the feeding hopper each time. The entire process requires no manual supervision, is highly automated, facilitates subsequent processing of the semiconductor devices, and improves work efficiency.

[0004] The aforementioned patented technology can quantitatively feed semiconductor devices, but in actual use, when all semiconductor devices are placed in the storage hopper, multiple semiconductor devices may collide with each other, causing scratches on the surface of the semiconductor devices and resulting in damage to the quality of the semiconductor devices. Therefore, an automatic feeding device for semiconductor device production is proposed. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides an automatic feeding device for semiconductor device manufacturing, thereby solving the problems mentioned in the background section.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an automatic feeding device for semiconductor device production, comprising two side plates, two transmission rollers rotatably connected between the two side plates, a motor fixedly mounted on the outer surface of one of the side plates, the output end of the motor fixedly connected to one of the transmission rollers, a transmission belt wound around the outer surfaces of the two transmission rollers, a plurality of fixed blocks fixedly connected at equal intervals on the outer surface of the transmission belt, a connecting plate fixedly connected to the top outer surface of the fixed blocks, a connecting box fixedly connected to the top outer surface of the connecting plate, a negative pressure box fixedly connected to the top outer surface of the connecting box, an air pump fixedly mounted on the inner surface of the connecting box, an air extraction pipe fixedly connected to the output end of the air pump, the air extraction pipe communicating with the interior of the negative pressure box, and a plurality of first through holes opened on the top outer surface of the negative pressure box.

[0007] Furthermore, a counting sensor is provided on the top outer surface of the side plate, and a mounting plate is fixedly connected to the top outer surface of both side plates at the tail end of the transmission belt. The counting sensor includes a transmitter and a receiver, which are respectively mounted on the opposite surfaces of the two mounting plates.

[0008] Furthermore, a silicone pad is fixedly connected to the top outer surface of the negative pressure box, and the outer surface of the silicone pad has several second through holes corresponding to the first through hole.

[0009] Furthermore, the diameter of the first through hole and the second through hole is 1-3 mm, and they are evenly distributed.

[0010] Furthermore, a support frame is provided on the bottom outer surface of the two side plates, and multiple support feet are provided on the bottom outer surface of the support frame.

[0011] Furthermore, the support frame includes multiple vertical plates and a support plate. The vertical plates are fixedly connected to the bottom outer surface of the side plate. The multiple vertical plates are fixed above the support plate. The length of the vertical plates is greater than the length between the silicone pad and the transmission surface.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This automatic feeding device for semiconductor device production uses an air pump to generate suction force in the suction pipe, which in turn creates negative pressure in the negative pressure box, adsorbing the semiconductor devices. The motor drives the transmission roller to rotate, and the transmission roller drives the transmission belt to transport the semiconductor devices. In conjunction with a counting sensor, the transported semiconductor devices are counted and quantitatively transported, and the device avoids scratching each other, thus ensuring the quality of the semiconductor devices. Attached Figure Description

[0014] Figure 1This is a front view structural diagram of the present invention;

[0015] Figure 2 This is a schematic diagram of the structure of this utility model from below;

[0016] Figure 3 This is a side sectional view of the present invention.

[0017] Figure 4 This is a schematic diagram of the internal structure of the connecting box of this utility model.

[0018] In the diagram: 1. Side plate; 2. Drive roller; 3. Motor; 4. Drive belt; 5. Fixing block; 6. Connecting plate; 7. Air pump; 8. Air extraction pipe; 9. Negative pressure box; 10. Silicone pad; 11. Second through hole; 12. Mounting plate; 13. Transmitter; 14. Connecting box; 15. Support frame. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1:

[0021] Please refer to the following: Figures 1-4This utility model provides a technical solution: an automatic feeding device for semiconductor device production, comprising two side plates 1, with two transmission rollers 2 rotatably connected between the two side plates 1. A motor 3 is fixedly mounted on the outer surface of one of the side plates 1, and the output end of the motor 3 is fixedly connected to one of the transmission rollers 2. A transmission belt 4 is wound around the outer surface of the two transmission rollers 2, and multiple fixing blocks 5 are fixedly connected at equal intervals on the outer surface of the transmission belt 4. A plate 6 is fixedly connected to the top outer surface of the fixing blocks 5, and a connecting box 14 is fixedly connected to the top outer surface of the connecting plate 6. A negative pressure box 9 is fixedly connected to the top outer surface of the connecting box 14, and an air pump 7 is fixedly mounted on the inner surface of the connecting box 14. An air extraction pipe 8 is fixedly connected to the output end of the air pump 7, and the air extraction pipe 8 is connected to the interior of the negative pressure box 9. Several first through holes are opened on the surface. Specifically, in the previous process, the semiconductor device is transported to the negative pressure box 9. The air pump 7 works at the air extraction pipe 8 to generate an adsorption force, thereby creating a negative pressure inside the negative pressure box 9. The semiconductor device is adsorbed by the negative pressure box 9. The motor 3 drives the transmission roller 2 to rotate. When the transmission roller 2 rotates, it drives the transmission belt 4 to transport the device. The transmission belt 4 transports the fixed block 5, thereby transporting the adsorbed semiconductor device in the negative pressure box 9. The semiconductor device is transported individually, so that the semiconductor devices will not scratch each other, thus ensuring the quality of the semiconductor device. When the device is transported to the bend of the transmission belt 4, the contact area between the fixed block 5 and the transmission belt 4 is small, so as not to affect the transport of the fixed block 5 at the bend of the transmission belt 4.

