A photovoltaic optimizer

Abstract

The utility model provides a kind of photovoltaic optimizer, belong to photovoltaic power generation equipment technical field, it includes upper shell, lower shell and fin cover, upper shell and lower shell are closed by buckle structure and constitute shell, main circuit board is equipped in shell inner cavity, heat conduction plate is equipped on main circuit board, opening is set on upper shell and is adapted to heat conduction plate, fin cover cap is located in the middle of shell and its inner side is in contact with heat conduction plate, screw hole is equipped in fin cover inner side, through hole is correspondingly equipped on upper shell, dismounting hole is correspondingly equipped on lower shell, and fin cover and shell are fixed by bolt passing through through hole and screw hole connection.This utility model directly contacts fin cover by heat conduction plate, forms low thermal resistance heat transfer path, improves the heat dissipation efficiency, and dismounting hole is convenient for assembly maintenance, compact and reliable structure.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic power generation equipment technology, and in particular to a photovoltaic optimizer. Background Technology

[0002] Photovoltaic optimizers are key components in photovoltaic systems, typically installed beneath each photovoltaic module to enable maximum power point tracking (MPPT) and module-level monitoring. During operation, the internal power devices (such as MOSFETs and inductors) of a photovoltaic optimizer generate significant heat. If this heat is not dissipated promptly, it can lead to overheating, affecting conversion efficiency and lifespan, and even causing malfunctions.

[0003] In existing technologies, to improve heat dissipation performance, the conventional approach is to directly integrally mold or attach heat dissipation fins to the outer casing of the photovoltaic optimizer. However, the fins are usually located on the top or side of the casing, and their heat comes from conduction within the casing itself. Furthermore, there are air gaps or insulating pads between the casing and the internal heat-generating elements, resulting in relatively high thermal resistance. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings and deficiencies of the existing technology and to provide a photovoltaic optimizer.

[0005] The technical solution adopted by this utility model is as follows: This application provides a photovoltaic optimizer, including an upper shell, a lower shell, and a fin cover. The upper shell and the lower shell are connected by a snap-fit ​​structure to form an outer shell. The outer shell has an inner cavity, in which a main circuit board is disposed. A heat-conducting plate is disposed on the main circuit board. An opening adapted to the heat-conducting plate is opened on the upper shell. The fin cover is disposed in the middle of the shell, and its inner side is in contact with the heat-conducting plate. A plurality of threaded holes are provided on the inner side of the fin cover. A through hole is provided on the upper shell corresponding to the threaded hole. A disassembly hole is provided on the lower shell corresponding to the through hole. A bolt is passed through the through hole and connected to the threaded hole to fix the fin cover to the outer shell.

[0006] In some embodiments, the front and rear ends of the housing are respectively provided with a front convex plate and a rear convex plate, and the fin cover is positioned between the front convex plate and the rear convex plate.

[0007] In some embodiments, the mounting base is further included. Slots are provided on the lower parts of both sides of the fin cover. Insert blocks adapted to the slots are provided on both sides of the mounting base. One end of the mounting base abuts against the front protrusion plate, and the other end extends out of the slot and is provided with a connecting plate. A fixing hole is provided on one side of the fin cover located in the slot. A pin is inserted into the fixing hole. One end of the pin extends out of the fixing hole and is provided with a positioning head. The positioning head abuts against the end of the fin cover and the mounting base near the rear protrusion plate.

[0008] In some embodiments, a connecting groove is provided on the connecting plate portion. The connecting groove includes a first vertical groove portion, an inclined groove portion and a second vertical groove portion, and the three form a hook-shaped structure. A guide portion is provided at the inlet end of the first vertical groove portion.

[0009] In some embodiments, the mounting base plate is used for grounding connection.

[0010] In some embodiments, a plurality of trapezoidal uprights are provided inside the lower housing, and the main circuit board is provided with positioning openings corresponding to the trapezoidal uprights. The main circuit board is raised by the trapezoidal uprights.

