Capacitance inductance type high frequency common mode inductor

Abstract

The utility model discloses a kind of capacitor inductance type high-frequency common mode inductance, it is related to high-frequency common mode inductance technical field, including common mode inductance shell and semiconductor refrigeration piece, the side portion of common mode inductance shell is equipped with mounting hole, slidingly threaded with the embedded ring in mounting hole, semiconductor refrigeration piece is fixedly arranged in embedded ring, the outer wall of embedded ring is fixedly equipped with locating ring, locating ring is contacted with the outer wall of common mode inductance shell, and threaded with connecting bolt, the outer wall of common mode inductance shell is equipped with the thread groove that connecting bolt is threaded, the cold end of semiconductor refrigeration piece is located in the inside of common mode inductance shell, and the outer wall lower end of semiconductor refrigeration piece is connected with electric conducting wire.The utility model can cool the inductance internal component when common mode inductance is used, reduce the generation of electric cylinder internal heat, guarantee the connection stability between inductance shell and base, to guarantee that the filtering effect of inductance is not affected.

Description

Technical Field

[0001] This utility model relates to the field of high-frequency common-mode inductor technology, specifically to a capacitive-inductive high-frequency common-mode inductor. Background Technology

[0002] A common-mode inductor, also known as a common-mode choke, consists of two independent windings with the same number of turns and phase but opposite winding directions, wound on the same high-permeability magnetic core. It is an electronic component used to suppress high-frequency common-mode noise. For example, patent document CN223078964U discloses a high-frequency common-differential-mode inductor. The magnetic cover of this high-frequency common-differential-mode inductor has a mounting space. The first coil and the second coil are stacked sequentially in the mounting space. The magnetic base includes a bottom and a side connected to the bottom. The bottom is covered with a magnetic cover, and the side is connected to the side of the magnetic cover by an adhesive. By fixing the adhesive to the side and the side of the magnetic cover, the magnetic cover and the bottom are tightly fitted without air gaps. The inductance of the common-differential-mode inductor is increased, the impedance increases, the magnetic field leakage is reduced, the anti-interference ability is enhanced, and the filtering effect is improved.

[0003] During the connection process between the housing and the base of the common mode inductor, the bonding strength of the adhesive will gradually decrease due to high temperature, resulting in gaps in the bonding part between the housing and the base and affecting the internal filtering effect. Summary of the Invention

[0004] In view of the problems existing in the current capacitive-inductive high-frequency common-mode inductors, this utility model is proposed.

[0005] Therefore, the purpose of this utility model is to provide a capacitive-inductive high-frequency common-mode inductor, which solves the problem that the bonding ability of the adhesive will gradually decrease due to high temperature during the connection process between the shell and the base of the common-mode inductor.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A capacitive-inductive high-frequency common-mode inductor includes a common-mode inductor housing and a semiconductor cooling chip. A mounting hole is provided on the side of the common-mode inductor housing. An insert ring slides through the mounting hole. The semiconductor cooling chip is fixedly disposed within the insert ring. A positioning ring is fixedly disposed on the outer wall of the insert ring. The positioning ring contacts the outer wall of the common-mode inductor housing and is threaded with a connecting bolt. A threaded groove is provided on the outer wall of the common-mode inductor housing to accommodate the connecting bolt. The cold end of the thermoelectric cooler is located inside the common mode inductor housing, and a current-carrying wire is connected to the lower end of the outer wall of the thermoelectric cooler.

[0007] Preferably, the outer wall of the common mode inductor housing is provided with an annular groove, the annular groove is connected to the mounting hole, and a sealing ring is embedded in the annular groove, the sealing ring abutting against the positioning ring.

[0008] Preferably, the cold end of the semiconductor cooling chip is provided with a heat-conducting plate, and multiple spaced heat sinks are fixed on both sides of the heat-conducting plate.

[0009] Preferably, both the heat-conducting plate and the heat sink are made of heat-conducting aluminum plate.

[0010] Furthermore, the cold end of the semiconductor cooling chip is coated with thermal grease, and the thermal grease is bonded to the heat-conducting plate.

[0011] Preferably, the heat-conducting plate is bonded to the sidewall of the semiconductor cooling chip with an auxiliary adhesive tape.

[0012] The technical effects and advantages provided by this utility model in the above technical solution are as follows: 1. This utility model, through the common mode inductor housing, mounting ring, embedding ring, semiconductor cooling chip, connecting bolts and threaded groove, can cool the internal components of the inductor during use, reduce the generation of heat inside the inductor cylinder, and ensure the connection stability between the inductor housing and the base, thereby ensuring that the filtering effect of the inductor is not affected.

[0013] 2. This utility model, through the provision of thermally conductive silicone grease, thermally conductive plate and heat dissipation plate, can fully deliver the cooling energy generated by the semiconductor cooling chip to the inside of the inductor, so as to stabilize the cooling effect inside the inductor. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a partial cross-sectional view of the common mode inductor housing of this utility model; Figure 3 For the present utility model Figure 2 Enlarged schematic diagram of part A.

[0016] Explanation of reference numerals in the attached figures: 1. Common mode inductor housing; 2. Semiconductor cooling chip; 3. Embedded ring; 4. Positioning ring; 5. Connecting bolt; 6. Threaded groove; 7. Power-carrying wire; 8. Annular groove; 9. Sealing ring; 10. Heat-conducting plate; 11. Heat sink; 12. Thermal grease; 13. Auxiliary adhesive tape. Detailed Implementation

[0017] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0018] This utility model discloses a capacitive-inductive high-frequency common-mode inductor.

