Integrated power module, controller, outdoor unit and air conditioner

Abstract

The utility model discloses an integrated power module, controller, outdoor unit and air conditioner, wherein, integrated power module includes: at least one compressor power module and at least one first sampling module, each compressor power module is configured to drive one compressor, and each first sampling module is configured to carry out current sampling to one compressor power module, at least one fan power module and at least one second sampling module, each fan power module is configured to drive one fan, and each second sampling module is configured to carry out current sampling to one fan power module, substrate, each compressor power module, each first sampling module, each fan power module and each second sampling module are arranged on the substrate respectively, and the substrate is configured to conduct heat to the heat dissipation device. The integrated power module is high in integrated degree, thereby improve the installation flatness.

Description

Technical Field

[0001] This application relates to the field of air conditioner technology, and in particular to an integrated power module, controller, outdoor unit and air conditioner. Background Technology

[0002] In related technologies, compressor power modules and fan power modules are usually independent, meaning there are two power modules in the circuit. The two power modules usually have a height difference. Therefore, when installing the heat dissipation device, due to flatness issues, the heat dissipation surfaces of the two power modules may not make good contact with the heat dissipation device, resulting in poor reliability. Utility Model Content

[0003] This utility model aims to at least partially solve one of the technical problems in related technologies. Therefore, the first objective of this utility model is to propose an integrated power module. By integrating the compressor power module and the fan power module into the integrated power module, the degree of integration is improved, thereby improving the flatness of the installation. Thus, when installing the heat dissipation device, the heat dissipation device can fully contact the substrate to dissipate heat from each module on the substrate, thereby improving the reliability of the power module.

[0004] The second objective of this invention is to provide a controller.

[0005] The third objective of this utility model is to propose an outdoor unit.

[0006] The fourth objective of this utility model is to provide an air conditioner.

[0007] To achieve the above objectives, an integrated power module is proposed according to a first aspect of the present invention, comprising: at least one compressor power module and at least one first sampling module, each compressor power module being configured to drive a compressor, and each first sampling module being configured to sample the current of a compressor power module; at least one fan power module and at least one second sampling module, each fan power module being configured to drive a fan, and each second sampling module being configured to sample the current of a fan power module; and a substrate, wherein each compressor power module, each first sampling module, each fan power module, and each second sampling module are respectively disposed on the substrate, and the substrate is configured to conduct the heat of each compressor power module, each first sampling module, each fan power module, and each second sampling module to a heat dissipation device.

[0008] The integrated power module according to an embodiment of the present invention includes at least one compressor power module, at least one first sampling module, at least one fan power module, at least one second sampling module, and a substrate. Each compressor power module is configured to drive a compressor, each first sampling module is configured to sample the current of a compressor power module, each fan power module is configured to drive a fan, and each second sampling module is configured to sample the current of a fan power module. Each compressor power module, each first sampling module, each fan power module, and each second sampling module are respectively disposed on the substrate. The substrate is configured to conduct the heat from each compressor power module, each first sampling module, each fan power module, and each second sampling module to a heat dissipation device. Therefore, by integrating the compressor power module and the fan power module into the integrated power module, the degree of integration is improved, thereby improving the installation flatness. Thus, when installing the heat dissipation device, the heat dissipation device can make complete contact with the substrate, and since each module is disposed on the substrate, the heat dissipation device can dissipate heat from each module on the substrate, solving the problem of poor contact with the heat dissipation device in related technologies, thereby improving the reliability of the power module.

[0009] According to one embodiment of the present invention, each compressor power module includes: a first power input terminal adapted to be connected to a DC positive bus; a second power input terminal connected to a DC negative bus via a first sampling module; and a first inverter circuit connected to the first power input terminal and the second power input terminal respectively, and adapted to be connected to the corresponding compressor. The first inverter circuit is configured to drive the corresponding compressor according to a first drive signal and a bus voltage.

[0010] According to one embodiment of the present invention, the first inverter circuit includes a first upper bridge switch and a first lower bridge switch. Each compressor power module further includes: a first driver chip, which is connected to the control terminal of the first upper bridge switch and is configured to generate a first upper bridge drive signal according to a first control instruction from the control unit and send the first upper bridge drive signal to the first upper bridge switch; and a second driver chip, which is connected to the control terminal of the first lower bridge switch and is configured to generate a first lower bridge drive signal according to the first control instruction and send the first lower bridge drive signal to the first lower bridge switch.

[0011] According to one embodiment of the present invention, the first inverter circuit includes a first upper-bridge switch and a first lower-bridge switch. The control terminal of the first upper-bridge switch is adapted to be connected to a first driver chip to receive a first upper-bridge drive signal sent by the corresponding first driver chip. Each first driver chip is disposed outside the integrated power module, and the first driver chip generates the first upper-bridge drive signal according to a first control instruction from the control unit. The control terminal of the first lower-bridge switch is adapted to be connected to a second driver chip to receive a first lower-bridge drive signal sent by the corresponding second driver chip. Each second driver chip is disposed outside the integrated power module, and the second driver chip generates the first lower-bridge drive signal according to the first control instruction.

[0012] According to one embodiment of the present invention, each wind turbine power module includes: a third power input terminal adapted to be connected to a DC positive bus; a fourth power input terminal connected to a DC negative bus via a second sampling module; and a second inverter circuit connected to the third power input terminal and the fourth power input terminal respectively, and adapted to be connected to a wind turbine, wherein the second inverter circuit is configured to drive the wind turbine according to a second drive signal and a bus voltage.