[0011] In some embodiments, the upper housing and the lower housing are provided with a wiring half-groove on one side of the front protrusion plate. The wiring half-groove of the upper housing and the wiring half-groove of the lower housing are matched to form a wiring channel. A plurality of protruding rings are provided at intervals along the axial direction in the wiring half-groove, and the top of the protruding rings is provided with an edge.

[0012] In some embodiments, an isolation strip is provided between adjacent wiring half-grooves, and the bottom of the isolation strip is provided with an edge.

[0013] In some embodiments, the end face of the upper housing near the fin cover is provided with an annular groove on the outer ring of the heat-conducting plate, and a first sealing ring is provided in the annular groove, the first sealing ring abutting between the annular groove and the fin cover.

[0014] In some embodiments, a second sealing ring is provided between the upper housing and the lower housing, and the tops of the first sealing ring and the second sealing ring are configured as ridge shapes.

[0015] The beneficial effects of this utility model are as follows: By opening an opening in the upper housing and directly placing the heat-conducting plate on the main circuit board, covering most of the heating elements, and ensuring direct contact between the inner side of the fin cover and the heat-conducting plate, a low thermal resistance heat transfer path is formed, improving the heat dissipation efficiency of the fins on the internal circuit board. Simultaneously, the fin cover is fixed to the outer shell with bolts, ensuring a stable structure, and the disassembly holes on the lower housing facilitate assembly or maintenance without removing the fin cover, making it highly practical. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, obtaining other drawings based on these drawings without creative effort still falls within the scope of this utility model.

[0017] Figure 1 This is a schematic diagram of a photovoltaic optimizer according to the present invention; Figure 2 An explosion of a photovoltaic optimizer in this utility model Figure 1 ; Figure 3 for Figure 2 Enlarged view of point A in the middle; Figure 4 An explosion of a photovoltaic optimizer in this utility model Figure 2 ; Figure 5 This is a partial schematic diagram of the finned cover in this utility model; Figure 6 This is a schematic diagram of the upper and lower shells in this utility model; Figure 7 This is a partial schematic diagram of the connecting plate portion in this utility model; In the diagram: 100-Upper housing, 110-Opening, 120-Through hole, 130-Annular groove, 131-First sealing ring, 140-Upper wiring half-groove, 141-Protruding ring, 142-Edge, 143-Isolation strip, 200-Lower housing, 210-Disassembly hole, 220-Trapezoidal vertical plate, 230-Lower wiring half-groove, 300-Fin cover, 310-Threaded hole, 320-Slot, 330-Fixing hole, 340- Insert, 341-positioning head, 400-main circuit board, 410-heat conduction plate, 420-positioning port, 500-snap-fit ​​structure, 600-front protrusion plate, 700-rear protrusion plate, 800-mounting base plate, 810-insertion block, 820-connecting plate part, 821-connecting groove, 8211-first vertical groove part, 8212-slanted groove part, 8213-second vertical groove part, 8214-guide part, 900-second sealing ring. Detailed Implementation

[0018] The following description provides specific application scenarios and requirements for this specification, intended to enable those skilled in the art to make and use the contents of this specification. Various partial modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of this specification. Therefore, this specification is not limited to the embodiments shown, but rather to the widest scope consistent with the claims.

[0019] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "longitudinal", "lateral", "radial", "length", "width", "thickness", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element or component to have a specific orientation, or to be constructed and operated in a specific orientation.

[0020] It should be noted that the terms "first," "second," and similar words do not indicate any order, quantity, or importance, but are only used to distinguish different components and should not be construed as limiting the embodiments of this application.

[0021] It should be noted that the terms "installation," "setup," "equipped with," "connection," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral structures; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium, or internal connections between two devices, components, or parts.

[0022] It should be noted that the terms "in some embodiments," "exemplarily," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "in some embodiments," "exemplarily," or "for example" should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "in some embodiments," "exemplarily," and "for example" is intended to present the relevant concepts in a specific manner, meaning that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of this application.

