Miniaturized 3db bridge

Abstract

The application discloses a miniaturized 3dB bridge, which comprises a first PCB board, a prepreg and a second PCB board which are sequentially stacked from top to bottom, the front surface of the first PCB board and the front surface of the second PCB board are both provided with a folding structure, the folding structure on the first PCB board is mirror-imaged with the folding structure on the second PCB board, the folding structure comprises a folding transmission line and a plurality of metallized vias which are uniformly arranged around the folding transmission line. The circuit miniaturization characteristic is realized by using the multi-layer board and the folding setting of the transmission line; the heat dissipation effect of the circuit is improved, and the power resistance effect of the circuit is improved by the setting of the metallized vias which penetrate through all the layers of the circuit; the coupling effect of the adjacent parts of the same transmission line after folding is improved, and the sensitivity of the circuit is improved by the setting of the metallized vias which penetrate through all the layers of the circuit; the circuit structure is simple, the product consistency is good, and the mass production can be met.

Description

Technical Field

[0001] This application relates to the technical field of couplers, especially a miniaturized 3dB bridge. Background Art

[0002] As a general radio frequency and microwave passive component, the directional coupler plays an important role in fields such as radar, communication, navigation, electronic countermeasure, and EMC testing. With the development of 5G communication, the spectrum utilization rate has been greatly improved, which also puts forward higher requirements for passive components. In addition to meeting the conventional indicators, it also needs to meet design indicators such as miniaturization, high power, low loss, and easy integration. Currently, in traditional designs, the bridge couplers based on air strip lines and waveguide structures have good performance but are often large in size and cannot meet the actual application requirements. Subsequently, the coupler design based on microstrip line technology further reduces the size of the device and expands the applicable scenarios of the coupler. However, the radiation loss of the microstrip line structure directional coupler is large and its performance is easily affected by the external electromagnetic environment. Content of the Utility Model

[0003] The purpose of the present utility model is to provide a miniaturized 3dB bridge to overcome the deficiencies in the prior art.

[0004] To achieve the above purpose, the present utility model provides the following technical solutions:

[0005] The embodiment of this application discloses a miniaturized 3dB bridge, which is characterized in that it includes a first PCB board, a prepreg, and a second PCB board stacked in sequence from top to bottom. The front sides of the first PCB board and the second PCB board are both provided with folding structures, and the folding structure on the first PCB board and the folding structure on the second PCB board are arranged in a mirror image. The folding mechanism includes a folded transmission line and several metallized vias, and the metallized vias are evenly arranged around the folded transmission line.

[0006] Preferably, in the above-mentioned miniaturized 3dB bridge, the folded transmission line includes a plurality of strip lines connected in sequence, the strip lines are in a "zigzag" shape, and adjacent strip lines are arranged in a mirror image.

[0007] Preferably, in the above-mentioned miniaturized 3dB bridge, there are two strip lines.

[0008] Preferably, in the above-mentioned miniaturized 3dB bridge, several of the metallized vias are arranged in multiple rows, and the multiple rows of metallized vias are sequentially arranged around the strip lines.

[0009] Compared with the prior art, the advantages of the present utility model are as follows:

[0010] The miniaturization characteristics of the circuit are achieved by using a multi-layer board and folding the transmission line; by setting the metallized vias that penetrate through each layer of the circuit, the heat dissipation effect of the circuit is improved, and the power resistance effect of the circuit is enhanced; by setting the metallized vias that penetrate through each layer of the circuit, the coupling effect between adjacent parts after folding the same transmission line is improved, and the sensitivity of the circuit is improved; the circuit structure is simple, and the product consistency is good, which can meet mass production. Brief Description of the Drawings

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only some embodiments recorded in the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0012] Figure 1 The figure shows a three-dimensional view of the miniaturized 3dB bridge in a specific embodiment of the present invention;

[0013] Figure 2 The figure shows a front view structural diagram of the first PCB board in a specific embodiment of the present invention;

[0014] Figure 3 The figure shows a front view structural diagram of the second PCB board in a specific embodiment of the present invention. Detailed Description of the Embodiments

[0015] The following will describe the technical solutions in the embodiments of the present invention in detail with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0016] Refer Figures 1-3 As shown, the miniaturized 3dB bridge in this embodiment includes a first PCB board 1, a prepreg 2, and a second PCB board 3 stacked in sequence from top to bottom. The front sides of the first PCB board 1 and the second PCB board 3 are both provided with a folding structure 4. The folding structure on the first PCB board 1 and the folding structure 4 on the second PCB board 3 are arranged in a mirror image. The folding mechanism 4 includes a folded transmission line 401 and a plurality of metallized vias 402. The metallized vias 402 are uniformly arranged around the folded transmission line 401.

[0017] Further, the folded transmission line 401 includes a plurality of strip lines 403 connected in sequence. The strip lines 403 are in a "zigzag" shape, and adjacent strip lines 403 are arranged in a mirror image.

[0018] Furthermore, there are two strip lines 403.

[0019] Furthermore, a number of metallized vias 402 are arranged in multiple rows, and the multiple rows of metallized vias 402 are arranged sequentially around the strip line 403.

[0020] The beneficial effects of this technical solution are as follows:

[0021] 1. The circuit miniaturization feature is achieved by using multilayer boards and folding the transmission lines.

[0022] 2. By using metallized vias that penetrate all layers of the circuit, the heat dissipation effect of the circuit is improved, and the power handling capacity of the circuit is enhanced.

[0023] 3. By using metallized vias that run through each layer of the circuit, the coupling effect between adjacent parts of the same transmission line after folding is improved, thus improving the sensitivity of the circuit.

[0024] 4. The circuit structure is simple, the product consistency is good, and it can meet the needs of mass production.

[0025] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0026] The above are merely specific embodiments of this application. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A miniaturized 3dB bridge, characterized in that: It includes a first PCB board, a prepreg, and a second PCB board stacked in sequence from top to bottom. Folding structures are provided on the front sides of both the first PCB board and the second PCB board. The folding structure on the first PCB board is arranged in a mirror image with respect to the folding structure on the second PCB board. The folding structure includes a folding transmission line and a number of metallized vias, and the metallized vias are evenly arranged around the folding transmission line.

2. The miniaturized 3dB bridge according to claim 1, characterized in that: The folding transmission line includes a plurality of strip lines connected in sequence. The strip lines are in a "zigzag" shape, and adjacent strip lines are arranged in a mirror image.

3. A miniaturized 3dB bridge according to claim 2, characterized in that: There are two strip lines.

4. A miniaturized 3dB bridge according to claim 2, characterized in that: A number of the metallized vias are arranged in multiple rows, and the multiple rows of metallized vias are sequentially arranged around the strip lines.

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