[0013] According to one embodiment of the present invention, the second inverter circuit includes a second upper bridge switch and a second lower bridge switch. Each wind turbine power module further includes: a third drive chip, which is connected to the control terminal of the second upper bridge switch and is configured to generate a second upper bridge drive signal according to a second control instruction from the control unit and send the second upper bridge drive signal to the second upper bridge switch; and a fourth drive chip, which is connected to the control terminal of the second lower bridge switch and is configured to generate a second lower bridge drive signal according to the second control instruction and send the second lower bridge drive signal to the second lower bridge switch.

[0014] According to one embodiment of the present invention, the second inverter circuit includes a second upper-bridge switch and a second lower-bridge switch. The control terminal of the second upper-bridge switch is adapted to be connected to a third driver chip to receive a second upper-bridge drive signal sent by the corresponding third driver chip. Each third driver chip is disposed outside the integrated power module, and the third driver chip generates the second upper-bridge drive signal according to a second control instruction from the control unit. The control terminal of the second lower-bridge switch is adapted to be connected to a fourth driver chip to receive a second lower-bridge drive signal sent by the corresponding fourth driver chip. Each fourth driver chip is disposed outside the integrated power module, and the fourth driver chip generates the second lower-bridge drive signal according to the second control instruction.

[0015] According to one embodiment of the present invention, the integrated power module further includes: a rectifier module, the rectifier module being adapted to input AC power, a first output terminal of the rectifier module being adapted to output a DC positive bus, and a second output terminal of the rectifier module being adapted to output a DC negative bus. The rectifier module is configured to rectify the AC power to generate a bus voltage.

[0016] According to one embodiment of the present invention, the integrated power module further includes: a pre-charge module, one end of which is adapted to be connected to a DC negative bus, and the other end of which is connected to each first sampling module and each second sampling module. The pre-charge module is configured to suppress the inrush current of the bus voltage when the bus voltage is energized.

[0017] According to one embodiment of the present invention, the pre-charging module includes: a switching transistor disposed on a substrate, a first end of the switching transistor being adapted to connect to a DC negative bus, a second end of the switching transistor being connected to each first sampling module and each second sampling module, and a control terminal of the switching transistor being adapted to connect to a control unit; and a first resistor disposed outside the integrated power module and connected in parallel with the switching transistor.

[0018] According to one embodiment of the present invention, the first sampling module and the second sampling module each include a sampling resistor.

[0019] To achieve the above objectives, a controller is provided according to a second aspect of the present invention, comprising the integrated power module of any of the foregoing embodiments.

[0020] According to the controller of this utility model embodiment, by adopting the above-mentioned integrated power module, the integration level is improved by integrating the compressor power module and the fan power module into the integrated power module, thereby improving the installation flatness. Therefore, when installing the heat dissipation device, the heat dissipation device can fully contact the substrate to dissipate heat from each module on the substrate, thereby improving the reliability of the power module.

[0021] To achieve the above objectives, an outdoor unit is provided according to a third aspect of the present invention, including the integrated power module of any of the foregoing embodiments or the foregoing controller.

[0022] According to the outdoor unit of this utility model embodiment, by adopting the above-mentioned integrated power module or controller, the integration level is improved by integrating the compressor power module and the fan power module into the integrated power module, thereby improving the installation flatness. Therefore, when installing the heat dissipation device, the heat dissipation device can fully contact the base plate to dissipate heat from each module on the base plate, thereby improving the reliability of the power module.

[0023] To achieve the above objectives, an air conditioner is provided according to a fourth aspect of the present invention, including the aforementioned outdoor unit.

[0024] According to the embodiment of the present utility model, the air conditioner adopts the above-mentioned outdoor unit, and improves the integration level by integrating the compressor power module and the fan power module into the integrated power module, thereby improving the installation flatness. Therefore, when installing the heat dissipation device, the heat dissipation device can fully contact the base plate to dissipate heat from each module on the base plate, thereby improving the reliability of the power module.

[0025] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0026] Figure 1 This is an installation diagram of two power modules and a heat dissipation device in related technologies;

[0027] Figure 2 This is a schematic diagram of the structure of an integrated power module according to an embodiment of the present invention;

[0028] Figure 3 This is a circuit diagram of an integrated power module of a compressor power module according to one embodiment of the present invention;

[0029] Figure 4 This is a circuit diagram of an integrated power module when there are two compressor power modules according to one embodiment of the present invention;

[0030] Figure 5 This is a circuit diagram of the first to fourth driver chips inside the integrated power module according to an embodiment of the present invention;

[0031] Figure 6 This is a circuit diagram of the first to fourth driver chips inside the integrated power module according to another embodiment of the present invention;

[0032] Figure 7 This is a circuit diagram of the first to fourth driver chips outside the integrated power module according to an embodiment of the present invention;

[0033] Figure 8 This is a circuit diagram of the first to fourth driver chips outside the integrated power module according to another embodiment of the present invention;

[0034] Figure 9 This is a schematic diagram of the structure of an integrated power module according to another embodiment of the present invention;

[0035] Figure 10 This is a schematic diagram of the controller according to an embodiment of the present invention;

[0036] Figure 11 This is a schematic diagram of the controller according to another embodiment of the present invention;

[0037] Figure 12 This is a schematic diagram of the structure of an outdoor unit according to an embodiment of the present invention;

[0038] Figure 13 This is a structural schematic diagram of an air conditioner according to an embodiment of the present invention. Detailed Implementation

[0039] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0040] It should be noted that this application is based on the inventor's understanding and research into the following issues:

[0041] In related technologies, compressor power modules and fan power modules typically employ external sampling resistors. However, these sampling resistors generate heat during operation, and their external placement limits heat dissipation. Specifically, during power module operation, current flowing through the resistor generates Joule heat, which is difficult to dissipate quickly and effectively, causing the resistor's temperature to rise continuously and significantly. Excessive temperature rise in the sampling resistor can have a significant negative impact on its own performance, the solder pads, and the reliability of the printed circuit board.

