Chip capacitor noise reduction structure of a display card mainboard

Abstract

The utility model relates to a display card technical field especially a kind of chip capacitor noise reduction structure of display card mainboard, include: mainboard and the pad formed on the both ends of the mainboard;The capacitor is welded above the pad, and the upper and lower coincidence of several capacitors on both ends is set;Wherein, the mainboard is located at the pad also has sound-absorbing structure, and the sound-absorbing structure and the capacitor are opposite, in the utility model, by using the capacitor layout of upper and lower opposition on the both ends of mainboard, capacitor is placed in the front and back of mainboard by center-to-center mode, so that the vibration mode from both sides is basically mutually cancelled, to reduce the overall vibration of mainboard, reach the purpose of reducing noise, furthermore, by designing sound-absorbing structure on mainboard, the noise generated by vibration can be absorbed, so as to further improve the noise reduction performance of the entire display card when working, effectively reduce the noise brought by chip capacitor by these relatively simple processing methods.

Description

Technical Field

[0001] This utility model relates to the field of graphics card technology, and in particular to a chip capacitor noise reduction structure for a graphics card motherboard. Background Technology

[0002] In graphics card motherboard design, multilayer ceramic chip capacitors (MLCCs) are widely used due to their high capacitance and miniaturization advantages. However, MLCCs exhibit piezoelectric effects under alternating electric fields, inducing high-frequency vibrations in the 20Hz–20kHz audible range. Since the capacitors are directly soldered to the circuit board, the vibrational energy is transferred to the motherboard through the solder joints, triggering resonance and producing a piercing whine, especially noticeable under high graphics card loads, severely degrading the user experience. Simultaneously, long-term vibration leads to accumulated mechanical stress, accelerating solder joint fatigue cracking and deterioration of the internal dielectric layer of the MLCC, shortening component lifespan.

[0003] With the improvement of graphics card performance, the usage and current density of MLCCs have continued to increase. The issues of coil whine and reliability have become key bottlenecks restricting the development of high-end graphics cards. Therefore, in order to achieve noise reduction during capacitor operation, we propose a chip capacitor noise reduction structure for graphics card motherboards. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies, such as howling and reliability issues, which have become key bottlenecks restricting the development of high-end graphics cards. This invention proposes a chip capacitor noise reduction structure for graphics card motherboards.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] Design a chip capacitor noise reduction structure for a graphics card motherboard, including:

[0007] The motherboard and the solder pads formed on both ends of the motherboard;

[0008] A capacitor is soldered above the pad, and several capacitors on both ends are arranged overlappingly.

[0009] The motherboard also has a sound-absorbing structure formed at the pad, and the sound-absorbing structure and the capacitor are positioned opposite each other.

[0010] Furthermore, the pad includes two pins, and the two ends of the capacitor are soldered to the two pins respectively.

[0011] Furthermore, the motherboard has an ink layer on its end face, and the ink layer forms an exposed window between the two pins;

[0012] The bottom of the capacitor is spaced a predetermined gap between the exposed window and the motherboard.

[0013] Furthermore, the sound-absorbing structure includes several sound-absorbing holes formed on the motherboard at the exposed window, and a sound-absorbing coating is also provided inside the sound-absorbing holes.

[0014] Furthermore, the sound-absorbing holes have a diameter of 0.3 mm and a depth of 0.4 mm, and are arranged in a honeycomb array.

[0015] Furthermore, the sound-absorbing coating is a sprayed nano-sound-absorbing coating.

[0016] This invention proposes a chip capacitor noise reduction structure for a graphics card motherboard. The advantages are as follows: By employing a top-to-bottom capacitor layout on both ends of the motherboard, with the capacitors positioned center-to-center on the front and back sides, the vibration modes from both sides essentially cancel each other out, thereby reducing overall motherboard vibration and noise. Furthermore, by designing a sound-absorbing structure on the motherboard, noise generated by vibration can be absorbed, further improving the overall noise reduction performance of the graphics card during operation. These relatively simple methods effectively reduce noise from chip capacitors, making them readily acceptable for production and suitable for mass production. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the sound-absorbing structure of this utility model.

[0019] In the diagram: 1. Motherboard; 10. Solder pad; 101. Pin; 2. Capacitor; 3. Sound-absorbing structure; 31. Sound-absorbing hole; 32. Sound-absorbing coating; 4. Ink layer; 41. Exposed window. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Reference Figure 1-2 As an embodiment of the present utility model, it discloses a chip capacitor noise reduction structure for a graphics card motherboard. Specifically, the graphics card motherboard includes a motherboard 1 and solder pads 10 formed on both ends of the motherboard 1.