[0019] This utility model provides, for example Figure 1-3 The above describes a capacitor-inductor type high-frequency common-mode inductor, including a common-mode inductor housing 1 and a semiconductor cooling chip 2. The common-mode inductor housing 1 has a mounting hole on its side, and an embedded ring 3 slides through the mounting hole. The semiconductor cooling chip 2 is fixedly disposed in the embedded ring 3. A positioning ring 4 is fixedly disposed on the outer wall of the embedded ring 3. An annular groove 8 is formed on the outer wall of the common-mode inductor housing 1. The annular groove 8 is connected to the mounting hole. A sealing ring 9 is embedded in the annular groove 8. The sealing ring 9 abuts against the positioning ring 4. The positioning ring 4 contacts the outer wall of the common-mode inductor housing 1 and is threaded with a connecting bolt 5. A threaded groove 6 is formed on the outer wall of the common-mode inductor housing 1 to accommodate the connecting bolt 5. The cold end of the semiconductor refrigeration chip 2 is located inside the common mode inductor housing 1, and a power-conducting wire 7 is connected to the lower end of the outer wall of the semiconductor refrigeration chip 2.

[0020] In order to fully transfer the cooling energy generated by the thermoelectric cooler to the inside of the inductor and ensure stable cooling within the inductor, such as... Figure 2-3 As shown, the cold end of the thermoelectric cooler 2 is provided with a heat-conducting plate 10, and the cold end of the thermoelectric cooler 2 is coated with thermal grease 12. The thermal grease 12 is bonded to the heat-conducting plate 10. Multiple heat sinks 11 are fixedly arranged at intervals on both sides of the heat-conducting plate 10. Both the heat-conducting plate 10 and the heat sinks 11 are made of thermally conductive aluminum plates. An auxiliary adhesive tape 13 is bonded to the side wall of the thermoelectric cooler 2.

[0021] Working principle: When this capacitor-inductor type high-frequency common mode inductor is working, the positioning ring 4 is first fixed to the common mode inductor housing 1 by the connecting bolt 5. At this time, the embedded ring 3 is firmly installed in the mounting hole, and the sealing ring 9 is pressed by the positioning ring 4 to ensure the sealing of the common mode inductor housing 1. Then, the semiconductor cooling chip 2 is energized by the power-conducting wire 7. The cold end of the semiconductor cooling chip 2 generates cooling. Since the cold end is located inside the common mode inductor housing 1 and is coated with thermal grease 12 and bonded to the heat-conducting plate 10, the cooling is quickly transferred to multiple spaced heat sinks 11 through the heat-conducting plate 10 under the reinforcement of the auxiliary adhesive tape 13. The heat sinks 11 are made of thermally conductive aluminum plate, which can evenly diffuse the cooling to the inside of the common mode inductor housing 1 to cool the internal components of the inductor and reduce the internal heat generation. In this way, the performance of the adhesive connecting the common mode inductor housing 1 and the base can be prevented from deteriorating due to high temperature, ensuring connection stability and thus ensuring that the filtering effect of the inductor is not affected. At the same time, the heat generated by the operation of the semiconductor cooling chip 2 is dissipated from its hot end to the outside of the common mode inductor housing 1, without affecting the internal cooling effect.

[0022] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A capacitive-inductive high-frequency common-mode inductor, comprising a common-mode inductor housing (1) and a semiconductor cooling chip (2), characterized in that, The common mode inductor housing (1) has a mounting hole on its side. An insert ring (3) slides through the mounting hole. The semiconductor cooling chip (2) is fixedly installed in the insert ring (3). A positioning ring (4) is fixedly installed on the outer wall of the insert ring (3). The positioning ring (4) contacts the outer wall of the common mode inductor housing (1) and is threaded with a connecting bolt (5). The outer wall of the common mode inductor housing (1) has a threaded groove (6) that matches the connecting bolt (5). The cold end of the semiconductor cooling chip (2) is located inside the common mode inductor housing (1), and a power-conducting wire (7) is connected to the lower end of the outer wall of the semiconductor cooling chip (2).

2. The capacitive-inductive high-frequency common-mode inductor according to claim 1, characterized in that, The outer wall of the common mode inductor housing (1) is provided with an annular groove (8), which is connected to the mounting hole. A sealing ring (9) is embedded in the annular groove (8), and the sealing ring (9) abuts against the positioning ring (4).

3. The capacitive-inductive high-frequency common-mode inductor according to claim 1, characterized in that, The cold end of the semiconductor cooling chip (2) is provided with a heat-conducting plate (10), and multiple heat sinks (11) are fixedly arranged at intervals on both sides of the heat-conducting plate (10).

4. The capacitive-inductive high-frequency common-mode inductor according to claim 3, characterized in that, Both the heat-conducting plate (10) and the heat sink (11) are made of heat-conducting aluminum plate.

5. The capacitive-inductive high-frequency common-mode inductor according to claim 1, characterized in that, The cold end of the semiconductor cooling chip (2) is coated with thermal grease (12), and the thermal grease (12) is bonded to the heat-conducting plate (10).

6. The capacitive-inductive high-frequency common-mode inductor according to claim 3, characterized in that, The heat-conducting plate (10) is bonded to the side wall of the semiconductor cooling chip (2) with an auxiliary adhesive tape (13).

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