[0042] Furthermore, the compressor power module and the fan power module are usually independent, meaning there are two power modules in the circuit. For example... Figure 1 As shown, the two power modules usually have a height difference. When installing the heat dissipation device 1, the installation position of the heat dissipation device 1 needs to be set according to the higher power module. Therefore, there is a problem of poor contact between the heat dissipation surface of the lower power module and the heat dissipation device 1, which makes it impossible for the heat dissipation device 1 to dissipate heat from the lower power module. In addition, the two power modules are large in size, resulting in a larger circuit board area and an increased heat dissipation area, which leads to an increase in cost.

[0043] Furthermore, power modules require pre-charging functionality in many application scenarios to ensure that the device can complete the charging process smoothly and safely during startup. In related technologies, the pre-charging circuit is usually placed outside the power module when designing the pre-charging function. The pre-charging circuit needs to be connected to the power module and requires additional wiring and interfaces, resulting in a complex external circuit structure that cannot achieve high-density miniaturization design.

[0044] Based on this, embodiments of the present invention provide an integrated power module, controller, outdoor unit, and air conditioner. By integrating the compressor power module and fan power module into the integrated power module, the degree of integration is improved, thereby improving the installation flatness. Therefore, when installing the heat dissipation device, the heat dissipation device can fully contact the substrate to dissipate heat from each module on the substrate, thereby improving the reliability of the power module.

[0045] The integrated power module, controller, outdoor unit, and air conditioner of this utility model are described below with reference to the accompanying drawings.

[0046] Figure 2 This is a structural schematic diagram of an integrated power module according to an embodiment of the present invention. Figure 2 As shown, the integrated power module includes: at least one compressor power module 10, at least one first sampling module 20, at least one fan power module 30, at least one second sampling module 40, and a base plate 50.

[0047] Each compressor power module 10 is configured to drive a compressor (not shown), and each first sampling module 20 is configured to sample the current of a compressor power module 10; each fan power module 30 is configured to drive a fan (not shown), and each second sampling module 40 is configured to sample the current of a fan power module 30; each compressor power module 10, each first sampling module 20, each fan power module 30, and each second sampling module 40 are respectively disposed on a substrate 50, and the substrate 50 is configured to conduct the heat of each compressor power module 10, each first sampling module 20, each fan power module 30, and each second sampling module 40 to a heat dissipation device (not shown).

[0048] Specifically, the number of compressor power modules 10 and first sampling modules 20 is set according to the number of compressors, and the number of fan power modules 30 and second sampling modules 40 is set according to the number of fans. If there is one compressor, there is one compressor power module 10 and one first sampling module 20; if there are two compressors, there are two compressor power modules 10 and two first sampling modules 20. Each compressor power module 10, each first sampling module 20, each fan power module 30, and each second sampling module 40 is integrated on a substrate 50 inside the integrated power module. The substrate 50 is connected to a heat dissipation device, which can transfer the heat generated by each compressor power module 10, each first sampling module 20, each fan power module 30, and each second sampling module 40 during operation to the heat dissipation device, thereby reducing the temperature rise of each compressor power module 10, each first sampling module 20, each fan power module 30, and each second sampling module 40. In this embodiment, the substrate 50 can be any one of an aluminum substrate, an aluminum alloy substrate, a copper substrate, or a copper alloy substrate.

[0049] It should be noted that the number of compressor power modules 10 and first sampling modules 20 is not limited to... Figure 2 The number of the two modules shown, namely the wind turbine power module 30 and the second sampling module 40, is not limited to... Figure 2 One of the settings shown can be configured according to the actual situation.

[0050] Furthermore, since the compressor power module 10 and the fan power module 30 are integrated in the integrated power module, and both the compressor power module 10 and the fan power module 30 are mounted on the substrate 50, the heat dissipation surfaces of the two power modules are in contact with the heat dissipation device through the substrate 50, so that the two power modules can effectively dissipate heat.

[0051] In one alternative implementation, the integrated power module is packaged in an Easy package or an Econo package.

[0052] It is understandable that Easy packaging and Econo packaging are two types of power module packaging. Easy packaging and Econo packaging have simple packaging structures and simple packaging processes, so the packaging cost is low.

[0053] In the above embodiments, by integrating the compressor power module and the fan power module into the integrated power module, the integration level is improved, thereby improving the installation flatness and facilitating the miniaturization of the electric drive. Therefore, when installing the heat dissipation device, the heat dissipation device can make full contact with the substrate. Since each module is mounted on the substrate, the heat dissipation device can dissipate heat from each module on the substrate, solving the problem of poor contact with the heat dissipation device in related technologies. Furthermore, the stray inductance of the integrated power module circuit is smaller, thereby improving the reliability of the power module. Further, by integrating the compressor power module and the fan power module, the area occupied by the power module on the circuit board is reduced, and the area of ​​the heat dissipation device is reduced, thus lowering the heat dissipation cost. Also, during refrigerant cooling, the fan power module generates relatively low heat, which may lead to condensation risk. Integrating the compressor power module and the fan power module into a single package ensures uniform heat distribution between the two modules, reducing the risk of condensation. Additionally, by integrating the first sampling module and the second sampling module into the integrated power module, the heat dissipation device can dissipate heat from the two sampling modules through the substrate, reducing the temperature rise of the two sampling modules.

[0054] In some embodiments, such as Figure 3 and Figure 4 As shown, each compressor power module 10 includes: a first power input terminal A1, a second power input terminal A2, and a first inverter circuit 11. The first power input terminal A1 is adapted to be connected to the DC positive bus; the second power input terminal A2 is connected to the DC negative bus through a first sampling module 20; the first inverter circuit 11 is connected to the first power input terminal A1 and the second power input terminal A2 respectively, and is adapted to be connected to the corresponding compressor. The first inverter circuit 11 is configured to drive the corresponding compressor according to the first drive signal and the bus voltage.