[0023] Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] Regarding the accompanying drawings of this application, it should be clearly understood that the drawings are for illustrative and descriptive purposes only and are not intended to limit the scope of this specification. It should also be understood that the drawings are not necessarily drawn to scale.

[0025] The fins of existing photovoltaic optimizers are not effective at dissipating heat from the internal circuit boards, mainly because of the long heat transfer path and high thermal resistance.

[0026] Based on the above issues, such as Figures 1 to 7As shown, this embodiment provides a photovoltaic optimizer, including an upper housing 100, a lower housing 200, and a fin cover 300. The upper housing 100 and the lower housing 200 are connected by a snap-fit ​​structure 500 to form a closed outer shell. An inner cavity is formed inside the outer shell. The snap-fit ​​structure 500 is as follows: Figure 6 As shown, the upper housing 100 and lower housing 200 are evenly distributed on each side, making them easy to assemble and disassemble.

[0027] The inner cavity is equipped with a main circuit board 400, which integrates power devices and other heat-generating components. On the upper surface of the main circuit board 400, a heat-conducting plate 410 is fixed corresponding to the heat-generating area. The top of the upper shell 100 is provided with an opening 110 that matches the shape and size of the heat-conducting plate 410. The fin cover 300 is a metal component with multiple parallel heat dissipation fins, which covers the middle area of ​​the outer shell.

[0028] After installation, the inner bottom surface of the fin cover 300 is in direct and tight contact with the upper surface of the heat-conducting plate 410. To achieve reliable fixation, the inner side of the fin cover 300 is provided with several threaded holes 310. The upper shell 100 is provided with through holes 120 at corresponding positions, and the lower shell 200 is provided with disassembly holes 210 at corresponding positions of the through holes 120. During assembly, bolts are inserted through the through holes 120 of the upper shell 100 and screwed into the threaded holes 310 of the fin cover 300 to tighten them, thus fixing the fin cover 300 and the outer shell together.

[0029] The presence of the disassembly hole 210 allows the operator to insert tools from the bottom of the lower housing 200 to install or remove bolts without first opening the housing, which facilitates production assembly and after-sales maintenance.

[0030] With the above configuration, the heat on the main circuit board 400 is directly transferred to the heat conduction plate 410. Since the heat conduction plate 410 is in direct contact with the fin cover 300, the heat is quickly conducted to the fin cover 300 with extremely low thermal resistance, and then dissipated into the surrounding air by the large area of ​​the fin cover 300.

[0031] Normally, the fin cover 300 does not come into direct contact with any charged potential. To further ensure electrical safety, optionally, a thermally conductive insulating layer is provided between the inner side of the fin cover 300 and the heat-conducting plate 410, or the heat-conducting plate 410 itself is made of a thermally conductive insulating material, such as a thermally conductive silicone pad or an alumina ceramic sheet. This provides efficient thermal coupling while maintaining reliable insulation between the heat-conducting plate 410 and the fin cover 300.

[0032] In some embodiments, the front and rear ends of the housing are respectively provided with an upwardly protruding front plate 600 and a rear plate 700. The longitudinal dimension of the fin cover 300 is adapted to the distance between the front plate 600 and the rear plate 700. After installation, the fin cover 300 is just stuck between the front plate 600 and the rear plate 700, thereby achieving front-to-back direction limitation.

[0033] In some embodiments, a mounting base plate 800 is further included. The lower portions of both sides of the fin cover 300 are provided with inwardly opening and through slots 320. Insert blocks 810 are bent upwards on both sides of the mounting base plate 800, and the insert blocks 810 slide into the slots 320. During installation, the insert blocks 810 of the mounting base plate 800 are pushed forward from the rear end of the fin cover 300 into the slots 320 until the front end face of the mounting base plate 800 abuts against the rear end face of the front protrusion plate 600.

[0034] The rear end of the mounting base plate 800 extends out of the slot 320 and forms a connecting plate portion 820 for fixing with an external bracket. To prevent the mounting base plate 800 from coming out of the slot 320 during use, a fixing hole 330 is provided on one side of the slot 320 on the fin cover 300. The fixing hole 330 communicates with the slot 320 and a pin 340 is inserted into it. The two are tightly fitted. One end of the pin 340 extends out of the fixing hole 330 and forms a positioning head 341 with a larger diameter.