[0022] A capacitor 2 is soldered above the pad 10. Several capacitors 2 on both ends are arranged vertically. Specifically, in this embodiment, capacitors 2 are arranged vertically opposite each other on the two ends of the motherboard 1. The capacitors 2 are placed on the front and back of the motherboard 1 in a center-to-center manner, so that the vibration modes from both sides are basically canceled out, thereby reducing the overall vibration of the motherboard 1 and achieving the purpose of reducing noise.

[0023] The motherboard 1 also has a sound-absorbing structure 3 formed at the pad 10, and the sound-absorbing structure 3 and the capacitor 2 are opposite each other.

[0024] In some embodiments, the pad 10 in this invention includes two pins 101, and the two ends of the capacitor 2 are respectively soldered to the two pins 101. Of course, the method of soldering the pins 101 and the capacitor 2 is a conventional technique used by those skilled in the art, and will not be elaborated on here.

[0025] Based on the above embodiments, the motherboard 1 in this embodiment has an ink layer 4 on its end face, and the ink layer 4 forms an exposed window 41 between the two pins 101;

[0026] The bottom of capacitor 2 is separated from the motherboard 1 by a predetermined gap at the exposed window 41. In the conventional method, the ink layer 4 covers the space between capacitor 2 and the two pins 101. Normally, due to the presence of this ink, there is almost no gap between capacitor 2 and motherboard 1 after it is mounted. To solve this problem, we improved the package by removing the ink layer 4 within this gap, maintaining a certain gap between capacitor 2 and motherboard 1, thereby further reducing the vibration of capacitor 2 on motherboard 1.

[0027] In some embodiments, the sound-absorbing structure 3 of the present invention includes a plurality of sound-absorbing holes 31 opened on the motherboard 1 at the exposed window 41, and a sound-absorbing coating 32 is also provided inside the sound-absorbing holes 31.

[0028] Specifically, in this embodiment, the sound-absorbing holes 31 have a diameter of 0.3 mm and a depth of 0.4 mm, and are arranged in a honeycomb array. In addition, the sound-absorbing coating 32 is a sprayed nano sound-absorbing coating. Optionally, the nano sound-absorbing coating in this embodiment can be set as a silica aerogel composite layer, which is formed inside the sound-absorbing holes 31 by spraying. Of course, it can also be sprayed and formed on the entire exposed window 41. In this embodiment, by opening several sound-absorbing holes 31 on the end face of the motherboard 1, the noise generated by vibration can be absorbed, thereby further improving the noise reduction performance of the entire graphics card during operation.

[0029] In summary, this invention employs a layout of capacitors 2 arranged vertically opposite each other on the two end faces of the motherboard 1. The capacitors 2 are placed center-to-center on the front and back sides of the motherboard 1, which essentially cancels out the vibration modes from both sides, thereby reducing the overall vibration of the motherboard 1 and achieving the goal of reducing noise. In addition, by designing a sound-absorbing structure 3 on the motherboard 1, the noise generated by vibration can be absorbed, thus further improving the noise reduction performance of the entire graphics card during operation. These relatively simple processing methods effectively reduce the noise caused by the chip capacitors, are easily accepted by production, and are a solution that can be directly mass-produced.

[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A chip capacitor noise reduction structure for a graphics card motherboard, characterized in that, include: The motherboard (1) and the pads (10) formed on both ends of the motherboard (1); A capacitor (2) is soldered above the pad (10), and several capacitors (2) on both ends are arranged to overlap vertically. The motherboard (1) also has a sound-absorbing structure (3) formed at the pad (10), and the sound-absorbing structure (3) and the capacitor (2) are opposite each other.

2. The chip capacitor noise reduction structure for a graphics card motherboard according to claim 1, characterized in that: The pad (10) includes two pins (101), and the two ends of the capacitor (2) are soldered to the two pins (101) respectively.

3. The chip capacitor noise reduction structure for a graphics card motherboard according to claim 2, characterized in that: The motherboard (1) has an ink layer (4) on its end face, and an exposed window (41) is formed between the ink layer (4) and the two pins (101); The bottom of the capacitor (2) is spaced a predetermined gap between the exposed window (41) and the motherboard (1).

4. The chip capacitor noise reduction structure for a graphics card motherboard according to claim 3, characterized in that: The sound-absorbing structure (3) includes a plurality of sound-absorbing holes (31) opened on the motherboard (1) at the exposed window (41), and a sound-absorbing coating (32) is also provided inside the sound-absorbing holes (31).

5. The chip capacitor noise reduction structure for a graphics card motherboard according to claim 4, characterized in that: The sound-absorbing holes (31) have a diameter of 0.3 mm and a depth of 0.4 mm, and are arranged in a honeycomb array.

6. The chip capacitor noise reduction structure for a graphics card motherboard according to claim 4, characterized in that: The sound-absorbing coating (32) is a sprayed nano-sound-absorbing coating.

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