[0055] Specifically, the first power input terminal A1 is adapted to connect to the DC positive bus, and the second power input terminal A2 is connected to one end of a first sampling module 20. The other end of the first sampling module 20 is adapted to connect to the DC negative bus. Therefore, the first sampling module 20 is connected in series on the DC negative bus, which can sample the bus current and provide the bus current to the control unit so that the control unit can control the corresponding compressor according to the bus current. The first inverter circuit 11 includes multi-phase bridge arms, each phase bridge arm includes two power switching transistors, and the midpoint of each phase bridge arm is the output terminal of the corresponding compressor power module 10. The output terminal of the compressor power module 10 is adapted to connect to the corresponding compressor, and the control terminal of each power switching transistor is adapted to input a first drive signal to turn on or off according to the first drive signal, thereby providing the bus voltage to the corresponding compressor so that the corresponding compressor runs.

[0056] by Figure 3The diagram shows a compressor power module 10 and a first sampling module 20. Figure 4 Taking the two compressor power modules 10 and two first sampling modules 20 shown as examples, each first inverter circuit 11 has 3 phase bridge arms, and each phase bridge arm has two power switching transistors. Each power switching transistor Q1-Q6 can be an IGBT (Insulated-Gate Bipolar Transistor), a MOS (Metal Oxide Semiconductor Field Effect Transistor), a SiC (Silicon Carbide) power device, or other power devices. The midpoint of each phase bridge arm is suitable for connecting one phase of the compressor.

[0057] Furthermore, to avoid excessive internal wiring within the integrated power module, which would result in an overly large integrated power module, the first power input terminal A1, both ends of each first sampling module 20, and the output terminal of each compressor power module 10 can be brought out. That is, the integrated power module has at least one first power input terminal A1, at least two ends of at least one first sampling module 20, and an output terminal of each compressor power module 10, and then connected using external wiring. The integrated power module includes, for example,... Figure 4 When two compressor power modules 10 are shown, the first power input terminal A11 of the first compressor power module 10 is connected to the DC positive bus and the first power input terminal A12 of the second compressor power module 10 respectively through external connection lines. The other end of the first sampling module 20 corresponding to the first compressor power module 10 is connected to the DC negative bus and the other end of the first sampling module 20 corresponding to the second compressor power module 10 respectively through external connection lines. The output terminal of the first compressor power module 10 is connected to the first compressor through external connection lines, and the output terminal of the second compressor power module 10 is connected to the second compressor through external connection lines.

[0058] In the above embodiment, since the first sampling module is connected in series on the DC negative bus, the first sampling module is placed on the low-voltage side and will not affect the driving circuit of the power switch, which is beneficial to the design of the driving circuit.

[0059] In some embodiments, such as Figure 5 and Figure 6As shown, the first inverter circuit 11 includes first upper bridge switches Q1-Q3 and first lower bridge switches Q4-Q6. Each compressor power module 10 further includes a first driver chip 12 and a second driver chip 13. The first driver chip 12 is connected to the control terminal of the first upper bridge switches Q1-Q3 and is configured to generate a first upper bridge drive signal according to a first control instruction from the control unit and send the first upper bridge drive signal to the first upper bridge switches Q1-Q3. The second driver chip 13 is connected to the control terminal of the first lower bridge switches Q4-Q6 and is configured to generate a first lower bridge drive signal according to the first control instruction and send the first lower bridge drive signal to the first lower bridge switches Q4-Q6.

[0060] by Figure 5 and Figure 6 Taking the example shown, power switches Q1-Q3 are the first upper-bridge switches, and power switches Q4-Q5 are the first lower-bridge switches. The first upper-bridge switches Q1-Q3 are connected to the first power input terminal A1, so they are on the high-voltage side. The first lower-bridge switches Q4-Q6 are connected to the second power input terminal A2, so they are on the low-voltage side. Therefore, two driver chips are required for the first upper-bridge switches Q1-Q3 and the first lower-bridge switches Q4-Q6. The first driver chip 12 and the second driver chip 13 are located inside the compressor power module 10. Therefore, the first driver chip 12 and the second driver chip 13 are also located on the substrate 50 and integrated inside the integrated power module. The first driver chip 12 is a high-voltage side driver chip, and the second driver chip 13 is a low-voltage side driver chip. The first drive signal includes the first upper bridge drive signal of the first upper bridge switch Q1-Q3 and the first lower bridge drive signal of the first lower bridge switch Q4-Q6. The first driver chip 12 and the second driver chip 13 are respectively adapted to connect to a control unit (not shown) to receive the first control command sent by the control unit. The first driver chip 12 generates the first upper bridge drive signal according to the first control command to control the first upper bridge switch Q1-Q3, and the second driver chip 13 generates the first lower bridge drive signal according to the first control command to control the first lower bridge switch Q4-Q6.

[0061] In this embodiment, each compressor power module also integrates a first driver chip and a second driver chip, thereby increasing the integration level of the integrated power module, simplifying the peripheral application circuit of the power module, and reducing the overall footprint of the circuit board.

[0062] In some embodiments, such as Figure 7 and Figure 8As shown, the first inverter circuit 11 includes first upper-bridge switches Q1-Q3 and first lower-bridge switches Q4-Q6. The control terminals of the first upper-bridge switches Q1-Q3 are adapted to be connected to a first driver chip 12 to receive a first upper-bridge drive signal sent by the corresponding first driver chip 12. Each first driver chip 12 is located outside the integrated power module, and the first driver chip 12 generates the first upper-bridge drive signal according to a first control instruction from the control unit. The control terminals of the first lower-bridge switches Q4-Q6 are adapted to be connected to a second driver chip 13 to receive a first lower-bridge drive signal sent by the corresponding second driver chip 13. Each second driver chip 13 is located outside the integrated power module, and the second driver chip 13 generates the first lower-bridge drive signal according to the first control instruction.