[0035] After the mounting base plate 800 is installed in place, the insert post 340 is inserted into the fixing hole 330, and its positioning head 341 abuts against the end of the fin cover 300 and the mounting base plate 800 near the rear protrusion 700, thereby locking the axial position of the mounting base plate 800.

[0036] Furthermore, such as Figure 7 As shown, in order to facilitate connection with various types of brackets, the connecting plate portion 820 is provided with a connecting groove 821. The connecting groove 821 is hook-shaped and includes a first vertical groove portion 8211, an inclined groove portion 8212 and a second vertical groove portion 8213 connected in sequence.

[0037] During installation, the hooks or bolt heads on the bracket can be slid into the entrance of the first vertical groove 8211, guided by the inclined groove 8212, and then fall into the second vertical groove 8213 to achieve quick mounting.

[0038] The first vertical groove 8211 has an outwardly expanding guide 8214 at its inlet end to facilitate the entry of the hook.

[0039] In some embodiments, the mounting substrate 800 is made of conductive metal material and is provided with a grounding connection point for reliably grounding the housing and fin cover of the photovoltaic optimizer, thereby improving safety performance.

[0040] In some embodiments, a plurality of trapezoidal upright plates 220 are provided on the inner bottom wall of the lower housing 200, and a positioning port 420 is provided on the main circuit board 400 at the corresponding position.

[0041] During installation, the positioning port 420 of the main circuit board 400 is fitted onto the trapezoidal upright plate 220, so that the main circuit board 400 is raised by the trapezoidal upright plate 220, forming a gap between it and the bottom surface of the lower housing 200, which is conducive to air circulation and convection heat dissipation.

[0042] In some embodiments, the upper housing 100 and the lower housing 200 are respectively provided with an upper wiring half-groove 140 and a lower wiring half-groove 230 on one side of the front protrusion plate 600. When the upper housing 100 and the lower housing 200 are engaged, the wiring half-groos of the two are engaged to form a complete wiring channel. In the upper wiring half-groove 140 and the lower wiring half-groove 230, a plurality of protruding rings 141 are provided at intervals along their axial direction, and the top of the protruding rings 141 is provided with a sharp edge 142.

[0043] When the cable is pressed into the cable routing channel, the edge 142 can penetrate the cable sheath, which can help fix it and prevent it from loosening.

[0044] Furthermore, an isolation strip 143 is provided between adjacent cable routing half-grooves, and the top of the isolation strip 143 is also provided with an edge to isolate adjacent cables.

[0045] In some embodiments, the upper housing 100 is provided with an annular groove 130 near the end face of the fin cover 300, that is, around the outer ring of the opening 110, and a first sealing ring 131 is installed in the annular groove 130.

[0046] When the fin cover 300 is tightened by bolts, the first sealing ring 131 is compressed between the annular groove 130 and the lower surface of the fin cover 300, forming a reliable seal.

[0047] Furthermore, a second sealing ring 900 is provided at the joint between the upper housing 100 and the lower housing 200 to ensure the sealing between the two.

[0048] The top of the cross-section of both the first sealing ring 131 and the second sealing ring 900 is designed as a ridge shape, that is, a triangular or arc-shaped protrusion, which can generate greater contact stress when under pressure, thereby further improving the sealing effect.

[0049] In summary, after reading this detailed disclosure, those skilled in the art will understand that the foregoing detailed disclosure is presented by way of example only and is not restrictive. Although not explicitly stated herein, those skilled in the art will understand that the requirements of this application encompass various reasonable changes, improvements, and modifications to the embodiments. These changes, improvements, and modifications are intended to be made by this application and are within the spirit and scope of the exemplary embodiments of this application.