[0022] In this embodiment, a counting sensor is provided on the top outer surface of the side plate 1. Mounting plates 12 are fixedly connected to the top outer surfaces of both side plates 1 at the tail end of the transmission belt 4. The counting sensor includes a transmitter 13 and a receiver. The transmitter 13 and the receiver are respectively mounted on the opposite surfaces of the two mounting plates 12. Specifically, when the connecting box 14 is transported to the transmitter 13, the light beam emitted by the transmitter 13 is blocked by the connecting box 14, and the light signal of the receiver changes, thereby triggering the counting function. The counting sensor counts the semiconductor device, thereby counting and quantitatively feeding it.

[0023] In this embodiment, a silicone pad 10 is fixedly connected to the top outer surface of the negative pressure box 9. The outer surface of the silicone pad 10 is provided with a number of second through holes 11 corresponding to the first through hole. Specifically, the negative pressure adsorbs the semiconductor device through the first through hole and the second through hole 11, and the silicone pad 10 provides flexible contact to avoid hard contact that could scratch the surface of the semiconductor device.

[0024] In this embodiment, the diameter of the first through hole and the second through hole 11 is 1-3 mm and they are evenly distributed. Specifically, the above-mentioned technical method is adopted to ensure that the adsorption force can be evenly distributed and to avoid excessive local adsorption force that could cause deformation of the semiconductor device.

[0025] In this embodiment, a support frame 15 is provided on the bottom outer surface of the two side plates 1, and a plurality of support feet are provided on the bottom outer surface of the support frame 15. Specifically, the bottom of the two side plates 1 is supported by the support feet and the support frame 15.

[0026] In this embodiment, the support frame 15 includes multiple vertical plates and a support plate. The vertical plates are fixedly connected to the bottom outer surface of the side plate 1. The multiple vertical plates are fixed above the support plate. The length of the vertical plates is greater than the length between the silicone pad 10 and the transmission surface. Specifically, the distance between the vertical plates and the transmission belt 4 provides space for the transmission of the connecting box 14 at the bottom of the transmission belt 4.

[0027] The counting sensor is any type of photoelectric counting sensor, which uses the emission and reception of light to count objects. It is a mature existing technology, so it has not been described in detail in this application.

[0028] Working Principle: In use, the semiconductor device is transported to the negative pressure box 9 in the previous process. The air pump 7 generates an adsorption force at the suction pipe 8, thereby creating a negative pressure inside the negative pressure box 9. The semiconductor device is adsorbed by the negative pressure box 9. The motor 3 drives the transmission roller 2 to rotate, and the transmission roller 2 drives the transmission belt 4 to transport the device. The transmission belt 4 transports the device to the fixed block 5, thus transporting the adsorbed semiconductor device. When the connecting box 14 is transported to the transmitter 13, it blocks the light beam emitted by the transmitter 13. The light signal of the receiver changes, thereby triggering the counting function. The counting sensor counts the semiconductor devices, thus counting and quantitatively feeding them. The semiconductor devices will not scratch each other, ensuring the quality of the semiconductor devices.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic feeding device for semiconductor device manufacturing, comprising two side plates (1), characterized in that: Two drive rollers (2) are rotatably connected between the two side plates (1). A motor (3) is fixedly installed on the outer surface of one of the side plates (1). The output end of the motor (3) is fixedly connected to one of the drive rollers (2). A drive belt (4) is wound around the outer surface of the two drive rollers (2). Multiple fixing blocks (5) are fixedly connected at equal intervals on the outer surface of the drive belt (4). A connecting plate (6) is fixedly connected to the top outer surface of the fixing block (5). A connecting box (14) is fixedly connected to the top outer surface of the connecting plate (6). A negative pressure box (9) is fixedly connected to the top outer surface of the connecting box (14). An air pump (7) is fixedly installed on the inner surface of the connecting box (14). An air extraction pipe (8) is fixedly connected to the output end of the air pump (7). The air extraction pipe (8) is connected to the interior of the negative pressure box (9). Several first through holes are opened on the top outer surface of the negative pressure box (9).

2. The automatic feeding device for semiconductor device production according to claim 1, characterized in that: A counting sensor is provided on the top outer surface of the side plate (1). The top outer surfaces of the two side plates (1) are fixedly connected to the mounting plate (12) at the tail end of the transmission belt (4). The counting sensor includes a transmitter (13) and a receiver. The transmitter (13) and the receiver are respectively mounted on the opposite surfaces of the two mounting plates (12).

3. The automatic feeding device for semiconductor device production according to claim 1, characterized in that: A silicone pad (10) is fixedly connected to the top outer surface of the negative pressure box (9), and a plurality of second through holes (11) corresponding to the first through hole are opened on the outer surface of the silicone pad (10).

4. The automatic feeding device for semiconductor device production according to claim 3, characterized in that: The diameter of the first through hole and the second through hole (11) is 1-3 mm, and they are evenly distributed.

5. The automatic feeding device for semiconductor device production according to claim 1, characterized in that: The bottom outer surfaces of the two side plates (1) are provided with support frames (15), and the bottom outer surfaces of the support frames (15) are provided with multiple support feet.

6. The automatic feeding device for semiconductor device production according to claim 5, characterized in that: The support frame (15) includes multiple vertical plates and a support plate. The vertical plates are fixedly connected to the bottom outer surface of the side plate (1). The multiple vertical plates are fixed above the support plate. The length of the vertical plates is greater than the length between the silicone pad (10) and the transmission surface.

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