[0063] Specifically Figure 7 and Figure 8 The circuit structure and working principle of the first inverter circuit 11 shown are the same as those of the first inverter circuit 11 shown. Figure 5 and Figure 6 The circuit structure and working principle of the first inverter circuit 11 shown are the same, but... Figure 7 and Figure 8 The first driver chip 12 and the second driver chip 13 are located outside the integrated power module, not inside it. Therefore, the peripheral circuit can be flexibly configured according to the actual situation, and the cost of the integrated power module can be reduced.

[0064] It should be noted that the number of the first driver chip 12 and the number of the second driver chip 13 are the same as the number of compressor power modules 10, such as... Figure 8 As shown, when there are two compressor power modules 10, there are two first drive chips 12 and two second drive chips 13.

[0065] In some embodiments, such as Figure 3 and Figure 4 As shown, each wind turbine power module 30 includes: a third power input terminal A3, a fourth power input terminal A4, and a second inverter circuit 31. The third power input terminal A3 is adapted to be connected to the DC positive bus; the fourth power input terminal A4 is connected to the DC negative bus through a second sampling module 40; the second inverter circuit 31 is connected to the third power input terminal A3 and the fourth power input terminal A4 respectively, and is adapted to be connected to the wind turbine. The second inverter circuit 31 is configured to drive the wind turbine according to the second drive signal and the bus voltage.

[0066] Specifically, the third power input terminal A3 is adapted to connect to the DC positive bus, and the fourth power input terminal A4 is connected to one end of the second sampling module 40. The other end of the second sampling module 40 is adapted to connect to the DC negative bus. Therefore, the second sampling module 40 is also connected in series on the DC negative bus, which can sample the bus current and provide the bus current to the control unit so that the control unit can control the fan according to the bus current. The second inverter circuit 31 includes a multi-phase bridge arm, each phase bridge arm includes two power switching transistors, and the midpoint of each phase bridge arm is the output terminal of the fan power module 30. The output terminal of the fan power module 30 is adapted to connect to the fan. The control terminal of each power switching transistor is adapted to input a second drive signal to turn on or off according to the second drive signal, thereby providing the bus voltage to the fan and making the fan run.

[0067] by Figure 3 and Figure 4 As shown in the example, the second inverter circuit 31 has three phase arms, each with two power switches. Each power switch Q7-Q12 can be an IGBT, MOS, SiC power device, or other power device. The midpoint of each phase arm is suitable for connecting one phase of the wind turbine. It should be noted that the second inverter circuit 31 can adopt the same circuit structure as the first inverter circuit 11, or it can adopt a different circuit structure. Figure 3 and Figure 4 The first inverter circuit 11 and the second inverter circuit 31 shown are merely exemplary and are not intended to limit the scope of this application.

[0068] Similarly, to avoid excessive internal wiring in the integrated power module, the third power input terminal A3, both ends of the second sampling module 40, and the output terminal of the fan drive module can be led out. That is, the integrated power module also has a third power input terminal A3, both ends of the second sampling module 40, and the output terminal of the fan power module 30, which can then be connected using external wiring. For example... Figure 4 As shown, the third power input terminal A3 is connected to the first power input terminal A11 via an external connection line, the other end of the second sampling module 40 is connected to the other end of the first sampling module 20 via an external connection line, and the output terminal of the fan power module 30 is connected to the fan via an external connection line.

[0069] In the above embodiment, since the second sampling module is connected in series on the DC negative bus, the second sampling module is placed on the low-voltage side and will not affect the driving circuit of the power switch, which is beneficial to the design of the driving circuit.

[0070] In some embodiments, such as Figure 5 and Figure 6As shown, the second inverter circuit 31 includes second upper bridge switches Q7-Q9 and second lower bridge switches Q10-Q12. Each fan power module 30 also includes a third driver chip 32 and a fourth driver chip 33. The third driver chip 32 is connected to the control terminal of the second upper bridge switches Q7-Q9 and is configured to generate a second upper bridge drive signal according to a second control instruction from the control unit and send the second upper bridge drive signal to the second upper bridge switches Q7-Q9. The fourth driver chip 33 is connected to the control terminal of the second lower bridge switches Q10-Q12 and is configured to generate a second lower bridge drive signal according to a second control instruction and send the second lower bridge drive signal to the second lower bridge switches Q10-Q12.

[0071] by Figure 5 and Figure 6 Taking the example shown, power switches Q7-Q9 are the second upper-bridge switches, and power switches Q10-Q12 are the second lower-bridge switches. The second upper-bridge switches Q7-Q9 are connected to the third power input terminal A3, so they are on the high-voltage side. The second lower-bridge switches Q10-Q12 are connected to the fourth power input terminal A4, so they are on the low-voltage side. Therefore, two driver chips are required for the second upper-bridge switches Q7-Q9 and the second lower-bridge switches Q10-Q12. The third driver chip 32 and the fourth driver chip 33 are located inside the fan power module 30. Therefore, the third driver chip 32 and the fourth driver chip 33 are also located on the substrate 50 and integrated inside the integrated power module. The third driver chip 32 is a high-voltage side driver chip, and the fourth driver chip 33 is a low-voltage side driver chip. The second drive signal includes the second upper bridge drive signal of the second upper bridge switch Q7-Q9 and the second lower bridge drive signal of the second lower bridge switch Q10-Q12. The third driver chip 32 and the fourth driver chip 33 are respectively adapted to be connected to the control unit to receive the second control command sent by the control unit. The third driver chip 32 generates the second upper bridge drive signal according to the second control command to control the second upper bridge switch Q7-Q9, and the fourth driver chip 33 generates the second lower bridge drive signal according to the second control command to control the second lower bridge switch Q10-Q12.