[0050] Furthermore, it should be understood that in the foregoing description of the embodiments of this application, various features are combined in a single embodiment, drawing, or description for the purpose of simplifying the understanding of a feature. However, this does not mean that the combination of these features is necessary, and those skilled in the art may readily identify some of the devices as separate embodiments when reading this application. That is, the embodiments in this application can also be understood as an integration of multiple sub-embodiments. It is also valid when each sub-embodiment contains fewer than all the features of a single foregoing disclosed embodiment.

[0051] Finally, it should be understood that the embodiments disclosed herein are illustrative of the principles of the embodiments of this application. Other modified embodiments are also within the scope of this application. Therefore, the embodiments disclosed herein are merely examples and not limitations. Those skilled in the art can adopt alternative configurations to implement the applications in this application based on the embodiments in this application. Therefore, the embodiments of this application are not limited to the embodiments precisely described in the application.

Claims

1. A photovoltaic optimizer, characterized in that, The device includes an upper shell, a lower shell, and a fin cover. The upper and lower shells are connected by a snap-fit ​​structure to form an outer shell. The outer shell has an inner cavity in which a main circuit board is installed. A heat-conducting plate is installed on the main circuit board. An opening adapted to the heat-conducting plate is opened on the upper shell. The fin cover is located in the middle of the outer shell, and its inner side contacts the heat-conducting plate. Several threaded holes are provided on the inner side of the fin cover. A through hole is provided on the upper shell corresponding to the threaded hole, and a disassembly hole is provided on the lower shell corresponding to the through hole. Bolts are passed through the through hole and connected to the threaded hole to fix the fin cover to the outer shell.

2. A photovoltaic optimizer according to claim 1, characterized in that, The front and rear ends of the outer shell are respectively provided with a front convex plate and a rear convex plate, and the fin cover is positioned between the front convex plate and the rear convex plate.

3. A photovoltaic optimizer according to claim 2, characterized in that, It also includes a mounting base plate. Slots are provided on the lower parts of both sides of the fin cover. Insert blocks that fit the slots are provided on both sides of the mounting base plate. One end of the mounting base plate abuts against the front protrusion plate, and the other end extends out of the slot and is provided with a connecting plate. A fixing hole is provided on one side of the slot on the fin cover. A plug is inserted into the fixing hole. One end of the plug extends out of the fixing hole and is provided with a positioning head. The positioning head abuts against the end of the fin cover and the mounting base plate near the rear protrusion plate.

4. A photovoltaic optimizer according to claim 3, characterized in that, The connecting plate has a connecting groove, which includes a first vertical groove, an inclined groove, and a second vertical groove, and the three form a hook-shaped structure. The inlet end of the first vertical groove is provided with a guide.

5. A photovoltaic optimizer according to claim 3, characterized in that, The mounting base plate is used for grounding connection.

6. A photovoltaic optimizer according to claim 1, characterized in that, The lower housing is provided with several trapezoidal uprights, and the main circuit board is provided with positioning holes corresponding to the trapezoidal uprights. The main circuit board is raised by the trapezoidal uprights.

7. A photovoltaic optimizer according to claim 1, characterized in that, The upper and lower housings are provided with wiring half-grooves on one side of the front protrusion plate. The wiring half-grooves of the upper housing and the wiring half-grooves of the lower housing are matched to form a wiring channel. Several protruding rings are provided at intervals along the axial direction in the wiring half-grooves, and the top of the protruding rings is provided with an edge.

8. A photovoltaic optimizer according to claim 7, characterized in that, An isolation strip is provided between adjacent wiring half-slots, and the bottom of the isolation strip is provided with an edge.

9. A photovoltaic optimizer according to claim 7, characterized in that, The end face of the upper outer shell near the fin cover is provided with an annular groove on the outer ring of the heat-conducting plate. A first sealing ring is provided in the annular groove, and the first sealing ring abuts between the annular groove and the fin cover.

10. A photovoltaic optimizer according to claim 9, characterized in that, A second sealing ring is provided between the upper shell and the lower shell, and the top of the first sealing ring and the second sealing ring are configured in a ridge shape.

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