[0072] In this embodiment, the wind turbine power module also integrates a third driver chip and a fourth driver chip, thereby increasing the integration level of the integrated power module, simplifying the peripheral application circuits of the power module, and reducing the overall footprint of the circuit board.

[0073] In some embodiments, such as Figure 7 and Figure 8As shown, the second inverter circuit 31 includes second upper bridge switches Q7-Q9 and second lower bridge switches Q10-Q12. The control terminals of the second upper bridge switches Q7-Q9 are adapted to be connected to the third driver chip 32 to receive the second upper bridge drive signal sent by the third driver chip 32. The third driver chip 32 is located outside the integrated power module and generates the second upper bridge drive signal according to the second control command of the control unit. The control terminals of the second lower bridge switches Q10-Q12 are adapted to be connected to the fourth driver chip 33 to receive the second lower bridge drive signal sent by the fourth driver chip 33. The fourth driver chip 33 is located outside the integrated power module and generates the second lower bridge drive signal according to the second control command.

[0074] Specifically Figure 7 and Figure 8 The circuit structure and working principle of the second inverter circuit 31 shown are the same as those of the second inverter circuit 31 shown. Figure 5 and Figure 6 The circuit structure and working principle of the second inverter circuit 31 shown are the same, but the third driver chip 32 and the fourth driver chip 33 are set outside the integrated power module and not inside the integrated power module. Therefore, the peripheral circuit can be flexibly configured according to the actual situation, and the cost of the integrated power module can be reduced.

[0075] In some embodiments, such as Figures 3 to 9 As shown, the integrated power module also includes: a rectifier module 60, which is adapted to input AC power, a first output terminal of the rectifier module 60 is adapted to output a DC positive bus, and a second output terminal of the rectifier module 60 is adapted to output a DC negative bus. The rectifier module 60 is configured to rectify the AC power to generate a bus voltage.

[0076] by Figures 3 to 8 Taking the example shown, the AC power is three-phase AC power. The rectifier module 60 includes six diodes D1-D6. The cathodes of diodes D1-D3 are connected and form the first output terminal of the rectifier module 60. The anodes of diodes D4-D6 are connected and form the second output terminal of the rectifier module 60. The anode of diode D1 and the cathode of diode D4 are connected and are suitable for connecting to the first phase of the three-phase AC power. The anode of diode D2 and the cathode of diode D5 are connected and are suitable for connecting to the second phase of the three-phase AC power. The anode of diode D3 and the cathode of diode D6 are connected and are suitable for connecting to the third phase of the three-phase AC power. Diodes D1-D6 rectify the three-phase AC power, output bus voltage, and provide the bus voltage to each compressor power module 10 and each fan power module 30.

[0077] In some embodiments, such as Figures 3 to 9As shown, the integrated power module also includes a pre-charge module 70, one end of which is adapted to connect to the DC negative bus, and the other end of which is connected to each first sampling module 20 and each second sampling module 40. The pre-charge module 70 is configured to suppress the inrush current of the bus voltage when the bus voltage is powered on.

[0078] Understandably, the integrated power module also integrates a pre-charge module 70. The pre-charge module 70 is located on the low-voltage side and suppresses the inrush current of the bus voltage when the bus voltage is powered on, thereby ensuring that the device can complete the charging process smoothly and safely during startup. In addition, it simplifies the peripheral circuit of the module and enables high-density miniaturized design. Furthermore, since the pre-charge module 70 is located on the low-voltage side, it is beneficial to the design of the drive circuit.

[0079] In some embodiments, such as Figures 3 to 9 As shown, the pre-charge module 70 includes a switch Q and a first resistor R1. The switch Q is disposed on the substrate 50. The first end of the switch Q is adapted to be connected to the DC negative bus. The second end of the switch Q is connected to each first sampling module 20 and each second sampling module 40. The control end of the switch Q is adapted to be connected to the control unit. The first resistor R1 is disposed outside the integrated power module and is connected in parallel with the switch Q.

[0080] Specifically, when the bus voltage is applied, the switch Q is turned off, and the first resistor R1 suppresses the inrush current of the bus voltage. After the bus capacitor has finished charging, the switch Q is turned on to short-circuit the first resistor R1, allowing the circuit to operate normally. The switch Q is located on the substrate 50, so it is inside the integrated power module. The first resistor R1 is also relatively large; placing it inside the integrated power module would increase its size. Therefore, the first resistor R1 is placed outside the integrated power module.

[0081] In some embodiments, the first sampling module 20 and the second sampling module 40 each include a sampling resistor.

[0082] by Figures 3 to 8 As shown in the example, the first sampling module 20 includes a first sampling resistor Rs1, and the second sampling module 40 includes a second sampling resistor Rs2. The resistance range of the first sampling resistor Rs1 and the resistance range of the second sampling resistor Rs2 are 1-30mΩ, respectively.

[0083] In an alternative embodiment, the integrated power module further includes a temperature sampling module 80, which is also disposed on the substrate 50. The temperature sampling module 80 includes a temperature sampling resistor Rs, which is adapted to be connected to a control unit, so that the control unit can determine the internal temperature of the power module based on the resistance value of the temperature sampling resistor Rs.

[0084] Based on this, when there is one compressor power module 10, and the first drive chip 12 to the fourth drive chip 33 are disposed outside the integrated power module, such as Figure 7 As shown, the pins of the integrated power module include the input terminal of the rectifier module 60, the first output terminal of the rectifier module 60, the first power input terminal A1, the output terminal of the compressor power module 10, the control terminals of the first upper bridge switches Q1-Q3, the control terminals of the first lower bridge switches Q4-Q6, the third power input terminal A3, the output terminal of the fan power module 30, the control terminals of the second upper bridge switches Q7-Q9, the control terminals of the second lower bridge switches Q10-Q12, the two ends of the first sampling resistor Rs1, the two ends of the second sampling resistor Rs2, the two ends of the temperature sampling resistor Rs, the two ends of the switch Q, and the control terminal of the switch Q. The input terminal of the rectifier module 60 is suitable for inputting AC power. The first output terminal of the rectifier module 60 is connected to the first power input terminal A1 via an external connection line. The first power input terminal A1 is connected to the third power input terminal A3 via an external connection line. The output terminal of the compressor power module 10 is suitable for connecting to the compressor. The control terminals of the first lower bridge switches Q4-Q6 are suitable for connecting to the first driver chip 12. The control terminals of the first lower bridge switches Q4-Q6 are suitable for connecting to the second driver chip 13. The output terminal of the fan power module 30 is suitable for connecting to the fan. The control terminals of the second upper bridge switches Q7-Q9 are suitable for connecting to the third driver chip 32. The control terminals of the second lower bridge switches Q10-Q12 are suitable for connecting to the fourth driver chip 33. The two ends of the first sampling resistor Rs1, the two ends of the second sampling resistor Rs2, and the two ends of the temperature sampling resistor Rs are respectively suitable for connecting to the control unit. The two ends of the switch Q are connected to the first resistor R1 via an external connection line. The second end of the switch Q is connected to the other end of the second sampling resistor Rs2 via an external connection line. The control terminal of the switch is suitable for connecting to the control unit.

[0085] When the first driver chip 12 to the fourth driver chip 33 are located inside the integrated power module, the difference between this configuration and when the first driver chip 12 to the fourth driver chip 33 are located outside the integrated power module is that the control terminals of the switching transistors Q1-Q12 do not need to be brought out, but are replaced by the control terminals of the first driver chip 12 to the fourth driver chip 33. The first driver chip 12 to the fourth driver chip 33 also have 12 control terminals.

[0086] In summary, the integrated power module according to this utility model improves the integration level by integrating the compressor power module and the fan power module into the integrated power module, thereby improving the installation flatness and facilitating the miniaturization of the electric drive. Therefore, when installing the heat dissipation device, the heat dissipation device can make full contact with the substrate, and since each module is set on the substrate, the heat dissipation device can dissipate heat from each module on the substrate, solving the problem of poor contact with the heat dissipation device in related technologies. Furthermore, the stray inductance of the integrated power module circuit is small, thereby improving the reliability of the power module. Further, by integrating the compressor power module and the fan power module, the area occupied by the power module on the circuit board is reduced, and the area of ​​the heat dissipation device is reduced, thereby lowering the heat dissipation cost. Moreover, during refrigerant cooling, the fan power module generates relatively low heat, which may lead to condensation risk. Integrating the compressor power module and the fan power module into one package ensures uniform heat distribution between the compressor power module and the fan power module, thereby reducing the risk of condensation. Furthermore, by integrating the first and second sampling modules into the integrated power module, the heat dissipation device can cool the two sampling modules through the substrate, reducing the temperature rise of the two sampling modules. Additionally, the integrated power module also integrates a pre-charge module, simplifying the module's peripheral circuitry and enabling high-density miniaturization design.

[0087] Corresponding to the above embodiments, this utility model also provides a controller. For example... Figure 10 As shown, the controller 200 includes the integrated power module 100 of any of the foregoing embodiments.

[0088] According to the controller of this utility model embodiment, by adopting the above-mentioned integrated power module, the integration level is improved by integrating the compressor power module and the fan power module into the integrated power module, thereby improving the installation flatness. Therefore, when installing the heat dissipation device, the heat dissipation device can fully contact the substrate to dissipate heat from each module on the substrate, thereby improving the reliability of the power module.

[0089] Corresponding to the above embodiments, this utility model also provides an outdoor unit. For example... Figure 11 and Figure 12 As shown, the outdoor unit 300 includes the integrated power module 100 of any of the foregoing embodiments or the controller 200 of the foregoing embodiments.

[0090] According to the outdoor unit of this utility model embodiment, by adopting the above-mentioned integrated power module or controller, the integration level is improved by integrating the compressor power module and the fan power module into the integrated power module, thereby improving the installation flatness. Therefore, when installing the heat dissipation device, the heat dissipation device can fully contact the base plate to dissipate heat from each module on the base plate, thereby improving the reliability of the power module.

[0091] Corresponding to the above embodiments, this utility model also provides an air conditioner. For example... Figure 13 As shown, the air conditioner 400 includes the aforementioned outdoor unit 300.

[0092] According to the embodiment of the present utility model, the air conditioner adopts the above-mentioned outdoor unit, and improves the integration level by integrating the compressor power module and the fan power module into the integrated power module, thereby improving the installation flatness. Therefore, when installing the heat dissipation device, the heat dissipation device can fully contact the base plate to dissipate heat from each module on the base plate, thereby improving the reliability of the power module.

[0093] It should be understood that the various parts of this utility model can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0094] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0095] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0096] Furthermore, the terms "first," "second," etc., used in the embodiments of this utility model are for descriptive purposes only and should not be construed as indicating or implying relative importance, or implicitly specifying the number of technical features indicated in this embodiment. Therefore, features defined with terms such as "first" and "second" in the embodiments of this utility model can explicitly or implicitly indicate that the embodiment includes at least one of those features. In the description of this utility model, the word "multiple" means at least two or more, such as two, three, four, etc., unless otherwise explicitly specified in the embodiments.

[0097] In this utility model, unless otherwise explicitly specified or limited in the embodiments, the terms "installation," "connection," "joining," and "fixing" appearing in the embodiments should be interpreted broadly. For example, a connection can be a fixed connection, a detachable connection, or an integral part; it can also be a mechanical connection, an electrical connection, etc. Of course, it can also be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two components, or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific implementation.

[0098] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0099] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An integrated power module, characterized in that, include: At least one compressor power module and at least one first sampling module, each of the compressor power modules being configured to drive a compressor, and each of the first sampling modules being configured to sample the current of one of the compressor power modules; At least one wind turbine power module and at least one second sampling module, each wind turbine power module being configured to drive a wind turbine, and each second sampling module being configured to sample the current of one of the wind turbine power modules; A substrate is provided on which each of the compressor power modules, each of the first sampling modules, each of the fan power modules and each of the second sampling modules is disposed, and the substrate is configured to conduct heat from each of the compressor power modules, each of the first sampling modules, each of the fan power modules and each of the second sampling modules to a heat dissipation device.

2. The integrated power module according to claim 1, characterized in that, Each of the compressor power modules includes: A first power input terminal, the first power input terminal being adapted to connect to a DC positive bus; The second power input terminal is connected to the DC negative bus through one of the first sampling modules; A first inverter circuit is connected to the first power input terminal and the second power input terminal respectively, and is adapted to connect to a corresponding compressor. The first inverter circuit is configured to drive the corresponding compressor according to the first drive signal and the bus voltage.

3. The integrated power module according to claim 2, characterized in that, The first inverter circuit includes a first upper bridge switch and a first lower bridge switch, and each compressor power module further includes: The first driver chip is connected to the control terminal of the first upper bridge switch. The first driver chip is configured to generate a first upper bridge drive signal according to a first control instruction from the control unit and send the first upper bridge drive signal to the first upper bridge switch. The second driver chip is connected to the control terminal of the first lower bridge switch. The second driver chip is configured to generate a first lower bridge drive signal according to the first control instruction and send the first lower bridge drive signal to the first lower bridge switch.

4. The integrated power module according to claim 2, characterized in that, The first inverter circuit includes a first upper-bridge switch and a first lower-bridge switch, wherein, The control terminal of the first bridge switch is adapted to be connected to a first driver chip to receive a first bridge drive signal sent by the corresponding first driver chip. Each first driver chip is disposed outside the integrated power module. The first driver chip generates the first bridge drive signal according to the first control instruction of the control unit. The control terminal of the first downbridge switch is adapted to be connected to a second driver chip to receive a first downbridge drive signal sent by the corresponding second driver chip. Each second driver chip is disposed outside the integrated power module, and the second driver chip generates the first downbridge drive signal according to the first control instruction.

5. The integrated power module according to claim 2, characterized in that, Each of the aforementioned wind turbine power modules includes: The third power input terminal is adapted to be connected to the DC positive bus. The fourth power input terminal is connected to the DC negative bus via a second sampling module; A second inverter circuit is connected to the third power input terminal and the fourth power input terminal respectively, and is adapted to connect to the fan. The second inverter circuit is configured to drive the fan according to the second drive signal and the bus voltage.

6. The integrated power module according to claim 5, characterized in that, The second inverter circuit includes a second upper bridge switch and a second lower bridge switch, and each of the wind turbine power modules further includes: The third driving chip is connected to the control terminal of the second upper bridge switch. The third driving chip is configured to generate a second upper bridge drive signal according to the second control instruction of the control unit and send the second upper bridge drive signal to the second upper bridge switch. A fourth driver chip is connected to the control terminal of the second lower bridge switch. The fourth driver chip is configured to generate a second lower bridge drive signal according to the second control instruction and send the second lower bridge drive signal to the second lower bridge switch.

7. The integrated power module according to claim 5, characterized in that, The second inverter circuit includes a second upper bridge switch and a second lower bridge switch, wherein, The control terminal of the second upper bridge switch is adapted to be connected to a third driver chip to receive the second upper bridge drive signal sent by the corresponding third driver chip. Each of the third driver chips is disposed outside the integrated power module. The third driver chip generates the second upper bridge drive signal according to the second control instruction of the control unit. The control terminal of the second lower bridge switch is adapted to be connected to a fourth driver chip to receive the second lower bridge drive signal sent by the corresponding fourth driver chip. Each of the fourth driver chips is disposed outside the integrated power module, and the fourth driver chip generates the second lower bridge drive signal according to the second control instruction.

8. The integrated power module according to any one of claims 2-7, characterized in that, Also includes: A rectifier module is configured to rectify the AC power input to generate the bus voltage. The rectifier module has a first output terminal adapted to output the DC positive bus and a second output terminal adapted to output the DC negative bus.

9. The integrated power module according to any one of claims 2-7, characterized in that, Also includes: A pre-charge module, one end of which is adapted to connect to the DC negative bus, and the other end of which is connected to each of the first sampling modules and each of the second sampling modules, wherein the pre-charge module is configured to suppress the inrush current of the bus voltage when the bus voltage is energized.

10. The integrated power module according to claim 9, characterized in that, The pre-charging module includes: A switching transistor is disposed on the substrate. The first end of the switching transistor is adapted to be connected to the DC negative bus, the second end of the switching transistor is connected to each of the first sampling modules and each of the second sampling modules, and the control end of the switching transistor is adapted to be connected to the control unit. A first resistor is disposed outside the integrated power module and is connected in parallel with the switching transistor.

11. The integrated power module according to claim 1, characterized in that, The first sampling module and the second sampling module each include a sampling resistor.

12. A controller, characterized in that, Includes the integrated power module according to any one of claims 1-11.

13. An outdoor unit, characterized in that, Includes the integrated power module according to any one of claims 1-11 or the controller according to claim 12.

14. An air conditioner, characterized in that, Includes the outdoor unit as described in claim 13.

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